TWM610098U - Structure of metal foil - Google Patents

Abstract

The metal foil structure of this creation is a carrier layer, a peeling layer, and a foil layer in order from bottom to top. The carrier layer is a heat-resistant carrier with a thickness, the foil layer is a metal foil with good conductive properties, and the peeling layer is a chromium concentration medium. In the chromium alloy of 5 atomic percent to 30 atomic percent; the metal foil structure of this creation is manufactured by a sputtering process to achieve the technical effect of the waste-free process, and the nickel-chromium alloy remaining in the manufacturing method of this creation, It can also be recycled.

Description

Metal foil structure

This creation belongs to the field of printed circuit boards, especially a detachable metal foil structure with ultra-thin metal attached.

In recent years, with the vigorous development of mobile devices, consumers have more and more computing speeds and functions for mobile devices, prompting mobile device manufacturers to increase the density of circuit design to improve the efficiency of electronic components per unit area. Drive the circuit board to reduce its line width.

In order to meet the modern demand for narrow line widths, the metal foils on circuit boards are becoming thinner and lighter. However, during the hot rolling process of circuit boards, the thinner and lighter the metal foil is, the more likely it is to break, resulting in good manufacturing. The rate has fallen sharply.

In order to solve the above-mentioned problems, the prior art proposes a technical means of attaching a carrier layer to one side of the metal foil. With a thicker carrier layer, the mechanical properties of the metal foil are increased, and the metal foil is prevented from breaking during the hot rolling process. , And after the metal foil is closely attached to the resin of the PCB board, the carrier layer is separated from the metal foil.

In order to achieve the above-mentioned purpose of the prior art, a peeling layer must exist between the metal foil and the carrier-attached layer, and the peeling layer is formed by growing chromium metal on the carrier-attached layer by a chemical wet process.

However, in the process of growing chromium metal, a large amount of chromium metal waste liquid is discharged, and the chromium metal in the chromium metal waste liquid is difficult to recover, which causes environmental pollution and waste of resources.

In view of the various shortcomings derived from the above-mentioned prior art, the creator of this case is eager to improve and innovate, and after years of painstaking research, finally successfully developed and completed the metal foil structure of this creation.

In order to solve the aforementioned problems of the prior art, this creation provides a metal foil structure, the purpose of which is to: 1. Reduce the content of chromium metal in the peelable layer; 2. Solve the problem of chromium-containing wastewater discharged by the previous technology; 3. Increase the recyclability of chromium metal.

The metal foil structure of this creation includes: a carrier layer, a peeling layer and a foil layer, and the peeling layer is sandwiched between the carrier layer and the foil layer. The peeling layer is composed of a chromium concentration of 5 atomic percent (at.%) to 30 atomic percent It is composed of chromium alloy and has conductivity.

Among them, one side of the peeling layer is connected to the foil layer, and the other side of the peeling layer is connected to the carrier layer.

Among them, the thickness of the peeling layer is 200-800 nm.

Preferably, the thickness of the peeling layer is 300-600 nm.

Wherein, the carrier layer is one of aluminum foil, copper foil, and iron foil or a combination of two or more of them.

Preferably, the carrier layer is aluminum copper foil.

Wherein, the chromium alloy may be one or a combination of nickel-chromium alloy, aluminum-chromium alloy, iron-chromium alloy, and silver-chromium alloy.

Wherein, when the chromium alloy is a nickel-chromium alloy, the concentration of nickel in the nickel-chromium alloy is 70 atomic percent to 95 atomic percent.

Preferably, the chromium alloy is a nickel-chromium alloy, and the chromium-containing concentration is 5 atomic percent to 20 atomic percent, and the chromium alloy has a nickel-containing concentration of 80 atomic percent to 95 atomic percent.

Among them, the foil layer is a metal foil such as gold foil, silver foil, copper foil, iron foil, etc., with a metal whose resistivity is lower than 10 ⁻⁷ (Ω∙m).

Preferably, the foil layer is copper foil.

In order to help the reviewers understand the technical features, content and advantages of this creation and its achievable effects, the creation is accompanied by drawings and detailed descriptions of the embodiments are as follows. The diagrams used therein are as follows: The subject matter is only for illustrative and auxiliary manual purposes, and may not be the true proportions and precise configuration after the implementation of the creation. Therefore, the scale and configuration relationship of the attached drawings should not be interpreted or limited to the scope of rights of the creation in actual implementation. Hexian stated.

Please refer to Figure 1, which is a schematic diagram of the metal foil structure of this creation. The metal foil structure 1 of this invention consists of a carrier layer 11, a peeling layer 12 and a foil layer 13 from bottom to top. The carrier layer 11 is a heat-resistant carrier with a thickness, and the foil layer 13 has good electrical conductivity (low resistivity For ^{the metal foil of 10 −7} Ω∙m), the peeling layer 12 is a peeling film sandwiched between the carrier layer 11 and the foil layer 13 with appropriate peel strength and conductivity.

In the embodiment of this creation, the carrier layer 11 is aluminum foil or copper foil, which is used to carry the foil layer 13, increase the toughness of the foil layer 13, and reduce the probability of the foil layer 13 breaking, so as to facilitate the circuit board manufacturing industry. Hot rolling technology, the foil layer 13 is attached to the resin substrate for PCB.

In addition, the carrier layer 11 that has undergone the hot rolling process can also be recycled and reused. The carrier layer 11 is preferably a copper foil, and the carrier layer 11 that has undergone the hot rolling process can be recycled and reused.

Please refer to Figure 2, which is a step diagram of the manufacturing method of the metal foil structure of this creation. The manufacturing method of the metal foil structure of this creation includes: S201: Provide a carrier layer 11; S202: Sputtering a nickel-chromium alloy target material on the carrier layer 11 by a sputtering process to form a peeling layer 12; S203: forming a film of copper metal on the peeling layer 12 by an electroforming process to form the foil layer 13.

In the embodiment of the present invention, the thickness of the carrier layer 11 is higher than 15 μm.

In the embodiment of the present creation, the thickness of the foil layer 13 is 0.5 μm to 5 μm.

In the embodiment of the present creation, when the peeling layer 12 is a nickel-chromium alloy, and when the atomic ratio of nickel to chromium is 90:10, and the thickness of the peeling layer 12 is 600 nm, the peeling layer 12 is tested by a peel strength tester. The strength is 0.15 to 3 kgf-cm.

In the embodiment of this creation, when the peeling layer 12 is a nickel-chromium alloy, and when the atomic ratio of nickel to chromium is 85:15, and the thickness of the peeling layer 12 is 400 nm, the peeling layer 12 is tested by a peel strength tester. The peel strength is 0.15 to 3 kgf-cm.

As mentioned above, the metal foil structure of the present invention uses a small amount of chromium metal to form a thin peeling layer 12, but it can still maintain its peel strength between 0.15 to 3 kgf-cm.

In addition, the stripping layer 12 of the present invention uses a sputtering process to replace the prior art method of forming a chromium-containing stripping layer by a chemical wet process, thereby solving the problem of the prior art that chromium-containing metal waste must be discharged, and the metal foil structure of the present invention In the manufacturing method, after the sputtering process is completed, the chromium metal in the sputtering cavity can be removed to achieve the purpose of recycling.

In summary, this creation reduces the use of chromium metal, and adopts a sputtering process with no waste liquid problem, and effectively recovers chromium metal and aluminum/copper carrier layer, and achieves that it is environmentally friendly and maintains strong peeling. The purpose of the metal foil structure between 0.15 to 3 kgf-cm.

1: Metal foil structure 11: carrier layer 12: peeling layer 13: foil layer S201-S203: steps

Figure 1 is a schematic diagram of the metal foil structure created; Figure 2 is a step diagram of the manufacturing method of the created metal foil structure.

1: Metal foil structure

11: carrier layer

12: peeling layer

13: foil layer

Claims (8)

A metal foil structure, including: A carrier layer with a thickness of 15-50μm; A peeling layer with a thickness of 100-900 nm and arranged on one side of the carrier layer; and A foil layer with a thickness of 0.5-5 μm, and is set on one side of the peeling layer; Wherein, the peeling layer is a chromium alloy, and the chromium concentration of the chromium alloy is 5 atomic percent (at.%) to 30 atomic percent. The metal foil structure according to claim 1, wherein the carrier layer is one of aluminum foil, copper foil, and iron foil, or a combination of two or more of them. The metal foil structure according to claim 1, wherein the thickness of the peeling layer is 200-800 nm. The metal foil structure according to claim 1, wherein the thickness of the peeling layer is 300-600 nm. The metal foil structure according to claim 1, wherein the chromium alloy is one or a combination of nickel-chromium alloy, aluminum-chromium alloy, iron-chromium alloy, and silver-chromium alloy. The metal foil structure according to claim 1, wherein the chromium alloy is a nickel-chromium alloy, and the nickel-chromium alloy has a nickel concentration of 70 atomic percent to 95 atomic percent. The metal foil structure according to claim 1, wherein when the chromium alloy is a nickel-chromium alloy, the chromium content of the chromium alloy is 5 atomic percent to 20 atomic percent, and the nickel content of the chromium alloy is 80 atomic percent To 95 atomic percent. The metal foil structure according to claim 1, wherein the foil layer is a metal with a resistivity lower than 10 ^{− 7} (Ω∙m).

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