CN107482082B - Silicon chip jacking comb tooth mechanism - Google Patents
Silicon chip jacking comb tooth mechanism Download PDFInfo
- Publication number
- CN107482082B CN107482082B CN201710602533.0A CN201710602533A CN107482082B CN 107482082 B CN107482082 B CN 107482082B CN 201710602533 A CN201710602533 A CN 201710602533A CN 107482082 B CN107482082 B CN 107482082B
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- China
- Prior art keywords
- comb
- silicon wafer
- jacking
- comb tooth
- groove
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 54
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 54
- 239000010703 silicon Substances 0.000 title claims abstract description 54
- 244000126211 Hericium coralloides Species 0.000 title claims abstract description 23
- 230000007246 mechanism Effects 0.000 title claims abstract description 17
- 239000010453 quartz Substances 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 210000004210 tooth component Anatomy 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 235000012431 wafers Nutrition 0.000 description 51
- 238000001179 sorption measurement Methods 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a silicon slice jacking comb tooth mechanism, which comprises: a comb assembly; and the lifting assembly is used for driving the comb tooth assembly to lift, wherein the comb tooth assembly comprises a supporting frame and comb teeth supported by the supporting frame, the comb teeth are provided with two groups of comb tooth sheets which are arranged in parallel at intervals, the comb teeth are formed by arranging a plurality of comb tooth sheets in a sequential and adjacent mode from left to right, the comb tooth sheets comprise a base part positioned at the bottom and an extension part fixedly connected with the base part, the thickness of the extension part is smaller than that of the base part, one side of the extension part, opposite to the base part, of the extension part is arranged in a biased mode, so that a yielding groove extending along the vertical direction is formed between two adjacent extension parts, and the top of the extension part is provided with a lifting groove extending along the vertical direction. According to the invention, the wafer taking efficiency of the wafer inserting sheet is improved, the breakage rate in the transferring process can be reduced by improving the uniformity of the supporting force of the wafer, the production efficiency is improved, and the production cost is reduced.
Description
Technical Field
The invention relates to the field of solar silicon wafer treatment, in particular to a silicon wafer jacking comb tooth mechanism.
Background
In the solar silicon wafer process treatment step, an inserting step is required to be carried out firstly, namely a plurality of silicon wafers are placed on a quartz boat at intervals, then the process treatment is carried out, and then the silicon wafers after the process treatment are taken out of the quartz boat (a wafer taking step) for subsequent process operation. In the prior art, a production mode operated manually is adopted, the production efficiency is limited to a certain extent, and meanwhile, silicon wafers are easily polluted and scratched to different degrees in the inserting and taking processes, so that the product quality is affected.
A batch of silicon wafer transfer devices are produced by accelerating the problems, and three grabbing modes are mainly utilized to grab silicon wafers, namely: clamping type, electromagnetic adsorption type, vacuum chuck type and the like, wherein, because the silicon wafer thickness is very thin, the material is more fragile, the clamping type is easy to cause the silicon wafer to be damaged, the electromagnetic adsorption type and the vacuum adsorption type are more complex in structure, the part processing difficulty is larger, the vacuum adsorption type is characterized in that the suction hole of the chuck is arranged at the center position of the chuck, gas can cause larger local impact on the silicon wafer in the moment of vacuum suction and inflation, in order to obtain enough adsorption force, the contact area of the chuck and the silicon wafer is often reduced, the formed vacuum adsorption cavity is concentrated at the center of the chuck, and thus the stress at the center of the silicon wafer is concentrated to cause the breakage of the silicon wafer. Based on the above technical problems, it is necessary to develop a new silicon wafer transfer mode.
In view of the foregoing, it is necessary to develop a silicon wafer lifting comb mechanism for solving the above problems.
Disclosure of Invention
Aiming at the defects existing in the prior art, the invention aims to provide the silicon wafer jacking comb tooth mechanism which can improve the wafer taking efficiency of the silicon wafer inserting sheets, reduce the breakage rate in the transferring process by improving the uniformity of the supporting force of the silicon wafer, improve the production efficiency and reduce the production cost.
To achieve the above objects and other advantages and in accordance with the purpose of the invention, there is provided a silicon wafer lifting comb tooth mechanism comprising:
a comb assembly; and
a jacking component for driving the comb tooth component to lift,
the comb teeth assembly comprises a supporting frame and comb teeth supported by the supporting frame, the comb teeth are provided with two groups of comb teeth and are arranged in parallel at intervals, the comb teeth are formed by a plurality of comb teeth in a sequential and adjacent mode from left to right, the comb teeth comprise a base part positioned at the bottom and an extension part fixedly connected with the base part, the thickness of the extension part is smaller than that of the base part, the extension part is arranged in a biased mode relative to one side of the base part, a yielding groove extending in the vertical direction is formed between two adjacent extension parts, and a jacking groove extending in the vertical direction is formed in the top of the extension part.
Preferably, the bottom of the jacking groove is provided with a placement inclined plane inclined towards the inner side of the comb teeth, and the included angle between the placement inclined plane and the horizontal plane is 30-60 degrees.
Preferably, the depth of the jacking groove is not greater than the depth of the relief groove.
Preferably, the thickness of the relief groove is not smaller than the thickness of the jacking groove.
Preferably, a guide inclined plane which gradually expands the top opening is arranged at the top opening of the jacking groove.
Preferably, the included angle between the guiding inclined plane and the vertical direction is 5-15 degrees.
Preferably, the jacking assembly comprises:
a fixing seat; and
a lifting part fixedly connected with the fixing seat,
the lifting part comprises a driver and a guide rail extending along the vertical direction, and the guide rail is matched with the support frame so that the support frame can slide up and down along the guide rail under the drive of the driver.
Preferably, a high position sensor and a low position sensor which are arranged along the height direction are arranged at the side of the guide rail.
Preferably, the bottom of the comb teeth is fitted with a mounting plate supported by the jacking assembly.
Compared with the prior art, the invention has the beneficial effects that:
the wafer taking efficiency of the wafer inserting sheets is improved, meanwhile, the damage rate of the wafer in the transferring process can be reduced by improving the uniformity of the supporting force of the wafer, the production efficiency is improved, and the production cost is reduced.
Drawings
FIG. 1 is a perspective view of a silicon wafer lifting comb tooth mechanism according to the invention;
fig. 2 is a front view of a silicon wafer lifting comb tooth mechanism according to the invention.
Detailed Description
The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses a device for practicing the invention. In the drawings, the shape and size may be exaggerated for clarity, and the same reference numerals will be used throughout the drawings to designate the same or similar components. In the description, relative terms such as "front," "rear," "upper," "lower," "top" and "bottom" and derivatives thereof should be construed to refer to the orientation as then described or as shown in the drawings under discussion. These relative terms are for convenience of description and are not generally intended to require a particular orientation. Terms (e.g., "connected" and "attached") referring to an attachment, coupling, etc., refer to a relationship wherein these structures are directly or indirectly secured or attached to one another through intervening structures, as well as both movable or rigid attachments or relationships, unless expressly described otherwise.
Referring to fig. 1 and 2, a silicon wafer lift-up comb tooth mechanism 1 includes:
a comb assembly; and
a jacking component for driving the comb tooth component to lift,
the comb assembly includes a support frame 13 and comb teeth 15 supported by the support frame 13, the comb teeth 15 are provided with two groups of comb teeth 15 and are arranged in parallel at intervals, the comb teeth 15 are formed by sequentially and closely arranging a plurality of comb teeth 151 from left to right, referring to a local amplifying region B in fig. 2B, the comb teeth 151 includes a base 1511 at the bottom and an extension part 1512 fixedly connected with the base 1511, the thickness of the extension part 1512 is smaller than that of the base 1511, the extension part 1512 is offset relative to one side of the base 1511, so that a yielding groove 152 extending along the vertical direction is formed between two adjacent extension parts 1512, and a jacking groove 1512a extending along the vertical direction is formed at the top of the extension part 1512.
Referring to fig. 1, the bottom of the lifting groove 1512a is provided with a seating slope inclined toward the inside of the comb teeth 15, and the included angle between the seating slope and the horizontal plane is 30 ° to 60 °. In a preferred embodiment, the angle between the mounting bevel and the horizontal plane is 45 °. By adopting the structure, the silicon wafer 2 can be inserted into the comb teeth 15 in a manner of inclining by a certain angle, and is stably clamped by the two groups of comb teeth 15 in the left-right direction, so that the silicon wafer 2 is prevented from generating larger shaking amplitude in the jacking process.
Referring to fig. 2, the depth of the lifting groove 1512a is not greater than the depth of the relief groove 152, and the thickness of the relief groove 152 is not less than the thickness of the lifting groove 1512a.
Referring to the enlarged area a in fig. 2a, a guide slope 1512b is provided at the top opening of the lifting groove 1512a so that the top opening is gradually widened, and an included angle between the guide slope 1512b and the vertical direction is 5 ° to 15 °. In a preferred embodiment, the angle between the guide ramp 1512b and vertical is 8 °.
Referring to fig. 1 and 2, the jacking assembly includes:
a fixed seat 11; and
a lifting part 12 fixedly connected with the fixed seat 11,
the jacking portion 12 comprises a driver and a guide rail extending along the vertical direction, and the guide rail is matched with the support frame 13 so that the support frame 13 can slide up and down along the guide rail under the drive of the driver.
Further, a high position sensor 122 and a low position sensor 121 are disposed at the sides of the guide rail along the height direction. The high position sensor 122 is used for sensing a position signal of the support frame 13 at the highest position, and the low position sensor 121 is used for sensing a position signal of the support frame 13 at the lowest position, so that the lifting height of the support frame 13 can be accurately controlled.
Referring again to fig. 1 and 2, the bottom of the comb 15 is fitted with a mounting plate 14, which mounting plate 14 is supported by the jacking assembly.
Working principle: because the space between the mounting grooves for placing the silicon wafers on the quartz boat is smaller, usually only 2-3 mm, the comb teeth 15 prepared according to the small distance are often poor in rigidity due to smaller thickness and longer height, and the comb teeth 15 are easy to deform or break in the transferring process, so that the space between the yielding grooves 152 in the comb teeth 15 and the space between the lifting grooves 1512a are both set to be twice of the space between the mounting grooves in the application, the thickness of the comb teeth 15 can be increased by two times, the overall rigidity and the structural strength of the comb teeth are increased, and the inserting/taking process of the silicon wafers on the quartz boat is completed by adopting two inserting/taking steps.
Specifically, assuming that the distance between adjacent silicon wafer mounting grooves on the quartz boat is H and the distance between adjacent abdication grooves 152/lifting grooves 1512a is H, there is h=2h, and when inserting the wafer, the quartz boat is placed right above the comb assembly, and the comb 15 is located at the lowest position.
Firstly, a first group of silicon wafers are placed in a jacking groove 1512a, the jacking assembly jacks up the comb teeth 15 together with the first group of silicon wafers and inserts the first group of silicon wafers into silicon wafer mounting grooves on a quartz boat, and at the moment, the silicon wafer mounting grooves with odd numbers/even numbers are filled with the first group of silicon wafers;
secondly, the comb teeth 15 descend to the lowest position again, the silicon wafer jacking comb tooth mechanism 1 or the quartz boat integrally translates to the left/right by the distance between two adjacent silicon wafer mounting grooves, namely translates to the distance h, a second group of silicon wafers are placed in the jacking groove 1512a, the jacking component jacks the comb teeth 15 together with the second group of silicon wafers into the silicon wafer mounting grooves on the quartz boat, at the moment, the silicon wafer mounting grooves with even number bits/odd number bits are filled by the second group of silicon wafers, and the first group of silicon wafers are accommodated in the abdicating groove 152;
finally, the comb teeth 15 descend to the lowest position to complete the step of inserting the silicon wafers on the single quartz boat, and the step of taking the silicon wafers is vice versa, and is not repeated here.
The number of equipment and the scale of processing described herein are intended to simplify the description of the present invention. Applications, modifications and variations of the present invention will be readily apparent to those skilled in the art.
Although embodiments of the present invention have been disclosed above, it is not limited to the details and embodiments shown and described, it is well suited to various fields of use for which the invention would be readily apparent to those skilled in the art, and accordingly, the invention is not limited to the specific details and illustrations shown and described herein, without departing from the general concepts defined in the claims and their equivalents.
Claims (6)
1. A silicon wafer lifting comb tooth mechanism (1), characterized by comprising:
a comb assembly; and
a jacking component for driving the comb tooth component to lift,
the comb tooth assembly comprises a supporting frame (13) and comb teeth (15) supported by the supporting frame (13), wherein the comb teeth (15) are provided with two groups and are arranged in parallel at intervals, the comb teeth (15) are formed by sequentially and closely arranging a plurality of comb tooth sheets (151) from left to right, the comb tooth sheets (151) comprise a base (1511) positioned at the bottom and an extension part (1512) fixedly connected with the base (1511), the thickness of the extension part (1512) is smaller than that of the base (1511), the extension part (1512) is offset relative to one side of the base (1511) so that a yielding groove (152) extending in the vertical direction is formed between two adjacent extension parts (1512), and the top of the extension part (1512) is provided with a jacking groove (1512 a) extending in the vertical direction;
the bottom of the jacking groove (1512 a) is provided with a placement inclined surface inclined towards the inner side of the comb teeth (15), and the included angle between the placement inclined surface and the horizontal plane is 30-60 degrees;
the depth of the jacking groove (1512 a) is not greater than the depth of the giving way groove (152);
the thickness of the relief groove (152) is not less than the thickness of the jacking groove (1512 a);
assuming that the distance between adjacent silicon wafer mounting grooves on the quartz boat is H, and the distance between adjacent yielding grooves (152) is H, h=2h exists, when inserting the sheet, the quartz boat is placed right above the comb teeth assembly, and the comb teeth (15) are located at the lowest position.
2. The silicon wafer lift-up comb mechanism (1) of claim 1, wherein a guide slope (1512 b) is provided at a top opening of the lift-up groove (1512 a) so that the top opening gradually expands outward.
3. The silicon wafer lift-up comb mechanism (1) of claim 2, wherein an angle between the guide slope (1512 b) and the vertical direction is 5 ° to 15 °.
4. The silicon wafer lift-up comb mechanism (1) of claim 1, wherein the lift-up assembly comprises:
a fixed seat (11); and
a jacking part (12) fixedly connected with the fixed seat (11),
the jacking part (12) comprises a driver and a guide rail extending along the vertical direction, and the guide rail is matched with the support frame (13) so that the support frame (13) can slide up and down along the guide rail under the drive of the driver.
5. The silicon wafer lifting comb tooth mechanism (1) according to claim 4, wherein a high-position sensor (122) and a low-position sensor (121) which are arranged along the height direction are arranged beside the guide rail.
6. Silicon wafer lifting comb mechanism (1) according to claim 1, characterized in that the bottom of the comb (15) is fitted with a mounting plate (14), which mounting plate (14) is supported by the lifting assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710602533.0A CN107482082B (en) | 2017-07-21 | 2017-07-21 | Silicon chip jacking comb tooth mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710602533.0A CN107482082B (en) | 2017-07-21 | 2017-07-21 | Silicon chip jacking comb tooth mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107482082A CN107482082A (en) | 2017-12-15 |
| CN107482082B true CN107482082B (en) | 2024-03-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710602533.0A Active CN107482082B (en) | 2017-07-21 | 2017-07-21 | Silicon chip jacking comb tooth mechanism |
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| Country | Link |
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| CN (1) | CN107482082B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109346429A (en) * | 2018-11-16 | 2019-02-15 | 罗博特科智能科技股份有限公司 | A kind of direct plugging-in silicon wafer inserted sheet slice getting device |
| CN110854237B (en) * | 2019-11-20 | 2021-04-20 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Sparse tooth bracket based on high-precision assembly and convenient to replace single tooth |
| CN110867407B (en) * | 2019-11-20 | 2023-04-18 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Method for manufacturing comb-shaped bracket of silicon wafer supporting mechanism in diffusion process basket |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10294356A (en) * | 1997-04-21 | 1998-11-04 | Kokusai Electric Co Ltd | Stage device for wafer cassette |
| CN106252266A (en) * | 2016-10-26 | 2016-12-21 | 河北晶龙阳光设备有限公司 | A kind of handler of solar battery sheet in loading and unloading quartz boat |
| CN206116440U (en) * | 2016-10-11 | 2017-04-19 | 河北晶龙阳光设备有限公司 | Solar wafer is unloader in automation of half interval quartz boat |
| CN207068899U (en) * | 2017-07-21 | 2018-03-02 | 罗博特科智能科技股份有限公司 | A kind of silicon chip jacking broach mechanism |
-
2017
- 2017-07-21 CN CN201710602533.0A patent/CN107482082B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10294356A (en) * | 1997-04-21 | 1998-11-04 | Kokusai Electric Co Ltd | Stage device for wafer cassette |
| CN206116440U (en) * | 2016-10-11 | 2017-04-19 | 河北晶龙阳光设备有限公司 | Solar wafer is unloader in automation of half interval quartz boat |
| CN106252266A (en) * | 2016-10-26 | 2016-12-21 | 河北晶龙阳光设备有限公司 | A kind of handler of solar battery sheet in loading and unloading quartz boat |
| CN207068899U (en) * | 2017-07-21 | 2018-03-02 | 罗博特科智能科技股份有限公司 | A kind of silicon chip jacking broach mechanism |
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| Publication number | Publication date |
|---|---|
| CN107482082A (en) | 2017-12-15 |
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