TWM599391U - Probe head assembly with shielding function - Google Patents

Abstract

A probe head assembly with shielding function is provided. The probe head assembly includes a printed circuit board, a plurality of probes, and a supporting base. Each of the plurality of probes includes an upper end electrically connected to the printed circuit board. The supporting base is used to fix the plurality of probes. The supporting base plate includes a guide plate, a spacer, and at least one shielding unit. The spacer is in the guide plate and is used for positioning the plurality of probes. The at least one shielding unit is disposed between the guide plate and the spacer and completely cover the guide plate.

Description

Probe head assembly with shielding function

The present invention relates to a probe head assembly; in detail, it relates to a probe head assembly with shielding function.

As the performance of integrated circuits (IC) develops towards high frequency and high speed, the wafer test frequency also increases. Therefore, when conducting wafer-level high-frequency testing, it is necessary to pay more attention to the interference of external electromagnetic waves.

In the prior art, the vertical probe head assembly is applied to the connection between the test equipment interface and the wafer contact pad and the space conversion device. The composition of the vertical probe head assembly can be divided into a plurality of probes and a plurality of probes for maintaining and positioning. The bearing base of the probe, and the objects arranged in the middle of the bearing base are called spacers.

Under the conventional structure, the height-enhanced component is made of metal material, which itself has the function of shielding electromagnetic waves, and the supporting base is made of insulating material, and is usually a material that does not have the function of shielding electromagnetic waves.

In the high-frequency test of the wafer, it is very likely that the external electromagnetic wave penetrates the material without shielding function, which will affect the high-frequency characteristics of the wafer test, cause the misjudgment of the wafer test or affect the function of the IC component. Even worse, it may cause damage to the IC.

In view of this, how to provide a probe head assembly that can shield the probe from the influence of external electromagnetic waves, so as to avoid misjudgment of wafer testing, affect the function of IC components, and cause damage to the IC. Problems that need to be solved urgently in the industry.

One purpose of the present invention is to provide a probe head assembly with shielding function. When it is used for wafer testing, a shielding element of the probe head assembly can shield the influence of external electromagnetic waves on the probe, thereby avoiding the wafer Circumstances such as misjudgment of the test, affecting the function of the IC component, and causing damage to the IC.

To achieve the above purpose, a probe head assembly with shielding function disclosed in the present invention includes a printed circuit board, a plurality of probes and a carrying base. Each of the plural probes has an upper end that is electrically connected to the printed circuit board. The bearing base is used to fix a plurality of probes. Wherein, the bearing base includes a guide plate, a height component and at least one shielding element. The height component is arranged in the guide plate and used for positioning the plural probes. At least one shielding element is sandwiched between the guide plate and the cushion component and covers the guide plate.

In the probe head assembly with shielding function of the present invention, the guide plate includes an upper guide plate and a lower guide plate.

In the probe head assembly with shielding function of the present invention, at least one shielding element is sandwiched between the upper guide plate and the elevated component, or between the elevated component and the lower guide plate.

In the probe head assembly with shielding function of the present invention, at least one shielding element is two shielding elements, and the two shielding elements are respectively clamped between the upper guide plate and the elevated component and between the elevated component and the lower guide plate .

In the probe head assembly with shielding function of the present invention, at least one shielding element is arranged between the guide plate and the raised assembly by attaching or locking.

In the probe head assembly with shielding function of the present invention, the thickness of at least one shielding element is less than a quarter of the thickness of the guide plate.

In the probe head assembly with shielding function of the present invention, at least one shielding element is a metal gasket, and the metal gasket is made of metals such as aluminum, nickel, and copper.

In the probe head assembly with shielding function of the present invention, at least one shielding element is composed of a metal layer coated with a soft plastic, and the metal layer is coated on the soft plastic by sputtering, evaporation or electroless plating. Plastic outside.

In the probe head assembly with shielding function of the present invention, the metal layer is made of metals such as aluminum, nickel, copper, silver, and gold.

In the probe head assembly with shielding function of the present invention, at least one shielding element is a gasket formed of a material with wave-absorbing properties.

The present invention relates to a probe head assembly with shielding function, which is used to solve the problem that when the wafer is in high-frequency test in the prior art, external electromagnetic waves may penetrate the carrier base and affect the probe, thereby causing misjudgment of the wafer test. Issues affecting the function of IC components and causing damage to the IC.

In the drawings, FIG. 1 is a schematic cross-sectional view of the new probe head assembly with shielding function in the first embodiment, and FIG. 2 is a cross-sectional view of the new probe head assembly with shielding function in the second embodiment Schematic.

In detail, as shown in the first embodiment of FIG. 1, the probe head assembly 100 with shielding function disclosed in the present invention includes a printed circuit board 200, a plurality of probes 300 and a supporting base 400. The probe head assembly 100 with shielding function disclosed in the present invention can be used in fields such as wafer testing, probe head devices, or high-frequency signal transmission.

Each probe 300 has an upper end 310 that is electrically connected to the printed circuit board 200, and is electrically connected to a wafer 500 to be tested through the lower end 320. The supporting base 400 is used for fixing the plurality of probes 300.

Wherein, the supporting base 400 includes a guide plate 410, a bumper component 420 and at least one shielding element 430. The bumper component 420 is disposed in the guide plate 410, and the guide plate 410 is used to position the plurality of probes 300. At least one shielding element 430 is sandwiched between the guide plate 410 and the pad component 420 and completely covers the guide plate 410.

In the first embodiment as shown in FIG. 1, the guide plate 410 includes an upper guide plate 412 and a lower guide plate 414, and at least one shielding element 430 has two shielding elements 430. In this way, the two shielding elements 430 can be sandwiched between the upper guide plate 412 and the elevated component 420, and between the elevated component 420 and the lower guide plate 414, respectively.

In conclusion, when the probe head assembly 100 is performing a high-frequency test of a wafer 500, if there is an electromagnetic wave 600 in the external environment, it is sandwiched between the upper guide plate 412 and the elevated assembly 420, and sandwiched between The two shielding elements 430 between the raised component 420 and the lower guide plate 414 can block the electromagnetic wave 600 from entering the inner side of the raised component 420 and prevent the electromagnetic wave 600 from affecting the probe 300 arranged in the raised component 420.

Those with ordinary knowledge in the art can also adjust the number and placement of the shielding elements 430. For example, it is possible to measure the position of the electromagnetic wave 600 that may appear (for example, the electromagnetic wave 600 will appear at the upper guide plate 412, or the electromagnetic wave 600 will appear at the lower guide plate 414), and only a single shielding element 430 is sandwiched between the upper guide plate. Between the plate 412 and the raised component 420, or only a single shielding element 430 is sandwiched between the raised component 420 and the lower guide plate 414, it can also have the effect of shielding external electromagnetic waves compared with the prior art.

In the creation of the present invention, the shielding element 430 is sandwiched between the guide plate 410 and the elevated component 420 by attaching or locking, but this is not a limitation.

Since the shielding element 430 is sandwiched between the guide plate 410 and the raised component 420 by attaching or locking, the user does not need to significantly change the original structure of the probe head component when installing. In addition, the shielding element 430 can be independently manufactured without affecting the manufacturing of the existing probe head assembly, and the feasibility is high. In addition, clamping the shielding element 430 through attachment or locking does not affect the operating characteristics of the original probe head assembly, and this design will reduce the risk of abnormal testing or IC damage.

In a preferred embodiment of the invention, the thickness of the shielding element 430 is less than a quarter of the thickness of the guide plate 410.

In the first embodiment shown in FIG. 1, the shielding element 430 is a metal gasket, and the metal gasket is made of metals such as aluminum, nickel, and copper, so as to reflect the electromagnetic wave 600 to achieve the effect of shielding the electromagnetic wave 600.

It should be noted that, in the first embodiment, the shielding element 430 may also have a state in which a metal layer is coated with a soft plastic. Wherein, the metal layer can be coated on the outer side of the soft plastic by sputtering, evaporation, or chemical plating, and the metal layer is made of metals such as aluminum, nickel, copper, silver, and gold, so as to reflect the electromagnetic wave 600 to shield the electromagnetic wave. The effect of 600.

In the second embodiment shown in FIG. 2, the shielding element 430 is a gasket formed of a material with wave-absorbing properties. Therefore, the shielding element 430 of the second embodiment absorbs the electromagnetic wave 600 to achieve the effect of shielding the electromagnetic wave 600.

In summary, through the probe head assembly 100 with shielding function provided by the present invention, when using it to test the wafer 500, the shielding element 430 of the probe head assembly 100 will be able to transmit reflection or The electromagnetic wave 600 is absorbed to achieve the effect of shielding the electromagnetic wave 600, and the addition of the shielding element 430 will not greatly change the structure of the original probe head assembly, and can further reduce the risk of abnormal testing or IC damage.

The above-mentioned embodiments are only used to exemplify the implementation of the new creation and to explain the technical features of the new creation, and are not used to limit the protection scope of the new creation. Any changes or equitable arrangements that can be easily completed by those familiar with this technology are within the scope of this new creation, and the scope of protection of the rights of this new creation shall be subject to the scope of the patent application.

100: Probe head assembly 200: printed circuit board 300: Probe 310: upper end 320: bottom 400: Carrying base 410: guide plate 412: upper guide 414: Lower guide plate 420: Raised component 430: shielding element 500: Wafer 600: electromagnetic wave

Fig. 1 is a schematic cross-sectional view of a new probe head assembly with shielding function in a first embodiment. 2 is a schematic cross-sectional view of a second embodiment of the new probe head assembly with shielding function.

100: Probe head assembly

200: printed circuit board

300: Probe

310: upper end

320: bottom

400: Carrying base

410: guide plate

412: upper guide

414: Lower guide plate

420: Raised component

430: shielding element

500: Wafer

600: electromagnetic wave

Claims (10)

A probe head assembly with shielding function, including: A printed circuit board; A plurality of probes, each of the plurality of probes has an upper end electrically connected to the printed circuit board; and A bearing base to fix the plural probes; Wherein, the bearing base includes: A guide plate A booster assembly, which is arranged in the guide plate and positions the plurality of probes; and At least one shielding element is sandwiched between the guide plate and the cushion component and covers the guide plate. The probe head assembly with shielding function according to claim 1, wherein the guide plate includes an upper guide plate and a lower guide plate. The probe head assembly with shielding function according to claim 2, wherein the at least one shielding element is sandwiched between the upper guide plate and the raised assembly, or sandwiched between the raised assembly and the lower guide plate between. The probe head assembly with shielding function according to claim 2, wherein the at least one shielding element is two shielding elements, and the two shielding elements are respectively sandwiched between the upper guide plate and the raised assembly and the pad Between the high component and the lower guide plate. The probe head assembly with shielding function according to claim 1, wherein the at least one shielding element is arranged between the guide plate and the booster assembly by attaching or locking. The probe head assembly with shielding function according to claim 1, wherein the thickness of the at least one shielding element is less than a quarter of the thickness of the guide plate. The probe head assembly with shielding function according to claim 1, wherein the at least one shielding element is a metal gasket, and the metal gasket is made of metals such as aluminum, nickel, and copper. The probe head assembly with shielding function according to claim 1, wherein the at least one shielding element is composed of a metal layer covered with a soft plastic, and the metal layer is covered by sputtering, evaporation, or electroless plating. Cover the outer side of the soft plastic. The probe head assembly with shielding function according to claim 8, wherein the metal layer is made of metals such as aluminum, nickel, copper, silver, and gold. The probe head assembly with shielding function according to claim 1, wherein the at least one shielding element is a gasket formed of a material with wave-absorbing properties.

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