CN218568809U

CN218568809U - Turnover sucker device for silicon wafer chip mounter

Info

Publication number: CN218568809U
Application number: CN202222664704.1U
Authority: CN
Inventors: 刘义; 赵晶; 蒙德强; 孙超; 何新平; 赵勇; 张西标; 姜振虎
Original assignee: Youyan Semiconductor Silicon Materials Co ltd; Shandong Youyan Semiconductor Materials Co ltd
Current assignee: Youyan Semiconductor Silicon Materials Co ltd; Shandong Youyan Semiconductor Materials Co ltd
Priority date: 2022-10-10
Filing date: 2022-10-10
Publication date: 2023-03-03
Anticipated expiration: 2032-10-10

Abstract

A turnover sucker device for a silicon chip mounter comprises a turnover support assembly and a vacuum sucker assembly; the overturning support assembly comprises a connecting plate, and the connecting plate is provided with a headstock and a tailstock; the headstock is provided with a first through hole and a second through hole, linear bearings are fixedly arranged in the first through hole, and sliding rods are arranged in the linear bearings; the top end of the sliding rod is fixed at the edge of the fixing plate, and the fixing plate is sleeved on the limiting screw rod; a limit bolt is arranged in each second through hole; the vacuum chuck assembly comprises a circular bottom plate, a side plate extends upwards from the edge of the bottom plate, a top plate is arranged on the inner side of the top of the side plate, and a plurality of air holes are formed in the bottom plate; the top plate is provided with an air pipe, and the tail end of the air pipe is provided with a threaded quick connector; the bottom end of the sliding rod is fixedly connected with the top surface of the top plate; a first concave hole which is concave upwards is arranged in the middle of the bottom surface of the head seat, a second concave hole which is concave downwards is arranged in the middle of the top surface of the top plate, and a compression spring is arranged between the first concave hole and the second concave hole.

Description

Turnover sucker device for silicon wafer chip mounter

Technical Field

The utility model belongs to the technical field of semiconductor processing, especially a upset sucking disc device for silicon chip mounter.

Background

Silicon materials are used as main functional materials in the electronic information industry, and the processing and manufacturing level thereof has become a key factor for determining the development of the electronic information industry. With the rapid development of semiconductor technology, the surface characteristic parameters of silicon wafers are also important. Before the silicon wafer is polished, the grinding effect of the silicon wafer can be influenced by the technical parameters of the previous working procedure. When a silicon wafer is pasted with a ceramic plate, the traditional overturning sucker still adopts a structure form of a downward pressing air bag, the problem of difficulty in regulating and controlling a horizontal angle and longitudinal pressure exists, a crescent shape with poor fitting exists between the silicon wafer and the ceramic plate, even the fitting fails, the silicon wafer is not uniformly ground, even cracks, finally a grinding table is scratched, subsequent production and processing are seriously influenced, and the product quality is reduced. Therefore, the adjustment of the horizontal angle and the downward pressure of the turning sucker is particularly important, and has become a difficult problem to be solved urgently by the technical personnel in the field.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a upset sucking disc device for silicon chip mounter, its simple structure, with low costs has higher commonality, can reduce the defective rate of paster effectively, improves product quality and production efficiency by a wide margin.

In order to achieve the purpose, the utility model adopts the following technical proposal:

a turnover sucker device for a silicon chip mounter comprises a turnover support assembly and a vacuum sucker assembly;

the overturning support assembly comprises a connecting plate, wherein one end of the connecting plate is provided with a headstock, and the other end of the connecting plate is provided with a tailstock; the cross section of the head seat is in an equilateral triangle shape and is provided with three end heads, the cross section of each end head is in a semicircular shape, and one end head is fixedly connected with the connecting plate; the top surface of the headstock is provided with a lining plate corresponding to the cross section of the headstock; the position of the lining plate corresponding to each end is provided with a first through hole and a second through hole which simultaneously penetrate through the lining plate and the end in the vertical direction, and the second through hole is positioned outside the first through hole; linear bearings are fixedly arranged in the first through holes, and sliding rods are arranged in the linear bearings; the top end of each sliding rod is fixed at the edge of a triangular fixing plate, and the fixing plate is sleeved on a limit screw and can move up and down along the limit screw; the bottom end of the limit screw is fixed in the middle of the lining plate, and the top end of the limit screw is provided with a limit nut; the inner wall of each second through hole is provided with internal threads, a limiting bolt is arranged in each second through hole, and the bottom end of each limiting bolt is positioned below the head seat; the tailstock comprises a vertical support plate, the top of one side of the support plate is fixedly connected with the connecting plate, the top of the other side of the support plate is provided with two lug plates which extend outwards and horizontally, and the bottom of the support plate is provided with a horizontal pin hole;

the vacuum chuck assembly comprises a circular bottom plate, the edge of the bottom plate extends upwards to form a cylindrical side plate, a circular top plate is arranged on the inner side of the top of the side plate, an air chamber is formed between the top plate and the bottom plate at intervals, and the bottom plate is provided with a plurality of air holes communicated with the air chamber; the top plate is provided with an air pipe communicated with the air chamber, and the tail end of the air pipe is provided with a threaded quick connector used for being connected with a vacuum pumping device;

the bottom ends of the three sliding rods are fixedly connected with the top surface of the top plate; a first concave hole which is concave upwards is arranged in the middle of the bottom surface of the head seat, a second concave hole which is concave downwards is arranged in the middle of the top surface of the top plate, and a compression spring is arranged between the first concave hole and the second concave hole.

Furthermore, the top of the sliding rod is connected with the fixing plate through a fixing bolt, and the bottom of the sliding rod is connected with the screw hole of the top plate through external threads.

Furthermore, a positioning nut is sleeved at the top of the limiting bolt.

Further, the bottom plate and the side plates are made of polyether-ether-ketone materials.

Further, the air holes are located on a plurality of concentric circles.

The utility model has the advantages that: the utility model discloses a upset sucking disc device for silicon chip mounter, its simple structure, with low costs has higher commonality, can conveniently adjust the level and the holding down force of upset sucking disc, effectively reduces the paster defective rate, and it is inhomogeneous to avoid polishing in-process silicon chip to grind, collapses the emergence of split phenomenon even, improves product quality and production efficiency by a wide margin.

Drawings

Fig. 1 is a front view of the turning chuck device for a silicon chip mounter.

Fig. 2 is a top view of the turning chuck device for a silicon chip mounter.

Fig. 3 is a schematic longitudinal sectional view of the turnover chuck device for a silicon wafer mounter according to the present invention.

Fig. 4 is a front view of the vacuum chuck assembly of the turnover chuck device for the silicon chip mounter.

Fig. 5 is a bottom view of the vacuum chuck assembly of the turnover chuck device for the silicon chip mounter.

Fig. 6 is a front view of the connection plate of the turnover sucker device for the silicon chip mounter.

Fig. 7 is a top view of the connection plate of the turnover chuck device for the silicon chip mounter.

Detailed Description

The structure and intended technical effects of the present invention will be described with reference to the following embodiments, which are only used for illustration and not for limiting the scope of the present invention.

As shown in fig. 1-3, the utility model provides a turnover chuck device for silicon chip mounter, which comprises a turnover support assembly 1 and a vacuum chuck assembly 2.

As shown in fig. 1-3, 6 and 7, the flip-flop support assembly 1 includes a connecting plate 11, and the connecting plate 11 has a headstock 12 at one end and a tailstock 13 at the other end. The cross section of the head base 12 is an equilateral triangle, and has three ends 121, each end 121 has a semicircular cross section, and one end 121 is fixedly connected with the connecting plate 11. The top surface of the header 12 is provided with a backing plate 14 corresponding to the cross-section of the header 12. The lining plate 14 is provided with a first through hole 15 and a second through hole 16 which penetrate through the lining plate 14 and the end 121 simultaneously in the vertical direction at the position corresponding to each end 121, and the second through hole 16 is positioned outside the first through hole 15. A linear bearing 151 is fixedly arranged in each first through hole 15, and a sliding rod 152 is arranged in each linear bearing 151. The top end of each sliding rod 152 is fixed to the edge of a triangular fixing plate 17, and the fixing plate 17 is sleeved on a limit screw 171 and can move up and down along the limit screw 171. The bottom end of the limit screw 171 is fixed in the middle of the lining board 14, and the top end of the limit screw 171 is provided with a limit nut 172. The inner wall of each second through hole 16 has an internal thread, and a limiting bolt 161 is arranged in the second through hole 16, and the bottom end of the limiting bolt 161 is located below the head base 12 and can abut against the top of the vacuum chuck assembly 2 below. The top of the limit bolt 161 is sleeved with a positioning nut 162 to position the position of the limit bolt 161. The tailstock 13 comprises a vertical support plate 131, the top of one side of the support plate 131 is fixedly connected with the connecting plate 11, the top of the other side is provided with two lug plates 132 extending outwards and horizontally, and the bottom of the support plate 131 is provided with a horizontal pin hole 133. A turnover motor of the chip mounter is connected with the positioning block through a clamping key, the turnover support assembly 1 is connected with the horizontal pin hole 133 at the bottom of the support plate 131 and the positioning block through a bolt, and the turnover motor drives the turnover support to work through circular motion. The two ear plates 132 are fixed on the turning seat of the turning motor by bolts in the transverse and longitudinal directions for reliable connection. The connection mode of the support plate 131 and the flipping motor of the chip mounter is the prior art and is not described again.

As shown in fig. 1, 3-5, the vacuum chuck assembly 2 includes a circular bottom plate 21, a cylindrical side plate 22 extending upward from the edge of the bottom plate 21, a circular top plate 23 disposed inside the top of the side plate 22, an air chamber 24 formed by a space between the top plate 23 and the bottom plate 21, and a plurality of air holes 211 communicating with the air chamber 24 in the bottom plate 21. Preferably, the air holes 211 are located on concentric circles. The top plate 23 is provided with an air pipe 25 communicated with the air chamber 24, the tail end of the air pipe 25 is provided with a threaded quick-connection plug 26 used for being connected with a vacuum-pumping device (not shown), vacuum is introduced through the air pipe 25 to suck the silicon chip through the bottom plate 21, and the vacuum pressure value is controlled to be-20 to-45 KPa. The tailstock 13 is installed on a turning motor (prior art, not described in detail) of the chip mounter, and the turning sucker device is driven to work through the circular motion of the motor, so that the silicon wafer is finally and stably attached to the ceramic plate.

The bottom ends of the three sliding rods 152 are fixedly connected with the top surface of the top plate 23. The head base 12 is provided with a first concave hole 18 in the middle of the bottom surface, a second concave hole 27 in the middle of the top surface, and a compression spring 3 is provided between the first concave hole 18 and the second concave hole 27. Specifically, the top of the sliding rod 152 is connected with the fixing plate 17 through a fixing bolt 153, the bottom of the sliding rod 152 is connected with the screw hole of the top plate 23 through an external thread, so that the vacuum chuck assembly 2 can move up and down along with the sliding rod 152, and in the upward movement process, the bottom of the sliding rod is limited by the bottom end of the limiting bolt 161, and the limiting nut 172 is limited, according to the actual production requirements, the degree of freedom of the compression spring 3 is controlled by adjusting the embedding position of the limiting bolt 161, meanwhile, the limiting nut 172 of the limiting screw 171 can restrict the minimum limiting amount of the compression spring 3, the function of protecting the degree of freedom is achieved, the pressure adjustability is finally achieved, and the effect of improving the patch is achieved.

The utility model discloses a upset sucking disc device for silicon chip mounter installs the upset motor department at the chip mounter, drives through the upset motor the utility model discloses upset sucking disc device work can realize the steady subsides of silicon chip on the ceramic plate, applicable in 5, 6, multiple specification silicon chips such as 8 inches, the device upset support assembly 1 is made by ordinary carbon steel, and the vacuum chuck outer lane (this bottom plate 21 and curb plate 22 promptly) are polyether ether ketone (Peek) material, can be applicable to the harsh operating mode in the wide temperature region, can guarantee silicon chip surface cleaning, stop metal and dirty pollution. The utility model can freely adjust the compression amount of the compression spring 3, and control the compression amount of the compression spring 3 by adjusting the position of the limit bolt 161, thereby realizing the adjustment of the pressure under the silicon wafer; the material of the turnover support assembly of the utility model is carbon steel, the compression spring 3 replaces the traditional air bag form, thereby not only reducing the arrangement of the air circuit, but also obviously reducing the cost, and the accessories are easy to be replaced; the overturning support assembly 1 is fixed on the overturning motor support through a bolt hole on the right side, so that the overturning support assembly is convenient to disassemble and fix; compared with a double-air-bag type overturning sucker, the manufacturing cost is obviously reduced, in addition, due to the fact that the structure of the air bag is omitted, the space for pipeline arrangement is saved, the fault problem is reduced, and the equipment is simpler and more durable.

The invention is defined by the claims. Based on the above, it will be apparent to those skilled in the art that various changes and modifications can be made, which are within the main spirit and scope of the present invention.

Claims

1. A turnover sucker device for a silicon chip mounter is characterized by comprising a turnover support assembly and a vacuum sucker assembly;

the overturning support assembly comprises a connecting plate, wherein one end of the connecting plate is provided with a head seat, and the other end of the connecting plate is provided with a tail seat; the cross section of the head seat is in an equilateral triangle shape and is provided with three end heads, the cross section of each end head is in a semicircular shape, and one end head is fixedly connected with the connecting plate; the top surface of the headstock is provided with a lining plate corresponding to the cross section of the headstock; the position of the lining plate corresponding to each end is provided with a first through hole and a second through hole which simultaneously penetrate through the lining plate and the end in the vertical direction, and the second through hole is positioned outside the first through hole; linear bearings are fixedly arranged in the first through holes, and sliding rods are arranged in the linear bearings; the top end of each sliding rod is fixed at the edge of a triangular fixing plate, and the fixing plate is sleeved on a limit screw and can move up and down along the limit screw; the bottom end of the limit screw is fixed in the middle of the lining plate, and the top end of the limit screw is provided with a limit nut; the inner wall of each second through hole is provided with internal threads, a limiting bolt is arranged in each second through hole, and the bottom end of each limiting bolt is positioned below the head seat; the tailstock comprises a vertical support plate, the top of one side of the support plate is fixedly connected with the connecting plate, the top of the other side of the support plate is provided with two lug plates which extend outwards and horizontally, and the bottom of the support plate is provided with a horizontal pin hole;

2. The inverted suction cup apparatus for a silicon wafer mounter according to claim 1, wherein: the top of the sliding rod is connected with the fixing plate through a fixing bolt, and the bottom of the sliding rod is connected with the screw hole of the top plate through an external thread.

3. The inverting chuck device for a silicon wafer mounter according to claim 1 or 2, wherein: and a positioning nut is sleeved at the top of the limiting bolt.

4. The inverting chuck device for a silicon wafer mounter according to claim 1 or 2, wherein: the bottom plate and the side plates are made of polyether-ether-ketone materials.

5. The inverting chuck device for a silicon wafer mounter according to claim 1 or 2, wherein: the air holes are located on a plurality of concentric circles.