TWM623396U - Display card back plate heat dissipation module - Google Patents

Abstract

The present invention provides a display card backplane heat dissipation module, which includes: a display card module, which at least includes a display card group, a heat dissipation group and a fan group, the display card module includes a display card substrate, the heat dissipation The set has a guide heat dissipation part protruding from the display card substrate; a backplane module, the backplane corresponding to the guide heat dissipation part is provided with a vacant part; a backplane heat dissipation module, including a heat dissipation fin group and At least one backplane heat pipe, the heat dissipation fin group is opposite to the vacant part, the backplane heat pipe passes through the heat dissipation fin group, and the end of the backplane heat pipe is close to a plurality of memory In this way, the heat source of the graphics card module in the body can be effectively guided and discharged, and the heat dissipation effect of the backplane heat pipe on the memory can be enhanced.

Description

Graphics card backplane cooling module

This creation relates to a display card structure, especially a backplane heat dissipation module used for the display card, so that the display card has an excellent heat dissipation effect, thereby ensuring the normal and stable performance of its operation.

Press, the display card is one of the most basic components of the computer. It is responsible for converting the display signals sent by the host to the monitor into general electrical signals, so that the monitor (screen) can clearly display the work content of the computer. The graphics card has a display chip (Video chipset/GPU or VPU/graphics processing unit or visual processor) for processing graphics or vision, which is the main processing unit of the graphics card, and the graphics card also includes storage (display memory/ video memory); and the current graphics cards generally have 3D picture calculation and graphics acceleration functions, so they are also called "graphics accelerator cards" or "3D acceleration cards"; In order to deal with the heat dissipation problem of the display card, the heat dissipation module is combined into one to facilitate the performance of the overall display card function.

As shown in FIG. 1 , the conventional heat dissipation module technology for graphics cards discloses a graphics card heat dissipation module 90 . The graphics card heat dissipation module 90 includes a graphics card module 91 , a heat dissipation module 92 and a backplane module 93 . , the display card module 91 is provided with a plurality of electronic component areas 911 and a plurality of wiring areas 912, the electronic component area 911 is provided for electronic components to be arranged, and the wiring area 912 is provided with electrical conduction lines, and the display card module A plurality of empty board areas 913 are further formed on the group 91, and a plurality of through holes 914 are formed on the empty board area 913; A plurality of fans 921, a set of heat dissipation fins 922 and at least one bottom plate 923 are used to attach the display card module 91 through the bottom plate 923, and a heat pipe (not shown) is also passed through the set of heat dissipation fins 922; The board module 93 is arranged on the lower side of the display card module 91, and the back plate module 93 is formed with a plurality of through holes 931 , the through holes 931 communicate with or are adjacent to the guide hole 914 .

In this way, the fan 921 generates air flow and sends it to the heat dissipation fin set 922, and takes away the heat energy of the heat dissipation fin set 922, and the air flow is sent to the display card module 91, and then passes through the corresponding guide holes 914 in the longitudinal direction. The hole 931 keeps the airflow away from the graphics card module 91 and the heat dissipation module 92, so that the airflow is not blocked by the graphics card module 91, so as to prevent the hot air from flowing back and being sucked by the fan 921, and to avoid the graphics card module 91 When there is residual heat, the overall air output can be increased and the heat dissipation efficiency can be improved.

Although the above-mentioned display card module heat dissipation group 90 is intended to be longitudinally connected or adjacent to the plurality of guide holes 914 of the display card module 91 and the plurality of through holes 931 of the backplane module 93, the airflow of the fan 921 can be achieved. Directly longitudinally passes through the heat dissipation fin set 922, the plurality of guide holes 914 of the display card module 91, and the plurality of through holes 931 of the backplane module 93, so as to achieve the theoretical purpose of preventing the hot air from flowing back and being sucked by the fan 921. However, there are still Its absence exists. For example, the display card module 91 is an important electronic component setting area. It is impractical to set a large number of plural guide holes 914 in the display card module 91, and the display card module 91 itself does not have much free area, even if The area, area and number of the plurality of vias 914 are also limited. To avoid thermal reflow through this structural method, it is difficult to achieve its exact effect, which is not an ideal structural design, and needs to be further solved and breakthrough. necessary.

For this reason, in view of the fact that the existing graphics card heat dissipation module is lacking in use and the structural design is not ideal, the creator of this case started to develop its solution, hoping to develop a solution that can avoid heat reflow and The display card backplane heat dissipation module with more heat dissipation effect is to promote the development of this industry. After a long time of conception, this creation came into being.

The purpose of this creation is to provide a heat dissipation module for the backplane of a display card, which can effectively guide and discharge the heat source of the display card module in the body, and has an excellent effect of avoiding heat reflow.

Another object of the present invention is to provide a heat dissipation module for the backplane of a display card, which can enhance the heat dissipation effect of the heat pipe of the backplane to the memory.

Another object of the present invention is to provide a heat dissipation module for the backplane of a display card, which can enable The display card module gives full play to the utilization effect of its component settings, improves the function, and prevents the display card module from destroying or reducing its utilization efficiency due to the perforation setting of the circuit board caused by the heat dissipation of the display card module.

The technical means adopted by the present invention to achieve the above-mentioned purpose include: a display card module, which at least includes a display card group, a heat dissipation group and a fan group, the display card group includes a display card substrate, and the heat dissipation group is arranged on the On the display card group, the heat dissipation group has a guide heat dissipation part protruding from the display card substrate, the fan group is arranged on the heat dissipation group, the fan group includes at least one fan, and the guide heat dissipation part corresponds to at least one of the A fan; a backplane module, including a backplane, the backplane is provided with a vacant part corresponding to the guide heat dissipation part; a backplane heat dissipation module, disposed on the backplane, the backplane heat dissipation module includes a A heat-dissipating fin group and at least one heat-dissipating fin group are arranged opposite to the vacant portion, and the back-plate heat-dissipating pipe passes through the heat-dissipating fin group.

In this embodiment, the display card substrate has a front surface and a back surface of the substrate, the front surface of the substrate is provided with at least one graphics processing unit (GPU), and the back surface of the substrate has a pair of graphics processing units (GPUs) corresponding to the graphics processing unit (GPU). dorsal area.

In this embodiment, a plurality of second heat sources are arranged around the back area of the graphics processor.

In this embodiment, the second heat sources are multiple memories.

In this embodiment, the backplane heat pipe has a final backplane heat pipe, and the end backplane heat pipe is close to a plurality of memories around the back area of the graphics processor.

In this embodiment, a plurality of corresponding heat dissipation patches are arranged on the memories in the back area of the graphics processor.

In this embodiment, the heat dissipation group includes a plurality of heat dissipation fins and at least one heat pipe penetrating the plurality of heat dissipation fins.

In this embodiment, the area of the vacant portion is equal to that of the guide and heat dissipation portion.

In this embodiment, the backplane has a backplane guide area corresponding to the back area of the graphics processor, and at least one heat dissipation guide is arranged around the backplane guide area, and the heat dissipation guide corresponds to contact the heat sink.

In this embodiment, the vacant portion extends toward the backplane guide area with a At least one heat pipe insert groove for arranging the heat pipe of the back plate.

In this embodiment, the heat dissipation guide is provided with a guide insert groove, and the guide insert groove communicates with the heat pipe insert groove.

In order to enable your reviewers to have a better understanding and understanding of the technical features of this creation and the effects achieved, I would like to provide a better embodiment diagram and a detailed description. The description is as follows:

1: Graphics card backplane cooling module

10: Graphics card module

11: Display deck

110: Display card substrate

110A: Backside of substrate

111: Graphics processor back area

112: Second heat source

1121: Memory

113: heat dissipation patch

12: Cooling group

121: cooling fins

121A: Guide heat sink

122: heat pipe

123: Bottom plate

13: Fan group

131: Fan Frame

132: Fan

133: Positioning pieces

20: Backplane module

21: Backplane

22: Vacancies

23, 24: Heat pipe inserts

231, 241: end slot

25, 26: Heat dissipation guide

251, 261: Guide insert groove

27: Backplane guide area

30: Backplane cooling module

31: Cooling fin group

32, 33: Backplane heat pipe

321, 331: end back plate heat pipe

50: Graphics Processing Unit (GPU)

FIG. 1 is a schematic diagram of the structure of a heat dissipation module for a conventional display card.

Figure 2 is a three-dimensional schematic diagram of the creation.

Figure 3 is an exploded schematic diagram of the creation.

Figure 4 is a schematic diagram of most of the three-dimensional flip of the creation.

Figure 5 is a schematic cross-sectional view of the creation.

Figure 6 is a schematic view of the creation from above.

Please refer to Figures 2, 3 and 4 to illustrate the embodiment of the structure of the display card backplane heat dissipation module of the present invention. The display card backplane heat dissipation module 1 disclosed in this embodiment includes a display card module 10, a backplane The board module 20 and the backplane heat dissipation module 30, the display card module 10 includes a display card group 11, a heat dissipation group 12 and a fan group 13, the display card group 11 has a display card substrate 110, the display card substrate 110 It has a front surface of the substrate and a back surface of the substrate. The surface shown in FIG. 3 is the back surface 110A of the substrate. The front surface of the substrate is provided with at least one graphics processing unit (GPU) 50 (see FIG. 6 ), and a plurality of memories and electronic components. , wiring, etc. (not shown), the back surface 110A of the substrate has a graphics processor back area 111, the graphics processor back area 111 corresponds to the graphics processing unit (GPU) 50 on the front surface of the substrate, the graphics processor back area 111 A plurality of second heat sources 112 are arranged around the area 111 , and the second heat sources 112 include memory, capacitors, and other heating elements other than graphics processors, and are not limited to this. In this embodiment, the second heat sources 112 is a plurality of memory cells 1121 , and a plurality of corresponding heat dissipation patches 113 are disposed on the memory cells 1121 .

The heat dissipation group 12 is disposed at the upper position of the front surface of the substrate of the display card group 11 (display card substrate 110 ). 123 is attached to the display card group 11, the heat dissipation group 12 is provided with at least one heat pipe 122 passing through it for guiding the heat source, and furthermore, the heat dissipation group 12 has a guide extending beyond/protruding from the display card substrate 110. The heat dissipation part 121A, in other words, after the heat dissipation group 12 is assembled with the display card substrate 110 (the display card group 11 ), the heat dissipation group 12 has a longer part/protruding part of the guide heat dissipation part 121A.

The above-mentioned heat dissipation group 12 can also be composed of other forms of heat dissipation, which is not limited. The heat dissipation group 12 mainly performs the heat dissipation operation of removing heat sources for the graphics processing unit (GPU) 50 and the plurality of memories.

The fan assembly 13 is disposed on the upper side of the heat dissipation assembly 12 , the fan assembly 13 includes a fan frame 131 , a plurality of fans 132 are arranged on the fan frame 131 , and the guide heat dissipation portion 121A at least longitudinally corresponds to a fan 132 , A positioning member 133 is disposed on the side of the fan frame 131 , and the positioning member 133 is fixed with the heat dissipation group 12 .

The backplane module 20 includes a backplane 21 , a side of the backplane 21 corresponding to the guide heat dissipation portion 121A is provided with a void portion 22 , in other words, the void portion 22 corresponds to the guide heat dissipation portion 121A, and the void portion The area/size of 22 is about the same as that of the guide and heat dissipation portion 121A; the backplane 21 is provided with a backplane guide area 27 corresponding to the graphics processor back area 111, and around the backplane guide area 27 is provided with at least A heat dissipation guide 25, 26, at the same time, the heat dissipation guide 25, 26 can also correspond to the memory 1121; in addition, the vacant portion 22 extends toward the backplane guide area 27 There are two heat pipe embedding grooves 23 , 24, the end sections of the heat pipe embedding grooves 23 and 24 respectively have an end section embedding groove 231 and 241. The grooves 231 and 241 also form guide insert grooves 251 and 261 respectively formed on the heat dissipation guides 25 and 26 . In other words, the guide insert grooves 251 and 261 communicate with the heat pipe insert grooves 23 and 24 respectively.

The backplane heat dissipation module 30 includes a heat dissipation fin group 31 and two backplane heat conduction pipes 32 and 33. The heat dissipation fin group 31 is composed of a plurality of heat dissipation fins. The backplane heat dissipation pipes 32 and 33 pass through the heat dissipation The fin group 31 extends to one side (relative to the direction of the back plate guide area 27 ), and the end sections of the back plate heat pipes 32 and 33 respectively have a final back plate heat pipe 321 and 331 .

Please also refer to FIG. 5. When the display card backplane heat dissipation module of the present invention is assembled, the backplane heat dissipation module 30 is assembled on the backplane module 20, and the heat dissipation fin group 31 is disposed opposite to the backplane module 20. At the vacant portion 22 of the back plate 21, the back plate heat pipes 32, 33 are respectively arranged in the heat pipe embedding grooves 23, 24 of the back plate 21, and the end back plate heat pipes 321, 331 are respectively arranged at the end portion The embedded grooves 231 and 241 are also located on the guide embedded grooves 251 and 261. Next, the backplane module 20 (including the backplane heat dissipation module 30) is assembled on the display card module 10 (display card substrate 110).

Please also refer to FIG. 6. When the heat dissipation module of the graphics card backplane is assembled and operated, the heat source of the graphics processing unit (GPU) 50 and the surrounding plural memories 1121 are guided by the heat pipes 122 of the heat dissipation group 12. The heat source is conducted to the guide and heat dissipation portion 121A, and the heat source at the guide heat dissipation portion 121A is dissipated by the fan 132 of the fan set 13, so that the heat source passes through the heat dissipation fin set 31 and is dissipated from the back plate 21. The vacant portion 22 is exhausted to achieve excellent heat dissipation and heat dissipation effects.

Furthermore, the heat source of the memory 1121 disposed on the backside 110A of the substrate is conducted through the heat dissipation patch 113, the heat dissipation guides 25, 26 and the backplane heat pipes 32, 33, so that the heat source is dissipated to the heat dissipation. The fin group 31 conducts conduction, especially the heat pipes 321 and 331 of the back plate at the end are respectively close to the plurality of memories 1121 around the back area 111 of the graphics processor, which can be more effectively conducted out around the back area 111 of the graphics processor The heat of the plurality of memories 1121, similarly, the heat source of the heat dissipation fin group 31 is dissipated by the fan 132 of the fan group 13, so that the heat source is discharged through the vacant portion 22 of the backplane 21, so as to achieve excellent heat dissipation , heat removal effect.

The display card backplane heat dissipation module of the present invention has the above-mentioned structure, which can effectively guide and discharge the heat source of the display card module in the body, and has an excellent effect of avoiding heat reflow; at the same time, the present invention can make the display card module The module gives full play to the utilization effect of its component settings, improves the function, and prevents the display card module from destroying or reducing its utilization efficiency due to the circuit board perforation arrangement caused by heat dissipation.

The present invention has been described in more detail through the above preferred specific embodiments, but the present invention is not limited to the above-mentioned examples, and within the scope of the technical idea disclosed in the present invention, various changes and modifications to these structures are still possible. It is within the scope of this creation.

1: Graphics card backplane cooling module

10: Graphics card module

11: Display deck

110: Display card substrate

110A: Backside of substrate

111: Graphics processor back area

112: Second heat source

1121: Memory

113: heat dissipation patch

12: Cooling group

121: cooling fins

121A: Guide heat sink

122: heat pipe

123: Bottom plate

13: Fan group

131: Fan Frame

132: Fan

133: Positioning pieces

20: Backplane module

21: Backplane

22: Vacancies

23, 24: Heat pipe inserts

231, 241: end slot

25, 26: Heat dissipation guide

251, 261: Guide insert groove

27: Backplane guide area

30: Backplane cooling module

31: Cooling fin group

32, 33: Backplane heat pipe

321, 331: end back plate heat pipe

Claims (11)

A display card backplane heat dissipation module, comprising: a display card module, which at least includes a display card group, a heat dissipation group and a fan group, the display card group includes a display card substrate, and the heat dissipation group is arranged on the display card On the assembly, the heat dissipation assembly has a guide heat dissipation portion protruding from the display card substrate, the fan assembly is disposed on the heat dissipation assembly, the fan assembly includes at least one fan, and the guide heat dissipation portion corresponds to at least one of the fans; A backplane module includes a backplane, and the backplane is provided with a vacant portion corresponding to the guiding heat dissipation portion; a backplane heat dissipation module is disposed on the backplane, and the backplane heat dissipation module includes a heat dissipation fin A sheet set and at least one heat-dissipating fin set are arranged opposite to the vacant part, and the heat-dissipating fin set is passed through the heat-dissipating fin set. The display card backplane heat dissipation module as described in claim 1, wherein the display card substrate has a substrate front and a substrate back, the front of the substrate is provided with at least one graphics processor, and the back of the substrate has a pair of corresponding graphics The graphics processor back area of the processor. The display card backplane heat dissipation module as described in item 2 of the patent application scope, wherein a plurality of second heat sources are arranged around the back area of the graphics processor. The display card backplane heat dissipation module as described in claim 3, wherein the second heat sources are a plurality of memories. The display card backplane heat dissipation module as described in item 4 of the patent application scope, wherein the backplane heat pipe has an end backplane heat pipe, and the end backplane heat pipe is closely attached to the surrounding of the graphics processor back area. multiple memories. The display card backplane heat dissipation module as described in item 4 of the patent application scope, wherein a plurality of corresponding heat dissipation patches are arranged on the memories in the back area of the graphics processor. The heat dissipation module of the display card backplane as described in claim 1 of the claimed scope, wherein the heat dissipation group comprises a plurality of heat dissipation fins and at least one heat pipe penetrating the plurality of heat dissipation fins. The heat dissipation module of the display card backplane as described in claim 1 of the claimed scope, wherein the area of the vacant portion is equivalent to the guide heat dissipation portion. The display card backplane heat dissipation module as described in item 6 of the patent application scope, wherein the backplane has a backplane guide area corresponding to the back area of the graphics processor, and at least one backplane guide area is arranged around the backplane guide area. A heat dissipation guide piece, the heat dissipation guide piece correspondingly contacts a heat dissipation patch. The display card backplane heat dissipation module as described in claim 9 of the claimed scope, wherein at least one heat pipe insert groove for arranging the backplane heat pipe extends from the vacant portion toward the backplane guide area. The heat dissipation module of the display card backplane as described in claim 10, wherein the heat dissipation guide member is provided with a guide member insertion groove, and the guide member insertion groove communicates with the heat pipe insertion groove.

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