CN213483732U - Chip transfer equipment with self-alignment positioning function - Google Patents
Chip transfer equipment with self-alignment positioning function Download PDFInfo
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- CN213483732U CN213483732U CN202022942391.2U CN202022942391U CN213483732U CN 213483732 U CN213483732 U CN 213483732U CN 202022942391 U CN202022942391 U CN 202022942391U CN 213483732 U CN213483732 U CN 213483732U
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Abstract
The utility model relates to a chip moves equipment of carrying with oneself aims at locate function contains: the device comprises a bearing substrate, a liquid adding device, a chip conveying device, a bearing substrate conveying device and a chip conveying device. Forming a plurality of separation grooves on the bearing surface of the bearing substrate, wherein the bearing surface has hydrophilicity, the separation grooves have hydrophobicity, and the separation grooves form a plurality of crystal bearing seats. Liquid is gathered in a plurality of the crystal carrying seats. The chip is positioned and carried on each crystal carrying seat by the surface free energy of the liquid. Applying electromagnetic wave to the bearing substrate to heat and evaporate the liquid, and separating each chip from each crystal carrying seat to a receiving surface of the receiving substrate.
Description
Technical Field
The utility model relates to a chip moves and carries equipment technical field, in particular to utilize liquid to adsorb the chip and move equipment technical field in order to carry out the chip that shifts, specifically indicate a chip moves equipment of carrying with oneself aims at locate function.
Background
In the production and manufacturing process of electronic devices, a Laser lift-off (Laser lift-off) process is adopted for manufacturing part of electronic products in order to transfer a large number of chips onto a circuit board. Specifically, laser lift-off is to irradiate a Sacrificial layer (DRL) with a laser beam, and then heat up the Sacrificial layer to form a small explosion, so as to generate a driving force for driving the chip to be transferred to the circuit substrate.
However, the laser lift-off of the prior art manufacturing equipment must be performed by using a sacrificial layer containing a specific chemical material. Furthermore, the cost of the sacrificial layer is relatively high, which leads to an increase in the production and manufacturing costs of the electronic device. Furthermore, the chemical material of the sacrificial layer is heated and slightly exploded to generate irreversible property change and cannot be recycled, and the sacrificial layer is regarded as chemical waste treatment of the tube, so that environmental protection is worried.
SUMMERY OF THE UTILITY MODEL
Therefore, the present invention is directed to a chip transfer apparatus with self-alignment and positioning functions, which can reduce the cost while meeting the environmental protection requirements of the manufacturing process.
The utility model discloses a solve the technical means that prior art's problem adopted and move equipment for providing a chip that utensil was aimed at the locate function by oneself, contain: the wafer carrier comprises a bearing substrate, a plurality of wafer carriers and a plurality of wafer-carrying grooves, wherein the bearing substrate is provided with a bearing surface and a plurality of separation grooves, the bearing surface is hydrophilic, each separation groove is a groove body with hydrophobicity, the separation grooves are formed on the bearing surface, and the wafer carriers are formed by the separation grooves which are staggered and surrounded on the bearing surface by the separation grooves which are staggered with each other; the liquid adding device is arranged in a mode that the nozzle faces the bearing surface of the bearing substrate, liquid is applied to the bearing surface of the bearing substrate, and the liquid is gathered in the plurality of crystal carrying seats and is far away from each groove body of the plurality of separation grooves; a chip carrying device which is configured to be adjacent to the bearing substrate and carries a plurality of chips to a plurality of crystal carrying seats, so that the liquid gathered in each crystal carrying seat is positioned between each crystal carrying seat and each chip, and each chip is positioned and carried on each crystal carrying seat at the position by the surface free energy of the liquid; a carrier substrate moving device which is arranged adjacent to the carrier substrate, moves the carrier substrate carrying a plurality of chips and enables the carrying surface of the carrier substrate to be opposite to the receiving surface of the receiving substrate; and the chip transfer device is arranged to be adjacent to the bearing substrate moving device, applies electromagnetic waves to the bearing substrate to heat and evaporate liquid positioned between the crystal carrying seats and the chips, and enables the chips to separate from the crystal carrying seats and fall to the receiving surface of the receiving substrate.
In an embodiment of the present invention, the chip transfer apparatus with self-alignment positioning function is provided, wherein the plurality of separation grooves are a plurality of longitudinal grooves and a plurality of transverse grooves, and the longitudinal grooves and the transverse grooves are staggered to form a plurality of chip carriers.
In an embodiment of the present invention, the chip transfer apparatus with self-alignment positioning function is provided, wherein the electromagnetic wave applied by the chip transfer device is a laser beam.
In an embodiment of the present invention, a chip transfer apparatus with self-alignment positioning function is provided, wherein the receiving surface of the receiving substrate has a plurality of chip receiving seats, and the carrier substrate moving device moves the carrier substrate by taking each of the chip receiving seats as a way facing each of the chip receiving seats of the receiving surface.
In an embodiment of the present invention, a chip transfer apparatus with self-aligned positioning function is provided, wherein the carrying surface of the carrying substrate has hydrophilicity for smoothing, and the separation groove has hydrophobicity for roughening.
In an embodiment of the present invention, a chip transfer apparatus with self-alignment positioning function is provided, wherein the carrier substrate is a glass substrate, and the electromagnetic wave applied by the chip transfer device penetrates through the carrier substrate to heat the liquid between each of the wafer carriers and each of the chips.
In an embodiment of the present invention, the chip transferring apparatus with self-aligning and positioning functions is provided, wherein the liquid applied to the carrying surface of the carrying substrate by the liquid adding device is water, and the electromagnetic wave applied by the chip transferring device is heated and evaporated.
Via the utility model discloses a chip that has oneself and aims at positioning function moves the technological means that equipment adopted, can obtain following technological effect. The liquid has surface free energy to make each chip self-align to each crystal carrier. In addition, the liquid is adopted to execute the laser stripping process, so that the production cost and the process cost of the electronic device can be reduced, and the defect of environmental protection worry caused by chemical materials of the conventional sacrificial layer is overcome.
Drawings
Fig. 1 is a schematic diagram of a chip transfer apparatus with a self-alignment positioning function according to an embodiment of the present invention.
Fig. 2 is a schematic top view of a carrier substrate of a chip transfer apparatus with a self-alignment positioning function according to an embodiment of the present invention.
Fig. 3 is a schematic side view partially enlarged view of a carrier substrate of a chip transfer apparatus with a self-alignment positioning function according to an embodiment of the present invention.
Fig. 4 is another side view partially enlarged schematic view of a carrier substrate of a chip transfer apparatus with a self-alignment positioning function according to an embodiment of the present invention.
Fig. 5 is a schematic diagram of chip transfer by a chip transfer apparatus with self-alignment positioning function according to an embodiment of the present invention.
Reference numerals
100 chip transfer equipment with self-alignment positioning function
1 carrying substrate
11 carrying surface
12 separating groove
121 longitudinal groove body
122 lateral groove body
13 carry crystal seat
2 liquid adding device
3 chip handling device
4 carrying substrate moving device
5 chip transfer device
Electromagnetic wave A
C chip
L liquid
R receiving substrate
S receiving surface
T chip receiving seat
Detailed Description
The following describes an embodiment of the present invention with reference to fig. 1 to 5. The description is not intended to limit the embodiments of the present invention, but is one example of the embodiments of the present invention.
As shown in fig. 1, a chip transfer apparatus 100 with self-alignment positioning function according to an embodiment of the present invention includes: a carrier substrate 1, a liquid adding device 2, a chip conveying device 3, a carrier substrate conveying device 4 and a chip conveying device 5. Therefore, the present invention enables each chip to be Self-aligned (Self-aligned) to each die paddle. Furthermore, the present invention uses liquid to perform the laser lift-off process, so that the production and manufacturing cost of the electronic device can be reduced, and the disadvantage of environmental protection caused by the chemical material of the sacrificial layer in the past can be improved.
As shown in fig. 1 to 3, the carrier substrate 1 has a carrier surface 11 and a plurality of separation grooves 12, wherein the carrier surface 1 is hydrophilic, and each separation groove 12 is a groove body with hydrophobicity. Further, a plurality of the dividing grooves 12 are formed on the carrying surface 11, and a plurality of the wafer carriers 13 are formed by the plurality of the dividing grooves 12 being staggered and the wafer carriers 13 being surrounded on the carrying surface by the staggered dividing grooves 12. In detail, the carrying surface 11 is hydrophilic to a predetermined working fluid (e.g., water), and the separation grooves 12 are hydrophobic to the predetermined working fluid.
Specifically, as shown in fig. 2 to 4, in the chip transfer apparatus 100 with self-alignment positioning function according to an embodiment of the present invention, in the carrier substrate 1, the carrying surface 11 is hydrophilic for performing smoothing treatment (i.e., the susceptor 13 is also hydrophilic), and the separation groove 12 is hydrophobic for performing roughening treatment. Of course, the present invention is not limited to the formation of hydrophilicity by smoothing treatment and the formation of hydrophobicity by roughening treatment, and the hydrophilicity of the carrying surface 11 and the hydrophobicity of the separation grooves 12 may be achieved by chemical or physical plating.
Further, as shown in fig. 2, the chip transferring apparatus 100 with self-aligning positioning function according to an embodiment of the present invention, wherein the plurality of separation grooves 12 are a plurality of vertical grooves 121 disposed at a distance from each other and a plurality of horizontal grooves 122 disposed at a distance from each other on the carrier substrate 1. Moreover, the plurality of transverse grooves 122 and the plurality of longitudinal grooves 121 are staggered to form a plurality of wafer carriers 13 distributed in a checkerboard manner.
As shown in fig. 1 to 3, the liquid adding device 2 is disposed with a nozzle facing the carrying surface 11 of the carrying substrate 1. The liquid adding device 2 applies the liquid L to the carrying surface 11 of the carrying substrate 1, so that the liquid L is gathered in the plurality of the susceptor 13 and is far away from each of the plurality of the dividing grooves 12.
As shown in fig. 1, 3 and 4, the chip handling device 3 is disposed adjacent to the carrier substrate 1. The chip carrier 3 carries a plurality of chips C to a plurality of the die carriers 12, and the liquid L collected in each die carrier 13 is located between each die carrier 13 and each chip C. Therefore, each chip C is positioned and supported on each of the crystal carriers 13 by the Surface free energy (Surface free energy) of the liquid L. In other words, each chip C can be positioned in a Self-aligned (Self-aligned) manner on each die paddle 13.
As shown in fig. 1 and 5, the carrier substrate transfer device 4 is provided adjacent to the carrier substrate 1. The carrier substrate transfer device 4 transfers the carrier substrate 1 carrying the plurality of chips C such that the carrying surface 11 of the carrier substrate 1 faces a receiving surface S (i.e., a surface of a circuit substrate for mounting electronic components) of a receiving substrate R (e.g., a circuit substrate of an electronic device).
As shown in fig. 1 and 5, the chip transfer device 5 is disposed adjacent to the carrier substrate transfer device 4. And, the chip transferring device 5 applies the electromagnetic wave a to the carrier substrate 1 to heat and evaporate the liquid L between the plurality of die carriers 1 and the plurality of chips C, so that each chip C is separated from each die carrier 13 and falls to the receiving surface S of the receiving substrate R.
Further, as shown in fig. 1 and 5, the chip transfer apparatus 100 with self-aligning positioning function according to an embodiment of the present invention has a receiving surface S of the receiving substrate R having a plurality of chip receiving seats T (e.g., conductive portions of a circuit substrate). The carrier substrate transfer device 4 transfers the carrier substrate 1 so that each of the die-receiving seats T of the receiving surface S faces each of the die-receiving seats T of the receiving surface S, and the die C is dropped to each of the die-receiving seats T of the receiving substrate R.
As shown in fig. 1 and 5, a chip transfer apparatus 100 with self-alignment positioning function according to an embodiment of the present invention is provided, wherein the electromagnetic wave a applied by the chip transfer device 5 is a laser beam. Of course, the present invention is not limited to the electromagnetic wave a being a laser beam, and the electromagnetic wave a may also be other forms of Energy beams (Energy beam), such as: infrared (IR, infra).
As shown in fig. 1 and 5, according to an embodiment of the present invention, a chip transfer apparatus 100 with self-alignment positioning function is provided, wherein the carrier substrate 1 is a glass substrate, and the electromagnetic wave a applied by the chip transfer device 5 penetrates through the glass substrate to heat the liquid L between each of the wafer carriers 13 and each of the chips C. Of course, the present invention is not limited to the carrying substrate 1 being a glass substrate, and the carrying substrate 1 may also be a substrate made of light-permeable material such as polymethyl methacrylate (PMMA).
As shown in fig. 1, fig. 3 and fig. 5, a chip transfer apparatus 100 with self-alignment positioning function according to an embodiment of the present invention is provided, wherein the liquid L applied to the carrying surface 11 of the carrying substrate 1 by the liquid adding device 2 is water, and the electromagnetic wave a applied by the chip transfer device 5 is heated and evaporated. Of course, the present invention is not limited to the liquid L being water, and the liquid L may be deionized water or other types of liquid such as alcohol.
Specifically, the chip transfer apparatus 100 with self-alignment positioning function of the present invention forms a plurality of separation grooves 12 on the carrying surface 11 of the carrying substrate 1 through the step of forming the wafer carrier on the carrying substrate 1, wherein the carrying surface 11 has hydrophilicity, and each separation groove 12 has hydrophobicity. In the present invention, the carrying surface 11 has hydrophilicity for smoothing, and the separation groove 12 has hydrophobicity for roughening. In addition, the plurality of dividing grooves 12 are staggered, and a plurality of wafer carriers 13 are formed by surrounding the wafer carriers 13 on the carrying surface 11 by the staggered dividing grooves 12. For example, the plurality of dividing grooves 12 are a plurality of longitudinal grooves 121 spaced apart from each other and a plurality of transverse grooves 122 spaced apart from each other, so as to form a plurality of the wafer carriers 13 distributed in a checkerboard manner.
Further, the chip transferring apparatus 100 with self-alignment positioning function of the present invention performs the liquid adding step by the liquid adding device 2, and applies the liquid L on the carrying surface 11 of the carrying substrate 1. Since the carrying surface 11 has hydrophilicity (i.e., the susceptor 13 also has hydrophilicity) and the dividing grooves 12 have hydrophobicity, the liquid L is collected in the plurality of susceptors 13 and away from each of the plurality of dividing grooves 12.
Furthermore, the chip transfer apparatus 100 with self-alignment positioning function of the present invention uses the chip transfer device 3 to perform chip transfer steps, so as to individually transfer a plurality of chips C to a plurality of the die carriers 13. Therefore, the liquid L collected in each of the crystal carriers 13 is located between each of the crystal carriers 13 and each of the chips C. In other words, each of the chips C is positioned (Self-aligned) by the surface free energy of the liquid L and is carried on each of the crystal carriers 13.
In detail, the chip transfer apparatus 100 with self-alignment positioning function according to the present invention performs a carrier substrate transfer step by the carrier substrate transfer device 4 to transfer the carrier substrate 1 carrying a plurality of chips C, and make the carrying surface 11 of the carrier substrate 1 opposite to the receiving surface S of the receiving substrate R.
Furthermore, the chip transfer apparatus 100 with self-alignment positioning function of the present invention executes the chip transfer step by the chip transfer device 5, and applies the electromagnetic wave a to the carrier substrate, so as to heat and evaporate the liquid L between each of the carrier seats 13 and each of the chips C. Therefore, the present invention will make each chip C separate from each of the die-carrying seats 13 and fall to the chip receiving seat T of the receiving surface S of the receiving substrate R.
As described above, the chip transfer apparatus 100 with self-alignment positioning function according to the present invention makes the liquid L gather in the plurality of the chip carriers 13 by the hydrophilic property of the carrying surface 11 (the chip carriers 13 also have hydrophilic property) and the hydrophobic property of the separation grooves 12, and makes each chip C self-align to each of the chip carriers 13 by the surface free energy of the liquid L. Further, the present invention can eliminate the need for a sacrificial layer containing a specific chemical material by using the liquid L to perform chip transfer (equivalent to laser lift-off in the conventional process), so that the required cost for the production and process of the electronic device can be reduced, and the disadvantage of environmental protection caused by the chemical material of the sacrificial layer in the conventional process can be improved.
The foregoing description and description are only illustrative of the preferred embodiments of the present invention, and other modifications may be made by those skilled in the art based on the above definitions and the above description, and it is intended that such modifications be within the scope of the present invention.
Claims (7)
1. A chip transfer equipment with self-aligning positioning function is characterized in that the chip transfer equipment comprises:
the wafer carrier comprises a bearing substrate, a plurality of wafer carriers and a plurality of wafer-carrying seats, wherein the bearing substrate is provided with a bearing surface and a plurality of separation grooves, the bearing surface is hydrophilic, each separation groove is a groove body with hydrophobicity, the separation grooves are formed on the bearing surface, and the wafer carriers are formed by the staggered separation grooves which are staggered with each other and surround the bearing surface to form the wafer carrier;
a liquid adding device, which is arranged in a manner that a nozzle faces the bearing surface of the bearing substrate, applies liquid to the bearing surface of the bearing substrate, and leads the liquid to gather in the crystal carrying seats and to be far away from each groove body of the separation grooves;
a chip carrying device which is configured to be adjacent to the bearing substrate and carry a plurality of chips to a plurality of crystal carrying seats, so that the liquid gathered in each crystal carrying seat is positioned between each crystal carrying seat and each chip, and each chip is positioned and carried on each crystal carrying seat at the position by the surface free energy of the liquid;
a carrier substrate transfer device which is provided adjacent to the carrier substrate, transfers the carrier substrate on which the plurality of chips are mounted, and causes the carrier surface of the carrier substrate to face a receiving surface of a receiving substrate; and the number of the first and second groups,
and a chip transfer device which is arranged adjacent to the carrying substrate moving device and applies electromagnetic waves to the carrying substrate to heat and evaporate liquid positioned between the crystal carrying seats and the chips so that the chips are separated from the crystal carrying seats and fall to the receiving surface of the receiving substrate.
2. The apparatus for transferring a chip having a self-aligning positioning function as claimed in claim 1, wherein the plurality of dividing grooves are a plurality of longitudinal grooves spaced apart from each other and a plurality of transverse grooves spaced apart from each other on the carrier substrate, and the plurality of transverse grooves and the plurality of longitudinal grooves are staggered to form a plurality of wafer carriers distributed in a checkerboard manner.
3. The apparatus for transferring a chip with a self-alignment positioning function as claimed in claim 1, wherein the electromagnetic wave applied by the chip transferring device is a laser beam.
4. The apparatus for transferring a chip having a self-aligning positioning function as claimed in claim 1, wherein the receiving surface of the receiving substrate has a plurality of chip receiving seats, and the carrier substrate transfer device transfers the carrier substrate so that each of the chip receiving seats faces the receiving surface.
5. The apparatus as claimed in claim 1, wherein the carrying surface of the carrying substrate is hydrophilic for smoothing, and the separation grooves are hydrophobic for roughening.
6. The apparatus as claimed in claim 1, wherein the carrier substrate is a glass substrate, and the electromagnetic wave applied by the chip transfer device penetrates the glass substrate to heat the liquid between each of the wafer carriers and each of the chips.
7. The apparatus as claimed in claim 1, wherein the liquid applied to the carrying surface of the carrier substrate by the liquid adding device is water, and the electromagnetic wave applied by the chip transferring device is heated and evaporated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022942391.2U CN213483732U (en) | 2020-12-11 | 2020-12-11 | Chip transfer equipment with self-alignment positioning function |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022942391.2U CN213483732U (en) | 2020-12-11 | 2020-12-11 | Chip transfer equipment with self-alignment positioning function |
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| CN213483732U true CN213483732U (en) | 2021-06-18 |
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| CN202022942391.2U Active CN213483732U (en) | 2020-12-11 | 2020-12-11 | Chip transfer equipment with self-alignment positioning function |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114122203A (en) * | 2021-11-19 | 2022-03-01 | 东莞市中麒光电技术有限公司 | Method for realizing chip transfer by utilizing liquid surface tension |
| CN116844969A (en) * | 2023-07-04 | 2023-10-03 | 江苏中科智芯集成科技有限公司 | Chip mounting positioning method and fan-out type packaging process |
-
2020
- 2020-12-11 CN CN202022942391.2U patent/CN213483732U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114122203A (en) * | 2021-11-19 | 2022-03-01 | 东莞市中麒光电技术有限公司 | Method for realizing chip transfer by utilizing liquid surface tension |
| CN114122203B (en) * | 2021-11-19 | 2023-03-14 | 东莞市中麒光电技术有限公司 | Method for transferring chip by utilizing liquid surface tension |
| CN116844969A (en) * | 2023-07-04 | 2023-10-03 | 江苏中科智芯集成科技有限公司 | Chip mounting positioning method and fan-out type packaging process |
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