TWM610474U - Adjustable elevation system for transporting wafer - Google Patents

Abstract

An adjustable lifting system for transferring wafers includes a base and a support. The susceptor is arranged under the carrier where the wafer is placed. The supporting member includes a main body, an adjusting screw member, a moving pin, an elastic sleeve and an elastic element. The body has a bottom space and a through hole communicating with the bottom space. The through hole has an inclined wall surface that tapers from bottom to top. The adjusting screw is inserted through the bottom space. The moving pin penetrates through the through hole, and the moving pin has a supporting end protruding from the body. The elastic sleeve is sleeved outside the moving pin and abuts against the inclined wall surface. One end of the elastic sleeve is connected to the top end of the adjusting screw member. The elastic element is inserted between the bottom end of the adjusting screw member and the bottom wall of the base. When the adjusting screw member is displaced upward due to rotation, it will receive the buffer force from the elastic element to fine-tune the height of the upward displacement.

Description

Adjustable lifting system for transferring wafers

The present invention relates to a lifting system, and particularly to an adjustable lifting system for transferring wafers.

The semiconductor industry is constantly developing vigorously. Technological advances in semiconductor design and materials have allowed semiconductor devices to have smaller and more complex circuits. The functional density of semiconductor devices generally increases and the size decreases, which can improve production efficiency and reduce costs. Therefore, semiconductor devices are gradually developing towards high functional density.

With the development of semiconductor technology, the requirements for precision in the manufacturing process of semiconductor devices are becoming higher and higher. However, as the accuracy requirements increase, it is more difficult to maintain the process quality and stability of the semiconductor device, which not only affects the yield but also affects the yield. Therefore, how to set up accurate and reliable semiconductor process equipment is actually the focus of attention of relevant personnel in the field.

The "prior art" paragraph is only used to help understand the content of the present invention. Therefore, the contents disclosed in the "prior art" paragraph may include some conventional technologies that do not constitute the common knowledge in the technical field. The content disclosed in the "prior art" paragraph does not represent the content or the problem to be solved by one or more embodiments of the present invention, and has been known or recognized by those with ordinary knowledge in the technical field before the application of the present invention.

The present invention provides an adjustable lifting system for transferring wafers, which can greatly improve the accuracy of the lifting system.

The other objectives and advantages of the present invention can be further understood from the technical features disclosed in the present invention. The adjustable lifting system for transferring wafers of this invention includes a base and at least one support. The base is arranged under a bearing seat where the wafer is placed. The support includes a body, an adjusting screw, a moving pin, an elastic sleeve and an elastic element. The body has a bottom space and a through hole communicating with the bottom space. The bottom space has an inner wall surface. A first thread structure is formed on the inner wall surface. The through hole has an inclined wall surface that tapers from bottom to top. The adjusting screw member penetrates through the bottom space. The adjusting screw has a top end, a bottom end and a second thread structure screwed with the first thread structure. The moving pin penetrates through the through hole, and the moving pin has a supporting end protruding from the body. The elastic sleeve is sleeved outside the moving pin and abuts against the inclined wall surface. One end of the elastic sleeve is connected to the top end of the adjusting screw member. The elastic element is inserted between the bottom end of the adjusting screw member and a bottom wall of the base. When the adjusting screw generates an upward displacement due to rotation, it will receive a buffer force from the elastic element to finely adjust a height of the upward displacement.

In an embodiment of this creation, the number of the above-mentioned support members is at least four.

In an embodiment of the present creation, the above-mentioned elastic element is a spring.

In an embodiment of this creation, the above-mentioned elastic element is a stainless steel spring.

In an embodiment of the present invention, the material of the elastic sleeve mentioned above includes a phenolic resin.

In an embodiment of the present invention, the material of the elastic sleeve mentioned above includes a polyether ether ketone.

In an embodiment of this creation, the aforementioned adjusting screw member is a bolt.

Based on the above, the adjustable lifting system for transferring wafers provided by this creation can fine-tune the position of the moving pin relative to the base by setting the adjusting screw and the moving pin on the support, thereby allowing the position of the support end to be fine-tuned. By fine-tuning the position of the support end, it is possible to accurately ensure the stability of the loaded wafer, greatly improve the accuracy of the adjustable lifting system, effectively improve the accuracy of the semiconductor process/operation, and improve the yield and efficiency.

In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows.

The aforementioned and other technical content, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, for example: up, down, left, right, front or back, etc., are only directions for referring to the attached drawings. Therefore, the directional terms used are used to illustrate and not to limit this creation.

Please refer to FIG. 1, which is a schematic diagram of an adjustable lifting system 1 for transferring wafers W according to an embodiment of the present invention. FIG. 1 shows a semiconductor process device S. The semiconductor processing device S includes a plurality of chambers C1, C2, C3, C4, a plurality of working areas P1, P2, P3, P4, and a mobile device M. Each of the chambers C1, C2, C3, C4 or the work areas P1, P2, P3, P4 can run a specific semiconductor manufacturing process and/or operation, but this creation is not limited thereto. In this embodiment, the chambers C1, C2, C3, and C4 can, for example, run a specific semiconductor process, and the work areas P1, P2, P3, P4 can run, for example, wafer transfer, placement, rotation, and/or cooling, etc. operation. The mobile device M can be arranged in a central chamber CM, but this creation is not limited to this. The moving device M is arranged between the chambers C1, C2, C3, C4 and the working areas P1, P2, P3, P4, and is used to move the wafer W in the chambers C1, C2, C3, Between C4 and these working areas P1, P2, P3, and P4. The adjustable lifting system 1 is arranged on the mobile device M, which can greatly improve the accuracy when transferring the wafer W, effectively improve the accuracy of the semiconductor manufacturing process/operation, and improve the yield and efficiency. The specific structure and operation details will be described in detail below.

Please also refer to FIG. 2, which is a schematic diagram of an adjustable lifting system 1 for transferring wafers W according to an embodiment of the present invention. FIG. 2 is a partial schematic diagram of the semiconductor processing apparatus S when it is in the chamber C1. In detail, the mobile device M may include a telescopic device Me and a supporting element Mb. In this embodiment, the bearing element Mb is arranged at one end of the telescopic device Me. The wafer W may be arranged on the carrier element Mb. Taking the chamber C1 as an example, through the telescopic movement of the telescopic device Me, the wafer W can be allowed to enter and exit the chamber C1. After the wafer W enters the chamber C1, it can be located on the adjustable lifting system 1. The mobile device M can rotate to allow the wafer W to enter and exit the chambers C1, C2, C3, C4 and the working areas P1, P2, P3, P4. The structure of the mobile device M shown in FIG. 1 and FIG. 2 is only for schematic illustration, and is not intended to limit the creation.

The present invention does not limit the mechanical structure of the semiconductor process device S or the types of processes that it runs. The semiconductor process device S shown in FIG. 1 is only an example. As long as it is a semiconductor process device/equipment that needs to use wafer transfer, it is within the scope of this creation.

Please refer to FIG. 3 at the same time. FIG. 3 is a schematic diagram of an adjustable lifting system 1 for transferring wafers W according to an embodiment of the present invention. 3 is a schematic side view of the adjustable lifting system 1 in the chamber C1 of the semiconductor processing apparatus S shown in FIG. 1. The adjustable lifting system 1 includes a base 11 and at least one support 15. The susceptor 11 is disposed under a carrier 13 on which the wafer W is placed. The supporting member 15 is installed on the base 11 and passes through the through hole 131 of the supporting base 13.

Please refer to FIGS. 4A to 4F at the same time. FIGS. 4A to 4F are schematic diagrams of the operation flow of the adjustable lifting system 1 shown in FIGS. 1 and 3. FIG. 4A shows the base 11, the supporting seat 13 and the supporting member 15 in the cavity C1 (not shown in FIG. 4A ). Then, as shown in FIG. 4B, the moving device M moves through the expansion and contraction of the expansion device Me, so that the wafer W enters the chamber C1 along with the carrier element Mb. Then, as shown in FIG. 4C, the support 15 rises with the base 11. The support 15 passes through the carrying element Mb and then abuts against the wafer W, so that the wafer W is out of contact with the carrying element Mb.

Specifically, the projected area of the wafer W on the x-y plane shown in FIGS. 1 and 3 has a non-overlapping part with the projected area of the carrier element Mb on the x-y plane. The supporting member 15 is arranged at these non-overlapping portions, so that the supporting member 15 can pass through the carrier element Mb and abut the wafer W. The present invention does not limit the structure and shape of the supporting element Mb, as long as the supporting element Mb can support the wafer W and the supporting member 15 can pass through.

Then, as shown in FIG. 4D, the moving device M moves through the expansion and contraction of the telescopic device Me, so that the bearing element Mb leaves the cavity C1. Then, as shown in FIG. 4E, the supporting member 15 descends along with the susceptor 11, so that the wafer W is lowered and placed on the carrier 13. Then, as shown in FIG. 4F, the bearing base 13 can be raised, for example, but this creation is not limited by this. Through the adjustable lifting system 1, the wafer W is set on the carrier 13 to perform various processes or operations on the wafer W.

5 is a schematic side view of the adjustable lifting system 1 in the chamber C1 of the semiconductor processing apparatus S shown in FIGS. 1 and 3. For clear and convenient description, FIG. 5 shows a schematic diagram of the adjustable lifting system 1 in the area A in FIG. 3. In detail, the supporting member 15 includes a main body 151, an adjusting screw member 153, a moving pin 155, an elastic sleeve 159 and an elastic element 157.

The body 151 has a bottom space 1511 and a through hole 1515 communicating with the bottom space 1511. The bottom space 1511 has an inner wall 1513. A first thread structure S1 is formed on the inner wall 1513. The through hole 1515 has an inclined wall 1517 that tapers from bottom to top. The adjusting screw 153 passes through the bottom space 1511. The adjusting screw 153 has a top end 1531, a bottom end 1533, and a second thread structure S2 suitable for screwing with the first thread structure S1.

The moving pin 155 passes through the through hole 1515. The moving pin 155 has a supporting end 1551 protruding from the main body 151. As shown in FIG. 5, the elastic sleeve 159 is sleeved outside the moving pin 155 and abuts against the inclined wall 1517. One end of the elastic sleeve 159 is connected to the top end 1531 of the adjusting screw 153. Specifically, the elastic sleeve 159 is disposed between the adjusting screw 153 and the moving pin 155. The elastic element 157 is inserted between the bottom end 1533 of the adjusting screw 153 and a bottom wall 111 of the base 11. When the adjusting screw 153 generates an upward displacement d due to rotation, it will receive a buffer force from the elastic element 157 to finely adjust a height h of the upward displacement d. The supporting member 15 can finely adjust the position of the moving pin 155 relative to the base 11 through the setting of the adjusting screw member 153 and the moving pin 155, so that the position of the supporting end 1551 can be finely adjusted. When a plurality of the support members 15 support the wafer W with a plurality of the support ends 1551, the position of the support end 1551 can be fine-tuned to accurately ensure the stability of the wafer W, which greatly improves the performance of the adjustable lifting system 1. Accuracy.

The present creation does not limit the number of the supporting members 15. The two supporting members 15 shown in FIG. 3 are only an example for illustration. In an embodiment of the present creation, the number of the support 15 is at least four. When the number of the supporting members 15 is 4 or more, by finely adjusting the position of the moving pin 155, the wafer W can be in contact with each of the supporting members 15, which greatly improves the accuracy of the adjustable lifting system 1 .

The adjusting screw 153 can be realized by, for example, a bolt, but this creation is not limited to this. The elastic element 157 may be a spring, for example. In an embodiment of the present invention, the elastic element 157 is a stainless steel spring. Through the arrangement of the elastic element 157, the arrangement of the movable pin 155 and the adjustment screw 153 can be made more stable, and the accuracy of fine-tuning the supporting end 1551 can be greatly improved.

In this embodiment, the material of the elastic sleeve 159 may include, for example, a phenol formaldehyde resin (Phenol formaldehyde resin). In an embodiment of the present invention, the material of the elastic sleeve 159 includes polyetheretherketone (PEEK). Through the arrangement of the elastic sleeve 159 and the inclined wall 1517, the arrangement of the moving pin 155 and the adjusting screw 153 can be made more stable, and the accuracy of fine-tuning the supporting end 1551 can be greatly improved.

To sum up, the adjustable lifting system for transferring wafers of this creative embodiment can fine-tune the position of the moving pin relative to the base by setting the adjusting screw and the moving pin on the support, so that the support end can be finely adjusted. position. By fine-tuning the position of the support end, it is possible to accurately ensure the stability of the loaded wafer, greatly improve the accuracy of the adjustable lifting system, effectively improve the accuracy of the semiconductor process/operation, and improve the yield and efficiency.

1: Adjustable lifting system 11: Pedestal 111: bottom wall 13: bearing seat 131: Piercing 15: Support 151: Body 1511: bottom space 1513: inner wall surface 1515: Through hole 1517: Inclined Wall 153: Adjusting screw 1531: top 1533: bottom 155: moving pin 1551: support end 157: elastic element 159: Elastic sleeve A: area C1, C2, C3, C4: chamber P1, P2, P3, P4: working area CM: Central chamber d: upward displacement h: height M: mobile device Mb: load-bearing component Me: Telescopic device S: Semiconductor process equipment S1: The first thread structure S2: Second thread structure W: Wafer

FIG. 1 is a schematic diagram of an adjustable lifting system for transferring wafers according to an embodiment of the present invention. 2 is a schematic diagram of an adjustable lifting system for transferring wafers according to an embodiment of the invention. FIG. 3 is a schematic diagram of an adjustable lifting system for transferring wafers according to an embodiment of the invention. 4A to 4F are schematic diagrams of the operation flow of the adjustable lifting system according to an embodiment of the invention. FIG. 5 is a schematic diagram of an adjustable lifting system for transferring wafers according to an embodiment of the present invention.

11: Pedestal

111: bottom wall

13: bearing seat

15: Support

151: Body

1511: bottom space

1513: inner wall surface

1515: Through hole

1517: Inclined Wall

153: Adjusting screw

1531: top

1533: bottom

155: moving pin

1551: support end

157: elastic element

159: Elastic sleeve

A: area

d: upward displacement

h: height

S1: The first thread structure

S2: Second thread structure

Claims (7)

An adjustable lifting system for transferring wafers, including: A pedestal arranged under a carrier where the wafer is placed; and At least one supporting member installed on the base and passing through at least one through hole of the supporting base, the supporting member including: A body having a bottom space and a through hole communicating with the bottom space, the bottom space having an inner wall surface, a first threaded structure is formed on the inner wall surface, and the through hole has an inclination that tapers from bottom to top Wall An adjusting screw member passing through the bottom space, the adjusting screw member having a top end, a bottom end, and a second thread structure screwed with the first thread structure; A moving pin passing through the through hole, the moving pin having a supporting end protruding from the body; An elastic sleeve sleeved outside the moving pin to abut against the inclined wall surface, one end of the elastic sleeve is connected to the top end of the adjusting screw member; and An elastic element is inserted between the bottom end of the adjusting screw member and a bottom wall of the base, wherein when the adjusting screw member generates an upward displacement due to rotation, it will receive an elastic element from the Buffer the force and finely adjust a height of the upward displacement. The adjustable lifting system according to claim 1, wherein the number of the supporting members is at least 4. The adjustable lifting system according to claim 1, wherein the elastic element is a spring. The adjustable lifting system according to claim 1, wherein the elastic element is a stainless steel spring. The adjustable lifting system according to claim 1, wherein the material of the elastic sleeve includes a phenolic resin. The adjustable lifting system according to claim 1, wherein the material of the elastic sleeve includes a polyether ether ketone. The adjustable lifting system according to claim 1, wherein the adjusting screw member is a bolt.

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