CN112233971A - Wafer cleaning method and wafer cleaning device - Google Patents
Wafer cleaning method and wafer cleaning device Download PDFInfo
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- CN112233971A CN112233971A CN202011470611.4A CN202011470611A CN112233971A CN 112233971 A CN112233971 A CN 112233971A CN 202011470611 A CN202011470611 A CN 202011470611A CN 112233971 A CN112233971 A CN 112233971A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 121
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000005096 rolling process Methods 0.000 claims abstract description 48
- 230000001680 brushing effect Effects 0.000 claims abstract description 10
- 230000007246 mechanism Effects 0.000 claims description 16
- 238000004590 computer program Methods 0.000 claims description 13
- 238000009434 installation Methods 0.000 claims description 12
- 239000007769 metal material Substances 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 239000000356 contaminant Substances 0.000 description 6
- 238000001514 detection method Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 206010063385 Intellectualisation Diseases 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- JLVVSXFLKOJNIY-UHFFFAOYSA-N Magnesium ion Chemical compound [Mg+2] JLVVSXFLKOJNIY-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910001425 magnesium ion Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- -1 organics Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- B08B1/12—
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- B08B1/32—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
Abstract
The invention discloses a wafer cleaning method and a wafer cleaning device, wherein the wafer cleaning method comprises the following steps: installing a cleaning brush according to the reference position, determined by the centering operation, of the two rolling brush tools, which are simultaneously contacted with the wafer tool, and controlling the cleaning brush to move to the corresponding cleaning position; and controlling the cleaning brush to carry out rolling brushing on the front surface and the back surface of the wafer at the cleaning position.
Description
Technical Field
The invention belongs to the technical field of chemical mechanical polishing post-treatment, and particularly relates to a wafer cleaning method and a wafer cleaning device.
Background
The integrated circuit industry is the core of the information technology industry and plays a key role in the process of upgrading the boosting manufacturing industry to digitalization and intellectualization transformation. The chip is a carrier of an integrated circuit, and the chip manufacturing relates to the process flows of chip design, wafer manufacturing, wafer processing, electrical property measurement, cutting packaging, testing and the like. Chemical Mechanical Polishing (CMP) is an ultra-precise surface processing technique for global Planarization.
After the chemical mechanical polishing, the wafer needs to be post-processed by cleaning, drying, etc. The purpose of cleaning is to avoid the pollution of trace ions and metal particles to the semiconductor device and ensure the performance and the qualification rate of the semiconductor device. The wafer cleaning method comprises the following steps: rolling brush cleaning, megasonic cleaning, and the like, wherein rolling brush cleaning is widely applied.
In the rolling brush cleaning process, the wafer is arranged on the supporting roller of the shell, and the rolling brushes arranged on the two sides of the wafer roll around the axis of the wafer to contact, clean and remove particles on the surface of the wafer. In the wafer processing device disclosed in CN209551448U, the post-processing unit includes a rolling brush device, the rolling brush device includes a mounting shell (housing), the wafer is rotatably disposed in the mounting shell (housing), and the rolling brush is disposed in the mounting shell (housing) in a rolling manner around an axis thereof and located at two sides of the wafer; the roller brush is contacted with the wafer, and pollutants on the surface of the wafer are removed in the rolling process of the roller brush.
Because the installation reference of the supporting roller in the shell is different from that of the rolling brush, the plane formed by the supporting roller can only be ensured to be approximately vertical to the installation reference plane of the rolling brush in the assembly process of the rolling brush cleaning module. This creates a problem: the wafer placed on the support rollers may not be in a vertical state. When the rolling brush cleaning module is debugged, the position of the rolling brush is debugged by using the wafer arranged on the support roller as a reference. When debugging is performed using a component whose state is unknown as a reference, there is a problem that the adjustment accuracy is not high and the debugging efficiency is low.
Further, even if the support roller is formed in a plane perpendicular to the mounting reference plane of the roll brush, the wafer placed on the support roller may be slightly inclined. The debugging result of the rolling brush cleaning module is also influenced to a certain extent, and the wafer brushing effect is influenced.
Disclosure of Invention
The present invention aims to solve at least to some extent one of the technical problems existing in the prior art.
To this end, a first aspect of an embodiment of the present invention provides a wafer cleaning method, which includes:
s1, centering the wafer cleaning device by using the cleaning brush centering device;
s2, determining the reference positions of the two roll brush tools and the wafer tool which are simultaneously contacted;
s3, installing the cleaning brush according to the reference position determined by the centering operation;
and S4, controlling the cleaning brush to move to a corresponding cleaning position and performing rolling brushing on the front and back surfaces of the wafer.
As a preferred embodiment, the centering operation includes:
s11, installing a rolling brush tool to replace a cleaning brush in the shell;
s12, placing the wafer tool on a support roller in the shell, adjusting the posture of the wafer tool to be in a vertical state and locking;
and S13, controlling the rolling brush tool to move so that the rolling brush tool can be simultaneously contacted with the wafer tool to determine the reference position.
As a preferred embodiment, the step of determining the reference position of the roll brush tool includes:
s131, controlling the roll-brushing tools to move, and measuring the distance L between one roll-brushing tool and the wafer tool when the distance between the other roll-brushing tool and the wafer tool is the set distance L0;
s132, if the distance L is larger than the set distance L0, adjusting the installation position of another roll brush tool;
and S133, repeating the steps S131 and S132 until the two rolling brush tools are simultaneously contacted with the wafer tool, wherein the installation position of the rolling brush tool is a reference position.
As a preferred embodiment, the position of the wafer tool is maintained by abutting the outer edge of the wafer tool.
As a preferred embodiment, the posture of the wafer tool is the inclination of the wafer tool, and the posture of the wafer tool is detected by a level gauge arranged on the side surface of the wafer tool.
As a preferred embodiment, the wafer tool is locked at the position of the wafer tool through a clamping mechanism, and the clamping mechanism is detachably arranged at the top of the shell.
As a preferred embodiment, the clamping mechanism includes a support and an ejector pin, the ejector pin is slidably connected to the support, and the ejector pin can move in the vertical direction to enable the ejector pin to abut against the outer edge of the wafer tool.
As a preferred embodiment, the support is provided with a slide rail perpendicular to the side surface of the wafer tool, the thimble is disposed on the support block, the support block is connected to the slide rail through a slide block, and the thimble can move along the slide rail to adjust the horizontal distance between the thimble and the wafer tool.
A second aspect of an embodiment of the present invention provides a wafer cleaning apparatus, including:
the first cleaning brush is used for cleaning the front side of the wafer;
the second cleaning brush is used for brushing the back side of the wafer;
the control module is used for installing the cleaning brush according to the reference position, determined by the centering operation, of the two rolling brush tools and the reference position of the wafer tool, which are simultaneously contacted, and controlling the cleaning brush to move to the corresponding cleaning position; and controlling the cleaning brush to carry out rolling brushing on the front surface and the back surface of the wafer at the cleaning position.
A third aspect of the embodiments of the present invention provides a control module, which includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the wafer cleaning method described above when executing the computer program.
The beneficial effects of the invention include: through the rolling brush tool, the wafer tool and the clamping mechanism, the influence of poor verticality between the mounting surface of the cleaning brush and the mounting surface of the supporting roller for placing the wafer on wafer cleaning is effectively eliminated, the mounting position of the cleaning brush is accurately determined, the symmetrical mounting of the cleaning brush is effectively guaranteed, the cleaning brush is enabled to be in contact with the front side and the back side of the wafer simultaneously, and a good cleaning effect is guaranteed.
Drawings
The advantages of the invention will become clearer and more readily appreciated from the detailed description given with reference to the following drawings, which are given by way of illustration only, and which do not limit the scope of protection of the invention, wherein:
FIG. 1 is a schematic structural diagram of a wafer cleaning apparatus 1 according to the present invention;
FIG. 2 is a schematic view of the brush centering device 2 according to the present invention;
fig. 3 is a schematic structural view of the chucking mechanism 60 according to the present invention;
FIG. 4 is a schematic view showing the construction of another embodiment of the washing brush centering device 2 according to the present invention;
FIG. 5 is a flow chart of a wafer cleaning method according to the present invention;
FIG. 6 is a flow chart of a centering method of the wafer cleaning apparatus according to the present invention;
FIG. 7 is a flow chart of the adjustment of the roll brush fixture 40 according to the present invention;
fig. 8 is a schematic diagram of the present invention for determining the datum position of the roll brush tooling.
Detailed Description
The technical solution of the present invention will be described in detail with reference to the following embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the present invention for the purpose of illustrating the concepts of the invention; the description is intended to be illustrative and exemplary and should not be taken to limit the scope of the invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious based on the disclosure of the claims and the specification thereof, and these technical solutions include technical solutions which make any obvious replacement or modification of the embodiments described herein.
The drawings in the present specification are schematic views to assist in explaining the concept of the present invention, and schematically show the shapes of respective portions and their mutual relationships. It should be understood that the drawings are not necessarily to scale, the same reference numerals being used to identify the same elements in the drawings in order to clearly show the structure of the elements of the embodiments of the invention.
In the present invention, "Chemical Mechanical Polishing" is also referred to as "Chemical Mechanical Planarization (CMP)" and "wafer" is also referred to as "substrate", and the meaning and the actual function are equivalent.
In IC processing, some organic and inorganic materials are used in clean rooms. Due to the influence of personnel, environment and other factors, a large amount of pollutants are generated in the wafer processing process. These contaminants generally include particles, organics, metal contaminants and/or oxides, and the like. The particle size of the contaminants varies from a few nanometers to hundreds of nanometers. The wafer cleaning function is to remove the contaminants attached to the wafer surface, so that the size and quantity of the contaminant particles on the wafer surface can be controlled within the process requirement range.
Fig. 1 is a schematic structural diagram of a wafer cleaning apparatus 1, wherein the wafer cleaning apparatus 1 includes a housing 10, and a support roller 20 is disposed inside the housing 10 to vertically support and position a wafer W to be cleaned. The wafer W is provided with a brush 30 on both sides thereof, and a drive motor, not shown, is connected to an end portion of the brush 30, and drives the brush 30 to rotate around the axis thereof. The upper portion of the housing 10 is provided with a spray line to spray DIW and/or cleaning solution to the wafer W.
When the wafer is cleaned, the support roller 20 rotates, and the wafer W vertically disposed on the support roller 20 rotates around the axis of the wafer under the action of friction. The brush 30 abuts on the front surface of the wafer W and rotates around the axis of the brush 30. The cleaning brush 30 may be made of a porous material, such as polyvinyl alcohol, and the cleaning brush 30 can absorb a large amount of cleaning solution for cleaning the surface of the wafer W. The rolling brush 30 is brought into contact with the wafer W being rotated to remove contaminants from the surface of the wafer W.
The cleaning brushes 30 positioned at both sides of the wafer W may be moved in a horizontal direction to be away from or close to the wafer W. When the cleaning brush 30 is far away from the wafer W, a certain gap is reserved between the cleaning brush 30 and the wafer W, and the wafer carrying manipulator can clamp the wafer W to take away the cleaned wafer; the brush 30 moves closer to the wafer W, and the brush 30 contacts the wafer W to clean the front surface of the wafer in contact therewith.
When the brush 30 is moved toward the other side, the brush 30 needs to be simultaneously brought into contact with the front surface of the wafer W and the wafer W is in a vertical position, so that the brush 30 is sufficiently in contact with the front surface of the wafer W to ensure the cleaning effect of the front surface of the wafer. Therefore, the mounting position of the brush 30 greatly affects the wafer cleaning effect.
In order to secure the accuracy of the mounting position of the washing brush 30, it is required to find and determine the mounting position of the washing brush 30.
When the wafer cleaning apparatus 1 is set up, the position of the brush 30 is generally set up with reference to the wafer mounted on the support rollers 20. Since the mounting reference of the supporting roller 20 inside the housing 10 is different from the mounting reference of the brush 30, it is only ensured that the plane formed by the supporting roller 20 is substantially perpendicular to the mounting reference surface of the brush 30 in the assembling process of the wafer cleaning apparatus 1. This creates a problem: the wafer W placed on the support rollers 20 may not be in a vertical state. When debugging is performed using a component whose state is unknown as a reference, there is a problem that the adjustment accuracy is not high and the debugging efficiency is low.
In order to improve the accuracy of the installation position of the cleaning brush 30 and the efficiency of the installation and debugging of the wafer cleaning device, the present invention provides a cleaning brush centering device 2 for assisting the debugging, as shown in fig. 2. The cleaning brush centering device 2 comprises a rolling brush tool 40, a wafer tool 50 and a clamping mechanism 60.
The wafer fixture 50 is a disk-shaped component having the same size as the wafer W and made of a non-metal material. The wafer fixture 50 is placed in the housing 10 and supported and positioned by the support rollers 20. The chucking mechanism 60 is provided at the top of the housing 10 so as to hold the position of the wafer tool 50 by abutting the outer edge of the wafer tool 50.
As an embodiment of the present invention, the wafer fixture 50 is made of teflon, which has a certain strength so as not to crack the wafer fixture 50 like the wafer W when the chucking mechanism 60 is locked. It is understood that the wafer fixture 50 may also be made of non-metal materials such as nylon, PET, ABS, etc.
In order to monitor the inclination of the wafer tool 50, a level gauge 70 is disposed on a side surface of the wafer tool 50, and whether the wafer tool 50 is in a vertical position is detected by the level gauge 70. As one aspect of the present embodiment, the level 70 is detachably mounted to a side surface of the wafer tool 50. As a variation of this embodiment, the level gauge 70 may be integrated with the wafer fixture 50, and the wafer fixture 50 and the level gauge 70 may be disposed on the upper portion of the support roller 20.
In the embodiment shown in fig. 2, the level 70 may be selected as a laser level with an angle measurement to measure whether the wafer tool 50 is in a vertical position and locked into that position using the clamping mechanism 60.
The rolling brush fixture 40 is installed in the casing 10 instead of the cleaning brush 30, and the rolling brush fixture 40 is made of a metal material, so that the influence of inconsistent elastic deformation of the cleaning brush 30 on the centering accuracy of the cleaning brush is avoided. It is understood that the coupling structure of both ends of the roll brush fixture 40 is the same as that of the cleaning brush 30 in order to ensure that the mounting positions of the roll brush fixture 40 and the cleaning brush 30 are identical.
As an embodiment of the present invention, the roll brush tool 40 is made of a metal material other than copper and magnesium, so as to prevent contamination of copper ions or magnesium ions during the centering operation of the wafer cleaning apparatus, which increases the difficulty of cleaning the wafer. As a variation of this embodiment, the roll brush tooling 40 may also be made of a non-metallic material with a certain hardness, so that the roll brush tooling 40 is hardly deformed when contacting the wafer W. Specifically, the roll brush tool 40 may be made of non-metallic materials such as nylon, plastic, organic glass, and the like.
Fig. 3 is a schematic structural view of the chucking mechanism 60 according to the present invention. The chucking mechanism 60 includes a holder 61 and a pin 62, the pin 62 is slidably connected to the holder 61, and the pin 62 is movable in the vertical direction so that the pin 62 abuts against the outer edge of the wafer tool 50.
In the embodiment shown in fig. 3, the support 61 is provided with a slide rail 63 perpendicular to the side surface of the wafer tool 50, the thimble 61 is disposed in the mounting hole of the supporting block 64, and the thimble 61 can move along the mounting hole of the supporting block 64 to adjust the position of the end of the thimble 62. The end of the thimble 61 is provided with a V-shaped groove for clamping the outer edge of the wafer W, so as to increase the reliability of fixing the thimble 61 and the wafer W.
Further, the supporting block 64 is connected to the slide rail 63 through a slider, and the thimble 62 can move along the slide rail 63 to adjust the horizontal distance between the thimble 62 and the wafer tool 50.
When the wafer tool 50 is in the vertical position, the supporting block 64 is slid, the vertical position of the thimble 62 is adjusted, and the position of the thimble 62 is locked by using the locking screw, so that the roll brush tool 40 can be controlled to move, and the installation position of the cleaning brush 30 can be determined.
It is understood that in order to measure the inclination of the wafer tool 50, an optical detection unit may be used to obtain the position information. Such as a camera, which collects images of the placement state of the wafer tool 50 to determine whether the wafer tool 50 is vertically disposed. To ensure the accuracy of the measurement, an optical detection unit may be fixed to the chucking mechanism 60. Specifically, the optical detection unit may be disposed on the bottom surface of the support 61 to collect an image to detect the inclination of the wafer fixture 50.
As a variation of this embodiment, an optical detection unit 70' for measuring the inclination of the wafer tool 50 may also be provided at the sidewall of the housing 10, as shown in fig. 4. Specifically, the optical detection unit 70' is detachably disposed at a middle position of the inner side wall of the rear portion of the housing 10, so as to accurately and conveniently detect whether the wafer fixture 50 is in the vertical position. It is understood that the optical detection unit 70' may also be disposed at a central position of an inner sidewall (not shown) of the front portion of the housing 10.
Meanwhile, the embodiment of the invention also discloses a wafer cleaning method, and a flow chart thereof is as shown in fig. 5, and comprises the following steps:
s1, centering the wafer cleaning apparatus 1 using the brush centering apparatus 2;
s2, determining the reference positions of the two roll brush tools 40 and the wafer tool 50 which are simultaneously contacted;
s3, mounting the washing brush 30 according to the reference position determined by the centering operation;
and S4, controlling the cleaning brush 30 to move to the corresponding cleaning position and performing rolling cleaning on the front and back surfaces of the wafer.
In addition, the present invention also discloses a centering operation method of the wafer cleaning apparatus, which has a flowchart as shown in fig. 6, and includes:
s11, installing the rolling brush fixture 40 to replace the cleaning brush 30 in the housing 10;
s12, placing the wafer tool 50 on the supporting roller 20 in the shell 10, adjusting the posture of the wafer tool 50 to be vertical and locking;
specifically, the posture of the wafer tool 50 is the inclination of the wafer tool 50, and the posture of the wafer tool 50 is detected by a level 70 disposed on the side surface of the wafer tool 50, as shown in fig. 2. When the wafer fixture 50 is adjusted to the vertical position, the chucking mechanism 60 abuts against the outer edge of the wafer fixture 50 to maintain the position thereof.
S13, the roll brush fixture 40 is controlled to move so as to simultaneously contact the wafer fixture 50, and the reference position for mounting the brush 30 is determined.
A flowchart corresponding to the step of determining the reference position of the roll brush fixture is shown in fig. 7, and includes:
s131, controlling the roll-brushing tools 40 to move, and when the distance between one roll-brushing tool 40 and the wafer tool 50 is the set distance L0, measuring the distance L between the other roll-brushing tool 40' and the wafer tool 50, as shown in fig. 8;
s132, if the distance L is larger than the set distance L0, adjusting the installation position of another roll brush tool 40';
and S133, repeating the steps S131 and S132 until the two roll brush tools 40 are simultaneously contacted with the wafer tool 50, wherein the installation position of the roll brush tool 40 is a reference position.
Specifically, the roll-brushing tool 40 is installed and driven to move towards the wafer tool 50 which is reliably fixed, when contact is observed when the distance between one roll-brushing tool 40 and the wafer tool 50 is the set distance L0, the position of the other roll-brushing tool 40 ' is observed, and if the distance L between the other roll-brushing tool 40 ' and the wafer tool 50 is greater than the set distance L0 and is not equal to zero, the installation position of the other roll-brushing tool 40 ' needs to be adjusted.
Because the rolling brush tool is made of a metal material, the influence of inconsistent elastic deformation of the cleaning brush 30 on the centering precision of the cleaning brush can be avoided. Meanwhile, the wafer tool 50 can bear a certain resisting pressure. Thus, the set distance L0 may be set to zero. Therefore, the rolling brush tool can be abutted against the wafer tool 50 in the middle of the rolling brush tool, so that the distance L between the wafer tool 50 and the rolling brush tool 40 is zero, and the rolling brush tool 40 and the wafer tool 50 are in contact simultaneously.
In some embodiments, the set distance L0 may be 0.005mm to 0.05mm, so as to prevent the roll brush tool 40 from slightly deforming the wafer tool 50 after one roll brush tool 40 abuts against the wafer tool 50, thereby affecting the measurement of the distance between the other roll brush tool 40 and the wafer tool 50. In the present invention, the distance between the roll brush tool 40 and the wafer tool 50 can be measured by using a feeler gauge with a corresponding size.
Preferably, the distance L0 is set to be 0.01mm, so that the rolling brush tool reference position can be accurately determined.
Meanwhile, the embodiment of the invention also discloses a wafer cleaning device, which comprises:
the first cleaning brush is used for cleaning the front side of the wafer;
the second cleaning brush is used for brushing the back side of the wafer;
the control module is used for installing the cleaning brush 30 according to the reference position, determined by the centering operation, where the two rolling brush tools 40 and the wafer tool 50 are simultaneously contacted, and controlling the cleaning brush 30 to move to the corresponding cleaning position; and controlling the cleaning brush 30 to perform rolling brushing on the front and back surfaces of the wafer at the cleaning position.
An embodiment of the present invention further provides a control module, including: a processor, a memory, and a computer program stored in the memory and executable on the processor. The processor, when executing the computer program, implements the steps in the embodiments as described in the embodiments of the wafer cleaning method, such as the steps S1 to S4 shown in fig. 5.
The control module refers to a terminal with data processing capability, including but not limited to a computer, a workstation, a server, etc. The processor may be a central processing unit or may be another general purpose processor. The memory may be an internal storage unit of the control module or an external storage device of the control module. The memory is used for storing the computer program and other programs and data required by the control module. The memory may also be used to temporarily store data that has been output or is to be output.
The embodiment of the present invention further discloses a computer-readable storage medium, which stores a computer program, and the computer program, when executed by a processor, implements the steps in the embodiments as described in the embodiment of the wafer cleaning method, for example, steps S1 to S4 shown in fig. 5.
The computer program may be stored in a computer readable storage medium, and the computer program includes computer program code, which may be in source code form, object code form, executable file or some intermediate form, and the like. The computer-readable medium may include: any entity or device capable of carrying said computer program code, recording medium, U-disk, removable hard disk, magnetic disk, optical disk, etc.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A method of cleaning a wafer, comprising:
s1, centering the wafer cleaning device by using the cleaning brush centering device;
s2, determining the reference positions of the two roll brush tools and the wafer tool which are simultaneously contacted;
s3, installing the cleaning brush according to the reference position determined by the centering operation;
and S4, controlling the cleaning brush to move to a corresponding cleaning position and performing rolling brushing on the front and back surfaces of the wafer.
2. The wafer cleaning method of claim 1, wherein the centering operation comprises:
s11, installing a rolling brush tool to replace a cleaning brush in the shell;
s12, placing the wafer tool on a support roller in the shell, adjusting the posture of the wafer tool to be in a vertical state and locking;
and S13, controlling the rolling brush tool to move so that the rolling brush tool can be simultaneously contacted with the wafer tool to determine the reference position.
3. The wafer cleaning method of claim 1, wherein the step of determining the reference position of the roll brush tooling comprises:
s131, controlling the roll-brushing tools to move, and measuring the distance L between one roll-brushing tool and the wafer tool when the distance between the other roll-brushing tool and the wafer tool is the set distance L0;
s132, if the distance L is larger than the set distance L0, adjusting the installation position of another roll brush tool;
and S133, repeating the steps S131 and S132 until the two rolling brush tools are simultaneously contacted with the wafer tool, wherein the installation position of the rolling brush tool is a reference position.
4. A method of cleaning a wafer as recited in claim 2, wherein the wafer tooling is held in position by abutting an outer edge of the wafer tooling.
5. The wafer cleaning method according to claim 2, wherein the posture of the wafer tool is an inclination of the wafer tool, and the posture of the wafer tool is detected by a level gauge arranged on a side surface of the wafer tool.
6. The wafer cleaning method as claimed in claim 2, wherein the wafer tool is locked in position by a chucking mechanism, and the chucking mechanism is detachably disposed on the top of the housing.
7. The wafer cleaning method of claim 6, wherein the chucking mechanism comprises a support and a pin slidably connected to the support, the pin being movable in a vertical direction to abut an outer edge of the wafer tool.
8. The wafer cleaning method as claimed in claim 7, wherein the support is provided with a slide rail perpendicular to the side surface of the wafer tool, the thimble is disposed on a support block, the support block is connected to the slide rail through a slide block, and the thimble can move along the slide rail to adjust the horizontal distance between the thimble and the wafer tool.
9. A wafer cleaning apparatus, comprising:
the first cleaning brush is used for cleaning the front side of the wafer;
the second cleaning brush is used for brushing the back side of the wafer;
the control module is used for installing the cleaning brush according to the reference position, determined by the centering operation, of the two rolling brush tools and the reference position of the wafer tool, which are simultaneously contacted, and controlling the cleaning brush to move to the corresponding cleaning position; and controlling the cleaning brush to carry out rolling brushing on the front surface and the back surface of the wafer at the cleaning position.
10. A control module comprising a memory, a processor and a computer program stored in the memory and executable on the processor, the processor implementing the steps of the wafer cleaning method according to any one of claims 1 to 8 when executing the computer program.
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| CN116092985A (en) * | 2023-03-21 | 2023-05-09 | 华海清科股份有限公司 | Wafer cleaning device and method for detecting clamping force of rolling brush |
| CN117219977A (en) * | 2023-11-09 | 2023-12-12 | 青岛天仁微纳科技有限责任公司 | Vertical double-sided plasma cleaning device |
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