TWM619734U - 具近接感測功能之耳機 - Google Patents
具近接感測功能之耳機 Download PDFInfo
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1041—Mechanical or electronic switches, or control elements
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/941—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated using an optical detector
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
- H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
- H10F55/255—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices formed in, or on, a common substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/941—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated using an optical detector
- H03K2217/94102—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated using an optical detector characterised by the type of activation
- H03K2217/94108—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated using an optical detector characterised by the type of activation making use of reflection
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1016—Earpieces of the intra-aural type
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2460/00—Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
- H04R2460/03—Aspects of the reduction of energy consumption in hearing devices
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Abstract
本創作提供一種具低透光率且無孔感測蓋的耳機，將該感測蓋覆蓋於近接感測裝置，可降低大部分環境光的干擾，提高量測準確性。
Description
本創作涉及具近接感測功能之耳機，特別是設置低透光率且無孔感測蓋的耳機。
無線耳機上配置近接感測裝置(proximity sensor, PS)用以偵測耳機配戴狀態，以開啟或停止耳機中的藍芽晶片，可避免電力損耗。
通常在感測過程中，近接感測裝置除了接收待測物反射的光線外，還會接收環境光(ambient light)形成干擾，影響感測器的量測結果。
為解決上述問題，本創作提供一種具低透光率且無孔感測蓋的耳機，將該感測蓋覆蓋於近接感測裝置上，可降低大部分環境光的干擾，改善量測的準確性。
一種具近接感測功能之耳機，包含：
一殼體，內部具有一容置空間；
一感測蓋，覆蓋該容置空間，與該殼體形成共平面，其中該感測蓋為無孔且厚度為0.5~1mm；
一音訊模組，設置於該容置空間內；
一近接感測封裝結構，設置於該感測蓋內側；以及
一控制單元，設置於該容置空間內，與該近接感測封裝結構及該音訊模組電性連接。
以下各實施例配合圖式，用以說明本創作之精神，讓本技術領域之人士能清楚理解本創作之技術，但非用以限制本發明的範圍，本創作之專利權範圍應由請求項界定。特別強調，圖式僅為示意之用，並非代表元件實際之尺寸或數量，部份細節可能也不完全繪出，以求圖式之簡潔。
請參閱圖1，為本創作耳機內部元件的示意圖。耳機1的殼體11內部具有容置空間，感測蓋13與殼體11結合形成共平面，容置空間內設有控制單元15、音訊模組以及近接感測封裝結構12，其中近接感測封裝結構12設置於感測蓋13內側的感測孔111，電連接於控制單元15。
在一實施例中，殼體11內側或容置空間表面更可覆蓋黑色矽膠層，可降低外部環境光穿透殼體11的穿透率。
感測蓋13為無孔且厚度為0.5~1mm，選用對可見光具有小於5%透光率的材質，包含聚甲醛、透明環氧樹脂或聚烯烴。
音訊模組包含音訊播放單14元設置於音訊孔112，以及收音單元16設置於收音孔113，音訊播放單元14及收音單元16分別電連接至控制單元15。
在一實施例中，耳機1更包含通訊單元18連接至控制單元15，可將從近接感測裝置輸出的距離感測訊號及/或從收音單元16輸出的收音音訊有線或無線地傳輸至外部電子裝置(圖未示)，或者通訊單元18接收從外部電子裝置傳輸的播放音訊，再透過控制單元15傳輸至音訊播放單元14，以及更包含電池單元17電連接至控制模組15，以供給控制單元15、音訊模組、通訊單元18以及近接感測封裝結構12運作的電力。
接著參閱圖2，為本創作近接感測封裝結構側視圖。近接感測裝置封裝結構12包含發光單元122設置於基板121的表面的一端，感光元件123設置於基板121的表面的另一端，以及透明封裝殼體124覆蓋基板121、發光單元122以及感光元件123，其中透明封裝殼體124具一溝槽125介於發光單元122與感光元件123之間，溝槽125朝基板121方向延伸並以不透光材料126填滿。
在一實施例中，基板121的表面上可選擇地覆蓋一黑色層，其材料為具高光吸收率，可避免光經基板121反射干擾感光元件123。
近接感測裝置封裝結構12的整體高度H介於0.5mm至0.7mm之間。溝槽125寬度為80μm~120μm，溝槽125與基板121的表面具有一間距D，該間距D為20μm~100μm，可減少會避免光串擾的情況，確保感光元件之功能，其中不透光材料126為矽晶圓、金屬、環氧樹脂、樹脂與矽膠混合膠或壓克力膠或其組合，以及透明封裝殼體124的材料為低分子量環氧樹脂，其光折射率介於1.55至1.65之間。
發光單元122採用垂直共振腔面射型雷射或雷射二極體，其具有較小的光發散角，有效降低光散射的情況，相對在封膠傳播的光也減少，隨之降低串音干擾。發光單元122所發出的檢測光可部分穿透感測蓋13，經待測物反射之反射光亦可穿透感側蓋13，使得感光元件123可接收反射光。
本創作提出一種具有無孔且低透光率感測蓋的耳機，可降低環境光的干擾，提高距離感測的準確性，且無孔設計的感測蓋可提升防塵防水效果且美觀。
1:耳機
11:殼體
12:近接感測封裝結構
13:感測蓋
14:音訊播放單元
15:控制單元
16:收音單元
17:電池單元
18:通訊單元
111:感測孔
112:音訊孔
113:收音孔
121:基板
122:發光單元
123:感光元件
124:透明封裝殼體
125:溝槽
126:不透光材料
H:高度
D:間距
圖1為本創作耳機內部元件的示意圖。
圖2為本創作近接感測封裝結構側視圖。
1:耳機
11:殼體
12:近接感測封裝結構
13:感測蓋
14:音訊播放單元
15:控制單元
16:收音單元
17:電池單元
18:通訊單元
111:感測孔
112:音訊孔
113:收音孔
Claims (10)
- 一種具近接感測功能之耳機，包含： 一殼體，內部具有一容置空間； 一感測蓋，與該殼體結合形成共平面，其中該感測蓋為無孔且厚度為0.5~1mm； 一音訊模組，設置於該容置空間內； 一近接感測封裝結構，設置於該感測蓋內側；以及 一控制單元，設置於該容置空間內，與該近接感測封裝結構及該音訊模組電性連接。
- 如請求項1所述之耳機，其中該近接感測封裝結構包含： 一發光單元，設置於一基板的表面的一端； 一感光元件，設置於該基板的表面的另一端；以及 一透明封裝殼體，覆蓋該基板、該發光單元以及該感光元件，其中該透明封裝殼體具一溝槽介於該發光單元與該感光元件之間，該溝槽朝該基板方向延伸並以一不透光材料填滿。
- 如請求項2所述之耳機，其中該溝槽寬度為80μm~120μm，以及該溝槽與該基板的表面具有一間距，該間距為20μm~100μm。
- 如請求項2所述之耳機，其中該發光單元為垂直共振腔面射雷射或發光二極體。
- 如請求項2所述之耳機，其中該基板的所有表面覆蓋一黑色矽膠層。
- 如請求項2所述之耳機，其中該不透光材料為矽晶圓、金屬、環氧樹脂、樹脂與矽膠混合膠或壓克力膠或其組合。
- 如請求項1所述之耳機，其中該近接感測封裝結構的整體高度介於0.5mm至0.7mm之間。
- 如請求項1所述之耳機，其中該感測蓋具小於5%的透光率。
- 如請求項8所述之耳機，其中該感測蓋的材料種類為聚甲醛、透明環氧樹脂或聚烯烴。
- 如請求項1所述之耳機，其中該殼體內側的所有表面覆蓋一黑色矽膠層。
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110210047U TWM619734U (zh) | 2021-08-25 | 2021-08-25 | 具近接感測功能之耳機 |
| CN202122429544.8U CN215912212U (zh) | 2021-08-25 | 2021-10-09 | 具有近接感测功能的耳机 |
| US17/502,950 US11611821B1 (en) | 2021-08-25 | 2021-10-15 | Earphone with proximity sensing function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110210047U TWM619734U (zh) | 2021-08-25 | 2021-08-25 | 具近接感測功能之耳機 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM619734U true TWM619734U (zh) | 2021-11-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110210047U TWM619734U (zh) | 2021-08-25 | 2021-08-25 | 具近接感測功能之耳機 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US11611821B1 (zh) |
| CN (1) | CN215912212U (zh) |
| TW (1) | TWM619734U (zh) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220012554A (ko) * | 2020-07-23 | 2022-02-04 | 삼성전자주식회사 | 마이크를 포함하는 오디오 출력 장치 |
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2021
- 2021-08-25 TW TW110210047U patent/TWM619734U/zh not_active IP Right Cessation
- 2021-10-09 CN CN202122429544.8U patent/CN215912212U/zh not_active Expired - Fee Related
- 2021-10-15 US US17/502,950 patent/US11611821B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US11611821B1 (en) | 2023-03-21 |
| CN215912212U (zh) | 2022-02-25 |
| US20230061606A1 (en) | 2023-03-02 |
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