TWM625609U - Wafer Alignment Device - Google Patents

Abstract

A wafer alignment device includes a lifting and rotating mechanism arranged on a worktable, which includes a main shaft that can rise, fall or rotate along a Z axis; a clamp includes a clamping table connected to the main shaft and a plurality of clamps arranged around the clamping table Blocks and jaws for gripping the edge of the wafer, the jaws being controlled by a control mechanism to move relative to the jaws along the radial direction of the jaws toward or away from the center of the circle; first and second X The axis moving mechanism is set on the worktable; the edge finder and the reader are respectively set on the first and second X-axis moving mechanisms to be controlled to move along the X-axis, and the edge finder is used to detect the feature of the wafer for positioning And eccentricity correction, the reader is used to detect the marked part of the wafer. In this way, the present invention uses the jig to contact the edge of the wafer to avoid contamination or damage and improve product yield.

Description

Wafer Alignment Device

This creation is about a semiconductor manufacturing device, especially a semiconductor manufacturing device that can reduce the wear of the wafer due to vibration during the wafer manufacturing process.

With the advancement of science and technology and the improvement of people's living standards, semiconductor electronic products have been widely used in various fields of society and life, and are an indispensable part of modern life.

Before the semiconductor wafer (Wafer) enters the process equipment, the wafer needs to be positioned so that the pre-set flat edges or gaps on the wafer face the same position, so as to facilitate subsequent processing of the wafer after positioning. Specifically, the general wafer positioning method is to place the wafer on the tray through a robotic arm, the controller will control the rotation of the tray, and detect the flat edge or notch of the wafer through the wafer edge finder (Wafer Aligner). In order to quickly locate and correct the eccentricity of the wafer, it is sent to the tray of another machine, and the code after detection is interpreted by a charge coupled device (CCD), and then the robot arm lifts the wafer off the tray and sends it to the designated position .

However, in the process of moving and placing the wafer for many times, the wafer is prone to wear and damage due to vibration, which increases the cost, and the movement also increases the overall process time, thereby increasing a lot of time cost.

Furthermore, when the wafer is placed on the tray, the back of the wafer will contact the surface of the tray. When the controller controls the rotation of the tray, the friction and vibration between the wafer and the tray will generate nano-scale particles, thereby causing Particle contamination on the back of the wafer will cause scratches on the wafer, resulting in damage to the wafer, resulting in an increase in the defect rate and irreparable losses during the manufacturing process.

The main purpose of this creation is to provide a wafer alignment device with a wafer reader and an edge finder to reduce wafer movement and placement times during the process.

Another object of the present invention is to provide a wafer alignment device, which uses the edge of the grasping wafer to avoid contact between the back of the wafer and the surface of the tray, prevent contamination and damage of the wafer, and improve product yield.

In order to achieve the aforementioned purpose, the present invention will provide a wafer alignment device, including a worktable, a lifting and rotating mechanism, a fixture, a first X-axis moving mechanism, an edge finder, a second X-axis moving mechanism, and a reader.

The lifting and rotating mechanism is arranged on the worktable, and the lifting and rotating mechanism includes a main shaft which can ascend, descend or rotate along a Z axis.

The clamp is arranged on the upper end of the main shaft, and the clamp includes a clamping table connected to the main shaft, and a plurality of clamping blocks and a clamping claw arranged around the clamping table. The clamping blocks are used to clamp the edge of a wafer. The control mechanism is controlled to move relative to the chuck table toward or away from the center of the circle in a radial direction of the chuck table.

The first X-axis moving mechanism is arranged on the worktable.

The edge finder is arranged on the first X-axis moving mechanism to be controlled by the first X-axis moving mechanism to move along the X-axis.

The second X-axis moving mechanism is arranged on the worktable.

The reader is arranged on the second X-axis moving mechanism to be controlled by the second X-axis moving mechanism to move along the X-axis.

Wherein, through the control of a controller, the clamping table carries a wafer and then the edge of the wafer is clamped by the clamping jaws, the lifting and rotating mechanism drives the clamp to rise and then rotate, and the first X-axis moving mechanism and the second X-axis moving mechanism respectively move along the edge of the wafer. Move along the X-axis to move the edge finder and the reader to the wafer, the edge finder is used to detect a feature of the wafer for positioning and eccentric correction, and the reader is used to detect a mark of the wafer .

In some embodiments, when the wafer is clamped by the clamping blocks and the clamping jaws, there is a gap between the bottom surface of the wafer and the top surface of the clamping table.

In some embodiments, the clamping blocks and the clamping jaws respectively include a first placement portion, and the edge of the wafer is placed in the first placement portion.

In some embodiments, the wafer alignment apparatus further includes a positioning frame, the positioning frame is disposed on the worktable, and the positioning frame includes four positioning blocks for placing the wafers.

In some embodiments, each of the positioning blocks includes a second placement portion, and the edge of the wafer is disposed in the second placement portion.

In some embodiments, the wafer features are flat edges or notches.

In some embodiments, the reader is a charge coupled device (CCD).

The effect of the invention is that the reader and the edge finder can be used in the invention to reduce the movement and placement times of the wafer in the process.

Furthermore, the edge of the wafer is clamped by the jig, and the first placement portion is arranged so that there is a distance between the bottom surface of the wafer and the top surface of the clamping table, so as to prevent the bottom surface of the wafer from contacting the top surface of the clamping table. Contamination occurs, thereby avoiding scratches on the wafer, resulting in wafer damage, and improving the process yield.

The embodiments of the present invention will be described in more detail below with reference to the drawings and component symbols, so that those skilled in the art can implement them after studying the description.

FIG. 1 is a three-dimensional combined view of a wafer alignment apparatus according to a preferred embodiment of the invention. FIG. 2 is a front view of a wafer alignment apparatus according to a preferred embodiment of the invention. As shown in FIG. 1 and FIG. 2 , the present invention provides a wafer alignment device, including a worktable 10 , a lifting and rotating mechanism 20 , a fixture 30 , a first X-axis moving mechanism 40 , an edge finder 50 , a The second X-axis moving mechanism 60 and a reader 70 . The following is a detailed explanation of each part.

The workbench 10 includes a first workbench 11 and a second workbench 12, and the second workbench 12 is disposed on one side of the first workbench 11; the first workbench 11 includes an accommodating space (not shown in the figure) Preferably, the first workbench 11 includes a plurality of positioning holes 13, and passes through the positioning holes 13 through a plurality of fixing pieces (not shown in the figure), so that the first workbench 11 can be fixed on the ground to achieve a stable And the effect of positioning; wherein, an anti-vibration pad (not shown in the figure) can be further arranged between the first workbench 11 and the ground to achieve a better anti-vibration effect.

Preferably, the workbench 10 is rectangular, but the structure of the workbench 10 is not limited to this, and can be modified according to requirements.

The lifting and rotating mechanism 20 is disposed on the worktable 10 , and the lifting and rotating mechanism 20 includes a main shaft 22 that can ascend, descend or rotate along a Z axis 21 . Specifically, the elevating and rotating mechanism 20 further includes an elevating and rotating motor (not shown in the figure). The elevating and rotating motor is arranged in the accommodating space of the first worktable 11 and is connected to the lower end of the main shaft 22, and the upper end of the main shaft 22 extends from the upper end. Out of the accommodating space of the first worktable 11 , the lifting and rotating mechanism 20 drives the main shaft 22 to ascend, descend or rotate along the Z axis 21 .

FIG. 3 is a three-dimensional combined view of the lifting and rotating mechanism 20 and the fixture 30 of the wafer alignment apparatus according to the preferred embodiment. FIG. 4 is a cross-sectional view taken along line II-II of FIG. 2 . FIG. 5 is a schematic view of the rotation of the wafer 90 of the wafer alignment apparatus according to the preferred embodiment. As shown in FIG. 3 , FIG. 4 and FIG. 5 , in the preferred embodiment of the present invention, the clamp 30 is arranged on the upper end of the main shaft 22 ; Claw 33 and a control mechanism 36; the clamping table 31 is connected with the upper end of the main shaft 22, and a plurality of clamping jaws 33 and clamping jaws 33 are arranged on the periphery of the clamping table 31; wherein, the clamping blocks 32 are fixed on the periphery of the clamping table 31, The clamping blocks 32 are used to clamp the edge of a wafer 90 ; the clamping jaws 33 are movably arranged on the periphery of the clamping table 31 , and the clamping jaws 33 are controlled by the control mechanism 36 to be directed toward the center of the circle along the radial direction of the clamping table 31 . Or move relative to the clamping table 31 away from the center of the circle.

Specifically, the control mechanism 36 is arranged in the clamping table 31 and is connected with the clamping jaws 33 ; when the clamping blocks 32 clamp the edge of the wafer 90 , the control mechanism 36 drives the clamping jaws 33 along the edge of the clamping table 31 . The radial direction moves relative to the chuck table 31 toward the center of the circle to fix the wafer 90 on the chuck 30 .

When the wafer 90 needs to be taken out, the control mechanism 36 drives the clamping jaw 33 to move relative to the clamping table 31 along the radial direction of the clamping table 31 away from the center of the circle. Round 90 is taken out.

Among them, the gripping force of the clamping jaws 33 can be adjusted and controlled by the control mechanism 36 to reduce the damage of the wafer edge.

In the preferred embodiment of the present invention, the fixture 30 includes two clamping blocks 32 and one clamping jaw 33 , however, the number of the clamping blocks 32 and the clamping jaws 33 is not limited to this, and can be increased or decreased as required.

In the preferred embodiment of the present invention, the clamping blocks 32 and the clamping jaws 33 respectively include a first placement portion 34, and the edge of the wafer 90 is placed in the first placement portion 34; wherein, the edge of the wafer 90 is placed in the first placement portion 34. After the first placement portion 34 of the clamping blocks 32, the control mechanism 36 drives the clamping jaws 33 to move relative to the clamping table 31 along the radial direction of the clamping table 31 toward the center of the circle, so that the edge of the wafer 90 is located in the clamping jaws. The first placing portion 34 of the 33 can further achieve the effect of fixing the wafer 90 .

FIG. 6 is a partial enlarged view of the wafer 90 placed on the fixture 30 of the wafer alignment apparatus according to the preferred embodiment. As shown in FIG. 6 , when the edge of the wafer 90 is located at the first placing portion 34 , there is a distance 35 between the bottom surface of the wafer 90 and the top surface of the clamping table 31 ; The top surface of the clamping table 31 is contacted to cause contamination, thereby preventing the wafer 90 from being scratched, so that the wafer 90 is damaged, and the process yield is improved.

Since the clamp 30 is disposed on the upper end of the main shaft 22 , the lifting and rotating mechanism 20 can drive the main shaft 22 to raise or lower the clamp 30 along the Z axis 21 , so that the clamp 30 moves to a first position, a second position and a first position. Three positions.

FIG. 7 is a schematic diagram of the jig 30 of the wafer alignment apparatus according to the preferred embodiment in the first position. FIG. 8 is a schematic diagram of the clamp 30 in the second position according to the preferred embodiment of the invention. As shown in FIG. 7 and FIG. 8 , when the clamp 30 is located at the first position, the clamp 30 clamps the edge of the wafer 90 and makes the edge of the wafer 90 located at the first placement portion 34 of the clamp 30 . At this time, the Through the control of a controller (not shown in the figure), the lifting and rotating mechanism 20 drives the clamp 30 to rise to the second position.

Please refer to FIG. 5 and FIG. 9 . FIG. 9 is a schematic diagram of the movement of the first X-axis moving mechanism 40 and the second X-axis moving mechanism 60 of the wafer alignment apparatus according to the preferred embodiment. In the preferred embodiment of the present invention, the first X-axis moving mechanism 40 is arranged on the second worktable 12 ; the edge finder 50 is arranged on the first X-axis moving mechanism 40 to be controlled by the first X-axis moving mechanism 40 along the X-axis moves.

Specifically, the first X-axis moving mechanism 40 includes a first X-axis sliding rail 401 and a first X-axis sliding seat 402; the first X-axis sliding rail 401 is disposed on the second worktable 12, and the first X-axis sliding The seat 402 is movably arranged on the first X-axis sliding rail 401, and the edge finder 50 is arranged on the first X-axis sliding seat 402; when the first X-axis sliding seat 402 is relative to the first X-axis sliding rail 401 along the X-axis When moving, the edge finder 50 is also driven to move along the X axis.

The edge finder 50 is used to detect a feature 91 of the wafer 90 for positioning and eccentricity correction; preferably, the feature 91 of the wafer 90 is a flat edge or a notch.

The second X-axis moving mechanism 60 is disposed on the second worktable 12 ; the reader 70 is disposed on the second X-axis moving mechanism 60 to be controlled by the second X-axis moving mechanism 60 to move along the X-axis.

Specifically, the second X-axis moving mechanism 60 includes a second X-axis sliding rail 601 and a second X-axis sliding seat 602; the second X-axis sliding rail 601 is disposed on the second worktable 12, and the second X-axis sliding The seat 602 is movably disposed on the second X-axis sliding rail 601, and the reader 70 is disposed on the second X-axis sliding seat 602; when the second X-axis sliding seat 602 is relative to the second X-axis sliding rail 601 along the X-axis When moving, the reader 70 is also driven to move along the X axis.

The reader 70 is used for detecting a marking part 92 of the wafer 90 ; preferably, the marking part 92 can be the ID or serial number of the wafer 90 .

In the preferred embodiment of the present invention, the reader 70 is a charge-coupled device (CCD); however, the structure of the reader 70 is not limited to this, and can be changed to other structures as required.

Please refer to FIG. 1 and FIG. 10 . FIG. 10 is a schematic diagram of the jig located at the third position of the wafer alignment apparatus according to the preferred embodiment. In the preferred embodiment of the present invention, the wafer alignment device further includes a positioning frame 80 , the positioning frame 80 is disposed on the first worktable 11 , and the positioning frame 80 includes four positioning blocks 81 for placing the wafers 90 . Specifically, each of the positioning blocks 81 includes a second placement portion 82 , and the edge of the wafer 90 is disposed in the second placement portion 82 .

The placement method of the wafer 90 is to place the wafer 90 on the positioning frame 80 by means of an external robot arm or the like; however, the placement method of the wafer 90 is not limited to this, and can be changed as required.

During initial use, the fixture 30 is located at the third position, and the wafer 90 is placed on the positioning frame 80 by means of an external mechanical arm, so that the edge of the wafer 90 is set in the second placing portion 82, and the controller can control the lifting and rotating mechanism 20. Drive the fixture 30 to move up to move the fixture 30 to the first position; wherein, since the height of the fixture 30 at the first position is higher than the positioning frame 80, the edge of the wafer 90 is easy to move during the movement of the fixture 30 to the first position. It will be separated from the second placement portions 82 of the positioning blocks 81 and placed on the first placement portions 34 of the clamping blocks 32 .

Referring to FIGS. 7 and 8 , when the clamp 30 is in the first position, the edge of the wafer 90 is placed on the first placement portion 34 of the clamp blocks 32 , and the control mechanism 36 drives the clamp claws 33 along the clamp table. The radial direction of 31 moves relative to the clamping table 31 toward the center of the circle, so that the wafer 90 is fixed on the fixture 30; after the wafer 90 is fixed, the controller controls the lifting and rotating mechanism 20 to drive the fixture 30 to rise, so that the fixture 30 moves to the second position.

Referring to FIG. 9 , after the clamp 30 is moved to the second position, the controller controls the first X-axis sliding seat 402 of the first X-axis moving mechanism 40 and the second X-axis sliding of the second X-axis moving mechanism 60 The seat 602 moves in the direction of the wafer 90 along the X-axis respectively, and the first X-axis sliding seat 402 of the first X-axis moving mechanism 40 and the second X-axis sliding seat 602 of the second X-axis moving mechanism 60 will respectively drive The edge finder 50 and the reader 70 move along the X-axis at the same time, so that the edge finder 50 and the reader 70 move toward the direction of the wafer 90 .

After the edge finder 50 and the reader 70 move above the wafer 90, the controller controls the edge finder 50 to detect a feature 91 of the wafer 90, perform positioning and eccentricity correction, and controls the reader 70 to detect A marking portion 92 of the wafer 90 .

After the edge finder 50 detects the feature portion 91 of the wafer 90 and the reader 70 detects the mark portion 92 of the wafer 90, the controller controls the lifting and rotating mechanism 20 to drive the clamp 30 to descend, so that the clamp 30 moves to the first position. Three positions, since the height of the clamp 30 in the third position is lower than that of the positioning frame 80, when the clamp 30 moves to the third position, the edge of the wafer 90A will be separated from the first placement portion 34 of the clamp blocks 32, And placed on the second placement portion 82 of the positioning blocks 81 , so that the edge of the wafer 90 is placed in the second placement portion 82 , the wafer 90 can be taken away by an external robot arm and other devices, and the wafer 90 can be displaced. to the next work area.

Wherein, when the edge finder 50 or the reader 70 cannot detect the feature portion 91 or the mark portion 92 of the wafer 90, the controller controls the lifting and rotating mechanism 20 to drive the fixture 30 to rotate, so that the feature portion 91 or the mark portion 92 rotates To the range that can be detected by the edge finder 50 or the reader 70, and after the detection is completed, the fixture 30 is moved to the third position, and the external robotic arm and other devices can take the wafer 90 away and move it to the next working area .

However, after the controller controls the lifting and rotating mechanism 20 to drive the fixture 30 to rotate for many times, when the edge finder 50 or the reader 70 still cannot detect the feature portion 91 or the marking portion 92 of the wafer 90, the controller still controls the lifting and rotating The mechanism 20 drives the jig 30 to descend, so that the jig 30 moves to the third position, and devices such as an external robotic arm take the wafer 90 away and move it to another working area.

In the preferred embodiment of the present invention, the wafer 90 is described by taking a circle as an example, and the feature portion 91 is a cutout, but the structure of the wafer 90 is not limited to this.

FIG. 11 is a schematic diagram of clamping a flat-edge wafer 90 of a wafer alignment apparatus according to another embodiment of the invention. As shown in FIG. 11 , in another embodiment of the present invention, the feature portion 91A of the wafer 90A is a flat edge.

FIG. 12 is a schematic diagram of the jig 30A of the wafer alignment apparatus according to another embodiment of the invention located at the third position. FIG. 13 is a schematic diagram of the rotation of a fixture 30A of a wafer alignment apparatus according to another embodiment. FIG. 14 is a schematic diagram of the jig 30A of the wafer alignment apparatus according to another embodiment in the second position. FIG. 15 is a schematic diagram of the clamp 30A of the wafer alignment apparatus according to another embodiment of the invention clamping and rotating the flat-edge wafer 90A. As shown in FIGS. 12 , 13 , 14 and 15 , in another embodiment of the present invention, when the controller controls the lifting and rotating mechanism 20A to drive the clamp 30A to rotate several times, and the edge finder 50A or the reader 70A is still When the feature portion 91A or the marking portion 92A of the wafer 90A is not detected, the controller will control the clamp 30A to descend to the third position, so that the edge of the wafer 90A is separated from the first placement portion 34A of the clamp blocks 32A, and placed on the second placement portion 82A of the positioning blocks 81A.

After the clamp 30A is displaced to the third position, the controller will control the clamp 30A to rotate and rise to the second position again. The portion 34A is close to the edge of the wafer 90A, so that the edge of the wafer 90A is separated from the second placement portion 82A of the positioning blocks 81A.

After the clamp 30A is displaced to the second position, the controller will control the edge finder 50A or the reader 70A to detect the circular feature 91A or the mark 92A again, and move the clamp 30A to the first position after the detection is completed, The control mechanism 36A drives the clamping jaws 33A to move relative to the clamping table 31A along the radial direction of the clamping table 31A toward the center of the circle, so that the external robotic arm and other devices can take out the wafer 90A and move it to the next working area.

By disposing the positioning frame 80A and the third position, the situation that the feature portion 91A or the marking portion 92 of the wafer may be blocked by the clamp 30A can be avoided.

In another embodiment of the present invention, the wafer 90A is described by taking the feature portion 91A as a flat edge as an example, but the wafer 90 applicable to the present invention is not limited to this, and can be modified to have double Flat edge, square or square-like wafer 90 .

To sum up, the present invention can reduce the movement and placement times of the wafer 90 in the process by using the reader 70 and the edge finder 50 .

Furthermore, the edge of the wafer 90 is clamped by the clamp 30, and the first placement portion 34 is disposed, so that there is a distance 35 between the bottom surface of the wafer 90 and the top surface of the clamping table 31, so as to prevent the bottom surface of the wafer 90 from falling. Contact with the top surface of the clamping table 31 causes contamination to occur, so as to avoid scratches on the wafer 90 and damage to the wafer 90, thereby improving the process yield.

The above descriptions are only used to explain the preferred embodiments of this creation, and are not intended to limit this creation in any form. Therefore, any modifications or changes to this creation are made in the same creative spirit. , should still be included in the scope of protection intended for this creation.

10: Workbench

11,11A: The first workbench

12: Second workbench

13: Positioning hole

20,20A: Lifting and rotating mechanism

21: Z axis

22: Spindle

30,30A: Clamp

31,31A: clamping table

32,32A: Clamping block

33,33A: Gripper

34, 34A: First Placement Section

35: Spacing

36,36A: Control mechanism

40: The first X-axis moving mechanism

401: First X-axis slide rail

402: The first X-axis slide

50,50A: Edge Finder

60: Second X-axis moving mechanism

601: Second X-axis slide rail

602: Second X-axis slide

70,70A: Reader

80,80A: Positioning frame 81,81A: Positioning block 82, 82A: Second placement part 90,90A: Wafer 91,91A: Features 92,92A: Marking Section

FIG. 1 is a three-dimensional combined view of a wafer alignment apparatus according to a preferred embodiment of the invention. FIG. 2 is a front view of a wafer alignment apparatus according to a preferred embodiment of the invention. FIG. 3 is a three-dimensional combined view of the lifting and rotating mechanism and the fixture of the wafer alignment apparatus according to the preferred embodiment. FIG. 4 is a cross-sectional view taken along line II-II of FIG. 2 . FIG. 5 is a schematic diagram of the rotation of the wafer in the wafer alignment apparatus according to the preferred embodiment. FIG. 6 is a partial enlarged view of the wafer placement jig of the wafer alignment apparatus according to the preferred embodiment. FIG. 7 is a schematic diagram of the jig of the wafer alignment apparatus according to the preferred embodiment in the first position. FIG. 8 is a schematic diagram of the fixture in the second position of the wafer alignment apparatus according to the preferred embodiment. 9 is a schematic diagram of the movement of the first X-axis moving mechanism and the second X-axis moving mechanism of the wafer alignment apparatus according to the preferred embodiment. FIG. 10 is a schematic diagram of the jig located at the third position of the wafer alignment apparatus according to the preferred embodiment. FIG. 11 is a schematic diagram of clamping a flat-edge wafer of a wafer alignment apparatus according to another embodiment of the invention. FIG. 12 is a schematic diagram of a jig of a wafer alignment apparatus according to another embodiment of the invention located at a third position. FIG. 13 is a schematic diagram of the rotation of a fixture of a wafer alignment apparatus according to another embodiment of the invention. FIG. 14 is a schematic diagram of a jig located at a second position of a wafer alignment apparatus according to another embodiment of the invention. FIG. 15 is a schematic diagram of a clamp of a wafer alignment apparatus according to another embodiment of the invention that clamps and rotates a flat-edge wafer.

10: Workbench

11: The first workbench

12: Second workbench

13: Positioning hole

20: Lifting and rotating mechanism

30: Fixtures

40: The first X-axis moving mechanism

50: Edge Finder

60: Second X-axis moving mechanism

70: Reader

80: Positioning frame

81: Positioning block

Claims (7)

A wafer alignment device, comprising: a workbench; a lift-and-rotate mechanism disposed on the worktable, the lift-rotate mechanism comprising a main shaft that can ascend, descend or rotate along a Z axis; A clamp is arranged on the upper end of the spindle, the clamp includes a clamping table connected to the main shaft, a plurality of clamping blocks and a clamping claw arranged around the clamping table, and the clamping blocks are used for clamping a wafer. an edge, the jaws are controlled by a control mechanism to move relative to the table along the radial direction of the table toward or away from the center of the circle; a first X-axis moving mechanism, located on the worktable; an edge finder, arranged on the first X-axis moving mechanism, to be controlled by the first X-axis moving mechanism to move along the X-axis; a second X-axis moving mechanism, located on the worktable; as well as a reader, disposed on the second X-axis moving mechanism, to be controlled by the second X-axis moving mechanism to move along the X-axis, Wherein, through the control of a controller, after the clamping table supports a wafer, the clamping jaws clamp the edge of the wafer, the lifting and rotating mechanism drives the clamp to rise and then rotate, the first X-axis moving mechanism and the first X-axis moving mechanism The two X-axis moving mechanisms move along the X-axis respectively to move the edge finder and the reader to the wafer. The edge finder is used to detect a feature of the wafer for positioning and eccentricity correction , the reader is used for detecting a marking part of the wafer. The wafer alignment device according to claim 1, wherein when the wafer is clamped by the clamping blocks and the clamping jaws, there is a gap between the bottom surface of the wafer and the top surface of the clamping table. The wafer alignment device of claim 1, wherein the clamping blocks and the clamping jaws respectively comprise a first placing portion, and the edge of the wafer is placed in the first placing portion. The wafer alignment device according to claim 1, further comprising a positioning frame, the positioning frame is disposed on the worktable, and the positioning frame includes four positioning blocks for placing the wafer. The wafer alignment device according to claim 4, wherein each of the positioning blocks includes a second placement portion, and the edge of the wafer is disposed in the second placement portion. The wafer alignment device of claim 1, wherein the feature portion of the wafer is a flat edge or a notch. The wafer alignment apparatus of claim 1, wherein the reader is a charge coupled device (CCD).

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