CN116169046B - Wafer cleaning method - Google Patents

Wafer cleaning method Download PDF

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Publication number
CN116169046B
CN116169046B CN202211721753.2A CN202211721753A CN116169046B CN 116169046 B CN116169046 B CN 116169046B CN 202211721753 A CN202211721753 A CN 202211721753A CN 116169046 B CN116169046 B CN 116169046B
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Prior art keywords
wafer
driven wheel
cleaning
driving wheel
wheel
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CN202211721753.2A
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CN116169046A (en
Inventor
睢英照
请求不公布姓名
赵德文
路新春
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Huahaiqingke Co Ltd
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Huahaiqingke Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • B08B1/12—
    • B08B1/20—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention discloses a wafer cleaning method, which comprises the following steps: checking the horizontal positions of the driving wheel and the driven wheel, and adjusting the driving wheel and/or the driven wheel as required so that the driving wheel and the driven wheel are positioned in the same plane; placing the wafer on a supporting device formed by a driving wheel and a driven wheel; the cleaning brushes positioned at the two sides of the wafer are moved to the cleaning position so as to carry out rolling brush cleaning on the front surface and the back surface of the wafer.

Description

Wafer cleaning method
Technical Field
The invention belongs to the technical field of wafer post-treatment, and particularly relates to a wafer cleaning method.
Background
The integrated circuit industry is the core of the information technology industry and plays a key role in the process of converting and upgrading the boosting manufacturing industry into digital and intelligent conversion. The chip is a carrier of an integrated circuit, and the chip manufacturing involves the technological processes of chip design, wafer manufacturing, wafer processing, electrical measurement, dicing packaging, testing, and the like. Among them, chemical mechanical polishing (Chemical Mechanical Planarization, CMP) belongs to a wafer manufacturing process, which is an ultra-precise surface processing technique for global planarization.
The wafer subjected to chemical mechanical polishing needs to be subjected to post-treatment such as cleaning, drying and the like so as to avoid pollution of trace ions and metal particles to the semiconductor device and ensure the performance and qualification rate of the semiconductor device. The wafer cleaning method comprises the following steps: roll brush cleaning, megasonic cleaning, etc., wherein roll brush cleaning is widely used, but has some problems.
In the process of rolling brush cleaning, a pair of driving wheels and driven wheels are used for forming a supporting device to vertically support and drive the wafer to rotate, wherein the driven wheels are arranged between the pair of driving wheels, and the driving wheels and the driven wheels are arranged on a mounting seat of a cleaning shell.
Due to processing and assembly errors, the grooves on the driving wheel and the driven wheel may not be in the same plane, so that the wafer placed on the supporting device is inclined or shifted, i.e. the brushed wafer cannot be ensured to be in a vertical state. At least the following problems exist in the wafer cleaning process: the inclined wafer is in inconsistent clamping state, so that the torque of a driving motor arranged on the cleaning brush fluctuates to influence the uniformity of cleaning the wafer; the inclined wafer cannot be placed in the washer of the driven wheel, so that the wafer slips to give out false alarm of falling speed; the inclined wafer is not beneficial to the picking of the mechanical arm, and the picking is easy to fail or break to interrupt production; if the megasonic cleaning module is disposed at the lower part of the cleaning housing, the ultrasonic waves emitted by the megasonic cleaning module cannot completely cover the surface of the wafer, so that the cleaning effect of the wafer is affected.
Disclosure of Invention
The embodiment of the invention provides a wafer cleaning method, which aims at solving at least one of the technical problems existing in the prior art.
In a first aspect of an embodiment of the present invention, a wafer cleaning method is provided, including:
s1, checking the horizontal positions of a driving wheel and a driven wheel, and adjusting the driving wheel and/or the driven wheel as required so that the driving wheel and the driven wheel are positioned in the same plane;
s2, placing the wafer on a supporting device formed by a driving wheel and a driven wheel;
and S3, the cleaning brushes positioned at the two sides of the wafer are moved to the cleaning positions so as to perform rolling brush cleaning on the front and back sides of the wafer.
Further, in step S1, the checking step includes:
s11, measuring the horizontal positions of the driving wheel and the driven wheel by using a position detection assembly;
s12, comparing the horizontal positions of the driving wheel and the driven wheel;
s13, according to the comparison result, the position adjusting assembly is used for adjusting the horizontal position of the driving wheel and/or the driven wheel.
In one embodiment, the horizontal positions of the driving wheel and the driven wheel are measured and verified using a position detecting assembly after the wafer is placed on the supporting device.
Further, in step S1, the horizontal position of the driving wheel is adjusted based on the driven wheel.
In one embodiment, the driving wheel is provided with an independently operated position adjusting assembly to adjust the horizontal position of the driving wheel according to the comparison result.
In one embodiment, the position detection assembly includes a ranging sensor that emits laser light toward sides of the capstan and the follower to obtain horizontal positions of the capstan and the follower.
In one embodiment, the ranging sensor emits laser light toward a center position of the capstan and the slave capstan, the laser light having a wavelength greater than 1000nm.
Further, in the wafer brushing process, when the rotating speed of the driven wheel is lower than the rotating speed of the wafer, or when fluctuation occurs in torque of the cleaning brush, the position detection assembly and the position adjustment assembly are combined, and the horizontal positions of the driving wheel and the driven wheel are checked.
In a second aspect of the embodiments of the present invention, there is provided a control module comprising a memory, a processor and a computer program stored in the memory and executable on the processor, the processor implementing the steps of the wafer cleaning method described above when executing the computer program.
In a third aspect of the embodiments of the present invention, there is provided a computer readable storage medium storing a computer program which, when executed by a processor, implements the steps of the wafer cleaning method described above.
The beneficial effects of the invention include:
a. before a wafer is placed on a supporting device, the horizontal positions of a driving wheel and a driven wheel of the supporting device are measured and adjusted, so that the wafer to be scrubbed is effectively ensured to be in a vertical state, and false alarm caused by the falling speed of the driven wheel is prevented;
b. in the wafer cleaning process, the state of the supporting device is indirectly judged by monitoring the rotation speed of the driven wheel and/or the fluctuation of the torque of the driving motor configured by the cleaning brush so as to determine whether to carry out position check before cleaning the next wafer, thereby ensuring the cleaning effect and improving the cleaning efficiency.
Drawings
The advantages of the present invention will become more apparent and more readily appreciated from the detailed description given in conjunction with the following drawings, which are meant to be illustrative only and not limiting of the scope of the invention, wherein:
FIG. 1 is a schematic view of a cleaning apparatus according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of a driven wheel provided in an embodiment of the present invention;
FIG. 3 is a schematic view of the driven wheel and the drive wheel not being in the same plane;
FIG. 4 is a flow chart of a wafer cleaning method according to an embodiment of the present invention;
FIG. 5 is a flow chart of a checking step provided by an embodiment of the present invention;
FIG. 6 is a schematic diagram of a position detecting assembly and a position adjusting assembly provided in a cleaning device according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a ranging sensor for measuring horizontal position according to an embodiment of the present invention;
FIG. 8 is a flow chart of a method for cleaning a wafer according to another embodiment of the present invention;
FIG. 9 is a flow chart of a method for cleaning a wafer according to yet another embodiment of the present invention;
fig. 10 is a schematic diagram of a control apparatus according to an embodiment of the present invention.
Detailed Description
The following describes the technical scheme of the present invention in detail with reference to specific embodiments and drawings thereof. The examples described herein are specific embodiments of the present invention for illustrating the concept of the present invention; the description is intended to be illustrative and exemplary in nature and should not be construed as limiting the scope of the invention in its aspects. In addition to the embodiments described herein, those skilled in the art can adopt other obvious solutions based on the disclosure of the claims of the present application and the specification thereof, including those adopting any obvious substitutions and modifications to the embodiments described herein.
The drawings in the present specification are schematic views, which assist in explaining the concept of the present invention, and schematically show the shapes of the respective parts and their interrelationships. It should be understood that for the purpose of clearly showing the structure of various parts of embodiments of the present invention, the drawings are not drawn to the same scale and like reference numerals are used to designate like parts in the drawings.
In the present invention, the Wafer (W) is also called a Substrate (Substrate), and the meaning and actual function are equivalent.
IC processes are performed in clean rooms using chemical materials such as organic and inorganic materials. Contaminants such as particles, organics, metal contaminants and/or oxides, which vary in particle size from a few nanometers to hundreds of nanometers, can be generated during wafer processing due to personnel, environmental, and like factors. Wafer cleaning is mainly to remove contaminants attached to the wafer surface and control the size and quantity of contaminant particles within the process requirements.
Fig. 1 is a schematic view of a wafer cleaning apparatus, which includes a housing 10, and a support device 20 is disposed inside the housing 10 to vertically support and position a wafer W to be cleaned. The wafer W is provided with the brush 30 on both sides, and a driving motor (not shown) is connected to an end of the brush 30 to drive the brush 30 to rotate about its axis. A spray line is provided at an upper portion of the housing 10 to spray DIW and/or cleaning liquid toward the wafer W.
The supporting device 20 comprises a pair of driving wheels 21 and driven wheels 22, and the driven wheels 22 are positioned in the middle of the driving wheels 21 and distributed along the edge of the wafer W to vertically support and drive the wafer to rotate.
When the wafer is cleaned, the motor arranged at the side part of the driving wheel 21 drives the motor to rotate in the same direction, and the wafer W vertically arranged on the supporting device 20 rotates around the axis of the wafer under the action of friction force. Since the wafer is inserted into the driven wheel 22, specifically, the wafer is inserted into a groove (shown in fig. 2) on the washer in the driven wheel 22, thereby driving the driven wheel 22 to rotate. Typically, a speed measuring module, not shown, is provided on one side of the driven wheel 22 to monitor the rotational speed of the wafer.
In the embodiment shown in fig. 1, brush 30 may be made of a porous material, such as polyvinyl alcohol, and brush 30 is capable of adsorbing a large amount of cleaning liquid for brushing the surface of wafer W. The rolling brush 30 contacts the rotating wafer W to remove contaminants from the surface of the wafer W. The brush 30 positioned at both sides of the wafer W may be moved in a horizontal direction to be away from or close to the wafer W. When the cleaning brush 30 is far away from the wafer W, a certain gap is reserved between the cleaning brush 30 and the wafer W, and the wafer W can be clamped by the wafer carrying manipulator to take away the wafer after cleaning; the brush 30 moves close to the wafer W, and the brush 30 contacts the wafer W to clean the wafer surface.
In the wafer cleaning device shown in fig. 1, due to processing and assembly errors, after the driving wheel 21 and the driven wheel 22 are installed, the situation that the driving wheel 21 and the driven wheel 22 are not coplanar easily occurs, as shown in fig. 3, so that the wafer placed on the supporting device 20 is inclined, and even the wafer cannot be accurately inserted into the washer of the driven wheel 22.
In order to solve the above problems, the present invention provides a wafer cleaning method, as shown in fig. 4, which includes:
s1, checking the horizontal positions of the driving wheel 21 and the driven wheel 22, and optionally adjusting the driving wheel 21 and/or the driven wheel 22 so that the driving wheel 21 and the driven wheel 22 are positioned in the same plane;
specifically, in order to ensure that the wafers disposed in the housing 10 are in a vertical state, the washers in the driving pulley 21 and the driven pulley 22 need to be kept uniform in a horizontal position.
S2, placing the wafer on a supporting device 20 formed by a driving wheel 21 and a driven wheel 22;
specifically, the wafer handling robot places the wafer to be cleaned on the supporting device 20 through the opening above the housing 10;
and S3, the cleaning brushes 30 positioned on the two sides of the wafer are moved to the cleaning positions so as to perform rolling brush cleaning on the front surface and the back surface of the wafer.
After the wafer is placed on the supporting device 20, the cleaning brushes 30 arranged in parallel move towards the wafer to a cleaning position; then, the cleaning brush 30 rolls around the central axis to brush out particles on the surface of the wafer in a rolling manner; the motor configured by the driving wheel 21 drives the wafer to rotate so as to drive the wafer to rotate, so that the cleaning brush 30 can fully cover the surface of the wafer, and a good cleaning effect is ensured.
Fig. 5 is a flowchart of a checking step provided in an embodiment of the present invention, and in step S1, the checking step includes:
s11, measuring the horizontal positions of the driving wheel 21 and the driven wheel 22 using the position detecting assembly 40 (shown in fig. 6);
s12, comparing the horizontal positions of the driving wheel 21 and the driven wheel 22;
s13, according to the comparison result, the horizontal position of the driving wheel 21 and/or the driven wheel 22 is adjusted using the position adjustment assembly 50 (shown in fig. 6).
In the present invention, it is necessary to use the position detecting unit 40 and the position adjusting unit 50 in the checking operation of the driving wheel 21 and the driven wheel 22, as shown in fig. 6. The position detecting assembly 40 includes a ranging sensor 41 (shown in fig. 7) provided at the outside of the housing 10, and a front end of the ranging sensor 41 is configured with a transparent window to emit light signals toward the driving wheel 21 and the driven wheel 22 in the housing 10, thereby realizing measurement of horizontal positions of the driving wheel 21 and the driven wheel 22.
In fig. 6, the position adjusting assembly 50 includes a servo motor 51, a screw 52 and a slider 53, wherein the slider 53 is disposed on the screw 52, and the slider 53 is connected with a mounting seat of the driving wheel 21 or the driven wheel 22 to drive the driving wheel 21 or the driven wheel 22 to move along a horizontal direction so as to adjust a position of the driving wheel 21 or the driven wheel 22.
As an embodiment of the present invention, the position of the driven wheel 22 is relatively fixed, and the position adjusting assembly 50 is specially configured for the driving wheel 21; the position detecting assembly 40 measures the horizontal positions of the driving wheel 21 and the driven wheel 22 to obtain measurement results; the position adjustment assembly 50 adjusts the horizontal position of the driving wheel 21 as needed based on the measurement results so that the driving wheel 21 and the driven wheel 22 are in the same plane. Specifically, grooves of the washer in the driving wheel 21 and the driven wheel 22 are in the same plane, so that the wafer inserted in the groove of the washer is in a vertical state.
That is, each of the driving wheels 21 is provided with a position adjusting assembly 50 that operates independently to adjust the horizontal position of the driving wheel 21 based on the measurement result of the horizontal position so that the pair of driving wheels 21 and the driven wheel 22 are in the same plane.
The horizontal positions of the driving wheel 21 and the driven wheel 22 are the distances D between the outer end surfaces of the driving wheel 21 and the driven wheel 22 and the reference surface, with the distance sensor 41 (shown in fig. 7) as the reference surface.
As one aspect of the present embodiment, the distance measuring sensor 41 is a laser distance measuring sensor that emits laser light toward the sides of the capstan 21 and the follower 22 to acquire the horizontal positions of the capstan 21 and the follower 22.
In the embodiment shown in fig. 7, the distance measuring sensor 41 measures the horizontal distance D of the driven wheel 22 i The distance measuring sensor 41 measures the horizontal distance D of the driving wheel 21 d 。
If D d <D i The driving wheel 21 needs to be moved in a direction away from the distance measuring sensor 41 so that D d ＝D i The method comprises the steps of carrying out a first treatment on the surface of the Or the difference between the two is within an allowable tolerance.
If D d >D i The driving wheel 21 needs to be moved in a direction approaching the ranging sensor 41 so that D d ＝D i The method comprises the steps of carrying out a first treatment on the surface of the Or the difference between the two is within an allowable tolerance.
In fig. 7, the distance measuring sensor 41 emits laser light toward the center positions of the capstan 21 and the follower 22 to measure the horizontal positions of the capstan 21 and the follower 22.
As an embodiment of the present invention, after the wafer is placed on the supporting device 20, it is generally unnecessary to use the ranging sensor 41 to perform the horizontal position measurement on the driving wheel 21 or the driven wheel 22. However, in some special processes, it is required to monitor whether the verticality of the wafer changes in real time, or whether the horizontal position of the driving wheel 21 or the driven wheel 22 changes after the wafer is placed on the supporting device 20. Therefore, when the wafer is placed on the supporting device 20, the ranging sensor 41 also needs to emit laser light toward the capstan 21 or the follower 22 to perform the measurement of the horizontal position.
As one aspect of the present embodiment, the wavelength of the laser light emitted from the ranging sensor 41 is greater than 1000nm. Since the laser wavelength is larger than 1000nm, the photo-induced corrosion is hardly caused in the wafer cleaning device, and thus the distance measuring sensor 41 can ensure the wafer cleaning effect and avoid the influence of the photo-induced corrosion on the wafer cleaning yield.
As another embodiment of the present invention, in order to avoid the influence of the ranging sensor 41 on the cleaning effect during the wafer cleaning process, the rotation speed V of the driven wheel 21 may be monitored i Whether the position of the driving wheel 21 or the driven wheel 22 changes in the brushing process is indirectly obtained so as to judge the verticality of the brushed wafer.
A flow chart of the wafer cleaning method described above is shown in fig. 8. The rotation speed V of the driven wheel 21 i With the rotational speed V of the brushed wafer W w And (3) performing comparison:
if V i ＜V w It is indicated that the brushed wafer has a problem of falling speed, that is, indirectly reflecting that the driving wheel 21 and the driven wheel 22 may be in different planes. Therefore, before the next wafer is cleaned, the horizontal positions of the driving wheel 21 and the driven wheel 22 need to be checked using the checking step shown in fig. 5.
If V i ＝V w It is explained that the speed measuring module configured with the driven wheel 22 can accurately measure the rotation speed of the wafer W, and before the next wafer is cleaned, it is not necessary to check the horizontal positions of the driving wheel 21 and the driven wheel 22.
As a variation of the embodiment of fig. 8, fluctuation of torque T of the driving motor provided to the brush 30 may also be detected to determine whether the brushed wafer is in a vertical state. Fig. 9 is a flow chart of a corresponding wafer cleaning method.
During the wafer cleaning process, the torque of the driving motor configured by the cleaning brush 30 is monitored in real time, and the torque T measured in real time is measured c Setting torque T of driving motor r Comparing to determine the state of brushing the wafer.
If | c -T r |＞T r *15, it is explained that the torque of the driving motor configured with the brush 30 fluctuates greatly during the wafer cleaning process, so the checking step shown in fig. 5 is required before the next wafer is cleanedAnd checking the horizontal positions of the driving wheel 21 and the driven wheel 22.
If | c -T r |≤T r *15, it is explained that the torque of the driving motor configured by the cleaning brush 30 fluctuates within a set range during the wafer cleaning process, and it is not necessary to check the horizontal positions of the driving wheel 21 and the driven wheel 22 before the next wafer is cleaned.
Fig. 10 is a schematic diagram of a control apparatus according to an embodiment of the present invention. In this embodiment, the control apparatus includes: a processor, a memory, and a computer program stored in the memory and executable on the processor. The steps in each of the above-described wafer cleaning method embodiments are implemented when the processor executes a computer program. Alternatively, the processor, when executing the computer program, performs the functions of the modules/units in the embodiments of the system as described above.
The control device refers to a terminal having data processing capability, including but not limited to a computer, a workstation, a server, and even some Smart phones, palm top computers, tablet computers, personal Digital Assistants (PDAs), smart televisions (Smart TVs), etc. with excellent performance.
The control device may include, but is not limited to, a processor, a memory. It will be appreciated by those skilled in the art that fig. 10 is merely an example of a control device and is not limiting of the control device, and may include more or fewer components than shown, or may combine certain components, or different components, e.g., the control device may also include an input-output device, a network access device, a bus, etc.
The processor may be a central processing unit (Central Processing Unit, CPU), other general purpose processors, digital signal processors (Digital Signal Processor, DSP), application specific integrated circuits (Application Specific Integrated Circuit, ASIC), off-the-shelf programmable gate arrays (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or the like.
The memory may be an internal storage unit of the control device, such as a hard disk or a memory of the control device. The memory may also be an external storage device of the control device, such as a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card) or the like, which are provided on the control device.
Further, the memory may also include both an internal memory unit of the control device and an external memory device. The memory is used for storing computer programs and other programs and data required for controlling the device. The memory may also be used to temporarily store data that has been output or is to be output.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.

Claims (7)

1. A method of cleaning a wafer, comprising:
s1, checking the horizontal positions of a driving wheel and a driven wheel, and adjusting the driving wheel and/or the driven wheel as required so that the driving wheel and the driven wheel are positioned in the same plane;
s2, placing the wafer on a supporting device formed by a driving wheel and a driven wheel;
s3, the cleaning brushes positioned on the two sides of the wafer move to the cleaning positions so as to perform rolling brush cleaning on the front surface and the back surface of the wafer;
in step S1, the checking step includes:
s11, measuring the horizontal positions of the driving wheel and the driven wheel by using a position detection assembly;
s12, comparing the horizontal positions of the driving wheel and the driven wheel;
s13, according to the comparison result, using a position adjusting assembly to adjust the horizontal position of the driving wheel and/or the driven wheel;
wherein the method further comprises: in the process of cleaning the wafer, when the rotating speed of the driven wheel is lower than the rotating speed of the wafer, or when the torque of the cleaning brush fluctuates, checking the horizontal positions of the driving wheel and the driven wheel by using a position detection assembly and a position adjustment assembly through steps S11-S13 before cleaning the next wafer, and continuously executing step S2;
after step S2, the method further comprises: the position detection assembly is used for measuring and checking the horizontal position of the driving wheel and the driven wheel.
2. The wafer cleaning method according to claim 1, wherein in step S1, a horizontal position of the driving wheel is adjusted based on the driven wheel.
3. The wafer cleaning method of claim 1, wherein the drive wheel is configured with an independently operable position adjustment assembly to adjust the horizontal position of the drive wheel based on the comparison.
4. The wafer cleaning method of claim 1, wherein the position detection assembly includes a ranging sensor that emits laser light toward sides of the capstan and the follower to obtain horizontal positions of the capstan and the follower.
5. The wafer cleaning method of claim 4, wherein the ranging sensor emits laser light toward a center position of the capstan and the slave wheel, the laser light having a wavelength greater than 1000nm.
6. A control module comprising a memory, a processor and a computer program stored in the memory and executable on the processor, the processor implementing the steps of the wafer cleaning method according to any one of claims 1 to 5 when the computer program is executed.
7. A computer-readable storage medium, characterized in that it stores a computer program which, when executed by a processor, implements the steps of the wafer cleaning method according to any one of claims 1 to 5.
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