TWM610013U - Chip transfer apparatus with self-alignment and positioning functions - Google Patents

Abstract

A wafer transfer equipment with self-aligned positioning includes: a carrier substrate, a liquid adding device, a wafer transfer device, a carrier substrate transfer device, and a wafer transfer device. A plurality of separation grooves are formed on the carrying surface of the carrying substrate, the carrying surface has hydrophilicity, the separation grooves have hydrophobicity, and the plurality of separation grooves form a plurality of crystal mounting seats. The liquid collects in a plurality of the crystal holders. The wafer is positioned by the surface free energy of the liquid and is carried on each of the crystal holders. Electromagnetic waves are applied to the carrier substrate to heat and evaporate the body, and each of the wafers is separated from each of the crystal carrier to the receiving surface of the receiving substrate.

Description

Chip transfer equipment with self-aligned positioning

This creation is related to a self-aligned wafer transfer equipment, especially a self-aligned wafer transfer equipment that uses liquid to adsorb wafers for transfer.

In the production and manufacturing process of electronic devices, in order to enable a large number of wafers to be transferred to the circuit board, the laser lift-off process is used in the manufacture of some electronic products. Specifically, laser stripping is to irradiate the sacrificial layer (also known as Dynamic release layer, or DRL) with a laser beam, and then heat the sacrificial layer to form a small explosion, so as to push the wafer to transfer to the circuit substrate. Driving force.

However, the laser stripping of the production equipment in the prior art can only be implemented by using a sacrificial layer containing a specific chemical material. Furthermore, the cost of the sacrificial layer is expensive, which leads to an increase in the production and manufacturing cost of the electronic device. Moreover, the chemical material of the sacrificial layer undergoes an irreversible change in properties after heating up and a small explosion, and cannot be recycled and reused, and the sacrificial layer needs to be treated as a chemical waste of the tube, thus causing the environment The hidden worries of protection.

Therefore, the purpose of this creation is to provide a chip transfer device with self-aligning positioning, which can reduce the cost while taking into account the environmental protection requirements of the manufacturing process.

The technical means used in this creation to solve the problems of the conventional technology is to provide a self-aligned wafer transfer equipment, including: a carrier substrate with a carrier surface and a plurality of separation grooves, wherein the carrier surface is provided with Hydrophilic, each of the separation grooves is a hydrophobic groove body, and a plurality of the separation grooves are formed on the bearing surface, and a plurality of the separation grooves are staggered by the mutually staggered separation grooves A plurality of crystal holders are formed by surrounding the crystal holder on the carrying surface; the liquid adding device is arranged in such a way that the nozzle faces the carrying surface of the carrying substrate, and the liquid is applied to the carrying surface of the carrying substrate, The liquid is collected in the plurality of the crystal carrier and each groove body away from the plurality of the separation grooves; the wafer transfer device is configured to be adjacent to the carrier substrate, and transfer the plurality of wafers to the plurality of the crystal carrier The liquid level gathered in each of the crystal holders is between each of the crystal holders and each of the wafers, whereby each of the wafers is positioned by the surface free energy of the liquid and is carried at each position The crystal carrier; the carrier substrate transfer device is arranged in a manner adjacent to the carrier substrate, and transfers the carrier substrate carrying a plurality of the wafers, and makes the carrier surface of the carrier substrate face a receiving substrate of a receiving substrate Surface; and, the wafer transfer device is configured to be adjacent to the carrier substrate transfer device, and applies electromagnetic waves to the carrier substrate so that the liquid located between the plurality of the wafer carrier and the plurality of wafers is heated to evaporate, so that Each of the wafers is separated from each of the crystal carrier and falls to the receiving surface of the receiving substrate.

In an embodiment of the present invention, a self-aligned wafer transfer device is provided, wherein on the carrier substrate, the plurality of separation grooves are a plurality of longitudinal groove bodies and a plurality of grooves arranged at an interval from each other. The horizontal groove bodies are arranged at an interval distance from each other, and a plurality of the horizontal groove bodies and a plurality of the longitudinal groove bodies are interlaced with each other to form a plurality of the crystal holders distributed in a checkerboard manner.

In one embodiment of the present invention, a self-aligned wafer transfer device is provided, wherein the electromagnetic wave applied by the wafer transfer device is a laser beam.

In an embodiment of the present creation, a self-aligned wafer transfer equipment is provided, wherein the receiving surface of the receiving substrate has a plurality of wafer receiving seats, and the carrier substrate transfer device is paired with each of the wafer carrier The carrier substrate is moved to each of the wafer receiving seats on the receiving surface.

In an embodiment of the present invention, a self-aligned wafer transfer device is provided, wherein on the carrier substrate, the carrier surface is smoothed to have hydrophilicity, and the separation groove is roughened Treated to be hydrophobic.

In an embodiment of the present invention, a self-aligned wafer transfer equipment is provided, wherein the carrier substrate is a glass substrate, and electromagnetic waves applied by the wafer transfer device penetrate to heat the wafers on each of the carrier substrates. The liquid between the crystal seat and each of the wafers.

In an embodiment of the present invention, a self-aligned wafer transfer device is provided, wherein the liquid applied by the liquid adding device to the bearing surface of the carrier substrate is water, and the liquid applied by the wafer transfer device Electromagnetic waves heat and evaporate.

The following technical effects can be obtained through the technical means adopted by the self-aligned chip transfer equipment of this creation. The surface free energy of the liquid enables each wafer to be self-aligned to each carrier. In addition, by using liquid to perform the laser stripping process, the required cost of the production and process of the electronic device can be reduced, and the improvement of the chemical materials of the sacrificial layer in the past causes the lack of environmental protection concerns.

The following describes the implementation of this creation based on Figures 1 to 5. This description is not intended to limit the implementation of this creation, but is a kind of embodiment of this creation.

As shown in Figure 1, a self-aligned wafer transfer device 100 according to an embodiment of the present creation includes: a carrier substrate 1, a liquid adding device 2, a wafer transfer device 3, a carrier substrate transfer device 4, and Wafer transfer device 5. In this way, this creation enables each chip to be self-aligned on each carrier. Furthermore, this creation uses liquid to perform the laser lift-off process, so that the cost of the production and manufacturing process of the electronic device can be reduced, and the chemical materials of the sacrificial layer in the past can be improved, which causes the lack of environmental protection concerns.

As shown in FIGS. 1 to 3, the carrier substrate 1 has a carrier surface 11 and a plurality of separation grooves 12, wherein the carrier surface 1 is hydrophilic, and each of the separation grooves 12 is hydrophobic的槽体。 The groove body. More specifically, a plurality of the separation trenches 12 are formed on the supporting surface 11, and a plurality of the separation trenches 12 are interlaced and the interlaced separation trenches 12 surround the supporting surface to form a crystal carrier 13 In a manner to form a plurality of crystal carrier 13. In detail, the bearing surface 11 is hydrophilic to a predetermined working fluid (for example, water), and the separation groove 12 is hydrophobic to the predetermined working fluid.

Specifically, as shown in FIGS. 2 to 4, according to an embodiment of the present invention, a self-aligned wafer transfer apparatus 100, wherein the carrier substrate 1 is smoothed on the carrier surface 11 It is treated to be hydrophilic (that is, the carrier 13 is also hydrophilic), and the separation groove 12 is roughened to be hydrophobic. Of course, this creation is not limited to smoothing treatment to form hydrophilicity and roughening treatment to form hydrophobicity. The hydrophilicity of the bearing surface 11 and the hydrophobicity of the separation groove 12 can also be achieved through chemical or physical plating. .

Furthermore, as shown in FIG. 2, according to an embodiment of the present invention, a self-aligned wafer transfer device 100, wherein in the carrier substrate 1, a plurality of the separation grooves 12 are mutually opposite The longitudinal groove bodies 121 arranged at an interval and a plurality of transverse groove bodies 122 arranged at an interval from each other. In addition, a plurality of the lateral groove bodies 122 and a plurality of the longitudinal groove bodies 121 are interlaced with each other to form a plurality of the crystal carrier 13 distributed in a checkerboard manner.

As shown in FIG. 1 to FIG. 3, the liquid adding device 2 is arranged in such a manner that the nozzle faces the supporting surface 11 of the supporting substrate 1. In addition, the liquid adding device 2 applies the liquid L to the bearing surface 11 of the carrier substrate 1 so that the liquid L is collected on the plurality of the crystal carrier 13 and away from each groove of the plurality of the separation grooves 12 body.

As shown in FIG. 1, FIG. 3 and FIG. 4, the wafer handling device 3 is configured to be adjacent to the carrier substrate 1. In addition, the wafer transport device 3 transports a plurality of wafers C to a plurality of the wafer carriers 12 so that the liquid L positions collected in each of the wafer carriers 13 are between each of the wafer carriers 13 and each of the wafers C. Thereby, each of the wafers C is positioned by the surface free energy of the liquid L and is carried on each of the wafer carrier 13 at the position. In other words, each of the wafers C can form a self-aligned position on each wafer carrier 13.

As shown in FIG. 1 and FIG. 5, the carrier substrate transfer device 4 is arranged in a manner adjacent to the carrier substrate 1. In addition, the carrier substrate transfer device 4 transfers the carrier substrate 1 carrying a plurality of the chips C, and makes the carrying surface 11 of the carrier substrate 1 face a receiving substrate R (for example, a circuit substrate of an electronic device) A receiving surface S (that is, the surface of the circuit board for mounting electronic components).

As shown in FIGS. 1 and 5, the wafer transfer device 5 is configured to be adjacent to the carrier substrate transfer device 4. In addition, the wafer transfer device 5 applies electromagnetic waves A to the carrier substrate 1 to heat and evaporate the liquid L located between the plurality of the crystal carrier 1 and the plurality of the wafers C, so that each of the wafers C is separated from the carrier. The crystal seat 13 drops to the receiving surface S of the receiving substrate R.

Furthermore, as shown in FIG. 1 and FIG. 5, according to an embodiment of the present invention, the self-aligned wafer transfer device 100 has a receiving surface S of the receiving substrate R having a plurality of wafer receiving seats T (for example: the conductive part of the circuit board). In addition, the carrier substrate moving device 4 moves the carrier substrate 1 in such a manner that each of the crystal carrier 13 is opposed to each of the wafer receiving seats T of the receiving surface S, so that each of the wafers C can be dropped onto the receiving substrate. R each of the wafer receiving seat T.

As shown in FIGS. 1 and 5, according to an embodiment of the self-aligned wafer transfer equipment 100 according to the present invention, the electromagnetic wave A applied by the wafer transfer device 5 is a laser beam. Of course, this creation is not limited to the electromagnetic wave A being a laser beam, and the electromagnetic wave A can also be other forms of energy beam (Energy beam), such as infrared (IR, Infrared).

As shown in Figures 1 and 5, according to an embodiment of the present invention, a self-aligned wafer transfer device 100, wherein the carrier substrate 1 is a glass substrate, and the wafer transfer device 5 applies The electromagnetic wave A penetrates to heat the liquid L between each of the crystal carrier 13 and each of the wafers C. Of course, the present creation is not limited to the carrier substrate 1 being a glass substrate, and the carrier substrate 1 may also be a substrate made of light-transmissive material such as PMMA (Poly methylmethacrylate).

As shown in FIG. 1, FIG. 3, and FIG. 5, a self-aligned wafer transfer device 100 according to an embodiment of the present creation, wherein the liquid adding device 2 is applied to the carrier substrate 1 The liquid L on the surface 11 is water, and the electromagnetic wave A applied by the wafer transfer device 5 is heated and evaporated. Of course, this creation is not limited to the fact that the liquid L is water, and the liquid L can also be other types of liquids such as deionized water or alcohol.

Specifically, the self-aligned wafer transfer device 100 of the present invention forms a plurality of separation grooves 12 on the carrier surface 11 of the carrier substrate 1 through the carrier substrate 1 forming step, wherein the carrier surface 11 has hydrophilicity, and each of the separation grooves 12 has hydrophobicity. In this creation, the bearing surface 11 is smoothed to have hydrophilicity, and the separation groove 12 is roughened to have hydrophobicity. In addition, a plurality of the separation trenches 12 are staggered, and the interlaced separation trenches 12 surround the carrier surface 11 to form a crystal carrier 13 to form a plurality of crystal carriers 13. For example, a plurality of the separation grooves 12 are a plurality of longitudinal groove bodies 121 arranged at an interval from each other and a plurality of transverse groove bodies 122 arranged at an interval from each other, and a plurality of the carriers are formed in a checkerboard distribution. Crystal seat 13.

Furthermore, the self-aligned wafer transfer device 100 of the present invention uses the liquid adding device 2 to perform the liquid adding step, and the liquid L is applied to the carrying surface 11 of the carrying substrate 1. Since the bearing surface 11 is hydrophilic (that is, the crystal carrier 13 is also hydrophilic) and the separation groove 12 is hydrophobic, the liquid L is collected on the plurality of crystal carrier 13 and away from A plurality of groove bodies for separating grooves 12 are provided.

Furthermore, the self-aligned wafer transfer equipment 100 of the present invention uses the wafer transfer device 3 to perform the wafer transfer step, and transfers a plurality of wafers C to a plurality of the wafer carrier 13 respectively. Therefore, the liquid L collected in each of the crystal carrier 13 will be located between each of the crystal carrier 13 and each of the wafers C. In other words, each of the wafers C is positioned (self-aligned) by the surface free energy of the liquid L and is carried on each of the wafer carrier 13 at the position.

In detail, the self-aligned wafer transfer equipment 100 of the present invention performs a carrier substrate transfer step by the carrier substrate transfer device 4, and transfers the carrier substrate 1 carrying a plurality of the chips C, and makes the carrier substrate 1 The supporting surface 11 of the supporting substrate 1 is opposite to a receiving surface S of a receiving substrate R.

In addition, the self-aligned wafer transfer equipment 100 of the present invention executes the wafer transfer step through the wafer transfer device 5, and applies electromagnetic waves A to the carrier substrate to position each of the wafer carrier 13 and each of the wafers. The liquid L between C is heated to evaporate. In this way, the present creation will cause each of the wafers C to be separated from each of the wafer carrier 13 and fall to the wafer receiving seat T of the receiving surface S of the receiving substrate R.

It can be seen from the above that the self-aligned wafer transfer device 100 of the present invention makes the carrier surface 11 hydrophilic (the carrier 13 is also hydrophilic) and the separation groove 12 is hydrophobic. The liquid L gathers on a plurality of the crystal carrier 13, and through the surface free energy of the liquid L, each wafer C can be self-aligned to each of the crystal carrier 13. Furthermore, this creation uses the liquid L to perform chip transfer (equivalent to laser stripping in the previous process), and eliminates the use of sacrificial layers containing specific chemical materials, so that the production and manufacturing of electronic devices are required. The cost can be reduced, and the chemical materials of the sacrificial layer in the past can be improved.

The above descriptions and descriptions are only descriptions of the preferred embodiments of this creation. Those with ordinary knowledge of this technology should make other modifications based on the scope of patent application defined below and the above descriptions, but these modifications should still be made. It is the creative spirit of this creation and within the scope of the rights of this creation.

100: Chip transfer equipment with self-aligned positioning 1: Carrier substrate 11: Bearing surface 12: Separation groove 121: Longitudinal groove body 122: horizontal groove body 13: Crystal holder 2: Liquid adding device 3: Wafer handling device 4: Carrying substrate transfer device 5: Wafer transfer device A: Electromagnetic wave C: chip L: Liquid R: receiving board S: receiving surface T: chip receiver

[Figure 1] is a schematic diagram showing a chip transfer device with self-aligned positioning according to an embodiment of the present creation; [Figure 2] is a schematic top view showing the carrier substrate of the chip transfer device with self-alignment positioning according to this creative embodiment; [Figure 3] is a partial enlarged schematic diagram showing a side view of the carrier substrate of the chip transfer device with self-alignment positioning according to this creative embodiment; [Figure 4] is a partial enlarged schematic diagram showing another side view of the carrier substrate of the chip transfer device with self-alignment positioning according to the present creative embodiment; and, [Figure 5] is a schematic diagram showing the wafer transfer device with self-aligned positioning according to the present creative embodiment.

100: Chip transfer equipment with self-aligned positioning

1: Carrier substrate

11: Bearing surface

2: Liquid adding device

3: Wafer handling device

4: Carrying substrate transfer device

5: Wafer transfer device

A: Electromagnetic wave

C: chip

L: Liquid

R: receiving board

S: receiving surface

Claims (7)

A chip transfer equipment with self-aligned positioning, including: The carrier substrate has a carrier surface and a plurality of separation grooves, wherein the carrier surface is hydrophilic, each of the separation grooves is a hydrophobic groove body, and a plurality of the separation grooves are formed on the carrier surface , And a plurality of crystal carrier seats are formed by a plurality of the separation grooves being staggered and the mutually staggered separation grooves surround the carrier surface to form a crystal carrier; The liquid adding device is arranged in such a way that the nozzle faces the supporting surface of the supporting substrate, and the liquid is applied to the supporting surface of the supporting substrate, so that the liquid is collected on the plurality of crystal holders and away from the plurality of separation grooves Each groove body of the groove; The wafer handling device is configured to be adjacent to the carrier substrate, and to transport a plurality of wafers to a plurality of the crystal carriers, so that the liquid level gathered in each of the crystal carriers is between each of the crystal carriers and each of the wafers, In this way, each of the wafers is positioned by the surface free energy of the liquid and is carried on each of the crystal holders at the position; The carrier substrate moving device is arranged in a manner adjacent to the carrier substrate, and moves the carrier substrate carrying a plurality of the wafers, so that the carrier surface of the carrier substrate faces a receiving surface of a receiving substrate; and, A wafer transfer device is configured to be adjacent to the carrier substrate transfer device, and applies electromagnetic waves to the carrier substrate to heat and evaporate the liquid between the plurality of the crystal carrier and the plurality of the wafers, so that each of the wafers is separated Each of the crystal holders falls to the receiving surface of the receiving substrate. The wafer transfer device with self-aligned positioning according to claim 1, wherein on the carrier substrate, the plurality of separation grooves are a plurality of longitudinal groove bodies arranged at a distance from each other and a plurality of grooves at a distance from each other A plurality of horizontal groove bodies are arranged, and a plurality of the horizontal groove bodies and a plurality of the longitudinal groove bodies are interlaced with each other to form a plurality of the crystal holders distributed in a checkerboard manner. The wafer transfer device with self-aligned positioning as described in claim 1, wherein the electromagnetic wave applied by the wafer transfer device is a laser beam. The wafer transfer equipment with self-aligned positioning according to claim 1, wherein the receiving surface of the receiving substrate has a plurality of wafer receiving seats, and the carrying substrate transferring device is opposed to the receiving wafer carrier. The carrier substrate is moved in the manner of each of the wafer receiving seats on the surface. The wafer transfer device with self-aligned positioning according to claim 1, wherein on the carrier substrate, the carrier surface is smoothed to have hydrophilicity, and the separation groove is roughened to have hydrophobicity Sex. The wafer transfer equipment with self-aligned positioning according to claim 1, wherein the carrier substrate is a glass substrate, and the electromagnetic wave applied by the wafer transfer device penetrates to heat each of the wafer carrier and each The liquid between the wafers. The wafer transfer device with self-aligned positioning according to claim 1, wherein the liquid applied by the liquid adding device to the bearing surface of the carrier substrate is water, and the electromagnetic wave applied by the wafer transfer device is heated and evaporated.

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