CN115274543B - Semiconductor device for preventing wafer from shifting - Google Patents
Semiconductor device for preventing wafer from shifting Download PDFInfo
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- CN115274543B CN115274543B CN202211177919.9A CN202211177919A CN115274543B CN 115274543 B CN115274543 B CN 115274543B CN 202211177919 A CN202211177919 A CN 202211177919A CN 115274543 B CN115274543 B CN 115274543B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The embodiment of the invention provides a semiconductor device for preventing wafer displacement, and relates to the field of semiconductor devices. The semiconductor equipment for preventing the wafer from shifting is provided with a wafer supporting device, wherein the wafer supporting device comprises a mounting plate and a plurality of supporting pieces, and the plurality of supporting pieces are arranged along the circumferential direction of the mounting plate; each supporting piece comprises a main limiting column, an auxiliary limiting column and a bearing part, the bearing part is arranged on the mounting plate and comprises a bearing surface, the main limiting column and the auxiliary limiting column are arranged on the bearing surface, and the bearing surface is used for supporting the wafer; the main limiting column and the auxiliary limiting column are matched to guide the wafer, so that the wafer is located at the center of the plurality of supporting pieces, the problem of wafer position deviation can be solved well, and the centering performance of the wafer is improved.
Description
Technical Field
The invention relates to the field of semiconductor process equipment, in particular to semiconductor equipment for preventing wafer displacement.
Background
Wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed.
The existing wafer supporting piece is easy to deviate in the position of the wafer in the process of bearing the wafer, and the problem of poor alignment exists.
Disclosure of Invention
The invention provides a semiconductor device for preventing wafer displacement, which can better solve the problem of wafer position deviation and improve the centering of the wafer.
Embodiments of the invention may be implemented as follows:
the embodiment of the invention provides semiconductor equipment for preventing wafer displacement, which comprises a reaction chamber, a wafer tray, a lifting driving device, a mechanical arm and a wafer supporting device, wherein the wafer supporting device comprises an installation plate and a plurality of supporting pieces, and the plurality of supporting pieces are arranged along the circumferential direction of the installation plate;
the wafer tray is arranged in the reaction chamber, and is provided with a plurality of openings for the support pieces to penetrate through;
the lifting driving device is arranged at the bottom of the reaction chamber, is connected with the mounting plate and is used for driving the supporting piece to lift so as to support the wafer;
each bearing piece comprises a main limiting column, an auxiliary limiting column and a bearing part, the bearing part is arranged on the mounting plate, the bearing part is provided with a bearing surface, the main limiting column and the auxiliary limiting column are arranged on the bearing surface, and the bearing surface is used for bearing a wafer;
the number of the main limiting columns of each supporting piece is one, the number of the auxiliary limiting columns comprises two, and the two auxiliary limiting columns are respectively positioned on two sides of the main limiting columns;
the main limiting column comprises a guide part and a positioning part, the height of the guide part is higher than that of the auxiliary limiting column, and the guide part is used for primarily guiding the wafer to realize large-amplitude deviation correction;
the positioning part is arranged on the bearing surface, and the guide part is connected to one end of the positioning part, which is far away from the bearing surface;
when the wafer is positioned at the center of the plurality of supporting pieces, the positioning part is abutted with the side wall of the wafer;
the auxiliary limiting column is used for secondarily guiding the wafer to realize small-amplitude accurate positioning;
the main limiting column and the auxiliary limiting column are matched to guide the wafer twice, so that the wafer is located at the center of the plurality of supporting pieces.
Optionally, the cross-sectional shape of the end surface of the guide part is an ellipse, and the area of the top surface of the guide part is smaller than that of the bottom surface; the auxiliary limiting column is conical.
Optionally, the height of the positioning part is equal to that of the secondary limiting column; the cross-sectional shape of the end face of the positioning part is oval, the positioning part is coaxially connected with the guide part, and the area of the top surface of the positioning part is equal to that of the bottom surface of the guide part.
Optionally, the main limiting column further comprises a limiting part, and the limiting part is arranged at the top end of the guide part to limit the wafer.
Optionally, the cross-sectional shape of the end face of the limiting portion is an ellipse, the limiting portion is coaxially connected with the guide portion, and the area of the bottom face of the limiting portion is equal to that of the top face of the guide portion.
Optionally, a connecting line of the main limiting column and one side of the two auxiliary limiting columns close to the wafer in each supporting piece is located on the same horizontal line.
Optionally, a connecting line between the main limiting column and one side, close to the wafer, of the two auxiliary limiting columns of each supporting member is an arc line, and the arc line is overlapped with an edge line of the wafer.
Optionally, an included angle between the centers of the two auxiliary limiting columns and a line connecting centers of circle centers corresponding to the circular arc lines is 1-10 °.
Optionally, an included angle between the centers of the two auxiliary limiting columns and a connecting line of circle centers corresponding to the circular arc lines is 2-3 °.
Optionally, the cross sections of the main limiting column and the auxiliary limiting column are circular, and the bearing surface is oval.
The semiconductor equipment for preventing the wafer from shifting disclosed by the embodiment of the invention has the beneficial effects that: the in-process of bearing wafer, the edge of wafer contacts with main spacing post and vice spacing post in proper order, under the dual direction (preliminary direction and secondary direction) effect of two-stage of main spacing post and vice spacing post, the wafer is finally accepted by a plurality of faces of accepting, and have the support of the main spacing post of main and vice spacing post through the multiunit, the wafer realizes the two-stage centering, multiple spot stable support behind the centering, thereby difficult emergence skew, the centering nature of wafer has been promoted.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is an exploded view of the wafer, the wafer tray and the wafer support device in this embodiment;
FIG. 2 is a schematic structural view of the supporting member of the present embodiment;
fig. 3 is a schematic view for showing the primary and secondary limiting columns in the present embodiment;
FIG. 4 is a first schematic view of another embodiment of the present invention showing a primary restraint post and a secondary restraint post;
fig. 5 is a second schematic diagram for showing the primary and secondary restraint posts in other embodiments.
Icon: 10-a wafer support device; 100-mounting a plate; 200-a support; 210-a primary restraint post; 211-a guide; 212-a positioning section; 213-a limiting part; 220-an auxiliary limit column; 230-a bay; 231-bearing surface; 2311-a receiving area; 2312-non-bearing area; 240-a mounting portion; 300-a wafer tray; 310-opening a hole; 400-wafer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
The inventor of the application finds that the existing supporting piece of the wafer is mostly of a single guide supporting structure, the position of the wafer is easy to deviate in the process of bearing the wafer, and the problem of poor centering performance exists after the guide supporting.
Referring to fig. 1 to 3, the semiconductor apparatus for preventing wafer shifting according to the present embodiment includes a wafer supporting device 10, where the wafer supporting device 10 includes a mounting plate 100 and a plurality of supporting members 200, and the plurality of supporting members 200 are arranged along a circumferential direction of the mounting plate 100; each of the supporting members 200 includes a main limiting column 210, an auxiliary limiting column 220 and a receiving portion 230, the receiving portion 230 is disposed on the mounting plate 100, the receiving portion 230 has a receiving surface 231, the main limiting column 210 and the auxiliary limiting column 220 are disposed on the receiving surface 231, and the receiving surface 231 is used for supporting the wafer 400; the primary restraint post 210 and the secondary restraint post 220 cooperate to guide the wafer 400 such that the wafer 400 is centered on the plurality of support members 200.
In this embodiment, a plurality of supporting pieces 200 are arranged in the same circumferential direction, the number of the main limiting columns 210 of each supporting piece 200 is one, the number of the auxiliary limiting columns 220 includes two, and the two auxiliary limiting columns 220 are respectively located at two sides of the main limiting columns 210; the receiving surface 231 includes a receiving area 2311 and a non-receiving area 2312, the primary restraint column 210 and the two secondary restraint columns 220 of each receiving member 200 are disposed in the non-receiving area 2312, the primary restraint column 210 and the secondary restraint column 220 of the non-receiving area cooperate to guide the wafer 400, and the receiving area is used for supporting the wafer 400.
In the process of supporting the wafer 400, the edge of the wafer 400 contacts with the primary restraint posts 210 and the secondary restraint posts 220 at different stages, and the wafer 400 is finally supported by the plurality of support areas 2311 under the dual guiding action of the primary restraint posts 210 and the secondary restraint posts 220, so that the wafer 400 is not prone to shift, and the alignment of the wafer 400 is improved.
Further, the main retaining column 210 includes a guide portion 211, the height of the guide portion 211 is higher than that of the sub-retaining column 220, and the guide portion 211 guides the wafer 400.
In this embodiment, the cross-sectional shape of the end surface of the guide portion 211 is an ellipse, and the area of the top surface of the guide portion 211 is smaller than the area of the bottom surface; the auxiliary limiting columns 220 are conical, because the height of the guide parts 211 is higher than that of the auxiliary limiting columns 220, in the process of bearing the wafer 400, the guide parts 211 firstly contact the wafer 400 to primarily guide the wafer 400, and the primary guide realizes large-amplitude deviation correction until the wafer 400 contacts the auxiliary limiting columns 220, and the auxiliary limiting columns 220 perform secondary guide on the wafer 400, and the secondary guide realizes small-amplitude accurate positioning, namely the guide parts 211 of the main limiting columns 210 arranged in the middle can enable the wafer 400 to be roughly adjusted in the circumferential direction to realize rapid small-stress centering and deviation correction of the wafer 400, and then if the single main limiting column 210 is still adopted for guiding to enable the wafer 400 to fall to the bearing surface 231, the wafer still has the possibility of incomplete centering and deviation, therefore, the wafer 400 is guided secondarily by the auxiliary limiting columns 220 arranged at two sides of the main limiting columns 210 at intervals, the wafer 400 is guided at least doubled at each bearing piece 200 to enable the wafer 400 to be guided and finely adjusted in position, so that the small-amplitude accurate positioning and position adjustment of the wafer 400 are realized, and the alignment of the wafer 400 is further improved, and the wafer 400 is not easy to deviate; in addition, the cross-sectional shape of the end surface of the guide portion 211 is an ellipse, and the structural arrangement in which the area of the top surface of the guide portion 211 is smaller than the area of the bottom surface reduces the contact area with the wafer 400, so that the wafer 400 is not easily damaged.
In addition, the main limiting column 210 further includes a positioning portion 212, the positioning portion 212 is disposed on the receiving surface 231, and the guiding portion 211 is connected to one end of the positioning portion 212 departing from the receiving surface 231; when the wafer 400 is located at the center of the plurality of supporting members 200, the positioning portion 212 abuts against the sidewall of the wafer 400; the height of the positioning portion 212 is equal to the height of the secondary limiting column 220, so that a better stable supporting effect can be achieved, and the possibility of wafer movement of the wafer 400 is avoided.
In this embodiment, the cross-sectional shape of the end surface of the positioning portion 212 is an ellipse, the positioning portion 212 is coaxially connected to the guide portion 211, and the area of the top surface of the positioning portion 212 is equal to the area of the bottom surface of the guide portion 211. After the guiding portion 211 and the sub-limiting column 220 guide the wafer 400, the wafer 400 is supported on the bearing surface 231, and the positioning portion 212 limits the wafer 400 to prevent the wafer 400 from deviating; in addition, the positioning portion 212 is formed in an elliptical column shape, and thus the wafer 400 is not easily damaged.
The main retaining post 210 further includes a retaining portion 213, and the retaining portion 213 is disposed at the top end of the guiding portion 211 to retain the wafer 400.
In this embodiment, the cross-sectional shape of the end surface of the limiting portion 213 is an ellipse, the limiting portion 213 is coaxially connected to the guide portion 211, and the bottom surface area of the limiting portion 213 is equal to the top surface area of the guide portion 211.
The limiting portion 213 is disposed to increase the height of the main limiting column 210, so as to limit the wafer 400, and the wafer 400 is not easily separated from the supporting member 200 during the process of receiving the wafer 400.
In this embodiment, the cross-sectional shapes of the end surfaces of the main limit post 210 and the auxiliary limit post 220 are both set to be elliptical, and the elliptical cross-section can increase the contact area between the main limit post 210 and the auxiliary limit post 220 and the wafer 400 during the guiding process of the wafer 400, increase the effect of guiding adjustment, and further increase the supporting stability.
In other embodiments, referring to fig. 4, the cross-sectional shapes of the end surfaces of the primary restraint post 210 and the secondary restraint post 220 may also be circular.
In this embodiment, a connection line between the main limiting column 210 and the two sub-limiting columns 220 of each supporting member 200 near the wafer 400 is an arc line, and the arc line is overlapped with an edge line of the wafer 400.
The arc line has the same radian as the wafer 400, so that the wafer 400 can be better attached to the main limiting column 210 and the two side auxiliary limiting columns 220, and therefore, based on a guiding mode of three-point positioning of the main limiting column 210 and the two side auxiliary limiting columns 220 to a remote contact position, the small-range circumferential and vertical self-adjusting guiding of the wafer 400 can be better realized, and the positioning accuracy of the wafer 400 can be further improved. Meanwhile, the main restraint columns 210 and the left and right auxiliary restraint columns 220 support the wafer 400 at multiple points, so that the wafer 400 is supported more stably.
Further, the included angle between the centers of the two secondary limiting columns 220 and the line connecting the centers of the circle corresponding to the circular arc line is 1-10 °.
It should be noted that the included angle between the connection line between the centers of the two secondary restraint pillars 220 and the circle center corresponding to the arc line refers to the included angle between the two connection lines from the centers of the two secondary restraint pillars 220 to the circle center of the wafer 400 when the wafer 400 is supported on the receiving area 2311. The included angle is limited to 1-10 degrees, and within the angle range, the two auxiliary limiting columns 220 can have a better positioning effect on the wafer 400 by matching with the main limiting column 210; preferably, the included angle between the centers of the two secondary limiting columns 220 and the line connecting the centers of the circle corresponding to the arc line can also be 2-3 degrees, and the primary limiting column 210 and the secondary limiting columns 220 on the two sides can be better attached to the wafer 400, so that a better positioning effect is achieved. The included angle between the centers of the two secondary limiting columns 220 and the connecting line of the circle centers corresponding to the arc lines is too small, so that the effect of realizing small-amplitude accurate positioning by secondary guiding is not obvious; the included angle is too large, the position adjusting amplitude in the secondary guiding process is too large, the influence on the displacement of the wafer 400 is too large, and the accurate positioning effect is also obviously reduced.
In another embodiment, referring to fig. 5, the connection line between the main retaining post 210 and the two sub-retaining posts 220 in each of the supporting members 200 near one side of the wafer 400 is located on the same horizontal line. After the guiding portion 211 primarily guides the wafer 400, the two secondary restraint posts 220 perform secondary guiding until the wafer 400 is received on the receiving area 2311, so as to achieve an accurate positioning effect.
The present embodiment provides a semiconductor device for preventing wafer shift, which includes a reaction chamber (not shown), a wafer tray 300, a lifting driving device (not shown), a robot arm (not shown), and the wafer supporting apparatus 10, wherein the wafer tray 300 is disposed in the reaction chamber, and a plurality of openings 310 are formed on the wafer tray 300 for a plurality of supporting members 200 to pass through; the lifting driving device is disposed at the bottom of the reaction chamber, and is connected to the mounting plate 100 for driving the supporting member 200 to lift and lower to support the wafer 400.
Optionally, the lifting driving device is an air cylinder, an output end of the air cylinder is connected to the mounting plate 100 to drive the supporting member 200 to lift, and the wafer 400 is disposed in the wafer tray 300; the robot arm is used to grab the wafer 400 to be reacted and place it in the reaction chamber, or take the reacted wafer 400 out of the reaction chamber.
In the process that the mechanical arm grabs the wafer 400 to be reacted and places the wafer in the reaction chamber, the air cylinder drives the mounting plate 100 and the supporting piece 200 to ascend, and the supporting piece 200 penetrates through the corresponding opening 310; the wafer 400 to be reacted is placed on the plurality of supporting pieces 200 by the mechanical arm, the wafer 400 is located at the central position under the guiding action of the main limiting columns 210 and the auxiliary limiting columns 220, then the mounting plate 100 and the supporting pieces 200 are driven to descend by the air cylinders, the wafer 400 is received in the wafer tray 300 after the supporting pieces 200 are located below the open holes 310, and then the wafer 400 is reacted in the reaction chamber; after the reaction is finished, in the process that the robot arm takes the wafer 400 after the reaction out of the reaction chamber, the air cylinder drives the mounting plate 100 and the supporting members 200 to ascend, the supporting members 200 pass through the corresponding openings 310, the wafer 400 is supported by the plurality of supporting members 200, and then the robot arm extends into the gap between the wafer tray 300 and the wafer 400 to grab the wafer 400.
Optionally, the receiving surface 231 is elliptical; in the process that the supporting piece 200 is lifted and arranged in the corresponding opening 310, as the bearing surface 231 is set to be oval, the bearing part 230 is not easy to scratch the edge of the opening 310, and the damage to the supporting piece 200 is reduced.
In addition, a mounting part 240 is arranged on one side of the bearing part 230 far away from the bearing surface 231, the mounting part 240 is positioned at the center of the bearing part 230, and the cross-sectional area of the mounting part 240 is smaller than that of the bearing part 230; the mounting portion 240 is connected to the mounting plate 100, so that convenience in mounting can be improved.
Optionally, the mounting portion 240 may be in threaded or plug-in engagement with the mounting plate 100 to facilitate mounting and dismounting of the support member 200.
In summary, in the semiconductor device with the wafer supporting apparatus 10 according to the embodiments of the present invention, when the robot arm picks up the wafer 400 to be reacted and places the wafer in the reaction chamber, the cylinder drives the mounting plate 100 and the supporting member 200 to ascend, and the supporting member 200 passes through the corresponding opening 310; the mechanical arm places the wafer 400 to be reacted on the plurality of supporting pieces 200, the wafer 400 is guided by the guide part 211 in a large amplitude for the first time and then guided by the auxiliary guide posts in a small amplitude for the second time, so that the wafer 400 finally slides down to the central position, and the bearing areas 2311 of the plurality of bearing surfaces 231 bear the wafer 400; then the air cylinder drives the mounting plate 100 and the supporting member 200 to descend, after the supporting member 200 is located below the opening 310, the wafer 400 is received in the wafer tray 300, and then the wafer 400 reacts in the reaction chamber; after the reaction is finished, in the process that the mechanical arm takes the wafer 400 after the reaction out of the reaction chamber, the air cylinder drives the mounting plate 100 and the supporting pieces 200 to ascend, the supporting pieces 200 penetrate through the corresponding openings 310, the wafer 400 is supported by the plurality of supporting pieces 200, in the process that the wafer 400 is supported, the guide portion 211 and the auxiliary guide posts perform twice guiding, so that the wafer 400 is located at the central position, and then the mechanical arm extends into a gap between the wafer tray 300 and the wafer 400 to grab the wafer 400, so that the operation of taking the wafer 400 is finished.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A semiconductor device for preventing wafer displacement comprises a reaction chamber, a wafer tray, a lifting drive device, a mechanical arm and a wafer supporting device,
the wafer supporting device comprises an installation plate and a plurality of supporting pieces, wherein the plurality of supporting pieces are arranged along the circumferential direction of the installation plate;
the wafer tray is arranged in the reaction chamber, and a plurality of openings are formed in the wafer tray so that a plurality of supporting pieces can penetrate through the wafer tray;
the lifting driving device is arranged at the bottom of the reaction chamber, is connected with the mounting plate and is used for driving the supporting piece to lift so as to support the wafer;
each bearing piece comprises a main limiting column, an auxiliary limiting column and a bearing part, the bearing part is arranged on the mounting plate, the bearing part is provided with a bearing surface, the main limiting column and the auxiliary limiting column are arranged on the bearing surface, and the bearing surface is used for bearing a wafer;
the number of the main limiting columns of each supporting piece is one, the number of the auxiliary limiting columns comprises two, and the two auxiliary limiting columns are respectively positioned on two sides of the main limiting columns;
the main limiting column comprises a guide part and a positioning part, the height of the guide part is higher than that of the auxiliary limiting column, and the guide part initially guides the wafer to realize large-amplitude deviation correction;
the positioning part is arranged on the bearing surface, and the guide part is connected to one end of the positioning part, which is far away from the bearing surface;
when the wafer is positioned at the center of the plurality of supporting pieces, the positioning part is abutted with the side wall of the wafer;
the auxiliary limiting column is used for carrying out secondary guiding on the wafer to realize small-amplitude accurate positioning;
the main limiting column and the auxiliary limiting column are matched to guide the wafer twice, so that the wafer is located at the center of the plurality of supporting pieces.
2. The wafer displacement preventing semiconductor device according to claim 1, wherein the cross-sectional shape of the end face of the guide portion is an ellipse, and the area of the top face of the guide portion is smaller than the area of the bottom face; the auxiliary limiting column is conical.
3. The wafer displacement prevention semiconductor device according to claim 1, wherein the positioning part has a height equal to that of the secondary limit post; the cross-sectional shape of the end face of the positioning part is oval, the positioning part is coaxially connected with the guide part, and the area of the top surface of the positioning part is equal to that of the bottom surface of the guide part.
4. The wafer displacement prevention semiconductor device according to claim 1, wherein the main limiting column further comprises a limiting portion disposed at a top end of the guiding portion to limit the wafer.
5. The wafer displacement prevention semiconductor device according to claim 4, wherein the cross-sectional shape of the end face of the limiting portion is an ellipse, the limiting portion is coaxially connected with the guide portion, and the area of the bottom surface of the limiting portion is equal to the area of the top surface of the guide portion.
6. The wafer displacement preventing semiconductor device according to claim 1, wherein the connecting lines of the main limiting column and the two auxiliary limiting columns in each supporting member on the side close to the wafer are located on the same horizontal line.
7. The wafer displacement preventing semiconductor device according to claim 1, wherein a connecting line between the main limiting column and one side of the two auxiliary limiting columns close to the wafer of each supporting member is an arc line, and the arc line is overlapped with an edge line of the wafer.
8. The wafer displacement preventing semiconductor device according to claim 7, wherein an included angle between centers of the two secondary limiting columns and a line connecting centers of circle centers corresponding to the circular arc lines is 1 to 10 °.
9. The wafer displacement prevention semiconductor device according to claim 8, wherein an included angle between the centers of the two secondary limiting columns and a line connecting centers of circle centers corresponding to the circular arc lines is 2-3 °.
10. The wafer displacement prevention semiconductor device as claimed in claim 1, wherein the main limiting post and the sub limiting post have circular cross sections, and the receiving surface has an oval shape.
Priority Applications (1)
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| CN109686696A (en) * | 2018-12-27 | 2019-04-26 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | A kind of chuck assembly |
| CN109698156A (en) * | 2018-12-27 | 2019-04-30 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Square silicon wafer compatibility rotary-tray and silicon chip cleaning device |
| CN112786521A (en) * | 2019-11-08 | 2021-05-11 | 盛美半导体设备(上海)股份有限公司 | Static conductive substrate holding device |
| CN213212144U (en) * | 2020-10-14 | 2021-05-14 | 天津中环领先材料技术有限公司 | Device for measuring appearance of silicon wafer in ground cleaning machine |
| KR20220000890U (en) * | 2020-10-16 | 2022-04-25 | 사이언테크 코포레이션 | Substrate rotatable holding device |
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| CN109686696A (en) * | 2018-12-27 | 2019-04-26 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | A kind of chuck assembly |
| CN109698156A (en) * | 2018-12-27 | 2019-04-30 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Square silicon wafer compatibility rotary-tray and silicon chip cleaning device |
| CN112786521A (en) * | 2019-11-08 | 2021-05-11 | 盛美半导体设备(上海)股份有限公司 | Static conductive substrate holding device |
| CN213212144U (en) * | 2020-10-14 | 2021-05-14 | 天津中环领先材料技术有限公司 | Device for measuring appearance of silicon wafer in ground cleaning machine |
| KR20220000890U (en) * | 2020-10-16 | 2022-04-25 | 사이언테크 코포레이션 | Substrate rotatable holding device |
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Address after: 214000 Guanshan Road, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Wuxi Yiwen Microelectronics Technology Co.,Ltd. Address before: 214000 Guanshan Road, Xinwu District, Wuxi City, Jiangsu Province Patentee before: WUXI YIWEN ELECTRONIC TECHNOLOGY Co.,Ltd. |