CN217506474U - Die-casting cooling device and computing device - Google Patents

Abstract

The utility model discloses a die-casting cooling device and computing device for protecting computer components. The die-cast cooling device includes a cooling plate, a plurality of die-cast fins, an opening formed on the cooling plate, and a cover coupled to the cooling plate. The cooling plate extends between two sidewalls, and the cooling plate and the sidewalls are arranged to form a protective space for the computing element. A plurality of die cast fins are formed on the cooling plate extending away from the protective space. The opening provides access to the protected space. The cover is movable between a closed position in which the cover prevents access to the protected space and an open position in which the cover provides access to the protected space.

Description

Die-casting cooling device and computing device

Technical Field

The present invention relates generally to a die-cast fin, and more particularly to a die-cast fin having an opening and a cover.

Background

Telecommunication devices 100, such as 5G equipment, base stations for cellular networks (cellular networks), and servers, typically have compartments for holding various components, such as Printed Circuit Board Assemblies (PCBA) 120, memory modules 130, on-Board chips (on-Board chips) 140, and thermal pads 150, as shown in fig. 1B-1D. Since telecommunication devices are typically located in outdoor environments, components are protected from adverse environmental conditions and unauthorized access by die-cast fins 110 (heat sink, shown in fig. 1A) covering the compartments, as shown in fig. 1C and 1D. Referring to fig. 1A-1D, generally, die-cast fins 110 that transfer heat directly from a source (e.g., an on-board chip 140) are secured to a compartment by fasteners (e.g., screws 160) to enclose and protect the component from external elements. In such a configuration, a thermal pad 150 is placed between the board chip 140 and the die cast fins 110 to cool heat generated from the board chip. When the die-cast fin 110 is decoupled from the printed circuit board assembly 120 and the compartment to replace a Memory Module 130 (e.g., a Dual In-line Memory Module (DIMM)) mounted on the printed circuit board assembly, not only the Dual-line Memory Module, but also all other components including the thermal pad 150 are exposed. When the die-cast fin 110 is decoupled from the printed circuit board assembly 120, other components on the printed circuit board assembly may impede access to the two-wire memory module 130. For example, when the die cast fin 110 is opened to expand or replace the two-wire memory module 130, the thermal pad 150 may be adversely affected or damaged, making expansion/replacement of the two-wire memory module difficult.

Thus, a need has arisen for an improved die-cast fin that allows easy/direct access to a two-wire memory module without affecting other components. The present invention is directed to such die cast fins that provide easy access to a two-wire memory module for expansion, modification or replacement.

SUMMERY OF THE UTILITY MODEL

Example language and similar language (e.g., implementations, configurations, features, examples, and options) is intended to broadly refer to all subject matter of the present invention and the following claims. Several statements containing these terms should be understood as not limiting the meaning or scope of the subject matter described herein or the following claims. Embodiments of the invention covered herein are defined by the following claims, rather than by the teachings of the invention. This summary is a high-level overview of various features of the invention and introduces some of the concepts described more fully in the detailed description that follows. This summary is not intended to identify key or essential elements of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter. The subject matter should be understood by reference to the entire specification of the invention, including all drawings and each claim, to the appropriate scale.

According to certain features of the present invention, a die-casting cooling device for protecting a computer assembly is disclosed. The die-cast cooling device includes a cooling plate, a plurality of die-cast fins, an opening formed on the cooling plate, and a cover coupled to the cooling plate. The cooling plate extends between two sidewalls, and the cooling plate and the sidewalls are arranged to form a protective space for the computing element. A plurality of die cast fins are formed on the cooling plate extending away from the protective space. The opening provides access to the protected space. The cover is movable between a closed position in which the cover prevents access to the protected space and an open position in which the cover provides access to the protected space.

In some examples, the cover is pivotably coupled to the cooling plate. In some examples, the lid has parallel sides and lid walls extending from each side of the lid such that the lid walls face each other. In some examples, a protrusion is formed outwardly from each lid wall, and the opening has a corresponding receiving portion configured to receive the protrusion. The lid wall is inserted in the opening in the closed position such that the opening is sealed by the lid. A top surface of the cover is aligned with a top surface of the plurality of die cast fins in the closed position.

In some examples, the die cast cooling device further comprises a fastener inserted through the through hole of the cover. Further, the plurality of die cast fins include receiving portions, the fasteners being received by the receiving portions to directly couple the cover to the cooling plate. A portion of the cover is recessed relative to a top surface of the cover such that when the fastener is received in the receiving portion, a top of the fastener is positioned below the top surface of the cover. Further, the receiving portion is recessed relative to the top surface of the plurality of die cast fins such that when the fastener is received in the receiving portion, the top of the fastener is positioned below the top surface of the plurality of die cast fins. A portion of the cover protrudes from an edge of the cover, and a side of the opening corresponding to the edge of the cover is recessed to receive the protruding portion of the cover.

In some examples, the plurality of die-cast fins and the cap are made of different materials. For example, the cover is made of a synthetic polymer including plastic.

According to certain features of the present invention, a frame for enclosing a computing element includes a plurality of fins arranged in parallel, an opening, and a cover movable between a closed position and an open position to close or open the opening. In some examples, the plurality of fins includes fins of different lengths. In some examples, the frame further includes a fastener that passes through the through-hole of the cover and is received by the receiving portion of the frame such that the cover is directly coupled to the frame by the fastener.

According to certain features of the present invention, a computing device includes a Printed Circuit Board Assembly (PCBA), a memory module, and die cast fins. A plurality of computing elements are mounted on the printed circuit board assembly. The memory module is mounted on the printed circuit board assembly. The die cast fins cover the printed circuit board assembly. The die cast fin has a cover that is movable between an open position and a closed position. The cover covers the opening in the closed position. When the cover is in the open position, the memory module can be accessed.

In some examples, the cover is pivotably coupled to the die cast fin. When the cover is in the open position, the plurality of computing elements are not exposed and the memory module is exposed. In some examples, the cover includes a protrusion. The opening has a corresponding receiving portion configured to receive the protrusion. The cover is configured to pivot about an axis of the protrusion.

The above summary of the present invention is not intended to represent each embodiment or every feature of the present invention. Rather, the foregoing disclosure provides examples of some of the novel features and characteristics set forth herein. The above features and advantages, and other features and advantages of the present invention, will be readily apparent from the following detailed description of representative embodiments and modes when taken in connection with the accompanying drawings and appended claims. Additional features of the invention will be apparent to those skilled in the art in view of the detailed description taken in conjunction with the drawings and various embodiments, a brief description of which is provided below.

Drawings

The advantages of the invention will be better understood from the following description of embodiments with reference to the accompanying drawings. These drawings depict only exemplary embodiments and are not therefore to be considered to limit the scope of the various embodiments or the claims.

Fig. 1A is a front view of a prior art die cast fin.

Fig. 1B is a front view of a compartment of the device with the die cast fins shown in fig. 1A removed.

FIG. 1C is a cross-sectional view taken generally through the line A-A shown in FIG. 1B.

Fig. 1D is a general perspective view of a device having a die cast fin of the prior art.

Fig. 2 is a general perspective view of a die cast fin having an opening and a separate cover in accordance with certain features of the present invention.

Fig. 3 is an exploded view of the die cast fin of fig. 2 showing a coupling mechanism between the die cast fin and the cover in accordance with certain features of the present invention.

Fig. 4A-4C are general perspective views of die-cast fins in open and closed configurations according to certain features of the present invention.

Fig. 5A-5C are general perspective views of a device having a two-wire reservoir module and a die-cast fin with a lid in open and closed configurations according to certain features of the invention.

While the invention is susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and will be described in further detail herein. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed. On the contrary, the invention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

Description of the reference numerals

100 electric device

110 die-casting fin

120 printed circuit board assembly

130 two-wire memory module/memory module

140 on-board chip

150 heat conducting pad

160: screw

200 telecommunication device/arrangement

210 die-casting fin

212 cover

214 pins or screws

216 through hole

218 receiving part

220 projection part

222 receiving part

230 memory module

A is wire

Detailed Description

The utility model relates to a die-casting fin with opening and lid. The cover can be easily opened to allow easy access to the components located below the die cast fins. Thus, the die cast fins need not be removed from the device when access to the components of the device is necessary.

Various embodiments are described with reference to the drawings, wherein like reference numerals are used to refer to similar or equivalent elements throughout. The drawings are not necessarily to scale and are provided solely for the purpose of illustrating the invention. It should be understood that numerous specific details, relationships, and methods are set forth to provide a full understanding. One skilled in the relevant art will recognize, however, that the various embodiments can be practiced without one or more of the specific details, or with other methods. In other instances, well-known structures or operations are shown in detail to avoid obscuring certain features of various embodiments. Various embodiments are not limited by the illustrated ordering of acts or events, as some acts may occur in different orders and/or concurrently with other acts or events. Moreover, not all illustrated acts or events are required to implement a methodology in accordance with the present invention.

For the purposes of this embodiment, the singular includes the plural and vice versa unless explicitly stated otherwise. The term "including" means "including, but not limited to". Moreover, approximating language, such as "about" (about), and the like, may be used herein to mean, for example, "(at)," (near at), "(within 3-5% of," (within 3-5%) of, "within acceptable manufacturing tolerances," or any logical combination thereof. Similarly, the terms "vertical" or "horizontal" are intended to additionally include within "3-5% of the vertical or horizontal direction, respectively. Also, directional terms, such as "top," "bottom," "left," "right," "above," and "below," are intended to refer to equivalent directions as depicted in the referenced figures, as understood from the context of the referenced object or element, e.g., a common location for an object or element, or as otherwise described herein.

Referring to fig. 2, a die-cast fin or cooling device 210 (referred to herein as a "die-cast fin") according to an embodiment of the present invention has an opening that can be closed or opened by a lid 212. Generally, the die-cast fin 210 has a cooling plate and a plurality of fins formed on the cooling plate to form a protective space for the computing element. In one embodiment, the cover 212 is coupled to the cooling plate. In fig. 2, the cover 212 is removed from the die cast fin 210 for clarity.

Referring to fig. 2, according to various embodiments of the present invention, openings are formed in a portion of the die cast fin 210 such that the length of some of the fins is shortened by the openings as compared to the length of the fins that are not interrupted by the openings. In one embodiment, a shorter fin is formed on a first side of the opening of the die cast fin 210, the shorter fin extending perpendicular to the first side. In a further embodiment, the longer fins are formed at or near a second side of the opening of the die cast fin 210, the second side being perpendicular to the first side, and the longer fins extending along the second side. In a further embodiment, no fins are formed on a third side of the opening of the die-cast fin 210, the third side being parallel to the first side. In another further embodiment, no fins or fewer fins are formed on the fourth side of the opening of the die-cast fin 210 parallel to the second side compared to the number of longer fins formed near the second side.

In one embodiment, the cover 212 coupled to the die cast fin 210 is locked or unlocked by a coupling means or fastener (e.g., pin or screw 214) that passes through a through hole 216 of the cover 212 and is inserted into a receiving portion 218 formed at a portion of the die cast fin. The receiving portion 218 may be a socket or a through hole. The coupling of the cap 212 to the die cast fin 210 will be discussed with reference to fig. 3.

According to various embodiments of the present invention, the through-hole 216 is formed at a portion protruding from a side portion of the cover 212, as shown in fig. 2 to 5C. In one embodiment, the protruding portion is recessed relative to the top surface of the cover 212. In one embodiment, the recessed ledge of the cover 212 is surrounded by a wall. In one embodiment, a gap is formed between one of the walls and the protruding portion of the cover 212 such that a portion of the die cast fin 210 is visible through the gap when the cover 212 is closed. In an embodiment, the top of the pin or screw 214 inserted into the receiving portion 218 of the die cast fin 210 is positioned below the top surface of the cover 212 in the closed configuration.

According to various embodiments of the present invention, the die-cast fin 210 has a recessed portion at one side portion of the opening. The recessed portion of the die cast fin 210 is the size and shape of the recessed protruding portion that receives the cover 212. According to an embodiment, the fins formed between the edge and the first side of the recessed portion of the die cast fin 210 are even shorter than the shorter fins, such that the even shorter fins are located between the shorter fins on one side thereof and the shorter fins on the other side thereof. See fig. 2 through 5C.

Typically, the die-cast fin 210 is made of zinc, aluminum, or a zinc-aluminum alloy. However, the material used to cast the fins 210 is not limited to zinc, aluminum, or zinc-aluminum alloy, and may be made of any suitable die cast material. Although the cover 212 may be made of the same material as the die-cast fins 210, it is preferred that the cover be made of a different weather resistant/heat/water resistant material. For example, the cover 212 is made of a polymer (e.g., plastic) that can be easily and inexpensively formed into a desired shape. However, the material of the cover 212 is not limited to plastic, and the cover may be made of any material that is easily and inexpensively formed into the shape of the cover.

According to various embodiments of the present invention, the cover 212 has parallel walls facing each other, as shown in fig. 2, 3, 4B, 5A, and 5C. Each wall extends upright from a corresponding edge of the lid 212 such that the wall is perpendicular to the top surface of the lid. When the cover is closed, the walls of the cover 212 are inserted into the openings of the die cast fins 210. In one embodiment, the height of the two parallel walls is the same.

Referring to fig. 4A through 5C, the openings of the die cast fins 210 are sized such that when the cover is closed, there is no space or very little space formed between the walls of the cover 212 and the sides of the openings of the die cast fins to which the walls correspond. Thus, when the lid 212 is closed, a seal is achieved, protecting the components below the die cast fin 210 from the external environment. According to various embodiments of the present invention, the cover 212 has an additional wall extending upright from the other edge of the cover, such that the additional wall is perpendicular to the two parallel walls. In an embodiment the height of the additional wall and the two parallel walls is the same. In another embodiment, the height of the additional wall is less than the height of the two parallel walls.

Various coupling mechanisms may be employed to couple the lid 212 to the die cast fin 210. Referring to fig. 3, for example, the cover 212 has protrusions 220 formed on two opposite sides near the edge of the cover. However, the position of the protrusion 220 is not limited thereto, and the protrusion may be formed at a different position of the cover 212, for example, near another edge or a middle portion of the cover. The die-cast fin 210 has a receiving portion 222 formed near or at an inner wall of the opening, and the receiving portion 222 is shaped to receive the protrusion 220. The position of the receiving portion 222 is determined according to the position of the corresponding protrusion 220. In one embodiment, the protrusion 220 of the cover 212 is inserted into a corresponding receiving portion 222 of the die cast fin 210. Various hinge mechanisms may be employed to couple the cover 212 and the die-cast fin 210 instead of the combination of the protrusion 220 and the receiving portion 222 described above. It is preferable that the cover 212 not be completely removed from the die cast fins 210 even when the cover is in the open configuration. For example, the protrusion may be formed on the die-cast fin 210. In addition, a through hole to receive a receiving portion or a protrusion may be formed at the cover 212.

In an alternative embodiment, the cover 212 is completely removed from the die cast fins 210 when the cover is in the open configuration. For example, the lid 212 has at least one handle so that the lid can be opened by pulling the handle away from the die cast fins 210.

Referring to fig. 4A, when the cover 212 is in the closed position, the cover is coupled directly to the die cast fins 210 or locked by a locking mechanism. In one embodiment, a through hole 216 (shown in FIG. 3) is formed in a portion of the cover 212. In addition, a pin or screw 214 passing through the through hole 216 is received in a receiving portion 218, the receiving portion 218 being formed in a portion of the die cast fin 210. Alternatively, rather than using pins or screws 214, the protrusions may be formed in a portion of the cover 212 without the need for the through holes 216. The protrusion may be inserted directly into the receiving portion 218 of the die cast fin 210 when the cover 212 is in the closed configuration.

Referring to fig. 4B, to open the lid 212, the lid may be lifted by rotating about the axis of the protrusion 220 and the receiving portion 222. The pin or screw 214 needs to be unscrewed from the receiving portion 218 before the cover 212 is lifted, in order to prevent the cover 212 from being locked by the pin or screw 214, as shown in fig. 4A. In an embodiment, a pin or screw 214 may be maintained in a through hole 216 of the lid once the lid 212 is unlocked, even when the lid is lifted and opened, as shown in fig. 4B.

Referring to fig. 4C, the cover 212 is closed by rotating downward about the axis of the two protrusions 220 and the corresponding receiving portions 222 of the protrusions 220. Once the cover 212 is closed, the cover 212 may be locked by inserting the pin or screw 214 into the receiving portion 218, or rotating at the receiving portion 218.

Referring to fig. 5A, to replace or augment the memory module 230 of the computing or telecommunications device 200, the memory module 230 mounted on the printed circuit board assembly may be accessed through the openings of the die-cast fins 210. This can be achieved by opening the cover 212 without removing the entire die-cast fin 210 from the device 200. Thus, referring to fig. 5B, the memory module 230 may be replaced or augmented without damaging the computing or other components of the telecommunications device 200. Referring to fig. 5C, once the memory module 230 is replaced, modified, or expanded, the cover 212 is closed, thereby avoiding the possibility of damaging other components when the entire die-cast fin 210 is removed from the computing or telecommunications device 200.

While various embodiments of the present invention have been described above, it should be understood that they have been presented by way of example only, and not limitation. Various changes may be made in accordance with embodiments of the invention disclosed herein without departing from the spirit or scope of the invention. Thus, the breadth and scope of the present invention should not be limited by any of the above-described embodiments. Rather, the scope of the invention should be defined in accordance with the following claims and their equivalents.

One or more elements or features or steps or any part thereof from any one of the following claims may be combined with one or more elements or features or steps or any part thereof from one or more of any other claims or combinations thereof to form one or more additional embodiments and/or claims of the present invention.

Although the invention has been shown and described with respect to one or more implementations, equivalents and modifications will occur to others skilled in the art upon the reading and understanding of the specification and the annexed drawings. In addition, while a particular feature of the invention may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for any given or particular application.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, the terms "including," having, "" with, "or variations thereof, are used in the detailed description and/or the claims, and are intended to be inclusive in a manner similar to the term" comprising.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Furthermore, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Claims (9)

1. A die-cast cooling device for protecting a computer component, the die-cast cooling device comprising:

a cooling plate extending between two sidewalls, the cooling plate and the sidewalls being arranged to form a protective space for the computer assembly;

a plurality of die-cast fins formed on the cooling plate and extending away from the protective space;

an opening formed in the cooling plate for providing access to the protected space; and

a cover coupled to the cooling plate and movable between a closed position in which the cover prevents access to the protected space and an open position in which the cover provides access to the protected space.

2. The die cast cooling device of claim 1, wherein the cover is pivotally coupled to the cooling plate.

3. The die cast cooling device of claim 1, wherein the cover has parallel sides and a plurality of cover walls extending from each side of the cover such that the plurality of cover walls face each other.

4. The die-cast cooling device of claim 3, wherein a plurality of protrusions are formed outwardly from each of the cover walls and the opening has a corresponding plurality of receiving portions configured to receive the plurality of protrusions.

5. The die cast cooling device of claim 3, wherein the plurality of cover walls are inserted in the opening in the closed position such that the opening is sealed by the cover.

6. The die-cast cooling device of claim 5, wherein a top surface of the cover is aligned with a top surface of the plurality of die-cast fins in the closed position.

7. The die-cast cooling apparatus as claimed in claim 1, further comprising a fastener inserted through a through hole of the cover.

8. The die cast cooling device of claim 7, wherein the plurality of die cast fins include a receiving portion, the fastener being received by the receiving portion to directly couple the cover to the cooling plate.

9. A computing device, comprising:

a printed circuit board assembly on which a plurality of computing elements are mounted;

a memory module mounted on the printed circuit board assembly; and

a die cast fin covering the printed circuit board assembly, the die cast fin having a cover movable between an open position and a closed position, the cover covering an opening in the closed position, the memory module accessible when the cover is in the open position.

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