TWM609387U - Substrate rotating holding device - Google Patents

Substrate rotating holding device Download PDF

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Publication number
TWM609387U
TWM609387U TW109213624U TW109213624U TWM609387U TW M609387 U TWM609387 U TW M609387U TW 109213624 U TW109213624 U TW 109213624U TW 109213624 U TW109213624 U TW 109213624U TW M609387 U TWM609387 U TW M609387U
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Taiwan
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substrate
supporting
holding device
rotating
base
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TW109213624U
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Chinese (zh)
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馮傳彰
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辛耘企業股份有限公司
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Priority to TW109213624U priority Critical patent/TWM609387U/en
Priority to KR2020210000053U priority patent/KR200496440Y1/en
Publication of TWM609387U publication Critical patent/TWM609387U/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

一種基板旋轉固持裝置，包含旋轉機構及多個支撐單元。旋轉機構包括具有承載面的旋轉座。支撐單元布設於承載面用以共同支撐並固持基板。每一支撐單元包括座體、安裝部、支撐部，及兩個限位部。座體具有底面及頂面，安裝部自底面延伸並連接旋轉座，支撐部及限位部設於頂面，支撐部具有用以供基板的背面靠抵的接觸弧面，該等限位部彼此相間隔且相較於支撐部遠離承載面的中心以供基板的周緣靠抵。藉由支撐部及限位部的配置能夠使基板與支撐單元的接觸區域容易乾燥，且能擴張支撐單元之間可供放置基板的範圍，以增加傳送基板時的容許誤差。A substrate rotating and holding device includes a rotating mechanism and a plurality of supporting units. The rotating mechanism includes a rotating seat with a bearing surface. The supporting unit is arranged on the carrying surface to jointly support and hold the substrate. Each supporting unit includes a base, a mounting part, a supporting part, and two limiting parts. The seat body has a bottom surface and a top surface. The mounting portion extends from the bottom surface and is connected to the rotating seat. The supporting portion and the limiting portion are provided on the top surface. The supporting portion has a contact arc surface for the back of the substrate to abut against, and the limiting portions They are spaced apart from each other and farther from the center of the supporting surface than the support part for the peripheral edge of the substrate to abut against. The configuration of the supporting part and the limiting part can make the contact area between the substrate and the supporting unit easy to dry, and can expand the range of the substrate for placing the substrate between the supporting units, so as to increase the allowable error when transferring the substrate.

Description

基板旋轉固持裝置Substrate rotation holding device

本新型是有關於一種旋轉固持裝置，特別是指一種用於固持基板並將基板旋轉的基板旋轉固持裝置。The present invention relates to a rotating holding device, in particular to a substrate rotating holding device for holding and rotating a substrate.

一般在半導體製程中，有些步驟需要旋轉基板以將附著在基板上的液體藉由離心力甩出基板，而使基板乾燥。Generally, in the semiconductor manufacturing process, some steps need to rotate the substrate so that the liquid attached to the substrate is thrown out of the substrate by centrifugal force to dry the substrate.

現有用於旋轉基板的旋轉裝置可依照轉速高低的需求配合不同的固持基板的方式。通常轉速較高的旋轉裝置會藉由真空吸附的方式來固持基板。而轉速較低的旋轉裝置，參閱圖1，可藉由多個分布在旋轉座91上的支撐限位件92來共同支撐基板S並將基板S限位，使基板S在被旋轉座91帶動旋轉的過程中不會離開旋轉座91。另配合參閱圖2，現有的支撐限位件92具有一圓柱狀基座921及一自該基座921的頂面921a同軸凸出的圓柱狀靠抵柱922，該基座921的頂面921a供基板S的背面靠抵，該靠抵柱922的側面供基板S的周緣靠抵。由圖1與圖2可看出，基板S的背面靠抵於支撐限位件92的基座921的頂面921a是呈面接觸，目前該基座921的頂面921a外周至該靠抵柱922外周之間在基座921直徑方向上的距離D為2mm。由於基板S是由多個支撐限位件92共同支撐，當基板S自前一個工作站由機械手臂傳送至旋轉裝置時，機械手臂必須將基板S放置於全部的支撐限位件92上，否則基板S會傾斜掉落而使傳送失敗，但是目前的傳送容許誤差僅有0.5mm，容易傳送失敗。The existing rotating device for rotating the substrate can be matched with different ways of holding the substrate according to the requirements of the high and low speed. Generally, a rotating device with a higher rotation speed will hold the substrate by means of vacuum adsorption. For a rotating device with a lower speed, referring to FIG. 1, a plurality of supporting and limiting members 92 distributed on the rotating seat 91 can jointly support the substrate S and limit the substrate S, so that the substrate S is driven by the rotating seat 91 It does not leave the rotating seat 91 during the rotation. In conjunction with FIG. 2, the existing supporting and limiting member 92 has a cylindrical base 921 and a cylindrical abutting post 922 coaxially protruding from the top surface 921a of the base 921, and the top surface 921a of the base 921 The back surface of the substrate S is pressed against, and the side surface of the abutting column 922 is used for the peripheral edge of the substrate S to bear against. It can be seen from FIGS. 1 and 2 that the back surface of the substrate S is in surface contact with the top surface 921a of the base 921 supporting the limiting member 92. Currently, the outer periphery of the top surface 921a of the base 921 reaches the abutting column. The distance D between the outer peripheries of 922 in the diameter direction of the base 921 is 2 mm. Since the substrate S is jointly supported by a plurality of supporting and limiting elements 92, when the substrate S is transferred from the previous workstation to the rotating device by the robotic arm, the robotic arm must place the substrate S on all the supporting and limiting elements 92, otherwise the substrate S It will tilt down and make the transmission fail, but the current transmission tolerance is only 0.5mm, which is easy to fail.

以現有的支撐限位件92結構而言，若要增加傳送容許誤差，則需增加該基座921的頂面921a外周至該靠抵柱922外周之間在基座921直徑方向上的距離D。然而，如此會導致基板S背面靠抵於基座921的頂面921a的接觸面積增加，而使基板S背面與基座921的頂面921a的接觸區域更不易乾燥。In terms of the existing structure of the supporting and limiting member 92, if the transmission tolerance is to be increased, the distance D from the outer circumference of the top surface 921a of the base 921 to the outer circumference of the abutment column 922 in the diameter direction of the base 921 needs to be increased. . However, this will increase the contact area of the back surface of the substrate S against the top surface 921a of the base 921, and make the contact area between the back surface of the substrate S and the top surface 921a of the base 921 more difficult to dry.

因此，本新型之一目的，即在提供一種可使基板接觸區域容易乾燥且能增加傳送容許誤差的基板旋轉固持裝置。Therefore, one of the objectives of the present invention is to provide a substrate rotating and holding device that can easily dry the substrate contact area and increase the tolerance of transmission.

於是，本新型基板旋轉固持裝置在一些實施態樣中，是適用於固持一基板並帶動該基板旋轉，該基板旋轉固持裝置包含一旋轉機構及多個支撐單元。該旋轉機構包括一旋轉座，該旋轉座具有一承載面。該等支撐單元布設於該承載面，用以共同支撐並固持該基板。每一支撐單元包括一座體、一安裝部、一支撐部，及兩個限位部。該座體具有位於相反兩側的一底面及一頂面，該安裝部自該底面延伸並連接該旋轉座，該支撐部及該等限位部設於該頂面，該支撐部具有一用以供該基板的背面靠抵的接觸弧面，該等限位部彼此相間隔且相較於該支撐部遠離該承載面的中心以供該基板的周緣靠抵。Therefore, in some embodiments, the substrate rotating and holding device of the present invention is suitable for holding a substrate and driving the substrate to rotate. The substrate rotating and holding device includes a rotating mechanism and a plurality of supporting units. The rotating mechanism includes a rotating seat, and the rotating seat has a bearing surface. The supporting units are arranged on the carrying surface to jointly support and hold the substrate. Each supporting unit includes a base, a mounting part, a supporting part, and two limiting parts. The seat body has a bottom surface and a top surface on opposite sides, the mounting portion extends from the bottom surface and is connected to the rotating seat, the support portion and the limiting portions are provided on the top surface, and the support portion has a With the contact arc surface for the back surface of the substrate to abut against, the limiting portions are spaced apart from each other and farther from the center of the carrying surface than the support portion for the peripheral edge of the substrate to abut against.

在一些實施態樣中，每一限位部呈圓柱狀凸出於該頂面。In some embodiments, each limiting portion protrudes from the top surface in a cylindrical shape.

在一些實施態樣中，該座體具有一連接該安裝部的主段及一自該主段沿平行該承載面方向延伸的延伸段，該主段及該延伸段的底面共同形成該座體之底面，該主段及該延伸段的頂面共同形成該座體之頂面，該支撐部設於該主段且該等限位部設於該延伸段靠近末端處，該延伸段可操作地以該安裝部為軸擺動一定角度，藉此調整該等限位部相對於該基板周緣的位置。In some embodiments, the seat body has a main section connecting the mounting portion and an extension section extending from the main section in a direction parallel to the bearing surface, and the bottom surface of the main section and the extension section together form the seat body The bottom surface of the main section and the top surface of the extension section together form the top surface of the seat body. The support portion is provided on the main section and the limit portions are provided near the end of the extension section. The extension section is operable The ground swings at a certain angle with the mounting portion as an axis, thereby adjusting the positions of the limiting portions relative to the peripheral edge of the substrate.

在一些實施態樣中，該支撐部相較於該座體的轉動軸心靠近該承載面的中心。In some embodiments, the supporting portion is closer to the center of the bearing surface than the rotation axis of the seat.

在一些實施態樣中，該主段呈圓柱狀且該延伸段自該主段至末端漸縮，而使該座體呈水滴狀。In some embodiments, the main section is cylindrical and the extension section is tapered from the main section to the end, so that the seat body is in the shape of a drop.

在一些實施態樣中，該等限位部可拆地設於該座體。In some embodiments, the limiting parts are detachably provided on the base body.

在一些實施態樣中，該支撐部可拆地設於該座體。In some embodiments, the supporting portion is detachably provided on the base body.

在一些實施態樣中，該支撐部呈中央隆起的弧面塊狀凸出於該座體的頂面。In some embodiments, the supporting portion protrudes from the top surface of the seat body in the shape of a curved block with a central bulge.

本新型具有以下功效：藉由每一支撐單元的支撐部具有接觸弧面，能夠減少與該基板的背面的接觸面積，且藉由兩個限位部彼此相間隔地共同供該基板的周緣靠抵，也能減少每一限位部與該基板的周緣的接觸面積，並在該等限位部之間形成間隙以供空氣流通，而使該基板的背面及周緣與該支撐單元的接觸區域都更容易乾燥。而且藉由每一支撐單元的限位部與支撐部的配置，能擴張該等支撐單元之間可供放置該基板的範圍，如此可增加傳送該基板時的容許誤差。The present invention has the following effects: the supporting part of each supporting unit has a contact arc surface, which can reduce the contact area with the back surface of the substrate, and the two limit parts are spaced apart from each other to jointly provide the peripheral edge of the substrate to lean against It can also reduce the contact area between each limit part and the periphery of the substrate, and form a gap between the limit parts for air circulation, so that the back and the periphery of the substrate are in contact with the support unit. Both are easier to dry. Moreover, by the arrangement of the limiting portion and the supporting portion of each supporting unit, the range in which the substrate can be placed between the supporting units can be expanded, which can increase the allowable error when transferring the substrate.

在本新型被詳細描述之前，應當注意在以下的說明內容中，類似的元件是以相同的編號來表示。Before the present invention is described in detail, it should be noted that in the following description, similar elements are represented by the same numbers.

參閱圖3與圖4，本新型基板旋轉固持裝置100之一第一實施例適用於固持一基板S並帶動該基板S旋轉，該基板旋轉固持裝置100包含一旋轉機構1及多個支撐單元2。Referring to FIGS. 3 and 4, a first embodiment of the substrate rotating and holding device 100 of the present invention is suitable for holding a substrate S and driving the substrate S to rotate. The substrate rotating and holding device 100 includes a rotating mechanism 1 and a plurality of supporting units 2 .

該旋轉機構1包括一旋轉座11，該旋轉座11具有一承載面111。該旋轉機構1的具體實施方式可採用現有技術，故不再詳細說明。The rotating mechanism 1 includes a rotating seat 11 having a bearing surface 111. The specific implementation of the rotating mechanism 1 can adopt the existing technology, so it will not be described in detail.

該等支撐單元2布設於該承載面111，用以共同支撐並固持該基板S。每一支撐單元2包括一座體21、一安裝部22、一支撐部23，及兩個限位部24。該座體21具有位於相反兩側的一底面211及一頂面212。該安裝部22自該底面211延伸並連接該旋轉座11。該支撐部23及該等限位部24設於該頂面212，該支撐部23具有一用以供該基板S的背面靠抵的接觸弧面231，該等限位部24彼此相間隔且相較於該支撐部23遠離該承載面111的中心C以供該基板S的周緣靠抵。The supporting units 2 are arranged on the carrying surface 111 to jointly support and hold the substrate S. Each supporting unit 2 includes a base 21, a mounting portion 22, a supporting portion 23, and two limiting portions 24. The base 21 has a bottom surface 211 and a top surface 212 on opposite sides. The mounting portion 22 extends from the bottom surface 211 and is connected to the rotating base 11. The supporting portion 23 and the restricting portions 24 are provided on the top surface 212. The supporting portion 23 has a contact arc surface 231 for the back of the substrate S to abut against, and the restricting portions 24 are spaced apart from each other. Compared with the supporting portion 23, it is farther away from the center C of the supporting surface 111 for the peripheral edge of the substrate S to abut against.

在本實施例中，該座體21具有一連接該安裝部22的主段213及一自該主段213沿平行該承載面111方向延伸的延伸段214。該主段213及該延伸段214的底面共同形成該座體21之底面211，該主段213及該延伸段214的頂面共同形成該座體21之頂面212。具體而言，該主段213呈圓柱狀且該延伸段214自該主段213至末端漸縮，而使該座體21呈水滴狀。該支撐部23設於該主段213且呈中央隆起的弧面塊狀凸出於該頂面212。該等限位部24設於該延伸段214靠近末端處，每一限位部24呈圓柱狀凸出於該頂面212。另配合參閱圖5與圖6，該安裝部22固定於該旋轉座11，該座體21可轉動地與該安裝部22連接，使該延伸段214可操作地以該安裝部22為軸擺動一定角度，藉此調整該等限位部24相對於該基板S周緣的位置。如圖5所示，在該基板S被置入該旋轉座11前，每一座體21的延伸段214較偏靠該旋轉座11的外側，而使該等限位部24與該承載面111的中心C的距離較遠，即能擴張可供放置該基板S的範圍，如此可增加傳送該基板S時的容許誤差。在本實施例中，傳送容許誤差可大於2mm。如圖6所示，當該基板S被放置於該等支撐單元2後，再使每一座體21的延伸段214往該承載面111的中心C方向擺動，以使該等限位部24靠抵於該基板S的周緣，而能更穩固地固持該基板S。而且，在本實施例中，每一支撐單元2的支撐部23相較於該座體21的轉動軸心A靠近該承載面111的中心C，藉此可確保在該座體21轉動時該基板S仍位於該支撐部23上方，而能被該支撐部23支撐。In this embodiment, the base body 21 has a main section 213 connected to the mounting portion 22 and an extension section 214 extending from the main section 213 in a direction parallel to the bearing surface 111. The bottom surfaces of the main section 213 and the extension section 214 jointly form the bottom surface 211 of the seat body 21, and the top surfaces of the main section 213 and the extension section 214 jointly form the top surface 212 of the seat body 21. Specifically, the main section 213 is cylindrical and the extension section 214 is tapered from the main section 213 to the end, so that the seat body 21 is in the shape of a drop. The supporting portion 23 is disposed on the main section 213 and protrudes from the top surface 212 in the shape of a centrally raised arc surface block. The limiting portions 24 are disposed near the end of the extension section 214, and each limiting portion 24 protrudes from the top surface 212 in a cylindrical shape. 5 and 6 in conjunction, the mounting portion 22 is fixed to the rotating seat 11, the seat body 21 is rotatably connected with the mounting portion 22, so that the extension 214 can operably swing about the mounting portion 22 as an axis A certain angle is used to adjust the position of the limiting portions 24 relative to the peripheral edge of the substrate S. As shown in FIG. 5, before the substrate S is placed in the rotating seat 11, the extension 214 of each seat body 21 is relatively close to the outer side of the rotating seat 11, so that the limiting portions 24 and the bearing surface 111 The distance between the center C of the substrate S is relatively far, that is, the range where the substrate S can be placed can be expanded, so that the allowable error when the substrate S is transferred can be increased. In this embodiment, the transmission tolerance may be greater than 2 mm. As shown in FIG. 6, after the substrate S is placed on the supporting units 2, the extension 214 of each seat body 21 is swung toward the center C of the supporting surface 111, so that the limiting portions 24 can lean against By pressing against the periphery of the substrate S, the substrate S can be held more firmly. Moreover, in this embodiment, the supporting portion 23 of each supporting unit 2 is closer to the center C of the bearing surface 111 than the rotation axis A of the base 21, so as to ensure that the base 21 is rotated when the base 21 rotates. The substrate S is still located above the supporting portion 23 and can be supported by the supporting portion 23.

在本實施例中，每一支撐部23的接觸弧面231與該基板S接觸的接觸面積的直徑約為0.5mm，能大幅減少與該基板S的接觸面積，而使該基板S的背面與該等支撐部23接觸的區域容易乾燥。In this embodiment, the diameter of the contact area of the contact arc 231 of each support portion 23 and the substrate S is about 0.5 mm, which can greatly reduce the contact area with the substrate S, and make the back of the substrate S and The areas in contact with the supporting parts 23 are easy to dry.

在本實施例中，每一支撐單元2藉由兩個限位部24共同靠抵於該基板S的周緣，能夠共同分擔該基板S在旋轉過程中施加在該等限位部24的力量，而能減少每一限位部24的受力。因為每一限位部24可受較小的力，所以相較於現有技術的單一靠抵柱922(見圖1)而言，該限位部24的直徑可以較為縮小，即能具備足以承受該基板S的施力所需的結構強度。由於該等限位部24的直徑較小也能減少與該基板S周緣的接觸面積，而且該等限位部24彼此相間隔，而使該等限位部24之間有間隙以利於空氣流通，進而使該基板S的背面及周緣與該支撐單元2的接觸區域都更容易乾燥。In the present embodiment, each supporting unit 2 can jointly share the force exerted on the limiting portions 24 by the substrate S during the rotation of the substrate S by abutting against the periphery of the substrate S by the two limiting portions 24 together. It can reduce the force of each limit part 24. Because each limiting portion 24 can be subjected to a smaller force, compared with the single abutting post 922 (see FIG. 1) of the prior art, the diameter of the limiting portion 24 can be reduced, that is, it can bear enough The strength of the structure required for the force of the substrate S. Since the diameter of the limiting portions 24 is smaller, the contact area with the periphery of the substrate S can be reduced, and the limiting portions 24 are spaced apart from each other, so that there is a gap between the limiting portions 24 to facilitate air circulation Therefore, the contact area between the back surface and the peripheral edge of the substrate S and the support unit 2 can be dried more easily.

此外，在本實施例中，該等限位部24及該支撐部23可拆地設於該座體21，藉此，當該等限位部24及該支撐部23磨耗或損壞時可更換新品，以節省材料成本。當然，在變化的實施例，該等限位部24及該支撐部23與該座體21一體成形亦可實施。In addition, in this embodiment, the restricting portions 24 and the supporting portion 23 are detachably provided on the base 21, so that the restricting portions 24 and the supporting portion 23 can be replaced when worn or damaged New products to save material costs. Of course, in a modified embodiment, the limiting portions 24 and the supporting portion 23 and the seat body 21 may be integrally formed.

參閱圖7，本新型基板旋轉固持裝置100之一第二實施例與該第一實施例的差異在於，每一支撐單元2的座體21呈圓柱狀且不能轉動，但是同樣具有與第一實施例相同的功效，亦即同樣能增加傳送該基板S時的容許誤差，且能使該基板S的背面及周緣與該支撐單元2的接觸區域都更容易乾燥。在第二實施例的每一支撐單元2中，該等限位部24相較於現有技術的單一靠抵柱922(見圖1)而言，由於單一靠抵柱922需要較大的直徑才能有足夠的支撐強度，而該等限位部24間隔設置能夠平均分攤受力，所以可以有較小的直徑，如此能使該等限位部24與該承載面111的中心C的距離較遠，即能擴張可供放置該基板S的範圍，從而增加傳送該基板S時的容許誤差。在本實施例中，傳送容許誤差同樣可大於2mm。Referring to FIG. 7, the difference between the second embodiment of the substrate rotating and holding device 100 of the present invention and the first embodiment is that the seat 21 of each supporting unit 2 is cylindrical and cannot rotate, but it also has the same features as the first embodiment. The same effect as the example, that is, it can also increase the allowable error when transferring the substrate S, and can make the contact area between the back and the periphery of the substrate S and the support unit 2 easier to dry. In each supporting unit 2 of the second embodiment, the limiting portions 24 are compared with the single abutting post 922 in the prior art (see FIG. 1), since the single abutting post 922 requires a larger diameter to It has sufficient support strength, and the spacing of the limiting parts 24 can evenly share the force, so it can have a smaller diameter, which can make the distance between the limiting parts 24 and the center C of the bearing surface 111 farther , Which can expand the range where the substrate S can be placed, thereby increasing the allowable error when transferring the substrate S. In this embodiment, the transmission tolerance can also be greater than 2 mm.

惟以上所述者，僅為本新型之實施例而已，當不能以此限定本新型實施之範圍，凡是依本新型申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本新型專利涵蓋之範圍內。However, the above are only examples of the present model, and should not be used to limit the scope of implementation of the present model, all simple equivalent changes and modifications made in accordance with the patent scope of the present model application and the contents of the patent specification still belong to This new patent covers the scope.

100:基板旋轉固持裝置 1:旋轉機構 11:旋轉座 111:承載面 2:支撐單元 21:座體 211:底面 212:頂面 213:主段 214:延伸段 22:安裝部 23:支撐部 231:接觸弧面 24:限位部 91:旋轉座 92:支撐限位件 921:基座 921a:頂面 922:靠抵柱 A:轉動軸心 C:中心 D:距離 S:基板100: Substrate rotation holding device 1: Rotating mechanism 11: Rotating seat 111: bearing surface 2: Support unit 21: Seat 211: Bottom 212: top surface 213: Main section 214: Extension 22: Installation Department 23: Support 231: contact arc 24: limit part 91: Rotating seat 92: Support limit piece 921: Pedestal 921a: Top surface 922: leaning against the column A: Rotate the axis C: Center D: distance S: substrate

本新型之其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中： 圖1是說明現有技術的一旋轉裝置的一俯視示意圖； 圖2是說明該旋轉裝置的一支撐限位件與一基板的作用關係的一不完整的側視示意圖； 圖3是本新型基板旋轉固持裝置的第一實施例的一立體圖； 圖4是該第一實施例的一支撐單元的一立體圖； 圖5是該第一實施例的支撐單元在未將一基板限位時的俯視圖； 圖6是該第一實施例的支撐單元在將該基板限位時的俯視圖；及 圖7是本新型基板旋轉固持裝置的第二實施例的一俯視圖。 The other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, among which: Figure 1 is a schematic top view illustrating a rotating device in the prior art; 2 is an incomplete schematic side view illustrating the functional relationship between a supporting and limiting member of the rotating device and a substrate; Fig. 3 is a perspective view of the first embodiment of the substrate rotation and holding device of the present invention; Figure 4 is a perspective view of a supporting unit of the first embodiment; 5 is a top view of the supporting unit of the first embodiment when a substrate is not restricted; Fig. 6 is a top view of the supporting unit of the first embodiment when the substrate is restricted; and Fig. 7 is a top view of the second embodiment of the substrate rotation and holding device of the present invention.

100:基板旋轉固持裝置 100: Substrate rotation holding device

1:旋轉機構 1: Rotating mechanism

11:旋轉座 11: Rotating seat

111:承載面 111: bearing surface

2:支撐單元 2: Support unit

21:座體 21: Seat

212:頂面 212: top surface

22:安裝部 22: Installation Department

23:支撐部 23: Support

24:限位部 24: limit part

C:中心 C: Center

S:基板 S: substrate

Claims (8)

一種基板旋轉固持裝置，適用於固持一基板並帶動該基板旋轉，該基板旋轉固持裝置包含： 一旋轉機構，包括一旋轉座，該旋轉座具有一承載面；及 多個支撐單元，布設於該承載面，用以共同支撐並固持該基板，每一支撐單元包括一座體、一安裝部、一支撐部，及兩個限位部，該座體具有位於相反兩側的一底面及一頂面，該安裝部自該底面延伸並連接該旋轉座，該支撐部及該等限位部設於該頂面，該支撐部具有一用以供該基板的背面靠抵的接觸弧面，該等限位部彼此相間隔且相較於該支撐部遠離該承載面的中心以供該基板的周緣靠抵。 A substrate rotation holding device is suitable for holding a substrate and driving the substrate to rotate. The substrate rotation holding device includes: A rotating mechanism, including a rotating seat, the rotating seat having a bearing surface; and A plurality of supporting units are arranged on the bearing surface to jointly support and hold the substrate. Each supporting unit includes a base, a mounting portion, a supporting portion, and two limiting portions. The base has two opposite positions. A bottom surface and a top surface of the side, the mounting portion extends from the bottom surface and is connected to the rotating seat, the support portion and the limiting portions are provided on the top surface, and the support portion has a back surface for the substrate to lean against The contact arc surface of the abutment, the limiting portions are spaced apart from each other and farther from the center of the bearing surface than the support portion, so that the periphery of the substrate can abut. 如請求項1所述基板旋轉固持裝置，其中，每一限位部呈圓柱狀凸出於該頂面。According to claim 1, the substrate rotation holding device, wherein each limiting portion protrudes from the top surface in a cylindrical shape. 如請求項1所述基板旋轉固持裝置，其中，該座體具有一連接該安裝部的主段及一自該主段沿平行該承載面方向延伸的延伸段，該主段及該延伸段的底面共同形成該座體之底面，該主段及該延伸段的頂面共同形成該座體之頂面，該支撐部設於該主段且該等限位部設於該延伸段靠近末端處，該延伸段可操作地以該安裝部為軸擺動一定角度，藉此調整該等限位部相對於該基板周緣的位置。The substrate rotation holding device according to claim 1, wherein the base body has a main section connecting the mounting portion and an extension section extending from the main section in a direction parallel to the bearing surface, and the main section and the extension section The bottom surface jointly forms the bottom surface of the seat body, the top surfaces of the main section and the extension section jointly form the top surface of the seat body, the supporting portion is provided on the main section and the limiting portions are provided near the end of the extension section The extension section is operable to swing at a certain angle with the mounting portion as an axis, thereby adjusting the positions of the limiting portions relative to the peripheral edge of the substrate. 如請求項3所述基板旋轉固持裝置，其中，該支撐部相較於該座體的轉動軸心靠近該承載面的中心。According to claim 3, the substrate rotation holding device, wherein the supporting portion is closer to the center of the bearing surface than the rotation axis of the base. 如請求項3所述基板旋轉固持裝置，其中，該主段呈圓柱狀且該延伸段自該主段至末端漸縮，而使該座體呈水滴狀。According to claim 3, the substrate rotation holding device, wherein the main section is cylindrical and the extension section is tapered from the main section to the end, so that the seat body is in the shape of a drop. 如請求項1所述基板旋轉固持裝置，其中，該等限位部可拆地設於該座體。According to claim 1, the substrate rotation holding device, wherein the limit parts are detachably provided on the base body. 如請求項1或6所述基板旋轉固持裝置，其中，該支撐部可拆地設於該座體。According to claim 1 or 6, the substrate rotation holding device, wherein the support portion is detachably provided on the base. 如請求項1所述基板旋轉固持裝置，其中，該支撐部呈中央隆起的弧面塊狀凸出於該頂面。According to claim 1, the substrate rotating and holding device, wherein the supporting portion protrudes from the top surface in the shape of an arc-shaped block with a central bulge.
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