CN218122602U - Air duct and computer system - Google Patents

Abstract

The utility model discloses an air conduit and computer system. The air duct includes a housing for directing air to a plurality of slots in a computer system. The housing includes a plurality of side housing walls and a top housing wall. Side enclosure walls are respectively connected to opposite ends of the top enclosure wall. Side enclosure walls extend in the same direction from the top enclosure wall. The air duct further includes a plurality of fins extending from the top case wall in the same direction as the side case walls. Each fin of the plurality of fins is arranged on the top housing wall so as to be positioned between adjacent slots of the plurality of slots when the housing is positioned within the computer system.

Description

Air duct and computer system

Technical Field

The present invention relates generally to an air duct, and more particularly, to an air duct for guiding air between components in a computer system (e.g., a rack server system).

Background

Computer systems, and particularly rack-mounted server computer systems, are being provided with an increasing number of components in a similar, or even smaller and smaller, footprint or chassis. This makes the airflow required to regulate the temperature of components within a computer system a more difficult problem to handle.

An example of a component within a computer system that must be temperature regulated is a Dual Inline Memory Module (DIMM). Computer systems, and particularly rack-mounted server computer systems, may be equipped with a number of dual inline memory modules to meet complex computing requirements, such as numerical simulations, artificial intelligence, big data processing, and the like. An unmanaged dual inline memory module temperature may affect system performance or even worse, e.g., resulting in a high annual failure rate. Therefore, the air duct is used in the computer system to manage or guide the air flow on the dual in-line memory module, dissipate the heat generated by the dual in-line memory module, and make the dual in-line memory module operate in a safe temperature range. However, typical air ducts specific to dual inline memory modules only manage the overall airflow through the rows of dual inline memory modules.

For example, FIG. 1 shows a typical air duct design for directing airflow over dual inline memory modules in a conventional rack server system 100. The system 100 includes a chassis 101 formed by a bottom chassis wall 102 having a front end 104 and a back end 106. The chassis 101 further includes a multi-sided chassis wall 108 extending from the front end 104 to the back end 106. A system board 109, such as a motherboard, is attached to bottom chassis wall 102 of chassis 101. Attached to the system board 109 are a plurality of dual row inline memory modules 110, the dual row inline memory modules 110 extending away from the system board 109 and generally parallel to the side chassis walls 108. An air duct 112 in the chassis 101 directs airflow into the front end 104, through the dual in-line memory module 110, and in the direction of arrow 114 to the back end 106. Although the air duct 112 improves cooling of the dual inline memory module 110, the dual inline memory module 110 may still overheat, causing the above-described problems.

The present disclosure is directed to solving the above-mentioned problems by providing an air duct having fins that direct air across components within a computer system to improve heat dissipation.

SUMMERY OF THE UTILITY MODEL

The terms of the embodiments and similar terms (e.g., implementation, configuration, features, examples, and options) are intended to broadly refer to all subject matter of the present disclosure and the following claims. Several statements containing these terms should be understood as not limiting the meaning or scope of the subject matter described herein or the following claims. Embodiments of the disclosure covered herein are defined by the following claims, rather than by the present disclosure. This summary is a high-level overview of various features of the disclosure and introduces some of the concepts that are more fully described in the detailed description below. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter. The subject matter should be understood by reference to appropriate portions of the entire specification of this disclosure, any or all of the drawings, and each claim.

According to an embodiment of the present disclosure, an air duct is disclosed. The air duct includes a housing for directing air onto a plurality of slots within a computer system. The housing includes a plurality of side housing walls and a top housing wall. Side enclosure walls are respectively connected to opposite ends of the top enclosure wall. Side enclosure walls extend in the same direction from the top enclosure wall. The air duct further includes a plurality of fins extending from the top enclosure wall in the same direction as the side enclosure walls. Each fin of the plurality of fins is arranged on the top housing wall so as to be positioned between adjacent slots of the plurality of slots when the housing is positioned within the computer system.

The above summary of the present disclosure is not intended to represent each embodiment, or every feature, of the present disclosure. Rather, the foregoing disclosure provides only examples of some of the novel features and characteristics set forth herein. The above features and advantages and other features and advantages of the present disclosure are readily apparent from the following detailed description of the representative embodiments and modes for carrying out the invention when taken in connection with the accompanying drawings and appended claims. Additional features of the present disclosure will become apparent to those of ordinary skill in the art in view of the detailed description of the various embodiments, which is briefly described below with reference to the drawings.

Drawings

The disclosure, together with its advantages, will be best understood from the following description of exemplary embodiments when read in conjunction with the accompanying drawings. The drawings depict only exemplary embodiments and are not therefore to be considered to be limiting of the various embodiments or the claims.

FIG. 1 shows a perspective view of a prior art computer system having a conventional air duct design for a dual inline memory module.

FIG. 2 illustrates a perspective view of an air duct, according to a feature of the present disclosure.

FIG. 3 illustrates a front view of the air duct of FIG. 2, according to a feature of the present disclosure.

FIG. 4 illustrates a perspective view of a fin within an air duct, according to a feature of the present disclosure.

FIG. 5 illustrates a side view of FIG. 4, in accordance with a feature of the present disclosure.

FIG. 6 illustrates a side view of a fin of an air duct, according to another feature of the present disclosure.

Fig. 7 illustrates a side view of a fin of an air duct, according to yet another feature of the present disclosure.

FIG. 8 illustrates a detailed front view of an air duct, according to an aspect of the present disclosure.

Figure 9 illustrates a side view of a fin of an air duct positioned relative to an assembly in accordance with a feature of the present disclosure.

FIG. 10 shows the results of a Computational Fluid Dynamics (CFD) simulation of a component in a computer system cooled by airflow directed by a conventional air duct.

FIG. 11 illustrates computational fluid dynamics simulation results of a component within a computer system cooled by airflow directed by an air duct with fins of the present application, in accordance with a feature of the present disclosure.

While the present disclosure is susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and will be described in further detail herein. However, it should be understood that the disclosure is not intended to be limited to the particular forms disclosed. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the disclosure as defined by the appended claims.

Description of the reference numerals

100 system

101 case

102 bottom case wall

104 front end

106 back end

108 side cabinet wall

109 system board

110 double-row direct-insert memory module

112 air conduit

114 arrow head

200 air duct

202 casing

204 side shell wall

206 top shell wall

208 opening (opening)

210 assembly

212 groove

214 arrow head

216 inclined part

218 front end

300 fins

302 bottom surface

402 top surface

404 front end

406 back end

408 bottom surface

410 front edge

412 rear edge

D1 length

D2 height of

D3 height

500 is protruded

600 fin

602 top surface

604 front end

606 back end

608 bottom surface

610 front edge

612 rear edge

700 fin

702 top surface

704 front end

706 back end

708 bottom surface

710 front edge

712 rear edge

800 computer system

D4 is thickness

D5 is the distance

Maximum height D6

D7 is interval

900 component

1000 assembly

1002 hottest element

Detailed Description

Various embodiments are described with reference to the drawings, wherein like reference numerals are used to refer to like or equivalent elements throughout. The drawings are not to scale and are provided solely to illustrate features and characteristics of the present disclosure. It should be understood that numerous specific details, relationships, and methods are set forth to provide a full understanding. However, it will be apparent to one of ordinary skill in the art that the various embodiments may be practiced without one or more of the specific details or with other methods. In some instances, well-known structures or operations are not shown in detail for illustrative purposes. Various embodiments are not limited by the illustrated ordering of acts or events, as some acts may occur in different orders and/or concurrently with other acts or events. Moreover, not all illustrated acts or events are required to implement some features and characteristics of the present disclosure.

For the purposes of this embodiment, the singular includes the plural and vice versa, unless explicitly stated otherwise. The term "including" means "including, but not limited to". Moreover, approximating language, such as "about" (about), and the like, may be used herein to mean, for example, "(at)," (near at), "(within 3-5% of" "(within 3-5%) of" "," (within acceptable manufacturing tolerances), "or any logical combination thereof. Additionally, the terms "vertical" or "horizontal" are intended to additionally include within "3-5% of the vertical or horizontal direction, respectively. Moreover, directional terms such as "top," "bottom," "left," "right," "above," and "below" are intended to refer to equivalent directions as depicted in the referenced drawings; from the context of reference objects or elements, e.g. from the usual position of an object or element; or other description as such.

FIG. 2 illustrates a perspective view of an air duct 200, according to a feature of the present disclosure. The air duct 200 includes a housing 202, the housing 202 including a plurality of generally parallel side housing walls 204. The housing 202 further includes a top housing wall 206 connected to the side housing walls 204 and extending between the side housing walls 204. The top housing wall 206 and the side housing walls 204 define an opening 208. The opening 208 allows the housing 202 to be positioned on a circuit board, such as the system board 109 of FIG. 1, within a computer system (e.g., the computer system 100) such that the housing 202 covers components coupled to the computer system (e.g., the dual inline memory module 110 of FIG. 1). This allows the air conduit 200 to direct air, represented by arrows 214, through the opening 208 and over the assembly 210 for cooling. The housing 202 is further positioned to cover the plurality of slots 212 of the retention assembly 210. It should be understood that the air duct design of the example air duct 200 may be used with any computer system or computer-related device that includes dual inline memory modules or other components that require cooling, such as storage devices (e.g., cluster disks), switches, routers, 5G telecommunications components, etc.

In one or more embodiments, the top housing wall 206 includes a sloped portion 216 at a forward end 218 of the air duct 200. The angled portion 216 allows the area of the opening 208 to be larger to collect more air for cooling, but still above the top housing wall 206 of the air duct 200, providing space away from the rest of the front end 218.

FIG. 3 illustrates a front view of the air duct 200 of FIG. 2, according to a feature of the present disclosure. The air conduit 200 includes a plurality of fins 300 extending downwardly from the top housing wall 206 of the housing 202. More specifically, the fin 300 is connected to a bottom surface 302 of the top housing wall 206 and extends downward toward the assembly 210 and the slot 212. Each fin 300 is aligned to be positioned between adjacent slots 212. Thus, the fins 300 and slots 212 are positioned in an alternating arrangement on the housing 202 with one fin 300 extending downwardly between adjacent slots 212 and adjacent elements 210. However, other arrangements are also included, such as extending a fin 300 down between every other slot 212 and the element 210. In an embodiment of the air duct 200 that includes the angled portion 216, the fins 300 that extend from the top housing wall 206 of the air duct 200 begin above the angled portion 216.

Figure 4 illustrates a perspective view of a fin 300 according to a feature of the present disclosure. The fin 300 includes a top surface 402 coupled to the bottom surface 302 of the housing 202 (fig. 3). Fin 300 further includes a front 404 and a back 406. Fin 300 also includes a bottom surface 408. The front end 404 of the fin 300 may have a beveled front edge 410 such that the beveled front edge 410 tapers down and into the direction of the airflow (arrow 214, fig. 2). Conversely, the rear end 406 may have a straight vertical rear edge 412. However, other shapes of the fins 300 are also contemplated, such as the shapes shown in fig. 6 and 7 and described below.

Figure 5 illustrates a side view of the fin 300 of figure 4, in accordance with a feature of the present disclosure. Fig. 5 shows the top 402 and bottom 408 surfaces of fin 300, along with a sloped front edge 410 and a straight vertical back edge 412.

The length D1 of the fin 300 may vary depending on various factors, such as the size of the air duct 200, the size of the computer system, the location of the hottest portion of the corresponding component 210 with respect to which the fin 300 is located, or the like. In one or more embodiments, the length D1 of the fin 300 may be about 35 millimeters to about 95 millimeters, such as about 74.35 millimeters.

In one or more embodiments, the fin 300 can include a protrusion 500 on the bottom surface 408, the protrusion 500 being formed by the beveled front edge 410 at the front end 404. The protrusion 500 may further direct air within the opening 208 (fig. 2) of the air conduit 200 to cool the component 210 at a particular location relative to the location of the fins 300. In one or more embodiments, the height D2 of the fins 300 at the protrusion 500 can be about 10 millimeters to about 40 millimeters, such as about 15.4 millimeters. Above the protrusion 500, the height D3 may be about 10 mm to about 35 mm, such as about 9.4 mm.

Fig. 6 illustrates a side view of a fin 600 according to another feature of the present disclosure. Fin 600 is similar to fin 300 except that fin 600 does not include a protrusion, such as protrusion 500 of fin 300 (fig. 5). Thus, the fin 600 may alternatively have only a top surface 602, a bottom surface 608, a front end 604 having a sloped front edge 610, and a rear end 606 having a straight vertical rear edge 612. In this case, the fin 600 generally has a quadrangular shape having an inclined front edge 610.

Figure 7 illustrates a side view of a fin 700 according to yet another feature of the present disclosure. Fin 700 is similar to fin 600 except that fin 700 does not include an angled front edge, such as angled front edge 610 of fin 600 (fig. 6). Thus, the fin 700 may alternatively have only a top surface 702, a bottom surface 708, a front end 704 with a vertical front edge 710, and a back end 706 with a straight vertical back edge 712. Thus, the fin 700 is generally rectangular in shape.

Various other shapes of fins 300, 600, and 700 are contemplated, which may have a particular geometry to provide a particular directed cooling within a computer system. Accordingly, the present application is not limited to the disclosed fins 300, 600, and 700.

FIG. 8 illustrates a detailed side view of the air duct 200 in relation to the components 210 and slots 212 within a computer system 800, according to another aspect of the present disclosure. The thickness D4 of each fin 300 may be about 1 mm to about 3 mm, such as about 2 mm. The spacing D5 between the adjacent component 210 and the slot 212 may be about 6 millimeters to about 10 millimeters wide, such as about 7.54 millimeters wide. The thickness D4 may be controlled based on the spacing D5 of the components 210.

The maximum height D6 of the fin 300, such as the height D2 of the fin 300 with the protrusion 500 in fig. 5, may be about 10 mm to about 40 mm, such as about 15.4 mm. This height D6 may be determined based on the location of the fin 300 relative to the hottest portion of the device 210. For example, the bottom surface 408 (fig. 5) of the fin 300 may be determined so that it is adjacent to the hottest portion of the device 210. For example, in an embodiment of a 1.5 unit rack server computer system having a 7.54 mm pitch D5, the fins 300 may have a length D1 (fig. 5) of about 74.35 mm, a maximum height D6 (and height D2 in fig. 5) of 15.4 mm, and a thickness D4 of about 2 mm. With this arrangement, the spacing D7 between the fins 300 and the adjacent components 210 is about 1.13 millimeters. This spacing provides for directed cooling on the assembly 210.

Fig. 9 illustrates a side view of a fin 300 of an air tube 200 positioned in relation to a component 210, the component 210 being within a slot 212, in accordance with another feature of the present disclosure. The hottest part or element of the assembly 210 may be element 900. For example, the device 900 may be a Dynamic Random Access Memory (DRAM). Thus, the protrusion 500 may be positioned adjacent to the element 900 to direct airflow around the element 900, improving the cooling provided to the element 900.

FIG. 10 shows a fluid dynamic image of components 1000 in a computer system without the air duct of the present disclosure. In the illustrated configuration, the inlet air temperature is 53.2 ℃ and the speed is 4.2 meters/second. As shown, the hottest element 1002 of the assembly 1000 may have a temperature of about 83 ℃.

Referring to fig. 11, the same arrangement as shown in fig. 10 is shown, except that the component 1000 is now surrounded by the air duct 200 (fig. 2), with a fin 300 (fig. 4) within the air duct 200. With the air conduit 200 and fins 300, the hottest element 1002 of the assembly 1000 has a temperature of 80.3 ℃. Thus, the addition of the air conduit 200 and the fins 300 may improve the temperature of the assembly 1000 by about 5.9% since the fins 300 direct the airflow around the assembly 1000.

The foregoing description of embodiments, including illustrated embodiments, has been presented for the purposes of illustration and description only and is not intended to be exhaustive or to limit the precise forms disclosed. Many modifications, adaptations, and uses will be apparent to those skilled in the art.

Although embodiments of the present disclosure have been shown and described with respect to one or more implementations, equivalents and modifications will occur to others skilled in the art upon the reading and understanding of the specification and the annexed drawings. In addition, while a particular feature of the disclosure may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for any given or particular application.

While various embodiments of the present disclosure have been described above, it should be understood that they have been presented by way of example only, and not limitation. Many variations may be made in the embodiments of the disclosure described herein without departing from the spirit or scope of the disclosure. Thus, the breadth and scope of the present disclosure should not be limited by any of the above-described embodiments. Rather, the scope of the present disclosure should be defined in accordance with the following claims and their equivalents.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, the terms "including," including, "and" having "or variants thereof, as used in the description and/or the claims, are intended to be inclusive in a manner similar to the term" comprising.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. Furthermore, terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Claims (10)

1. An air duct, comprising:

a housing for directing air to a plurality of slots in a computer system, the housing comprising a plurality of side housing walls respectively connected to opposite ends of a top housing wall, and a top housing wall, the plurality of side housing walls extending in the same direction from the top housing wall; and

a plurality of fins extending from the top housing wall in the same direction as the plurality of side housing walls, each fin of the plurality of fins being arranged on the top housing wall so as to be positioned between adjacent slots of the plurality of slots when the housing is positioned within the computer system.

2. The air duct of claim 1, wherein each of the plurality of fins is a quadrilateral having an inclined front edge.

3. The air duct of claim 1, wherein each of the plurality of fins includes a projection extending downwardly from a bottom of the fin.

4. The air duct of claim 1, wherein each fin thickness of the plurality of fins is about 1 mm to about 2 mm.

5. The air duct of claim 1, wherein each fin of the plurality of fins has a length of about 35 mm to about 95 mm.

6. The air duct of claim 1, wherein each fin height of the plurality of fins is approximately 10 mm to 40 mm.

7. The air duct of claim 1, wherein the top enclosure wall includes a sloped portion at a front end of the air duct, and the plurality of fins extending from the top enclosure wall begin rearward of the sloped portion.

8. A computer system, comprising:

a chassis having a front end, a rear end, two side chassis walls, and a bottom chassis wall;

a plate connected to the bottom chassis wall, the plate having a plurality of slots, upward from the bottom chassis wall, each slot of the plurality of slots receiving a component; and

an air conduit coupled to the plate and positioned over the plurality of slots, the air conduit comprising:

a housing for directing air over the plurality of slots, the housing including side housing walls connecting the air conduit to the plate, and a top housing wall connected to and extending between the side housing walls; and

a plurality of fins extending from the top housing wall toward the plurality of slots, each fin of the plurality of fins being arranged on the top housing wall such that each component received by the plurality of slots is positioned between adjacent fins of the plurality of fins.

9. The computer system of claim 8, wherein each of the plurality of fins includes a protrusion extending from a bottom of the fin.

10. The computer system of claim 9, further comprising a plurality of components connected to the plurality of slots, wherein the protrusion of each of the plurality of fins is vertically aligned to be adjacent to a hottest portion of each of the plurality of components.

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