CN218352901U - Telecommunication system - Google Patents

Abstract

The utility model discloses a dustproof telecommunication system, the system includes a quick-witted case, a printed circuit board, a memory module and a lid, and the machine case includes an opening on a top side of quick-witted case, and printed circuit board is located quick-witted incasement, and memory module can remove to install on the circuit board, and the lid can remove to couple to the top side of quick-witted case. The positioning and shape of the opening allows the memory module to be accessed through the opening for easy replacement. The method includes inserting a strip into the opening such that a space is formed between the walls of the opening and the strip, and inserting the memory module into the space formed between the walls of the opening and the strip such that another strip on a first side of the memory module contacts the walls and the strip contacts a second side of the memory module. The memory module may alternatively be coupled to the printed circuit board.

Description

Telecommunication system

[ technical field ] A

The present invention relates generally to a dust-proof telecommunications system, and more particularly, to a dust-proof mechanism for memory modules.

[ background of the invention ]

Telecommunication devices, such as 5G equipment, base stations of cellular networks, and servers, typically have compartments to house various components, such as Printed Circuit Board Assemblies (PCBAs), central Processing Units (CPUs), system on chip (socs), memory modules, and on-board chips. Since telecommunication devices are typically located in outdoor environments, the components are protected from adverse environmental conditions and unauthorized access by a protective cover (e.g., die cast) that covers the compartment.

In addition, telecommunication devices in harsh locations face a number of challenges, including high amounts of dust, poor airflow, and extreme temperatures. Outdoor environments or infrequently accessed, poorly airflow storage enclosures may introduce excessive dust into the server hardware, eventually leading to failure. Typically, a cooling plate or die-cast heat sink having a fin structure or a plurality of fins is designed to dissipate heat generated by the server hardware components.

With the explosion of the Internet and the Internet of Things (IOT), the demand for signal speed is higher and higher. In response to high speed signal demand, the number of server nodes must increase, and some servers are placed in harsh environments. In this case, the waterproof as well as the dustproof function is particularly important. A known memory dust-proof mechanism is shown in fig. 1A and 1B.

Referring to fig. 1A and 1B, there is shown a known telecommunications system 10, a dust protection mechanism for a memory 12, such as a dual in-line memory module, using a die cast 13 covering the entire Printed Circuit Board (PCB) 14, and the memory being soldered directly to the PCB. Due to the dust-proof requirement, the printed circuit board 14 is completely covered by the die cast 13 as shown in fig. 1B, and the space near the memory 12 is not passed by the air flow. In this case, the heat dissipation of the reservoir 12 requires the heat generated by the reservoir to be conducted to the die cast by the die cast 13 in contact with the reservoir, so that the heat is taken away by the external air flow. The use of such known dust-proof mechanisms has the following problems: if the memory 12 is damaged, the entire printed circuit board 14 must be replaced because the memory is soldered directly to the printed circuit board. When there is limited space on board the printed circuit board 14, it may only support a limited number of memories 12. The above problems will place many restrictions on the replacement/repair of the memory and the design of the printed circuit board.

Therefore, there is a need for an improved dust protection mechanism that allows airflow through both sides of a dual in-line memory module or dual in-line memory module. The present invention is directed to a dustproof telecommunication system that provides an easy solution to the heat dissipation problem while ensuring easy replacement of the memory and reducing the area occupied by the printed circuit board.

[ Utility model ] content

The terms of the embodiments and similar terms (e.g., embodiments, configurations, features, examples, and options) are intended to broadly refer to all subject matter of the present disclosure and the claims below. Several statements containing these various terms should be understood as not limiting the meaning or scope of the subject matter described herein or the following claims. Embodiments of the invention covered herein are defined by the claims below, not the contents of the inventions. This summary is a high-level overview of various features of the invention and introduces some of the concepts described more fully in the detailed description that follows. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter. The subject matter should be understood by reference to appropriate portions of the entire specification of the invention, any or all of the drawings, and each claim.

According to some aspects of the present invention, a telecommunications system is disclosed. For example, the telecommunications system is dust tight. According to various embodiments, the telecommunications system includes a chassis including an opening on a top side of the chassis, a Printed Circuit Board (PCB) located within the chassis, and a memory module removably mounted on the circuit board. The openings are positioned and shaped such that the memory modules may be accessed through the openings. The telecommunications system further includes a cover removably coupled to the top side of the chassis such that the opening is covered by the cover.

In some examples, a memory module includes a dual inline memory module, a first chip covering a first side of the dual inline memory module, a second chip covering a second side of the dual inline memory module opposite the first side. The dual inline memory module is positioned between the first chip and the second chip. The memory module further includes a clip inserted into a gap formed in a top side of the memory module between the first plate and the second plate.

In some examples, the memory module further includes a first thermal pad coupled to an inner side of the first die and a second thermal pad coupled to an inner side of the second die. The dual inline memory module is positioned between the first heat pad and the second heat pad.

In some examples, the memory module further includes a first strap coupled to the clip. The first strip is placed on a portion of the first sheet when the clip is inserted into the gap to form the memory module. Further, in some examples, a latch of a connector of the dual in-line memory module is exposed through a side gap formed between the first and second sheets of the memory module. Further, in some examples, the opening has a wall, and the opening is sized to receive a second slat.

In some examples, the opening is further sized to receive a memory module. The first strip on a first side of the memory module contacts the wall and the second strip contacts a second side of the memory module opposite the first side.

In some examples, the opening is further sized to receive another memory module in addition to the second stripe. For example, the memory module is a first memory module and the other memory module is a second memory module, the first memory module including the first stripe and being in contact with the second stripe. A gap between the first memory module and the second memory module is blocked by the first strap. A third strip of the second memory module is in contact with the wall. Further, in some examples, the first, second, and third slats are made of a rubber material or a sponge material. In addition, in some examples, the opening is further sized to receive a plastic cap. The plastic cover encloses a first latch of a connector included in the memory module, and the plastic cover further encloses a second latch of a connector included in the second memory module. When the plastic cover is moved to contact the first memory module and the second memory module, the plastic cover closes the first latch and the second latch.

In some examples, a first rubber or sponge is coupled to the plastic cover and is in contact with the first memory module and the second memory module. A second rubber or sponge is coupled to the plastic cover and has a plurality of cutouts such that air flow is allowed through the cutouts to the first and second memory modules. The second rubber or sponge blocks dust from entering the first memory module and the second memory module.

In some examples, the first sheet, the second sheet, the clip, and the cover are made of a metallic material. Further, in some examples, a plurality of holes are formed on the clip.

In some examples, the plurality of projections are formed on at least the first sheet, each of the second sheets, or both the first sheet and the second sheet. Further, in some examples, the clip is coupled with the first sheet or the second sheet, and the plurality of projections are individually inserted into the plurality of holes.

In some examples, a plurality of screw holes are formed on the top side of the case, and a plurality of through holes corresponding to the plurality of screw holes are formed on the cover. The cover is coupled to the chassis through the through holes by screws, respectively. A plurality of screws are individually received in the plurality of screw holes.

In accordance with certain aspects of the present invention, a telecommunications system having a dust-tight frame is disclosed. The dust-proof frame allows air flow into a reservoir and air flow for replacement of the reservoir. According to various embodiments, the telecommunications system includes a memory module including a memory enclosed by a first sheet, a second sheet, and a clip inserted into a gap formed in a top side of the memory module between the first sheet and the second sheet, the first sheet covering a first side of the memory, the second sheet covering a second side of the memory opposite the first side, a first strip coupled to the clip, the first strip disposed on a portion of the first sheet, a second strip disposed in an opening formed on a top side of the frame. A space is formed between a wall of the opening and the second strip, and the memory module is placed in the space formed between the wall of the opening and the second strip. The first strap is located on a first side of the memory module and contacts the wall. The second strip plate is in contact with a second side of the memory module. The memory module is alternatively coupled to a Printed Circuit Board (PCB) located within the frame.

In some examples, the telecommunications system further includes a plastic cover disposed in the opening to contact the memory module. A latch of a connector included in the memory module is closed by the plastic cover. The telecommunications system further includes a metal cover removably coupled to the top side of the frame. The opening is covered by a metal cover. Further, in some examples, the memory modules may be accessible via the opening when the metal cover is removed from the top side of the frame.

According to certain aspects of the present invention, a method of assembling a dust prevention mechanism for a memory in a telecommunications system is disclosed. According to various embodiments, the method includes assembling a memory module, enclosing the memory module by using a first sheet, a second sheet, and a clip inserted into a gap formed in a top side of the memory module between the first sheet and the second sheet. The first piece covers a first side of the memory, the second piece covers a second side of the memory opposite the first side, and a first strap coupled to the clip is placed over a portion of the first piece. The method further includes inserting a second strip into an opening formed on a top side of a frame such that a space is formed between a wall of the opening and the second strip, and inserting the assembled memory module into the space formed between the wall of the opening and the second strip. The first strap is located on a first side of the memory module in contact with the wall and the second strap is in contact with a second side of the memory module. The memory module is alternatively coupled to a Printed Circuit Board (PCB) located within the frame.

In some examples, the method further includes inserting a plastic cover into the opening and moving the plastic cover to contact the memory module. A latch of a connector included in the memory module is closed by the plastic cover. The method further includes coupling a metal cover to the top side of the frame such that the opening is covered by the metal cover. When the metal cover is removed from the top side of the frame, the memory module may be accessed through the opening.

The above summary of the present invention is not intended to represent each embodiment, or every feature, of the present invention. Rather, the foregoing novel disclosure provides examples of some of the novel features and characteristics set forth herein. The above features and advantages and other features and advantages of the present invention are readily apparent from the following detailed description of the representative embodiments and modes for carrying out the invention when taken in connection with the accompanying drawings and appended claims. Additional features of the present invention will become apparent to those skilled in the art upon consideration of the following detailed description of various embodiments with reference to the accompanying drawings, which are provided for illustration purposes only.

[ description of the drawings ]

The invention, together with its advantages, will be best understood from the following description of exemplary embodiments when read in conjunction with the accompanying drawings. The drawings depict only exemplary embodiments and are not therefore to be considered to be limiting of the various embodiments or the scope of the claims.

Fig. 1A is a top view of a prior art telecommunications system that is not covered by die cast.

Fig. 1B is a general perspective view of the prior art telecommunications system shown in fig. 1A covered by die casting.

Fig. 2A is a top view of a telecommunications system shown through a protective cover in accordance with certain aspects of the present invention.

Fig. 2B is a general perspective view of the telecommunications system shown in fig. 2A through a protective cover, in accordance with certain aspects of the present disclosure.

Fig. 2C is a general perspective view of the telecommunications system of fig. 2B with the protective cover shielding a dust frame thereunder and showing airflow directions in accordance with certain aspects of the present invention.

Fig. 2D is a general perspective view of the telecommunications system shown in fig. 2B, showing the dust-tight frame through the protective cover, and showing the direction of airflow, in accordance with certain aspects of the present invention.

Fig. 3 is a general perspective view of a first metal sheet and a corresponding thermal pad, in accordance with certain aspects of the present invention.

Fig. 4 is a general perspective view of a second metal sheet and a corresponding thermal pad, according to certain aspects of the present invention.

Fig. 5A is a general perspective view of a metal clip and assembly of the metal clip according to certain aspects of the present disclosure.

Fig. 5B is a general perspective view of the clip of fig. 5A showing an opposite side of the clip, in accordance with certain aspects of the present invention.

Fig. 6 illustrates the assembly of a dual inline memory module in accordance with certain aspects of the present invention.

FIG. 7A shows a next step in the assembly of the dual inline memory module of FIG. 6, in accordance with certain aspects of the present invention.

FIG. 7B is a general perspective view of the assembled dual inline memory module of FIGS. 6 and 7A, according to certain aspects of the present invention.

FIG. 8A is a general perspective view of the assembled dual in-line memory module shown in FIG. 7B, in accordance with certain aspects of the present invention.

FIG. 8B is a general perspective view of an opposite side of the assembled dual in-line memory module of FIG. 8A, according to certain aspects of the present invention.

Fig. 9 is a top view of a telecommunications system without a protective cover in accordance with certain aspects of the present invention.

Fig. 10A is a top view of a dust frame of a telecommunications system, in accordance with certain aspects of the present invention.

Fig. 10B is a general perspective view of the dust frame of fig. 10A, in accordance with certain aspects of the present disclosure.

Fig. 10C is a general perspective view of the dust frame of fig. 10A and 10B with slats inserted into respective corresponding openings of the frame, in accordance with certain aspects of the present invention.

Fig. 10D is a general perspective view of the dust frame of fig. 10C with slats placed in respective corresponding openings of the frame, in accordance with certain aspects of the present invention.

Fig. 11A is a general perspective view of a telecommunications system without a protective cover with dual in-line memory module modules inserted into respective corresponding openings of a dust frame in accordance with certain aspects of the present invention.

Fig. 11B is a side view of the telecommunications system of fig. 11A showing the order of installation of dual in-line memory modules, in accordance with certain aspects of the present invention.

Fig. 12A is a side view of the telecommunications system of fig. 11A and 11B with dual in-line memory modules installed in respective corresponding openings of a dust-tight frame in accordance with certain aspects of the present invention.

Fig. 12B is a cross-sectional view of the telecommunications system shown in fig. 12A with dual in-line memory module modules installed at corresponding openings of the dust frame, in accordance with certain aspects of the present invention.

FIG. 13 is a view corresponding to the cross-sectional view shown in FIG. 12B, illustrating an example interference caused by an incorrect order of dual inline memory module installation, in accordance with certain aspects of the present invention.

Fig. 14A is a general perspective view of a cover and assembly of covers for a dust-tight frame of a telecommunications system, in accordance with certain aspects of the present disclosure.

Fig. 14B is a general perspective view of the cover shown in fig. 14A, in accordance with certain aspects of the present disclosure, wherein rubber/sponge is attached to the cover.

Fig. 14C is a first top perspective view of the cover shown in fig. 14B, in accordance with certain aspects of the present invention.

Fig. 14D is a second top perspective view of the cover shown in fig. 14B, viewed from a direction opposite the viewing direction of fig. 14C, in accordance with certain aspects of the present invention.

Fig. 14E is a bottom perspective view of the lid of fig. 14C and 14D, in accordance with certain aspects of the present invention.

Fig. 15 illustrates an exemplary rubber included in the cap assembly shown in fig. 14C-14E, in accordance with certain aspects of the present invention.

Fig. 16 is a general perspective view of a telecommunications system without a protective cover, with covers inserted into respective corresponding openings of a dust frame, in accordance with certain aspects of the present invention.

Fig. 17A is a top cross-sectional view of a dust-tight frame of a telecommunications system with dual in-line memory module modules mounted at an opening in the frame and a cover inserted into the opening in accordance with certain aspects of the present invention.

FIG. 17B is a top cross-sectional view corresponding to the top cross-section shown in FIG. 17A, with the cover moved toward the dual inline memory module to close a gap between the dual inline memory module and the cover, in accordance with certain aspects of the present invention.

FIG. 18 is a general perspective view of a telecommunications system having dual inline memory module modules mounted therein and a cover enclosing a latch of a connector of a dual inline memory module in accordance with certain aspects of the present invention.

Fig. 19A is a general perspective view of a telecommunications system with a protective cover coupled to a dust-proof frame of the telecommunications system in accordance with certain aspects of the present invention.

Fig. 19B is a general perspective view of the telecommunications system shown in fig. 19A, with a protective cover coupled to the telecommunications system, in accordance with certain aspects of the present invention.

Fig. 20 is a cross-sectional view of a portion of the telecommunications system shown in fig. 19B with the protective cover covering the dust frame and a cover installed in an opening of the dust frame, in accordance with certain aspects of the present invention.

While the invention is susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and will be described in further detail herein. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

[ description of symbols ]

10 telecommunication system

12 memory

13, die casting

14 printed circuit board

100 telecommunication system

110 cover/metal cover/protective cover

110-1: through hole

112, screw

120 memory module

120-1,120-2,120-3,120-4 memory module

121 dual inline memory module

121-1,121-2 latch

122, a clip

122-1,122-2,122-3 holes

123,123-3 first strip

123-4 third strip

124: first sheet

124-1,124-2,124-3 protrusions

125 the second sheet

125-1,125-2,125-3 protrusions

126 first thermal pad

127 second heating pad

140 dustproof frame/chassis

140-1: screw hole

141 opening (D)

142 wall

143 lid/plastic cover

143-1 receiving part

143-2 rib structure

143-3 structure

143-4 transverse rib structure

144 first rubber or sponge

145 second rubber or sponge

146 screw

150: second strip

[ detailed description ] embodiments

The present invention relates to a telecommunications system or telecommunications frame having a dust protection mechanism/structure. The dust protection mechanism/structure allows for easy replacement of memory modules, such as dual in-line memory modules or dual in-line memory module modules, and also allows for airflow through the space near the memory or dual in-line memory module modules.

Various embodiments are described with reference to the drawings, wherein like reference numerals are used to refer to like or equivalent elements throughout. The drawings are not to scale and are provided solely to illustrate features and characteristics of the present invention. It should be understood that numerous specific details, relationships, and methods are set forth to provide a full understanding. One skilled in the relevant art will recognize, however, that the various embodiments can be practiced without one or more of the specific details, or with other methods. In some instances, well-known structures or operations are not shown in detail for illustrative purposes. Various embodiments are not limited by the illustrated ordering of acts or events, as some acts may occur in different orders and/or concurrently with other acts or events. Moreover, not all illustrated acts or events are required to implement some features and characteristics of the present invention.

For the purposes of this embodiment, the singular includes the plural and vice versa, unless explicitly stated otherwise. The term "including" means "including, but not limited to". Moreover, approximating language, such as "about (about, almost, approximate") and the like, may be used herein to mean, for example, "(at)," (near, near at), "(within 3-5% of a", "(within 3-5%) of" "," (within acceptable manufacturing tolerances), "or any logical combination thereof. Additionally, the terms "vertical" or "horizontal" are intended to additionally include within "3-5% of the vertical or horizontal direction, respectively. Moreover, directional terms such as "top," "bottom," "left," "right," "above," and "below" are intended to refer to equivalent directions as depicted in the referenced drawings; from the context of reference objects or elements, e.g. from the usual position of an object or element; or other description as such.

Referring to fig. 2A-2D, a telecommunications system 100 is dustproof. According to various embodiments, the telecommunications system 100 includes a chassis 140 having a dust-tight mechanism. The dust-proof mechanism of the chassis 140 includes an opening 141 (shown in fig. 9 and 10A to 10D) formed at a top side of the chassis 140. The chassis 140 is die cast, for example. A Printed Circuit Board (PCB) is located within the chassis 140, and a memory module 120 is removably mounted on the PCB. The positioning and shape of the opening 141 is designed so that the memory module 120 can be accessed through the opening. The telecommunications system 100 further includes a cover 110, the cover 110 removably coupled to the top side of the chassis 140 such that the opening 141 is covered by the cover.

According to some embodiments, memory module 120 includes a Dual Inline Memory Module (DIMM) 121. The memory module 120 further comprises a first chip 124 (shown in FIG. 3) and a second chip 125 (shown in FIG. 4), the first chip 124 covering a first side of the dual inline memory module 121 and the second chip 125 covering a second side of the dual inline memory module opposite to the first side. Thus, the dual inline memory module 121 is located between the first chip 124 and the second chip 125, as shown in FIG. 6. According to some embodiments, the first sheet 124 and the second sheet 125 each include at least one protrusion 124-1/124-2/124-3 and 125-1/125-2/125-3. Referring to fig. 3 and 4, each of the thermal pads 126, 127 corresponds to the first sheet 124 and the second sheet 125, respectively. The memory module 120 further includes a clip 122 shown in fig. 5A and 5B, with fig. 5A showing a first side of the clip and fig. 5B showing a second side of the clip opposite the first side. The clip 122 is inserted into a gap formed between the first sheet 124 and the second sheet 125 on a top side of the memory module 120, as shown in fig. 7A.

According to some embodiments, the memory module 120 further includes a first thermal pad 126 coupled to an inner side of the first slice 124 and a second thermal pad 127 coupled to an inner side of the second slice 125, as shown in fig. 3 and 4. The dual inline memory module 121 is located between a first heat pad 126 and a second heat pad 127 as shown in FIG. 6.

According to some embodiments, the memory module 120 further includes a first strap 123 coupled to the clip 122, as shown in FIG. 5A. Referring to fig. 7A and 7B, when the first strip-coupled clips 122 are inserted into the gap to form the memory module 120, the first strip 123 is placed on a portion of the first sheet 124. Referring to FIGS. 7A and 7B, a latch 121-1 of a connector of the dual inline memory module 121 is exposed through a side gap of the memory module 120 formed between the first plate 124 and the second plate 125. FIG. 8A shows one side of the assembled memory module 120 showing a latch 121-1, while FIG. 8B shows the other side of the assembled memory module showing a latch 121-2. Referring to fig. 10B, the opening 141 of the chassis 140 has a wall 142 and is sized to receive a second slat 150, as shown in fig. 10C and 10D.

Referring to FIG. 11A, the opening 141 with the second slat 150 is further sized to receive the memory module 120 (120-3, 120-4). Once the memory module 120 is inserted into the opening 141 to which the second strip 150 is attached, the first strip 123 on a first side of the memory module contacts the wall 142 and the second strip contacts a second side of the memory module opposite the first side of the memory module. In fig. 11A, the second strip 150 located in the opening 141 opposite the wall 142 is not shown.

According to some embodiments, the chassis 140 has more than one opening 141. For example, two openings 141 are shown in fig. 9, 10A to 10D, and 11A to 11B. Referring to FIG. 11A, each opening 141 is sized to receive two memory modules 120-3,120-4 in addition to the second plate 150. For example, the first memory module 120-3 includes a first stripe 123-3 and is in contact with a second stripe 150, as shown in FIG. 12B. Referring to fig. 12A and 12B, a gap between the first and second memory modules 120-3 and 120-4 is blocked by the first stripe 123-3. A third plate 123-4 of the second memory module 120-4 is in contact with the wall 142. Referring to FIG. 11B, a particular order is required to install the memory modules 120-1,120-2,120-3,120-4 into the opening 141 of the chassis 140. For example, one of the two pairs of memory modules 120-1/120-2 and 120-3/120-4 that contacts the second slat 150 120-1 or 120-3 must first be inserted into the opening, and then the other 120-2 or 120-4 can be inserted to contact the respective corresponding first slat 123 of the previously inserted memory module 120-1 or 120-3. Further, as exemplified in FIG. 11B, the memory modules 120-1,120-2,120-3,120-4 may be assembled in the order of 120-1,120-2,120-3, and 120-4. If the assembly sequence is incorrect, assembly may be interfered with. For example, as shown in fig. 13, if the memory module 120-4 contacting the wall 142 is assembled first, and then the memory module 120-3 contacting the second strip 150 is assembled, interference will occur, and it is impossible or difficult to insert the two memory modules 120-3,120-4 into the opening 141. However, when the memory modules 120-1,120-2,120-3,120-4 are assembled in the correct order, the gaps between the memory modules are tightly blocked by the first strips 123 attached to the clips 122.

According to some embodiments, the first flight 123-3, the second flight 150, and the third flight 123-4 are made of a rubber material or a sponge material. Additionally, according to some embodiments, the opening 141 is further sized to receive a cover 143. The cover 143 is shown in fig. 14A to 14E. For example, the cover 143 is made of a plastic material. As shown in FIGS. 17A, 17B, and 18, a structure 143-3 of the cover 143 encloses a first latch 121-1 of a connector included in the first memory module 120-3, and the cover 143 further encloses a second latch 121-2 of a connector included in the second memory module 120-4. When the cover 143 is moved to contact the first and second memory modules 120-3,120-4, the cover 143 closes the first latch 121-1 and the second latch 121-2, as shown in fig. 17A and 17B. Once cover 143 is in contact with memory module 120 and rib structures 143-2 fit into the gaps formed between memory modules 120-3,120-4, a coupler or screw 146 is inserted into a receiving portion 143-1 of cover 143.

In some examples, a first rubber or sponge 144 is coupled to the cover 143 and is in contact with the first and second memory modules 120-3, 120-4. A second rubber or sponge 145 is coupled to the cover 143. In some embodiments, the second rubber or sponge 145 has a plurality of cutouts, as exemplified in FIG. 15, such that airflow is allowed through the cutouts to the first and second memory modules 120-3, 120-4. The second rubber or sponge 145 blocks dust from entering the first and second memory modules 120-3,120-4 while allowing airflow through the space near the memory modules.

Referring to fig. 16, the cover 143 to which the first rubber or sponge 144 and the second rubber or sponge 145 are attached is moved from the top to the bottom to be inserted into a gap formed between the memory module 120 and one side of the opening 141, and then the inserted cover 143 is moved toward the memory module. Finally, a coupler or screw 146 is inserted into the receiving portion 143-1 of the cover 143 to secure the cover 143 to the chassis 140.

For example, the first sheet 124, the second sheet 125, the clip 122, and the cover 110 are made of a metallic material. Further, in some examples, a plurality of apertures 122-1,122-2,122-3 are formed on the clip 122.

According to some embodiments, a plurality of protrusions 124-1,124-2, 124-3/125-1, 125-2,125-3 are formed on each of at least the first sheet 124, the second sheet 125, or both the first sheet and the second sheet. Further, in some examples, the clip 122 is coupled with the first piece 124 or the second piece 125. The plurality of protrusions 124-1,124-2, 124-3/125-1, 125-2,125-3 are individually inserted into the plurality of holes 122-1,122-2, 122-3.

According to some embodiments, a plurality of screw holes 140-1 are formed on the top side of the cabinet 140, and a plurality of through holes 110-1 corresponding to the plurality of screw holes are formed on the cover 110, as shown in fig. 19A. The cover 110 is coupled with the cabinet 140 by a plurality of screws 112 individually passing through the plurality of through holes 110-1. The plurality of screws 112 are individually received within the plurality of screw holes 140-1, and the cover 110 is removably coupled to the top side of the chassis 140 to protect components within the chassis, as shown in fig. 19B.

Fig. 20 shows a cross-sectional view of the internal structure of the telecommunications system 100. Due to the cover 143, the memory module 120 is stably mounted, and the mounted memory module is closed by the protective cover 110, which can be easily removed. When coupled to the top side of the chassis 140, the protective cover 110 contacts the cross-rib structure 143-4 of the cover 143 and the memory module 120, thus restricting their movement in the height direction and also providing a dust-proof effect.

As described above, a telecommunications system 100 having a dust-tight frame/chassis 140 is disclosed. The dust-tight frame/chassis 140 allows airflow in and allows easy replacement of the memory module 120, the memory module 120 being replaceably coupled to a printed circuit board located within the frame. In particular, when the metal cover 110 is removed from the top side of the frame 140, the memory module 120 may be accessed via the opening 141.

In addition to the above-described telecommunications system, a method for assembling a dust prevention mechanism for dual in-line memory modules 121 in a telecommunications system 100 is disclosed. Referring to FIGS. 5A-7B, the method includes enclosing the dual inline memory module 121 by a first plate 124, a second plate 125, and a clip 122 to assemble a memory module 120. In particular, clip 122 is inserted into a gap formed in a top side of memory module 120 between first sheet 124 and second sheet 125. The first sheet 124 covers a first side of the dual inline memory module 121 and the second sheet 125 covers a second side opposite to the first side of the memory. In addition, a first strip 123 of the coupling clip 122 is placed over a portion of the first sheet 124. Referring to fig. 10C and 10D, the method further includes inserting the second strip 150 into an opening 141 formed on a top side of a frame 140 such that a space is formed between a wall 142 of the opening and the second strip. Referring to fig. 11A and 11B, the method further includes inserting the assembled memory module 120 into a space formed between the wall 142 of the opening 141 and the second strap 150. Referring to fig. 12A, the first strip 123 on a first side of the memory module 120 contacts the wall 142, and the second strip 150 contacts a second side of the memory module. The memory module 120 may alternatively be coupled to a Printed Circuit Board (PCB) located within the frame 140. In the assembly method, when there are multiple memory modules 120-1,120-2,120-3,120-4, the assembly order is important to avoid any interference that may result from an incorrect assembly order. See fig. 11B and 13. For example, as shown in FIG. 11B, memory modules are inserted into opening 141 in the order of 120-1,120-2,120-3, and 120-4 to avoid any interference.

Referring to fig. 16, the method further includes inserting a cover 143 into the opening 141 and moving the plastic cover to contact the memory module 120. A latch 121-1 of a connector included in the memory module 120 is closed by the cover 143, as shown in fig. 17A, 17B, and 18. Referring to fig. 19A and 19B, the method further includes coupling a metal cover 110 to the top side of the frame 140 such that the opening 141 is covered by the metal cover. When the metal cover 110 is removed from the top side of the frame 140, the memory module 120 may be accessed via the opening 141.

While various embodiments of the present invention have been described above, it should be understood that they have been presented by way of example only, and not limitation. Numerous variations may be made in accordance with the embodiments of the present invention disclosed herein without departing from the spirit or scope of the invention. Thus, the breadth and scope of the present invention should not be limited by any of the above-described embodiments. Rather, the scope of the present invention should be defined in accordance with the following claims and their equivalents.

One or more elements or features or steps, or any portion thereof, from any one or more of the following claims may be combined with one or more elements or features or steps, or any portion thereof, from any other one or more claims, or combinations thereof, to form one or more additional embodiments and/or claimed herein.

Although embodiments of the invention have been shown and described with respect to one or more implementations, equivalents and modifications will occur to others skilled in the art upon the reading and understanding of the specification and the annexed drawings. In addition, while a particular feature of the invention may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for any given or particular application.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, the terms "including," including, "and" having "or variations thereof as used in the detailed description and/or the claims are intended to be inclusive in a manner similar to the term" comprising.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. Furthermore, terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Claims (10)

1. A telecommunications system, comprising:

a chassis including an opening on a top side of the chassis;

a printed circuit board located in the case;

a memory module removably mounted on the circuit board, the opening being positioned and shaped such that the memory module is accessible through the opening; and

a cover removably coupled to the top side of the chassis such that the opening is covered by the cover.

2. The telecommunications system of claim 1, wherein the memory module comprises:

a dual inline memory module;

a first sheet covering a first side of the dual in-line memory module;

a second chip covering a second side of the dual inline memory module opposite the first side such that the dual inline memory module is positioned between the first chip and the second chip; and

a clip inserted into a gap formed in a top side of the memory module between the first and second sheets.

3. The telecommunications system of claim 2, wherein the memory module further comprises:

a first thermal pad coupled to an inner side of the first die; and

a second heat pad coupled to an inner side of the second die such that the dual inline memory module is positioned between the first heat pad and the second heat pad.

4. The telecommunications system of claim 3, wherein the memory module further includes a first strip coupled to the clip such that the first strip is positioned over a portion of the first sheet when the clip is inserted into the gap to form the memory module.

5. The telecommunications system of claim 4, wherein a latch of a connector of the dual in-line memory module is exposed through a side gap of the memory module formed between the first and second sheets.

6. The telecommunications system of claim 4, wherein the opening has a wall and is sized to receive a second strip.

7. The telecommunications system of claim 6, wherein the opening is further sized to receive the memory module such that the first strip on a first side of the memory module contacts the wall and the second strip contacts a second side of the memory module opposite the first side.

8. The telecommunications system of claim 6, wherein the opening is further sized to receive another memory module other than the second strip, the memory module being a first memory module and the another memory module being a second memory module, the first memory module including the first strip and being in contact with the second strip, a gap between the first and second memory modules being blocked by the first strip, a third strip of the second memory module being in contact with the wall.

9. The telecommunications system of claim 8, wherein the opening is further sized to receive a plastic cover that closes a first latch of a connector included in the memory module, the plastic cover further closing a second latch of a connector included in the second memory module, the plastic cover closing the first latch and the second latch when the plastic cover is moved to contact the first memory module and the second memory module.

10. The telecommunications system of claim 9, wherein: a first rubber or sponge coupled to the plastic cover and in contact with the first memory module and the second memory module; and

a second rubber or sponge is coupled to the plastic cover and has a plurality of cutouts such that air flow is allowed through the plurality of cutouts to the first and second memory modules, the second rubber or sponge blocking dust from entering the first and second memory modules.

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