CN110854237B - Sparse tooth bracket based on high-precision assembly and convenient to replace single tooth - Google Patents
Sparse tooth bracket based on high-precision assembly and convenient to replace single tooth Download PDFInfo
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- CN110854237B CN110854237B CN201911143862.9A CN201911143862A CN110854237B CN 110854237 B CN110854237 B CN 110854237B CN 201911143862 A CN201911143862 A CN 201911143862A CN 110854237 B CN110854237 B CN 110854237B
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- tooth
- supporting
- shaped
- strip
- bottom frame
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 85
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 84
- 239000010703 silicon Substances 0.000 claims abstract description 84
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 230000007246 mechanism Effects 0.000 abstract description 28
- 239000010453 quartz Substances 0.000 description 66
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 66
- 235000012431 wafers Nutrition 0.000 description 54
- 238000009792 diffusion process Methods 0.000 description 14
- 210000003781 tooth socket Anatomy 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000002253 acid Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000010432 diamond Substances 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 241000252254 Catostomidae Species 0.000 description 2
- 244000126211 Hericium coralloides Species 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000009194 climbing Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 206010024796 Logorrhoea Diseases 0.000 description 1
- HIVGXUNKSAJJDN-UHFFFAOYSA-N [Si].[P] Chemical compound [Si].[P] HIVGXUNKSAJJDN-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 230000036544 posture Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a thinning gear bracket convenient for single-tooth replacement and based on high-precision assembly, which solves the problems that the damage of individual supporting teeth of the existing mechanism requires the whole replacement of the bracket and the assembly precision of the bracket is low. The silicon wafer inserting device is characterized in that long-strip-shaped grooves (17) are formed in the middle upper portion of the front side face of a carrier tooth bottom frame plate (16) at equal intervals along the vertical direction, threaded counter bores (18) are formed in the front side face of the carrier tooth bottom frame plate (16) below the long-strip-shaped grooves (17), a silicon wafer inserting U-shaped groove (20) is formed in the top end of each long-strip-shaped carrier tooth (19), top thread holes (25) for fixing the long-strip-shaped carrier teeth are formed in the upper portion of a carrier tooth fixing cover plate (23) at equal intervals, the lower ends of the long-strip-shaped carrier teeth (19) are movably inserted into the long-strip-shaped grooves (17) in the carrier tooth bottom frame plate (16), and the carrier tooth fixing cover plate. The replacement is convenient when a single tooth of the supporting tooth is damaged.
Description
Technical Field
The invention relates to solar cell production equipment, in particular to a sparse tooth bracket which is used for jacking grouped silicon wafers in a quartz boat in a diffusion and junction making process and is convenient for single-tooth replacement and based on high-precision assembly.
Background
The production process of the solar cell can be roughly summarized as follows: silicon chip detection, surface texturing and acid washing, diffusion knot making, phosphorus silicon glass removal, plasma etching and acid washing, antireflection film plating, screen printing and rapid sintering; the silicon wafer which is subjected to the surface texturing and acid washing process is transferred into a quartz boat from a diffusion process basket tool, and then the quartz boat loaded with the silicon wafer is transferred into a sintering furnace to perform diffusion and junction making on the silicon wafer; the operation of transferring the silicon wafer from the diffusion process basket to the quartz boat is completed by a quartz boat loading machine; the quartz boat loading machine is provided with a quartz boat conveying rail and a diffusion process basket conveying rail respectively, the quartz boat conveying rail is provided with a quartz boat, the diffusion process basket is arranged on the diffusion process basket conveying rail, a sucking disc mechanism for grabbing and transferring silicon wafers is arranged above the two rails, every 100 silicon wafers after surface texturing and acid pickling are in one group and are flatly placed in the diffusion process basket, the diffusion process basket with the horizontally placed silicon wafers is conveyed to a feeding platform of the quartz boat loading machine, and then the quartz boat is conveyed to a position right below the sucking disc mechanism; firstly, to accomplish the action of snatching of silicon chip, be provided with silicon chip under sucking disc mechanism and hold up the mechanism, hold up the task of mechanism and hold up the silicon chip in the basket utensil, make it break away from the basket utensil to make things convenient for the sucking disc to snatch, concrete process is: the bracket penetrates through the bottom end of the basket to be lifted upwards from the bottom of the basket, a group of 50 silicon wafers in the basket are lifted upwards and lifted from the basket, the sucker is downwards stretched to suck and grab the 50 silicon wafers, the sucker mechanism sucking the 50 silicon wafers drives the grabbed silicon wafers to convey the silicon wafers to the upper part of the quartz boat, in the conveying process, the sucker rotates 45 degrees to enable the grabbed silicon wafers to be changed into postures and be in a diamond arrangement state, when the sucker mechanism grabbing the silicon wafers moves to the position right above the quartz boat, the bracket of the jacking mechanism below the quartz boat penetrates through the bottom of the quartz boat to be lifted from the quartz boat, the top end of the bracket of the jacking mechanism is provided with a group of supporting teeth, the sucker downwards places the rotated 50 silicon wafers on the group of supporting teeth, at the moment, the silicon wafers are still in a diamond arrangement state on the supporting teeth, the jacking mechanism of the silicon wafers is descended, then the group of silicon wafers are transferred to the quartz boat in a diamond arrangement state, and the wafer loading, the quartz boat filled with the silicon wafers is transferred into a diffusion furnace to perform a diffusion bonding process.
The existing quartz boat is structurally composed of two end plates and 4 connecting rods, wherein two silicon wafer bottom supporting rods are arranged between the bottoms of the two end plates at intervals, two sides of the two end plates are respectively provided with a silicon wafer limiting rod, and tooth sockets with constant intervals are arranged on the silicon wafer limiting rods; silicon chip climbing mechanism sets up under the quartz boat, and current climbing mechanism's structure is: the silicon chip lifting device is characterized in that two supporting plates are arranged on the jacking frame base in parallel, a sparse toothed bracket is arranged on the top end of each supporting plate, the jacking frame base is connected with a lead screw lifting driving mechanism together, the lifting of the jacking frame base is realized through a lead screw driving motor, the sparse toothed bracket above the supporting plates is lifted upwards from a gap between two silicon chip bottom supporting rods at the bottom in a quartz boat, a sucking disc is waited to place a silicon chip after being lifted, the sucking disc conveys the silicon chip in a basket tool to be right above the quartz boat, the sucking disc descends to place the silicon chip on the sparse toothed bracket above the lifted supporting plates, the lead screw driving motor drives the jacking mechanism to descend, the silicon chip is transferred to two tooth socket limiting rods with constant intervals on the quartz boat, and therefore the silicon chip is transferred from the basket tool to the quartz boat.
The silicon wafers required to enter the diffusion furnace and the silicon wafers processed in the diffusion furnace are transferred and conveyed through the quartz boat, in the process of conveying the silicon wafers between the sucking disc and the quartz boat, every two square silicon wafers are overlapped and placed in one tooth socket of the quartz boat, every 100 tooth sockets form a group, a silicon wafer jacking mechanism is arranged right below the quartz boat and used for jacking the silicon wafers in the quartz boat in groups to finish the conveying of the silicon wafers from the quartz boat to the silicon wafer supporting tooth sockets on the jacking mechanism, and 2 silicon wafers are arranged in each supporting tooth socket so as to meet the requirement of sucking and conveying by the sucking disc above; because the distance between the tooth sockets in the quartz boat is constant and the precision is very high, 100 silicon wafers are stably supported at the same time, and the silicon wafers at two ends are not influenced when the silicon wafers are supported and grabbed by the suckers, the distance between the tooth sockets on the assembled jacking frame is required to be matched with the distance between the tooth sockets in the quartz boat and is long and thin enough, so that the silicon wafers supported in the jacking mechanism are higher than the silicon wafers stored in the quartz boat, and an operating space is provided for grabbing of the suckers above the silicon wafers; therefore, when the jacking frame supporting tooth is manufactured, strict requirements are placed on the selection of a single supporting tooth material, the material must have enough hardness and good processing performance, the existing structure is generally manufactured by using 99 porcelain, and the material has the advantages of small processing deformation and high hardness, but has the defects of high manufacturing cost and frangibility; the middle single supporting tooth of the existing jacking mechanism is 2.38 mm thick, 10 mm wide and 190 mm long, the upper end of the supporting tooth is milled with a plane with 0.6 mm deep and 45 mm long, and the top is provided with an 11.42-degree chamfer; the left side surface of the single supporting tooth is 1 mm thick, 190 mm long and 10 mm wide, and the top of the single supporting tooth is provided with a 5.72-degree chamfer; the thickness of a single supporting tooth on the right side surface is 1.6 mm, the width is 10 mm, the length is 190 mm, and the upper end of the supporting tooth is subjected to turn milling on a plane with the depth of 0.6 mm and the length of 45 mm; the existing jacking mechanism is formed by overlapping and assembling 1 left supporting tooth, 99 middle supporting teeth and 1 right supporting tooth, two through holes with the diameter of 6.5 mm are usually processed at the bottom of each supporting tooth, a shaft penetrates through the middle of 101 supporting teeth, and the supporting teeth are fixed at two ends in a mode of aluminum plate clamping and screw fastening; the assembly process is complex, the technical requirement on an assembler is high, the side surface of the assembled support tooth is lack of a reference surface, and due to the installation of the through hole with the diameter of 6.5, the support tooth is easy to topple left and right, be uneven and the like, so that the insertion and the taking of the silicon wafer are influenced; due to the adoption of the mode of clamping screws at two ends of the bottom, opening of the supporting teeth is easy to occur at the top of the supporting tooth after the supporting teeth are overlapped and installed, the gap between the supporting teeth is difficult to guarantee, staggered teeth, inserting breakage and other conditions are easy to occur when a silicon wafer is lifted, the gaps are not uniform and easy, and the sucking disc is easy to leak and suck; through the mode that whole root major axis runs through the installation of support tooth, when supporting single the emergence of tooth and damaging, need a whole set of dismantlement, there is the problem that the change time is long and the change degree of difficulty is big.
Disclosure of Invention
The invention provides a thinning gear bracket convenient for single-tooth replacement and based on high-precision assembly, and solves the technical problems that the damage of individual supporting teeth of the existing mechanism requires the whole replacement of the bracket and the assembly precision of the bracket is low.
The invention solves the technical problems by the following technical scheme:
a jacking mechanism of a quartz boat silicon wafer comprises a screw rod supporting frame and a quartz boat mounting frame, wherein the screw rod supporting frame is arranged under the quartz boat mounting frame, a screw rod guide rail mounting plate arranged along the vertical direction is arranged on the screw rod supporting frame, a pair of screw rod supporting seats and a slide block guide rail are arranged on the screw rod guide rail mounting plate, a screw rod arranged along the vertical direction is arranged on the screw rod supporting seats, a screw rod driving motor is arranged on the screw rod supporting frame, an output shaft of the screw rod driving motor is connected with the screw rod through a coupler, a screw rod nut is arranged on the screw rod, a slide block is connected on the left side surface of the screw rod nut and arranged on the slide block guide rail, a connecting transition plate is arranged on the right side surface of the screw rod nut, a jacking frame bottom plate is arranged on the connecting transition plate, and two vertical plates are arranged on the jacking, the top end of each vertical plate is provided with a comb-shaped bracket; be provided with the quartz boat on quartz boat mounting bracket, be provided with rectangular gap on the quartz boat mounting bracket of quartz boat below, set up in the quartz boat top after two comb teeth form brackets pass rectangular gap and the quartz boat on the quartz boat mounting bracket in proper order, be provided with the silicon chip between two comb teeth form brackets.
The comb-shaped bracket of the sparse tooth bracket based on high-precision assembly and convenient for single-tooth replacement is formed by combining a supporting tooth bottom frame plate, long-strip-shaped supporting teeth and a supporting tooth fixing cover plate, wherein long-strip-shaped grooves are formed in the middle upper part on the front side surface of the supporting tooth bottom frame plate at equal intervals along the vertical direction, openings are formed in the top ends of the long-strip-shaped grooves, threaded counter bores are formed in the front side surface of the supporting tooth bottom frame plate below the long-strip-shaped grooves, silicon wafers are arranged at the top ends of the long-strip-shaped supporting teeth and inserted into U-shaped grooves, top thread holes for fixing the long-strip-shaped supporting teeth are formed in the upper part of the supporting tooth fixing cover plate at equal intervals; the lower end of the long strip-shaped supporting tooth is movably inserted into the long strip-shaped groove on the supporting tooth bottom frame plate, the supporting tooth fixing cover plate is abutted to the front side face of the supporting tooth bottom frame plate, and the connecting bolt penetrates through the through hole from the connecting bolt and then is in threaded connection with a threaded counter bore arranged on the front side face of the supporting tooth bottom frame plate.
A 45-degree inclined plane is arranged at the bottom of the U-shaped groove where the silicon chip arranged at the top end of the strip-shaped support tooth is inserted; a jackscrew is arranged in the jackscrew hole; the top ends of the strip-shaped supporting teeth, inserted into the two sides of the U-shaped groove, of the silicon wafer are provided with conical tops, and the vertex angles of the conical tops are 10.2 degrees.
The quartz boat silicon wafer jacking mechanism convenient for single-tooth replacement and based on high-precision assembly has the advantages of simple structure, convenience in processing and installation, high precision of the assembled supporting teeth, good uniformity and convenience in replacement when a single supporting tooth is damaged, and effectively solves the problems of complex manufacturing and installation, low assembly precision and difficulty in replacement of the existing jacking mechanism.
Drawings
Fig. 1 is a schematic structural view of a comb-shaped carrier 11 of the present invention;
fig. 2 is a schematic view of the construction of the denture base plate 16 of the present invention;
fig. 3 is a schematic structural view of the elongated carrier tooth 19 of the present invention;
fig. 4 is a schematic structural view of the denture fixing cover plate 23 of the present invention;
FIG. 5 is a schematic structural diagram of a jacking mechanism for a quartz boat according to the present invention;
fig. 6 is a schematic structural view of the jacking frame bottom plate 9 and components thereon of the invention.
Detailed Description
The invention is described in detail below with reference to the accompanying drawings:
a jacking mechanism of a quartz boat silicon wafer comprises a screw rod supporting frame 1 and a quartz boat mounting frame 13, wherein the screw rod supporting frame 1 is arranged under the quartz boat mounting frame 13, a screw rod guide rail mounting plate 2 arranged along the vertical direction is arranged on the screw rod supporting frame 1, a pair of screw rod supporting seats 4 and a slider guide rail 3 are arranged on the screw rod guide rail mounting plate 2, a screw rod 5 arranged along the vertical direction is arranged on the screw rod supporting seats 4, a screw rod driving motor 6 is arranged on the screw rod supporting frame 1, an output shaft of the screw rod driving motor 6 is connected with the screw rod 5 through a coupler, a screw rod nut is arranged on the screw rod 5, a slider 7 is connected on the left side surface of the screw rod nut, the slider 7 is arranged on the slider guide rail 3, a connecting transition plate 8 is arranged on the right side surface of the screw rod nut, a jacking frame bottom plate 9 is arranged on the, two vertical plates 10 are arranged on the bottom plate 9 of the jacking frame at intervals in parallel, and the top end of each vertical plate 10 is provided with a comb-shaped bracket 11; a quartz boat 15 is arranged on the quartz boat mounting frame 13, a long strip gap 14 is arranged on the quartz boat mounting frame 13 below the quartz boat 15, two comb-shaped brackets 11 sequentially penetrate through the long strip gap 14 on the quartz boat mounting frame 13 and the quartz boat 15 and then are arranged above the quartz boat 15, and a silicon wafer 12 is arranged between the two comb-shaped brackets 11; the screw driving motor 6 drives the screw 5 to rotate forwards and reversely to realize the lifting or descending of the bottom plate 9 of the jacking frame, the comb-shaped bracket 11 on the bottom plate 9 of the jacking frame receives the silicon wafer on the sucking disc above the comb-shaped bracket, then the jacking frame descends, and then the received silicon wafer is transferred to the quartz boat, so that the silicon wafer is conveyed from the sucking disc to the quartz boat; when the silicon chip is required to be conveyed from the quartz boat to the sucker, the quartz boat carrying the silicon chip can be moved to the position above the jacking mechanism, the jacking mechanism is driven by the screw rod driving motor, the comb-shaped bracket 11 penetrates through the strip gap 14 on the quartz boat mounting frame 13 from bottom to top and enters the quartz boat, the silicon chip in the quartz boat is jacked to the silicon chip arranged at the top end of the strip-shaped support tooth 19 to be inserted into the U-shaped groove 20, the comb-shaped bracket 11 continues to rise upwards, the silicon chip is separated from the quartz boat until the silicon chip reaches the position right above the quartz boat to stop, and after the sucker above the silicon chip is jacked downwards, the silicon chip on the comb-shaped bracket 11 is grabbe.
The comb-shaped bracket 11 of the sparse tooth bracket based on high-precision assembly and convenient for single-tooth replacement is formed by combining a bracket bottom plate 16, a long strip-shaped bracket tooth 19 and a bracket tooth fixing cover plate 23, wherein long strip-shaped grooves 17 are formed in the middle upper part on the front side surface of the bracket bottom plate 16 at equal intervals along the vertical direction, openings 27 are formed in the top ends of the long strip-shaped grooves 17, threaded counter bores 18 are formed in the front side surface of the bracket bottom plate 16 below the long strip-shaped grooves 17, silicon wafer inserting U-shaped grooves 20 are formed in the top ends of the long strip-shaped bracket tooth 19, top thread holes 25 for fixing the long strip-shaped bracket tooth are formed in the upper part of the bracket tooth fixing cover plate 23 at equal intervals, and connecting bolts are arranged in the lower part of the bracket tooth fixing cover; the lower end of the long strip-shaped supporting tooth 19 is movably inserted into the long strip-shaped groove 17 on the supporting tooth bottom frame plate 16, the supporting tooth fixing cover plate 23 is abutted against the front side surface of the supporting tooth bottom frame plate 16, and a connecting bolt penetrates through a through hole 24 from the connecting bolt and then is screwed with a threaded counter bore 18 arranged on the front side surface of the supporting tooth bottom frame plate 16; this kind of modular comb-tooth bracket 11 facilitates the processing, and the machining precision is high, has guaranteed the precision in the clearance of holding in the palm the tooth, is difficult to take place the condition of wrong tooth and inserting garrulous silicon chip during jacking silicon chip, and this structure has still guaranteed when a set of silicon chip in the comb-tooth bracket 11 jacking quartz boat, can not influence other silicon chips in the quartz boat of neighbouring.
A 45-degree inclined plane 21 is arranged at the bottom of the silicon chip inserting U-shaped groove 20 arranged at the top end of the strip-shaped support tooth 19; a jackscrew 26 is arranged in the jackscrew hole 25; the top ends of the strip-shaped supporting teeth 19, inserted into the two sides of the U-shaped groove 20, of the silicon wafer are provided with conical apexes 22, and the vertex angles of the conical apexes 22 are 10.2 degrees; the conical tip 22 is arranged to provide a guiding function for inserting the silicon wafer into the U-shaped groove 20, and the bottom of the groove is provided with a 45-degree inclined surface 21 so that the silicon wafer can still keep an inclined diamond-shaped placing state after being transferred onto the comb-shaped bracket 11; when a certain strip-shaped support tooth 19 on the comb-shaped bracket 11 is damaged, the damaged strip-shaped support tooth 19 can be taken out for replacement only by loosening the corresponding jackscrew 26 jacked at the root of the strip-shaped support tooth, and the whole comb-shaped bracket 11 does not need to be scrapped, so that the cost of maintaining accessories is greatly reduced.
Claims (2)
1. A thinning gear bracket convenient for single-tooth replacement and based on high-precision assembly comprises a supporting gear bottom frame plate (16), long strip-shaped supporting teeth (19) and a supporting tooth fixing cover plate (23), and is characterized in that long strip-shaped grooves (17) are formed in the middle upper portion of the front side surface of the supporting gear bottom frame plate (16) at equal intervals along the vertical direction, openings (27) are formed in the top ends of the long strip-shaped grooves (17), threaded counter bores (18) are formed in the front side surface of the supporting gear bottom frame plate (16) below the long strip-shaped grooves (17), silicon wafer inserting U-shaped grooves (20) are formed in the top ends of the long strip-shaped supporting teeth (19), top thread holes (25) for fixing the long strip-shaped supporting teeth are formed in the upper portion of the supporting tooth fixing cover plate (23) at equal intervals, and connecting bolts are arranged on the lower portion of the supporting tooth fixing cover; the lower end of a long strip-shaped supporting tooth (19) is movably inserted into a long strip-shaped groove (17) on a supporting tooth bottom frame plate (16), a supporting tooth fixing cover plate (23) is abutted to the front side surface of the supporting tooth bottom frame plate (16), a connecting bolt penetrates through a through hole (24) from the connecting bolt and then is in threaded connection with a threaded counter bore (18) arranged on the front side surface of the supporting tooth bottom frame plate (16), and a top thread (26) is arranged in a top thread hole (25).
2. The thinning tooth bracket based on high precision assembly for facilitating single tooth replacement according to claim 1, characterized in that the bottom of the silicon chip insertion U-shaped groove (20) provided at the top end of the elongated carrier tooth (19) is provided with a 45 degree inclined surface (21); the top ends of the strip-shaped supporting teeth (19) of the two sides of the silicon chip inserted into the U-shaped groove (20) are provided with conical apexes (22), and the vertex angles of the conical apexes (22) are 10.2 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911143862.9A CN110854237B (en) | 2019-11-20 | 2019-11-20 | Sparse tooth bracket based on high-precision assembly and convenient to replace single tooth |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911143862.9A CN110854237B (en) | 2019-11-20 | 2019-11-20 | Sparse tooth bracket based on high-precision assembly and convenient to replace single tooth |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110854237A CN110854237A (en) | 2020-02-28 |
| CN110854237B true CN110854237B (en) | 2021-04-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911143862.9A Active CN110854237B (en) | 2019-11-20 | 2019-11-20 | Sparse tooth bracket based on high-precision assembly and convenient to replace single tooth |
Country Status (1)
| Country | Link |
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| CN (1) | CN110854237B (en) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2248478Y (en) * | 1995-11-23 | 1997-03-05 | 李永民 | Hair comb with moveable teeth |
| DE202007012384U1 (en) * | 2007-08-31 | 2007-11-22 | Jonas & Redmann Automationstechnik Gmbh | Comb-type holder of a holding device for disk-like substrates such as solar cell wafers |
| CN104538328B (en) * | 2014-11-26 | 2018-01-02 | 北京七星华创电子股份有限公司 | A kind of silicon chip vacuum suction machinery hand |
| CN205321561U (en) * | 2015-11-24 | 2016-06-22 | 重庆谭木匠工艺品有限公司 | Detachable combination gear shaping comb |
| CN206317001U (en) * | 2016-12-19 | 2017-07-11 | 江苏超力散热器有限公司 | A kind of applicable quick construction of remodeling of radiator core body assembling |
| CN107481964B (en) * | 2017-07-18 | 2023-08-25 | 罗博特科智能科技股份有限公司 | Silicon wafer batch sucking device |
| CN107482082B (en) * | 2017-07-21 | 2024-03-15 | 罗博特科智能科技股份有限公司 | Silicon chip jacking comb tooth mechanism |
| CN207458913U (en) * | 2017-09-30 | 2018-06-05 | 河北晶龙阳光设备有限公司 | A kind of comb tablet |
| CN208385434U (en) * | 2018-07-16 | 2019-01-15 | 苏州映真智能科技有限公司 | A kind of top flat mechanism for the taking-up silicon wafer from the gaily decorated basket |
| CN209071294U (en) * | 2018-11-16 | 2019-07-05 | 罗博特科智能科技股份有限公司 | A kind of direct plugging-in silicon wafer inserted sheet slice getting device |
-
2019
- 2019-11-20 CN CN201911143862.9A patent/CN110854237B/en active Active
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| CN110854237A (en) | 2020-02-28 |
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