CN220829933U - Etching machine conveying device and semiconductor device - Google Patents
Etching machine conveying device and semiconductor device Download PDFInfo
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- CN220829933U CN220829933U CN202322567863.4U CN202322567863U CN220829933U CN 220829933 U CN220829933 U CN 220829933U CN 202322567863 U CN202322567863 U CN 202322567863U CN 220829933 U CN220829933 U CN 220829933U
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- 238000005530 etching Methods 0.000 title claims abstract description 61
- 239000004065 semiconductor Substances 0.000 title claims abstract description 10
- 238000001514 detection method Methods 0.000 claims abstract description 160
- 235000012431 wafers Nutrition 0.000 claims abstract description 107
- 239000012634 fragment Substances 0.000 claims abstract description 22
- 238000007689 inspection Methods 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 230000007547 defect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 34
- 238000010586 diagram Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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Abstract
The invention relates to an etching machine conveying device and a semiconductor device, wherein the etching machine conveying device comprises a vacuum conveying cavity, a mechanical arm and a detection device, and the vacuum conveying cavity is used for conveying wafers among different etching cavities of the etching machine; the mechanical arm is arranged in the vacuum conveying cavity and is used for supporting and conveying the wafer; the cavity cover of the vacuum conveying cavity is provided with a plurality of first detection holes for detecting the front end of the mechanical arm and a plurality of second detection holes for detecting the root of the mechanical arm; the mechanical arm is provided with a third detection hole which is positioned right above one second detection hole; the detection device is arranged on the cavity cover and used for detecting fragments and/or the integrity of the wafer through the third detection hole, the second detection hole and/or the first detection hole. The defect of vacuum conveying cavity wafer detection is overcome, the integrity of the wafer is detected to the greatest extent, and the production efficiency is improved.
Description
Technical Field
The present application relates to the field of semiconductor manufacturing, and in particular, to an etching machine conveying device and a semiconductor device.
Background
In the technical field of chip manufacturing, wafers are conveyed among different process cavities through an etching machine vacuum conveying cavity, and a mechanical arm is arranged in the vacuum conveying cavity and is used for supporting and conveying the wafers.
The cavity cover of the vacuum conveying cavity of the existing etching machine is only provided with a transparent plate for detecting the front end of the mechanical arm, a wafer sensing device is covered above the transparent plate, when wafers are conveyed in and out of each process cavity, if the wafer part positioned at the root of the mechanical arm is broken and missing, or the mechanical arm takes a piece, under the condition that fragments are generated, the sensor cannot effectively detect due to the shielding of an opaque area of the vacuum conveying cavity, the mechanical arm executes the next wafer conveying action, the next wafer is caused to be bad in process and scratched on the surface, and extra process is caused to be scrapped.
Disclosure of utility model
Based on this, it is necessary to provide an etching machine conveying device and a semiconductor device to solve the defects of wafer detection in the vacuum conveying cavity, detect the integrity of the wafer to the greatest extent, and improve the production efficiency.
To achieve the above and other objects, according to various embodiments of the present disclosure, a first aspect of the present disclosure provides an etching tool transfer device, including a vacuum transfer chamber, a robot arm, and a detecting device, the vacuum transfer chamber being configured to transfer a wafer between different etching chambers of an etching tool; the mechanical arm is arranged in the vacuum conveying cavity and is used for supporting and conveying the wafer; the cavity cover of the vacuum conveying cavity is provided with a plurality of first detection holes for detecting the front end of the mechanical arm and a plurality of second detection holes for detecting the root of the mechanical arm; the mechanical arm is provided with a third detection hole right above a second detection hole; the detection device is arranged on the cavity cover and used for detecting the integrity of fragments and/or wafers through the third detection hole, the second detection hole and/or the first detection hole.
In some embodiments, the detection device includes a sensor disposed on the chamber cover for detecting the vacuum transmission chamber via the third detection hole, the second detection hole, and/or the first detection hole, and generating detection information.
In some embodiments, the detection device includes an alarm and a controller, where the controller is connected to both the sensor and the alarm, and is configured to receive detection information and generate an alarm control command to control the alarm to generate alarm information.
In some embodiments, at least one of the first, second and third inspection holes includes a transparent substrate.
In some embodiments, the first plurality of detection holes surrounds the second plurality of detection holes.
In some embodiments, the plurality of first detection holes are uniformly spaced apart; and/or the plurality of second detection holes are uniformly distributed at intervals.
In some embodiments, the robotic arm includes a plurality of fixed arms; a plurality of fixed arms are positioned above the cavity cover; a third detection hole is formed in a fixed arm.
In some embodiments, the angle between any two adjacent fixed arms is equal among the plurality of fixed arms.
In some embodiments, the mechanical arm is further provided with a fourth detection hole, which is located right above the first detection hole and is used for detecting the integrity of the front end of the wafer; the third detection hole is a rectangular detection hole, and the fourth detection hole is a circular detection hole.
A second aspect of the present disclosure provides a semiconductor device processed using any one of the etching tool transfer devices described above.
The etching machine conveying device and the semiconductor device convey wafers among different etching cavities of the etching machine through the vacuum conveying cavity; supporting and conveying the wafer by a mechanical arm arranged in the vacuum conveying cavity; the vacuum conveying cavity comprises a cavity cover, a plurality of first detection holes, a plurality of second detection holes and a third detection hole, wherein the first detection holes are formed in the cavity cover of the vacuum conveying cavity and used for detecting the front end of the mechanical arm, the second detection holes are used for detecting the root of the mechanical arm, the third detection holes are formed in the mechanical arm and located right above the second detection holes, and the integrity of fragments and/or wafers is detected through the third detection holes, the second detection holes and/or the first detection holes through the detection device arranged on the cavity cover. At present, a transparent plate for detecting the front end of a mechanical arm is only arranged on a cavity cover of a vacuum conveying cavity of a related etching machine table, a wafer sensing device is covered above the transparent plate, when wafers are conveyed into and out of each process cavity, if the wafer part positioned at the root of the mechanical arm is broken and missing, or the mechanical arm takes a wafer, under the condition that fragments are generated, the sensor cannot effectively detect due to the shielding of an opaque area of the vacuum conveying cavity, the mechanical arm executes the next wafer conveying action, the next wafer is caused to be poor in process and surface scratch, and extra process rejection is caused. According to the etching machine conveying device, the wafer is supported and conveyed through the mechanical arm arranged in the vacuum conveying cavity, the first detection holes used for detecting the front end of the mechanical arm and the second detection holes used for detecting the root of the mechanical arm are formed in the cavity cover of the vacuum conveying cavity, the third detection holes located right above the second detection holes and the fourth detection holes located right above the first detection holes are formed in the mechanical arm, the integrity of fragments and/or wafers is detected by the aid of the detection device on the cavity cover, and the next step of wafer conveying is performed under the condition that fragments occur in the process cavity is avoided, so that extra products are scraped, and production efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the related art, the drawings that are required to be used in the embodiments or the related technical descriptions will be briefly described, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.
FIG. 1 is a schematic diagram of an etcher structure and a schematic diagram of an etcher wafer sensor in top view provided in one embodiment of the disclosure;
FIG. 2 is a schematic block diagram of an etching tool transfer device according to an embodiment of the disclosure;
FIG. 3 is a schematic block diagram of an etching tool conveyor according to another embodiment of the disclosure;
FIG. 4 is a schematic diagram illustrating a comparison of a lid detection hole of a vacuum transfer chamber of an etching tool according to an embodiment of the present disclosure and a lid detection hole of a vacuum transfer chamber of an etching tool according to the present disclosure;
Fig. 5 is a schematic diagram illustrating structural comparison of a related etching machine mechanical arm detection hole and a related etching machine mechanical arm detection hole according to an embodiment of the present disclosure.
Reference numerals illustrate:
10. A cavity cover; 11. a wafer sensor; 12. opaque regions; 13. a first detection hole; 14. a second detection hole; 15. a third detection hole; 16. a fourth detection hole; 200. etching machine conveying device; 210. a vacuum transfer chamber; 220. a mechanical arm; 230. a detection device; 231. a sensor; 232. an alarm; 233. and a controller.
Detailed Description
In order that the application may be readily understood, a more complete description of the application will be rendered by reference to the appended drawings. Embodiments of the application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
It will be understood that the terms first, second, etc. as used herein may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another element. For example, a first resistance may be referred to as a second resistance, and similarly, a second resistance may be referred to as a first resistance, without departing from the scope of the application. Both the first resistor and the second resistor are resistors, but they are not the same resistor.
Where the terms "comprising," "having," and "including" are used herein, another component may also be added unless a specifically defined term is used, such as "consisting of only," "… …," etc. Unless mentioned to the contrary, singular terms may include plural and are not to be construed as being one in number.
It is to be understood that in the following embodiments, "connected" is understood to mean "electrically connected", "communicatively connected", etc., if the connected circuits, modules, units, etc., have electrical or data transfer between them.
It is understood that "at least one" means one or more and "a plurality" means two or more. "at least part of an element" means part or all of the element.
As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," and/or the like, specify the presence of stated features, integers, steps, operations, elements, components, or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof. Also, the term "and/or" as used in this specification includes any and all combinations of the associated listed items.
In the chip manufacturing technology, wafers are transferred between different etching cavities through an etching machine vacuum transfer cavity, and a mechanical arm is arranged in the vacuum transfer cavity and is used for supporting and transferring the wafers, so that the mechanical arm needs to have high reliability. The cavity cover of the vacuum conveying cavity of the existing etching machine is only provided with a transparent plate for detecting the front end of the mechanical arm, a wafer sensing device is covered above the transparent plate, when wafers are conveyed in and out of each process cavity, if the wafer part positioned at the root of the mechanical arm is broken and missing, or the mechanical arm takes a piece, under the condition that fragments are generated, the sensor cannot effectively detect due to the shielding of an opaque area of the vacuum conveying cavity, the mechanical arm executes the next wafer conveying action, the next wafer is caused to be bad in process and scratched on the surface, and extra process is caused to be scrapped.
As an example, referring to fig. 1, the related etching apparatus includes a vacuum sample chamber, a valve, a vacuum transfer chamber, a cooling chamber, a flat side alignment chamber, and various process chambers, wherein a mechanical arm is disposed in the vacuum transfer chamber, and the wafer is transferred into and out of the different process chambers through the mechanical arm; as shown in fig. 1 (2), a wafer sensing device 11 is disposed on a cover 10 of the vacuum transfer chamber, and is used for detecting a wafer, but the wafer sensing device 11 can only detect a wafer at the front end of the mechanical arm, when the wafer is transferred into and out of each process chamber, if a wafer part at the root of the mechanical arm occurs, a chipping missing condition occurs, or when the mechanical arm takes a wafer, in the case that a chip occurs, the sensor cannot effectively detect due to the shielding of an opaque area 12 of the vacuum transfer chamber, the mechanical arm performs the next wafer transferring action, which results in the process failure and surface scratch of the next wafer, and causes additional process rejection.
Based on this, referring to fig. 2, an embodiment of the disclosure provides an etching machine table conveying device 200, which includes a vacuum conveying cavity 210, a mechanical arm 220 and a detecting device 230, wherein the vacuum conveying cavity 210 is used for conveying wafers between different etching cavities of an etching machine table; the mechanical arm 220 is disposed in the vacuum transferring chamber 210, and is used for supporting and transferring the wafer; wherein, a cavity cover of the vacuum conveying cavity 210 is provided with a plurality of first detection holes for detecting the front end of the mechanical arm 220 and a plurality of second detection holes for detecting the root of the mechanical arm 220; the mechanical arm 220 is provided with a third detection hole right above a second detection hole; the detecting device 230 is disposed on the chamber cover and is used for detecting the integrity of the fragments and/or the wafer through the third detecting hole, the second detecting hole and/or the first detecting hole.
As an example, please continue to refer to fig. 2, wafers are transferred between different etch chambers of an etching tool through the vacuum transfer chamber 210; the wafer is supported and transferred by a robot arm 220 disposed in the vacuum transfer chamber 210; wherein, the chamber cover of the vacuum conveying chamber 210 is provided with a plurality of first detection holes for detecting the front end of the mechanical arm 220 and a plurality of second detection holes for detecting the root of the mechanical arm 220, the mechanical arm 220 is provided with a third detection hole located right above the second detection hole, and the integrity of fragments and/or wafers is detected through the third detection hole, the second detection hole and/or the first detection hole by the detection device 230 arranged on the chamber cover. At present, a transparent plate for detecting the front end of a mechanical arm is only arranged on a cavity cover of a vacuum conveying cavity of a related etching machine table, a wafer sensing device is covered above the transparent plate, when wafers are conveyed into and out of each process cavity, if the wafer part positioned at the root of the mechanical arm is broken and missing, or the mechanical arm takes a wafer, under the condition that fragments are generated, the sensor cannot effectively detect due to the shielding of an opaque area of the vacuum conveying cavity, the mechanical arm executes the next wafer conveying action, the next wafer is caused to be poor in process and surface scratch, and extra process rejection is caused. According to the etching machine conveying device, the wafer is supported and conveyed through the mechanical arm arranged in the vacuum conveying cavity, the first detection holes used for detecting the front end of the mechanical arm and the second detection holes used for detecting the root of the mechanical arm are formed in the cavity cover of the vacuum conveying cavity, the third detection holes located right above the second detection holes and the fourth detection holes located right above the first detection holes are formed in the mechanical arm, the integrity of fragments and/or wafers is detected by the aid of the detection device on the cavity cover, and the next step of wafer conveying is performed under the condition that fragments occur in the process cavity is avoided, so that extra products are scraped, and production efficiency is improved.
In some embodiments, referring to fig. 3, the detecting device includes a sensor 231 disposed on the chamber cover and configured to detect the inside of the vacuum transmission chamber 210 through the third detecting hole, the second detecting hole, and/or the first detecting hole, so as to generate detection information.
In some embodiments, please continue to refer to fig. 3, the detecting apparatus includes an alarm 232 and a controller 233, where the controller 233 is connected to both the sensor 231 and the alarm 232, and is configured to receive the detection information and generate an alarm control command to control the alarm to generate alarm information.
As an example, please continue to refer to fig. 3, wafers are transferred between different etch chambers of the etching tool through the vacuum transfer chamber 210; the wafer is supported and transferred by a robot arm 220 disposed in the vacuum transfer chamber 210; wherein, a plurality of first detection holes for detecting the front end of the mechanical arm 220 and a plurality of second detection holes for detecting the root of the mechanical arm 220 are formed on the cavity cover of the vacuum conveying cavity 210, a third detection hole located right above the second detection hole is formed on the mechanical arm 220, the sensor 231 in the detection device is utilized to detect the inside of the vacuum conveying cavity 210 through the third detection hole, the second detection hole and/or the first detection hole through the detection device 230, detection information is generated, and a controller 233 in the detection device 230 is used for receiving the detection information and generating an alarm control command to control the alarm 232 to generate alarm information, wherein the controller 233 is connected with the sensor 231 and the alarm 232. At present, a transparent plate for detecting the front end of a mechanical arm is only arranged on a cavity cover of a vacuum conveying cavity of a related etching machine table, a wafer sensing device is covered above the transparent plate, when wafers are conveyed into and out of each process cavity, if the wafer part positioned at the root of the mechanical arm is broken and missing, or the mechanical arm takes a wafer, under the condition that fragments are generated, the sensor cannot effectively detect due to the shielding of an opaque area of the vacuum conveying cavity, the mechanical arm executes the next wafer conveying action, the next wafer is caused to be poor in process and surface scratch, and extra process rejection is caused. According to the etching machine conveying device, the wafer is supported and conveyed through the mechanical arm arranged in the vacuum conveying cavity, the first detection holes used for detecting the front end of the mechanical arm and the second detection holes used for detecting the root of the mechanical arm are formed in the cavity cover of the vacuum conveying cavity, the third detection holes located right above the second detection holes and the fourth detection holes located right above the first detection holes are formed in the mechanical arm, the integrity of fragments and/or wafers is detected by the aid of the detection device on the cavity cover, and the next step of wafer conveying is performed under the condition that fragments occur in the process cavity is avoided, so that extra products are scraped, and production efficiency is improved.
In some embodiments, at least one of the first, second and third inspection holes includes a transparent substrate.
In some embodiments, referring to fig. 4 (2), the first plurality of detection holes 13 surrounds the second plurality of detection holes 14.
In some embodiments, please continue to refer to fig. 4 (2), the plurality of first detecting holes 13 are uniformly spaced; and/or the plurality of second detection holes 14 are uniformly spaced apart.
As an example, referring to fig. 4 (1), on the cover 10 of the vacuum transfer chamber of the related etching machine, only a plurality of first detecting holes 13 are provided at uniform intervals for detecting the wafer portion at the front section of the mechanical arm, and the wafer portion blocked by the opaque region 12 of the vacuum transfer chamber cannot be effectively detected, so that the wafer is damaged, which may result in additional process rejection; as shown in fig. 4 (2), in the etching machine table conveying device provided in the embodiment of the present disclosure, a plurality of first detection holes 13 for detecting the front end of the mechanical arm and a plurality of second detection holes 14 for detecting the root of the mechanical arm are provided on the cavity cover 10 of the vacuum conveying cavity, the first detection holes 13 detect the wafer portion of the front section of the mechanical arm, and the second detection holes 14 detect the wafer portion of the root of the mechanical arm, so that the problem that the integrity of the wafer cannot be effectively monitored due to the shielding of the wafer portion of the root of the mechanical arm by the opaque region 12 is solved, the occurrence of poor process is avoided, and the production efficiency is improved.
In some embodiments, the robotic arm includes a plurality of fixed arms; a plurality of fixed arms are positioned above the cavity cover; a third detection hole is formed in a fixed arm.
In some embodiments, the angle between any two adjacent fixed arms is equal among the plurality of fixed arms.
In some embodiments, referring to fig. 5, a fourth inspection hole 16 is further provided on the mechanical arm and located right above the first inspection hole, for inspecting the integrity of the front end of the wafer; wherein the third detecting hole 15 is a rectangular detecting hole, and the fourth detecting hole is a circular detecting hole.
As an example, as shown in fig. 5 (1), a fourth detection hole 16 is provided at a front end portion of the mechanical arm in the vacuum transfer chamber of the relevant etching machine, for detecting the integrity of a wafer portion located at the front end of the mechanical arm, and when the wafer is transferred into and out of the process chamber, the portion located at the root of the mechanical arm cannot be effectively detected due to being blocked by an opaque area of the vacuum transfer chamber, and if the wafer at the blocked position is chipped and missing, or if chips occur during the wafer taking of the mechanical arm, the mechanical arm performs the next wafer transferring action, resulting in the poor process and surface scratch of the next wafer, and causing additional process rejection. As shown in fig. 5 (2), the etching machine conveying device provided in this embodiment of the disclosure is provided with a third detection hole 15 located right above a second detection hole, a fourth detection hole 16 located right above the first detection hole, and detects the integrity of the front end and root wafer portion of the mechanical arm, and fragments, so as to detect the integrity of the wafer to the greatest extent, and to avoid the occurrence of fragments in the process chamber, and to perform the next step of wafer conveying, thereby resulting in additional product scratch and scrapping, and improving the production efficiency.
In some embodiments, a semiconductor device is provided, which is processed by using any one of the etching machine conveying devices, and according to the etching machine conveying device in the embodiments, wafers are conveyed between different etching cavities of the etching machine through the vacuum conveying cavity; supporting and conveying the wafer by a mechanical arm arranged in the vacuum conveying cavity; the vacuum conveying cavity comprises a cavity cover, a plurality of first detection holes and a plurality of second detection holes, wherein the first detection holes are formed in the cavity cover and used for detecting the front end of the mechanical arm, the second detection holes are used for detecting the root of the mechanical arm, the third detection holes are formed in the mechanical arm and located right above the second detection holes, the detection device arranged on the cavity cover is used for detecting the inside of the vacuum conveying cavity through the sensor in the detection device, the third detection holes, the second detection holes and/or the first detection holes to generate detection information, and the controller in the detection device is used for receiving the detection information and generating an alarm control command to control the alarm to generate alarm information, wherein the controller is connected with the sensor and the alarm. At present, a transparent plate for detecting the front end of a mechanical arm is only arranged on a cavity cover of a vacuum conveying cavity of a related etching machine table, a wafer sensing device is covered above the transparent plate, when wafers are conveyed into and out of each process cavity, if the wafer part positioned at the root of the mechanical arm is broken and missing, or the mechanical arm takes a wafer, under the condition that fragments are generated, the sensor cannot effectively detect due to the shielding of an opaque area of the vacuum conveying cavity, the mechanical arm executes the next wafer conveying action, the next wafer is caused to be poor in process and surface scratch, and extra process rejection is caused. According to the etching machine conveying device, the wafer is supported and conveyed through the mechanical arm arranged in the vacuum conveying cavity, the first detection holes used for detecting the front end of the mechanical arm and the second detection holes used for detecting the root of the mechanical arm are formed in the cavity cover of the vacuum conveying cavity, the third detection holes located right above the second detection holes and the fourth detection holes located right above the first detection holes are formed in the mechanical arm, the integrity of fragments and/or wafers is detected by the aid of the detection device on the cavity cover, and the next step of wafer conveying is performed under the condition that fragments occur in the process cavity is avoided, so that extra products are scraped, and production efficiency is improved.
In the description of the present specification, reference to the term "some embodiments," "other embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples merely represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the present application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of the application should be assessed as that of the appended claims.
Claims (10)
1. An etching machine conveying device, characterized by comprising:
the vacuum conveying cavity is used for conveying wafers among different etching cavities of the etching machine;
The mechanical arm is arranged in the vacuum conveying cavity and is used for supporting and conveying the wafer; the cavity cover of the vacuum conveying cavity is provided with a plurality of first detection holes for detecting the front end of the mechanical arm and a plurality of second detection holes for detecting the root of the mechanical arm; the mechanical arm is provided with a third detection hole which is positioned right above one second detection hole; and
And the detection device is arranged on the cavity cover and is used for detecting the integrity of fragments and/or the wafer through the third detection hole, the second detection hole and/or the first detection hole.
2. The etching tool transfer device of claim 1, wherein the detecting means comprises:
And the sensor is arranged on the cavity cover and used for detecting the inside of the vacuum transmission cavity through the third detection hole, the second detection hole and/or the first detection hole to generate detection information.
3. The etching tool transfer device of claim 2, wherein the detecting means comprises:
An alarm;
And the controller is connected with the sensor and the alarm and is used for receiving the detection information and generating an alarm control command so as to control the alarm to generate alarm information.
4. The etching tool transfer device of any of claims 1-3, wherein at least one of the first inspection hole, the second inspection hole, and the third inspection hole comprises a transparent substrate.
5. The etching tool transfer device of any of claims 1-3, wherein the first plurality of inspection holes surrounds the second plurality of inspection holes.
6. The etching tool transfer unit as in claim 5, wherein the plurality of first detection holes are uniformly spaced apart; and/or
The plurality of second detection holes are uniformly distributed at intervals.
7. The etching tool transfer device of claim 5, wherein the mechanical arm comprises a plurality of fixed arms;
The plurality of fixed arms are positioned above the cavity cover;
The third detection hole is formed in the fixing arm.
8. The etching tool transfer device of claim 7, wherein the included angles between any two adjacent ones of the plurality of fixed arms are equal.
9. The etching machine table conveying device according to any one of claims 1 to 3, wherein a fourth detection hole is further formed in the mechanical arm and located right above the first detection hole, and is used for detecting the complete condition of the front end of the wafer; the third detection hole is a rectangular detection hole, and the fourth detection hole is a circular detection hole.
10. A semiconductor device processed by the etching tool transfer device according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322567863.4U CN220829933U (en) | 2023-09-20 | 2023-09-20 | Etching machine conveying device and semiconductor device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322567863.4U CN220829933U (en) | 2023-09-20 | 2023-09-20 | Etching machine conveying device and semiconductor device |
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| CN220829933U true CN220829933U (en) | 2024-04-23 |
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| CN202322567863.4U Active CN220829933U (en) | 2023-09-20 | 2023-09-20 | Etching machine conveying device and semiconductor device |
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