TWM610458U - Die pressing device with package substrate detection function - Google Patents

Abstract

A molding equipment with package substrate detection function, including a machine table and at least one molding zone and at least one discharging zone distributed on the machine. The molding zone is provided with a compression mold unit, and the discharging zone is provided with a discharging unit. The unit can be transferred between the molding area and the discharging area. The package substrate processed by the molding unit is transferred to the discharging area. The discharging unit is equipped with multiple contact sensors and multiple vacuum suction cups, which are connected to the vacuum suction cups. The pipeline is equipped with a vacuum sensor. When the discharging unit wants to suck the package substrate by the vacuum chuck, it will synchronously determine whether the package substrate is sucked by the signal of the contact sensor and the vacuum sensor; this ensures that the package substrate will not be left behind In the molding area, it affects the subsequent processing operations.

Description

Molding equipment with package substrate detection function

This creation is a technical field of semiconductor packaging substrate molding equipment, especially a molding equipment with package substrate detection function.

Semiconductor packaging operations will use molding equipment. The molding equipment includes a machine and at least one molding area and at least one discharging area distributed on the machine. The molding area is equipped with a compression molding unit. The compression molding unit adopts a hot compression molding method to encapsulate the substrate. The periphery of several chips on the board is encapsulated and protected by resin or other materials. The discharging area is provided with a discharging unit, and the discharging unit can be moved between the molding area and the discharging area to transfer the package substrate processed by the molding unit to the discharging area. When the conventional molding equipment is about to leave the molding area, the discharging unit uses several vacuum chucks to suck the package substrate and set up a vacuum sensor to detect the pressure in the vacuum line. If the vacuum line pressure is abnormal during the process, the cause may be possible If the package substrate is not adsorbed or the package substrate falls during the transfer process, the machine can be shut down immediately and the fault can be eliminated. However, if the vacuum sensor fails, the system cannot immediately obtain the message that the package substrate has not been removed. The processing process continues, which will cause the two package substrates to be stacked in the molding area and cause damage, reimbursement, or even damage to a large number of chips on the package substrate. Relevant positioning and machine equipment may be damaged or need to be re-calibrated, which is time-consuming and labor-intensive.

In order to solve the above problems, the main purpose of this creation is to provide a molding equipment with package substrate detection function, which is mainly equipped with two safety detection mechanisms to ensure that the discharging unit can indeed move the package substrate out of the molding area every time. Avoid damage to the raw material.

In order to achieve the foregoing objectives, this creation adopts the following technical solutions:

This creation is a molding equipment with package substrate detection function, including a machine and at least one molding zone and at least one discharging zone distributed on the machine. The molding zone is equipped with a compression mold unit, and the discharging zone is equipped with a discharging unit. , The discharging unit can be moved between the molding area and the discharging area, and the package substrate after processing and packaging by the molding unit is transferred to the discharging area. The discharging unit is equipped with multiple contact sensors and multiple vacuum suction cups. , The pipeline connected to the vacuum chuck is equipped with a vacuum sensor. When the discharging unit contacts the packaging substrate by the vacuum chuck, it will synchronously determine whether the packaging substrate is sucked up by the signals of the contact sensor and the vacuum sensor.

As one of the preferred embodiments, a plurality of contact sensors are distributed on both sides of the vacuum chuck.

As one of the preferred embodiments, a plurality of contact sensors are distributed in the peripheral area of the bottom surface of the discharging unit.

As one of the preferred embodiments, the machine further includes a controller, and the controller is connected in series with a contact sensor and a vacuum sensor.

As one of the preferred embodiments, the discharging unit is additionally provided with a height sensor.

Compared with the prior art, the molding equipment with the detection function of the package substrate of this invention has the following specific functions: 1. The design of this creation ensures that the package substrate is indeed removed from the molding area during each transfer process of the package substrate, avoiding the occurrence of two package substrates being stacked and compressing and causing chip damage, effectively improving the package yield. 2. This creation uses the dual sensing mechanism of the vacuum sensor and the contact sensor, which can avoid one of the failures, causing the equipment to misjudge, leading to chip damage or equipment failure. 3. This creation uses multiple touch sensors to actually sense package substrates at different locations, reducing misjudgments. 4. This creation adds several touch sensors to the discharging unit. Because the structure of the touch sensor is simple and easy to install, it does not need to significantly change the original control system. It is a way to achieve high yield at a lower cost of improvement. Good quality design.

The technical solution of this creation will be clearly and completely described below in conjunction with specific embodiments and drawings. It should be noted that when a component is referred to as being "mounted on or fixed to" another component, it means that it can be directly on the other component or a centered component may also exist. When an element is considered to be "connected" to another element, it means that it can be directly connected to the other element or a central element may be present at the same time. In the illustrated embodiment, the directions indicate that up, down, left, right, front and back, etc. are relative, and are used to explain that the structure and movement of different components in this case are relative. These representations are appropriate when the parts are in the positions shown in the figure. However, if the description of the component location changes, it is considered that these representations will also change accordingly.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art of creation. The terminology used herein is only for the purpose of describing specific embodiments, and is not intended to limit the creation. The term "and/or" as used herein includes any and all combinations of one or more related listed items.

Figure 1 is a plan view of the first embodiment of the creation of a molding equipment with a package substrate detection function. The creation of the molding equipment at least includes a machine 1 and a molding area 2 and a discharge area 3 provided on the machine 1. Of course, the machine 1 can also include a feeding mechanism 41, a resin supply mechanism 42, a feeding unit 43, a material loading mechanism 44, a slag removal mechanism 45, a waste collection box 46, a material clamping mechanism 47, and a discharge mechanism according to different operation modes.料机构48. The packaging substrate carrying many chips is placed in the feeding mechanism 41, and then it will be transferred, packaging material (such as resin) placement, thermo-compression molding, removal, waste removal, packaging substrate collection, etc., using a series of automated operating procedures, Complete the substrate packaging operation.

As shown in Fig. 1 and Fig. 2, this creation is mainly to improve the package substrate transfer operation in both the molding zone 2 and the discharging zone 3. The molding area 2 is provided with a molding unit 21, which is a hot press molding mechanism with a three-dimensional upper and lower multilayer structure. The discharging area 3 is provided with a discharging unit 31, and the discharging unit 31 can be moved between the molding area 2 and the discharging area 3. As shown in FIG. 2, the discharging unit 31 is provided with a plurality of contact sensors 311 and a plurality of vacuum suction cups 312. The pipeline connected to the vacuum chuck 312 is provided with a vacuum sensor 313. When the discharging unit 31 moves to the molding zone 2, the contact sensor 311 and the vacuum chuck 312 are set from the discharging unit 31 toward the molding unit 21. The vacuum sensor 313 detects the pressure of the pipeline, and determines whether the vacuum chuck 312 is adsorbing the package substrate A according to the output pressure value. The contact sensor 311 retracts when it is pressed down and contacts the package substrate A and triggers a signal.

As shown in FIG. 2, after the compression molding unit 21 completes the hot-press packaging operation, the processed packaging substrate A is located on the compression molding unit 21, and the discharging unit 31 moves to its upper position. The discharge unit 31 is pressed down and contacted with the packaging substrate A by the contact sensor 311 and the vacuum chuck 312 respectively. During this process, the system must receive both the signals of the vacuum sensor 313 and the contact sensor 311 at the same time to confirm that the packaging substrate A has been After being sucked by the vacuum chuck 312, the movement of transferring from the molding area 2 to the discharging area 3 can be continued. In the initial contact state or the transfer path, as long as one of the signals of the vacuum sensor 313 and the contact sensor 311 is abnormal, the machine will be shut down for inspection immediately to ensure that the package substrate A maintains the adsorbed state. In addition, the plurality of contact sensors 311 can also confirm whether the package substrate A at different positions is in contact. By using multiple sensing mechanisms to avoid misjudgment situations, where the vacuum sensor fails in an unconventional way, the system can still operate. This invention can effectively avoid the situation where the two package substrates A are stacked and deformed by thermal compression.

As shown in FIG. 3, it is a diagram of a second embodiment of the creation of a molding equipment with a package substrate detection function. In this embodiment, the machine 1 further includes a controller 11, and the discharging unit 31 is also equipped with a contact sensor 311 and a vacuum sensor 313. The controller 11 is connected in series with the contact sensor 311 and the vacuum sensor 313, so it is molded When the equipment is in operation, the controller 11 must obtain the signals of both the contact sensor 311 and the vacuum sensor 313 at the same time, so that the controller 11 can continue to control the operation of various mechanisms, otherwise, if the contact sensor 311 and the vacuum sensor are not received When one of the signals is 313, the controller 11 stops the machine 1 and sends out an alarm, so as to eliminate the fault immediately, thereby improving the production yield.

As shown in FIG. 4, it is a diagram of the third embodiment of the creation of a molding equipment with a package substrate detection function. In this embodiment, the multiple contact sensors 311 placed on the discharging unit 31 are distributed in the peripheral area of the bottom surface. For example, the multiple contact sensors 311 are evenly distributed in the four corners. In this way, it can be confirmed whether the package substrate is present during contact. Skew situation.

As shown in FIG. 5, it is a fourth embodiment diagram of a mold press device with a package substrate detection function. In this embodiment, a height sensor 314 is additionally provided at the bottom of the discharging unit 31. The height sensor 314 can detect whether the packaging substrates are repeatedly stacked when the discharging unit 31 moves directly above the die unit 21, so as to prevent the discharging unit 31 from being pressed to the repeatedly stacked packaging substrates when the discharging unit 31 is lowered, which may cause the packaging substrates. Damaged.

Based on the above, the molding equipment with package substrate detection function of the present invention can effectively prevent the two package substrates A from stacking and sticking in the molding unit 21, or the package substrate A falling into the mold during movement, which improves the packaging. Yield. In addition, multiple contact sensors 311 are added to the discharging unit 31, because there is no need to greatly increase the complicated control system, and with the vacuum sensor 313 of the vacuum suction cup 312, the signals can be connected in series, which can obtain multiple safety mechanisms and improve the low cost. It can also increase the packaging yield and meet the requirements of patent application.

However, the above-mentioned embodiments are only illustrative of the effects of this creation, and are not used to limit this creation. Anyone familiar with this technical field can modify and change the above-mentioned embodiments without departing from the spirit and scope of this creation. . In addition, the number of elements in the above-mentioned embodiments is merely illustrative, and is not used to limit the creation. Therefore, the protection scope of this creation should be as listed in the following patent scope.

1: Machine 11: Controller 2: Molded area 21: die unit 3: Discharge area 31: Discharge unit 311: Touch Sensor 312: Vacuum Suction Cup 313: Vacuum Sensor 314: Altitude Sensor 41: Feeding mechanism 42: Resin supply mechanism 43: Feeding unit 44: Material loading mechanism 45: Deslagging mechanism 46: Waste collection box 47: Material clamping mechanism 48: discharge mechanism A: Package substrate

Figure 1 is a plan view of the first embodiment of the creation of a molding equipment with package substrate detection function;

FIG. 2 is a partial structure diagram of the first embodiment of the creation of the molding equipment with the detection function of the package substrate.

Fig. 3 is a diagram of a second embodiment of the creation of a molding equipment with a package substrate detection function.

FIG. 4 is a diagram of a third embodiment of a molding equipment with a detection function of package substrates.

FIG. 5 is a diagram of a fourth embodiment of the creation of a molding equipment with a package substrate detection function.

21: die unit

31: Discharge unit

311: Touch Sensor

312: Vacuum Suction Cup

313: Vacuum Sensor

A: Package substrate

Claims (5)

A molding equipment with a package substrate detection function, comprising a machine table and at least one molding zone and at least one discharging zone distributed on the machine table. The molding zone is provided with a compression mold unit, and the discharging zone is provided with a discharging unit, The discharging unit can be transferred between the molding zone and the discharging zone, and the package substrate processed by the molding unit is transferred to the discharging zone. The discharging unit is characterized in that: the discharging unit is provided with a plurality of A contact sensor and a plurality of vacuum chucks. The pipeline connected to the vacuum chuck is equipped with a vacuum sensor. When the discharging unit contacts the packaging substrate by the vacuum chuck, it will synchronize the signals via the contact sensor and the vacuum sensor Determine whether the package substrate is sucked up. In the molding equipment with the detection function of the package substrate as described in claim 1, a plurality of the contact sensors are distributed on both sides of the vacuum chuck. In the molding equipment with the detection function of the package substrate according to claim 1, a plurality of the contact sensors are distributed in the peripheral area of the bottom surface of the discharging unit. According to the molding equipment with package substrate detection function as described in claim 1, the machine further includes a controller, and the controller is connected in series with the contact sensor and the vacuum sensor. For the molding equipment with package substrate detection function described in claim 1, the discharging unit is additionally provided with a height sensor.

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