TWM598847U - System embedded with a carbon black thermal conductive glue, thermal conductive film containing a carbon black thermal conductive glue and system embedded with the same - Google Patents

System embedded with a carbon black thermal conductive glue, thermal conductive film containing a carbon black thermal conductive glue and system embedded with the same Download PDF

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TWM598847U
TWM598847U TW109203398U TW109203398U TWM598847U TW M598847 U TWM598847 U TW M598847U TW 109203398 U TW109203398 U TW 109203398U TW 109203398 U TW109203398 U TW 109203398U TW M598847 U TWM598847 U TW M598847U
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carbon black
thermal conductive
conductive adhesive
heat
heat dissipation
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TW109203398U
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傅宗民
周文成
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傅宗民
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Priority to TW109203398U priority Critical patent/TWM598847U/en
Priority to CN202010300837.3A priority patent/CN113451240A/en
Publication of TWM598847U publication Critical patent/TWM598847U/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/653—Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/655—Solid structures for heat exchange or heat conduction
    • H01M10/6551—Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

This utility model provides a system embedded with a carbon black thermal conductive glue, comprising a thermal generating device and a heat dissipating pattern consisted of a carbon black thermal conductive glue.

Description

嵌入含碳黑導熱膠材的系統、含碳黑導熱膠材的導熱片以及嵌入該含碳黑導熱膠材的導熱片的系統System embedded with carbon black thermal conductive adhesive material, thermal conductive sheet containing carbon black thermal conductive adhesive material and system embedded thermal conductive sheet containing carbon black thermal conductive adhesive material

本新型乃關於一種嵌入含導熱膠材的系統、含導熱膠材的導熱片以及嵌入含導熱膠材的導熱片的系統，且特別是關於一種嵌入含碳黑導熱膠材的系統、含碳黑導熱膠材的導熱片以及嵌入含碳黑導熱膠材的導熱片的系統。The present invention relates to a system embedded with a thermally conductive adhesive material, a thermally conductive sheet containing a thermally conductive adhesive material, and a system for an embedded thermally conductive sheet containing a thermally conductive adhesive material, and in particular to a system embedded with a thermally conductive adhesive material containing carbon black, Thermally conductive adhesive material and thermal conductive film embedded system containing carbon black thermally conductive adhesive material.

微型化製造已經是目前電子業、半導體業以及許多科技產業的主要趨勢，惟將將許多功能性、能源性積體電路整合在一微型元件上將導致過熱的缺點。為了解決微型元件散熱的問題，目前有許多解決過熱問題的方案，例如包括導入散熱系統或者藉由導熱層來促進微型元件的散熱。惟導入散熱系統的方案，必須視微型元件而選擇特定的散熱系統，無法協同設計，且往往受到許多限制；藉由導熱層來促進微型元件的散熱的解決方案，由於現有的導熱層往往藉由在膠材內混入具高導熱性的金屬粒子，使該等導入金屬粒子將微型元件產生的熱加以排除，不過這些具高導熱性的金屬粒子之粒徑較大，故無法均勻的在膠材內混合，且這些具高導熱性的金屬粒子不見得化性安定可靠，也許還有些副作用造成電子元件、半導體元件且特別是通訊元件(例如RF、5G通訊元件)的電磁干擾(EMI)。有鑑於此，一種可配合微型元件協同設計且不會造成電磁干擾的一種嵌入含碳黑導熱膠材的系統、含化性安定且便宜的碳黑導熱膠材的導熱片以及嵌入含碳黑導熱膠材的導熱片的系統，乃業界所殷切期盼的。Miniaturized manufacturing has been the main trend in the electronics, semiconductor, and many high-tech industries. However, integrating many functional and energy-based integrated circuits on a single micro-component will lead to the disadvantage of overheating. In order to solve the problem of heat dissipation of micro-components, there are currently many solutions to the problem of overheating, such as introducing a heat dissipation system or promoting the heat dissipation of the micro-components through a thermally conductive layer. However, the solution of introducing a heat dissipation system must select a specific heat dissipation system depending on the micro-components, which cannot be collaboratively designed and is often subject to many restrictions. The solution to promote the heat dissipation of the micro-components through the thermal conductive layer is due to the existing thermal conductive layer. The metal particles with high thermal conductivity are mixed into the plastic material, so that the introduced metal particles can remove the heat generated by the micro-components. However, the particle size of these metal particles with high thermal conductivity is large, so they cannot be uniformly placed in the plastic material. Internal mixing, and these metal particles with high thermal conductivity may not be chemically stable and reliable, and there may be some side effects that cause electromagnetic interference (EMI) of electronic components, semiconductor components, and especially communication components (such as RF, 5G communication components). In view of this, a system that can be designed with micro-components and will not cause electromagnetic interference is embedded with carbon black thermal conductive adhesive, a thermal conductive sheet containing chemically stable and cheap carbon black thermal conductive adhesive, and embedded carbon black thermal conductive The system of thermal conductive sheet of adhesive material is what the industry is eagerly awaiting.

本新型之一目的是揭示一種嵌入含碳黑導熱膠材的系統，包括：一個會發熱的元件；以及一個含碳黑導熱膠材構成的散熱路徑圖案，形成於該會發熱的元件上。One purpose of the present invention is to disclose a system for embedding a carbon black-containing thermal conductive adhesive material, which includes: an element that generates heat; and a heat dissipation path pattern formed by the carbon black thermally conductive adhesive material formed on the element that generates heat.

如上所述之嵌入含碳黑導熱膠材的系統，更包括一絕緣塗層，形成於該會發熱的元件表面，使得該含碳黑導熱膠材構成的散熱路徑圖案被該絕緣塗層所圍繞。The system for embedding the carbon black-containing thermal conductive adhesive as described above further includes an insulating coating formed on the surface of the heat-generating component, so that the heat dissipation path pattern formed by the carbon black-containing thermal conductive adhesive is surrounded by the insulating coating .

如上所述之嵌入含碳黑導熱膠材的系統，該會發熱的元件為半導體元件、半導體元件封裝體、發光二極體元件、發光二極體封裝體、燈具、電池或電池模組。In the above-mentioned system embedded with carbon black thermal conductive adhesive, the heat-generating components are semiconductor components, semiconductor component packages, light-emitting diode components, light-emitting diode packages, lamps, batteries or battery modules.

如上所述之嵌入含碳黑導熱膠材的系統，該散熱路徑上更包括至少一個熱感應器，使得該會發熱的元件之散熱情況可藉由該熱感應器獲得監控。In the above-mentioned system embedded with a thermal conductive adhesive containing carbon black, the heat dissipation path further includes at least one thermal sensor, so that the heat dissipation of the heat-generating component can be monitored by the thermal sensor.

如上所述之嵌入含碳黑導熱膠材的系統，更包括至少一個冷卻裝置，該冷卻裝置可在該會發熱的元件之散熱情況異常時啟動冷卻處理，使該會發熱的元件降溫。The above-mentioned system embedded with carbon black thermal conductive adhesive material further includes at least one cooling device, which can start a cooling process when the heat dissipation of the heat generating component is abnormal, so as to cool the heat generating component.

本新型之另一目的是揭示一種嵌入含碳黑導熱膠材的導熱片，包括：一基材，具有相對的第一表面以及第二表面；以及一含碳黑導熱膠材構成的散熱路徑圖案，形成於該基材的該第一表面及/或該第二表面。Another object of the present invention is to disclose a thermal conductive sheet embedded with a carbon black thermal conductive adhesive material, which includes: a substrate having opposite first and second surfaces; and a heat dissipation path pattern formed by the carbon black thermal conductive adhesive material , Formed on the first surface and/or the second surface of the substrate.

本新型之再一目的是揭示一種嵌入含碳黑導熱膠材的導熱片的系統，包括：一個或一個以上的會發熱的元件；以及一如段落[0008]所述之含碳黑導熱膠材的導熱片，且該或該等會發熱的元件與該嵌入含碳黑導熱膠材的導熱片中形成有該含碳黑導熱膠材構成的散熱路徑圖案的該第一表面及/或該第二表面接觸，藉此使該或該等會發熱的元件可藉由該嵌入含碳黑導熱膠材的導熱片中的該第一表面及/或該第二表面所形成的該含碳黑導熱膠材構成的散熱路徑圖案將熱散除。Another object of the present invention is to disclose a system for embedding a thermal conductive sheet containing carbon black thermal conductive adhesive material, including: one or more components that generate heat; and the carbon black thermal conductive adhesive material as described in paragraph [0008] The first surface and/or the first surface and/or the first surface of the heat dissipation path pattern formed by the carbon black thermal conductive adhesive formed in the thermal conductive film embedded with the carbon black thermal conductive adhesive material The two surfaces are in contact with each other, so that the heat-generating component(s) can be thermally conductive by the carbon black formed by the first surface and/or the second surface of the thermal conductive sheet embedded in the carbon black thermal conductive adhesive The heat dissipation path pattern formed by the plastic material dissipates the heat.

如上所述的嵌入含碳黑導熱膠材的導熱片的系統，該或該等會發熱的元件為半導體元件、半導體元件封裝體、發光二極體元件、發光二極體封裝體、燈具、電池或電池模組。The above-mentioned system for embedding a thermally conductive sheet containing carbon black thermally conductive adhesive, the component or components that generate heat are semiconductor components, semiconductor component packages, light-emitting diode components, light-emitting diode packages, lamps, and batteries Or battery module.

如上所述之嵌入含碳黑導熱膠材的導熱片的系統，更包括至少一個熱感應器，使得該或該等會發熱的元件之散熱情況可藉由該熱感應器獲得監控。The above-mentioned system embedded with a thermal conductive sheet containing carbon black thermal conductive adhesive further includes at least one thermal sensor, so that the heat dissipation of the heat-generating component or components can be monitored by the thermal sensor.

如上所述之嵌入含碳黑導熱膠材的導熱片的系統，更包括至少一個冷卻裝置，該冷卻裝置可在該或該等會發熱的元件之散熱情況異常時啟動冷卻處理，使該或該等會發熱的元件降溫。The above-mentioned system of embedded thermal conductive sheet containing carbon black thermal conductive adhesive further includes at least one cooling device, which can start the cooling process when the heat dissipation of the heat-generating component or components is abnormal, so that the or the Wait for the heating element to cool down.

以下將詳細說明本新型各實施例。然應注意的是，本新型提供許多可供應用的新型概念，其可以多種特定型式實施。文中所舉例討論之特定實施例僅為例示，非用以限制本新型之範圍。The various embodiments of the present invention will be described in detail below. It should be noted, however, that the present invention provides many new concepts for application, which can be implemented in a variety of specific types. The specific embodiments discussed in the text are only examples and are not intended to limit the scope of the present invention.

實施例一Example one

首先，請參照圖1A，圖1A的立體圖為根據本新型實施例一所繪示的一種嵌入含碳黑導熱膠材的系統1000。如圖1A所示，此嵌入含碳黑導熱膠材的系統1000包括一個會發熱的元件100以及一個散熱路徑圖案200，形成於該會發熱的元件100的表面100A上，該散熱路徑圖案200乃嵌入一含碳黑導熱膠材。如上所述之含碳黑導熱膠材，包含：一膠材，以及複數碳黑粉末，均勻摻混於該膠材內，該等碳黑粉末在該含碳黑導熱膠材中的含量為大於或等於30重量百分比。上述膠材為一種高分子樹脂，可選自例如但不限於環氧系樹脂、醇酸系樹脂、丙稀酸系樹脂、氰基丙烯酸酯系樹脂、聚氨酯系樹脂、酚醛系樹脂、聚二甲基矽氧烷系(Polydimethylsiloxane，PDMS) 樹脂以及氯乙烯-醋酸乙烯共聚物系樹脂所構成之族群其中之一或其組合。上述該等碳黑粉末之粒徑為微米或奈米等級。此外，上述含碳黑導熱膠材之導熱係數乃大於或等於0.25瓦·公尺 -1克爾文 -1(Wm -1K -1)。 First of all, please refer to FIG. 1A. The perspective view of FIG. 1A shows a system 1000 embedded with a carbon black thermal conductive adhesive according to the first embodiment of the present invention. As shown in FIG. 1A, the system 1000 embedded with a thermal conductive adhesive containing carbon black includes a heat-generating element 100 and a heat dissipation path pattern 200 formed on the surface 100A of the heat-generating element 100. The heat dissipation path pattern 200 is Embed a thermal conductive adhesive containing carbon black. The carbon black-containing thermal conductive adhesive material as described above includes: a plastic material and a plurality of carbon black powders uniformly mixed in the plastic material, and the content of the carbon black powder in the carbon black thermal conductive adhesive material is greater than Or equal to 30 weight percent. The above-mentioned glue is a polymer resin, which can be selected from, for example, but not limited to, epoxy resins, alkyd resins, acrylic resins, cyanoacrylate resins, polyurethane resins, phenolic resins, polydimethylsiloxanes One or a combination of polydimethylsiloxane (PDMS) resins and vinyl chloride-vinyl acetate copolymer resins. The particle size of the aforementioned carbon black powder is micron or nanometer level. In addition, the thermal conductivity of the aforementioned carbon black-containing thermal conductive adhesive is greater than or equal to 0.25 watt·meter -1 kelvin- 1 (Wm -1 K -1 ).

上述該等會發熱的元件100可為例如但不限於半導體元件、半導體元件封裝體、發光二極體元件、發光二極體封裝體、燈具、電池或電池模組。The aforementioned heat-generating components 100 can be, for example, but not limited to, semiconductor components, semiconductor component packages, light emitting diode components, light emitting diode packages, lamps, batteries, or battery modules.

此外，如上所述之嵌入含碳黑導熱膠材的系統1000，該散熱路徑200上更包括至少一個熱感應器300，使得該會發熱的元件100之散熱情況可藉由該熱感應器300獲得監控。In addition, in the above-mentioned system 1000 embedded with a thermal conductive adhesive containing carbon black, the heat dissipation path 200 further includes at least one thermal sensor 300, so that the heat dissipation of the heating element 100 can be obtained by the thermal sensor 300 monitor.

根據本新型實施例一所繪示的一種嵌入含碳黑導熱膠材的系統1000可藉由如圖1B~1C所繪示的剖面製程製備，或者藉由如圖1B’~1D’所繪示的剖面製程製備。According to the first embodiment of the present invention, a system 1000 embedded with carbon black thermal conductive adhesive can be prepared by the cross-sectional process shown in FIGS. 1B to 1C, or by the cross-sectional process shown in FIGS. 1B' to 1D' The profile process is prepared.

圖1B~1C的剖面圖所繪示者為一種製造如圖1A所示之一種嵌入含碳黑導熱膠材的系統1000的製程。首先，如圖1B所示，提供一個會發熱的元件100，然後提供一含碳黑導熱膠材，選擇性地將該含碳黑導熱膠材噴塗或塗佈於該會發熱的元件100的表面100A上，並且照光或加熱固化，使該含碳黑導熱膠材的散熱路徑圖案被固化，以在該會發熱的元件100的表面100A上形成一該含碳黑導熱膠材的散熱路徑圖案200，使該會發熱的元件1000可藉由該含碳黑導熱膠材的散熱路徑圖案200將熱散除。如上所述之含碳黑導熱膠材，包含：一膠材，以及複數碳黑粉末，均勻摻混於該膠材內，該等碳黑粉末在該含碳黑導熱膠材中的含量為大於或等於30重量百分比。上述膠材為一種高分子樹脂，可選自例如但不限於環氧系樹脂、醇酸系樹脂、丙稀酸系樹脂、氰基丙烯酸酯系樹脂、聚氨酯系樹脂、酚醛系樹脂、聚二甲基矽氧烷系(Polydimethylsiloxane，PDMS) 樹脂以及氯乙烯-醋酸乙烯共聚物系樹脂所構成之族群其中之一或其組合。此外，上述該等碳黑粉末之粒徑為微米或奈米等級。The cross-sectional views of FIGS. 1B to 1C show a manufacturing process of a system 1000 embedded with a carbon black thermal conductive adhesive as shown in FIG. 1A. First, as shown in FIG. 1B, a heat-generating component 100 is provided, and then a carbon black-containing thermal conductive adhesive material is provided, and the carbon black-containing thermal conductive adhesive material is selectively sprayed or coated on the surface of the heat-generating component 100 100A, and irradiate or heat to cure, so that the heat dissipation path pattern of the carbon black-containing thermal conductive adhesive is cured, so as to form a heat dissipation path pattern 200 of the carbon black-containing thermal conductive adhesive on the surface 100A of the heat-generating component 100 , So that the heat-generating device 1000 can dissipate heat through the heat dissipation path pattern 200 of the carbon black-containing thermal conductive adhesive. The carbon black-containing thermal conductive adhesive material as described above includes: a plastic material and a plurality of carbon black powders uniformly mixed in the plastic material, and the content of the carbon black powder in the carbon black thermal conductive adhesive material is greater than Or equal to 30 weight percent. The above-mentioned glue is a polymer resin, which can be selected from, for example, but not limited to, epoxy resins, alkyd resins, acrylic resins, cyanoacrylate resins, polyurethane resins, phenolic resins, polydimethylsiloxanes One or a combination of polydimethylsiloxane (PDMS) resins and vinyl chloride-vinyl acetate copolymer resins. In addition, the particle size of the carbon black powders is micron or nanometer level.

然後，如圖1C所示，於該含碳黑導熱膠材的散熱路徑圖案200上形成至少一個熱感應器300，使得該會發熱的元件100之散熱情況可藉由該熱感應器300獲得監控。Then, as shown in FIG. 1C, at least one thermal sensor 300 is formed on the heat dissipation path pattern 200 of the thermal conductive adhesive containing carbon black, so that the heat dissipation of the heat-generating component 100 can be monitored by the thermal sensor 300 .

圖1B’~1D’的剖面圖所繪示者為另一種製造如圖1A所示之一種嵌入含碳黑導熱膠材的系統1000的製程。首先，如圖1B’所示，提供一個會發熱的元件100，然後提供一含碳黑導熱膠材，全面性地將該含碳黑導熱膠材噴塗或塗佈於該會發熱的元件100的表面100A上，形成一含碳黑導熱膠材的薄膜20。如上所述之含碳黑導熱膠材，包含：一膠材，以及複數碳黑粉末，均勻摻混於該膠材內，該等碳黑粉末在該含碳黑導熱膠材中的含量為大於或等於30重量百分比。上述膠材為一種高分子樹脂，可選自例如但不限於環氧系樹脂、醇酸系樹脂、丙稀酸系樹脂、氰基丙烯酸酯系樹脂、聚氨酯系樹脂、酚醛系樹脂、聚二甲基矽氧烷系(Polydimethylsiloxane，PDMS) 樹脂以及氯乙烯-醋酸乙烯共聚物系樹脂所構成之族群其中之一或其組合。此外，上述該等碳黑粉末之粒徑為微米或奈米等級。此外，上述含碳黑導熱膠材之導熱係數乃大於或等於0.25 瓦·公尺 -1克爾文 -1(Wm -1K -1)。 The cross-sectional views of FIGS. 1B' to 1D' show another process for manufacturing a system 1000 embedded with a carbon black thermal conductive adhesive as shown in FIG. 1A. First, as shown in FIG. 1B', a heat-generating component 100 is provided, and then a carbon black-containing thermal conductive adhesive material is provided, and the carbon black-containing thermal conductive adhesive material is sprayed or coated on the heat-generating component 100 in a comprehensive manner. On the surface 100A, a film 20 containing carbon black thermal conductive adhesive is formed. The carbon black-containing thermal conductive adhesive material as described above includes: a plastic material and a plurality of carbon black powders uniformly mixed in the plastic material, and the content of the carbon black powder in the carbon black thermal conductive adhesive material is greater than Or equal to 30 weight percent. The above-mentioned glue is a polymer resin, which can be selected from, for example, but not limited to, epoxy resins, alkyd resins, acrylic resins, cyanoacrylate resins, polyurethane resins, phenolic resins, polydimethylsiloxanes One or a combination of polydimethylsiloxane (PDMS) resins and vinyl chloride-vinyl acetate copolymer resins. In addition, the particle size of the carbon black powders is micron or nanometer level. In addition, the thermal conductivity of the above-mentioned carbon black-containing thermal conductive adhesive is greater than or equal to 0.25 watt·meter -1 Kelvin- 1 (Wm -1 K -1 ).

其次，如圖1C’所示，利用微影、蝕刻製程圖案化該含碳黑導熱膠材的薄膜20，以在該會發熱的元件100的表面100A上形成一該含碳黑導熱膠材的散熱路徑圖案200，使該會發熱的元件1000可藉由該含碳黑導熱膠材的散熱路徑圖案200將熱散除。Second, as shown in FIG. 1C', the carbon black-containing thermal conductive adhesive film 20 is patterned by a lithography and etching process to form a carbon black-containing thermal conductive adhesive on the surface 100A of the heating element 100 The heat dissipation path pattern 200 allows the heat-generating device 1000 to dissipate heat through the heat dissipation path pattern 200 of the carbon black-containing thermal conductive adhesive.

然後，如圖1D’所示，於該含碳黑導熱膠材的散熱路徑圖案200上形成至少一個熱感應器300，使得該會發熱的元件100之散熱情況可藉由該熱感應器300獲得監控。Then, as shown in FIG. 1D', at least one thermal sensor 300 is formed on the heat dissipation path pattern 200 of the thermal conductive adhesive containing carbon black, so that the heat dissipation of the heat-generating component 100 can be obtained by the thermal sensor 300 monitor.

此外，本實施例一所揭示的一種嵌入含碳黑導熱膠材的系統1000， 更可導入至少一個冷卻裝置(未繪示)，該冷卻裝置可在該會發熱的元件100之散熱情況異常時啟動冷卻處理，使該會發熱的元件降溫。In addition, the system 1000 with embedded carbon black thermal conductive adhesive disclosed in the first embodiment can further introduce at least one cooling device (not shown), which can be used when the heat dissipation of the heating element 100 is abnormal. Start the cooling process to cool down the heating element.

實施例二Example two

首先，請參照圖2A，圖2A的立體圖為根據本新型實施例二所繪示的一種嵌入含碳黑導熱膠材的系統2000。如圖2A所示，此嵌入含碳黑導熱膠材的系統2000包括一個會發熱的元件100、一個散熱路徑圖案200，形成於該會發熱的元件100的表面100A上，該散熱路徑圖案200乃嵌入一含碳黑導熱膠材、以及一絕緣塗層25-，形成於該會發熱的元件100的表面100A上，使得該散熱路徑圖案200被該絕緣塗層250所圍繞。First, please refer to FIG. 2A. The perspective view of FIG. 2A is a system 2000 with embedded carbon black thermal conductive adhesive according to the second embodiment of the present invention. As shown in FIG. 2A, the system 2000 embedded with a thermal conductive adhesive containing carbon black includes a heat-generating element 100 and a heat dissipation path pattern 200 formed on the surface 100A of the heat-generating element 100. The heat dissipation path pattern 200 is A thermal conductive adhesive containing carbon black and an insulating coating 25- are embedded on the surface 100A of the heat generating element 100, so that the heat dissipation path pattern 200 is surrounded by the insulating coating 250.

根據本新型實施例二所繪示的一種嵌入含碳黑導熱膠材的系統2000可藉由如圖2B~2D所繪示的剖面製程製備，或者藉由如圖2B’~2D’所繪示的剖面製程製備。According to the second embodiment of the present invention, a system 2000 with embedded carbon black thermal conductive adhesive can be prepared by the cross-sectional process shown in FIGS. 2B~2D, or by the cross-sectional process shown in FIGS. 2B'~2D' The profile process is prepared.

圖2B~2D的剖面圖所繪示者為一種製造如圖2A所示之一種嵌入含碳黑導熱膠材的系統2000的製程。首先，如圖2B所示，提供一個會發熱的元件100，形成一絕緣塗層250於該會發熱的元件100的表面100A，且該絕緣塗層250具有一露出該會發熱的元件100的表面100A的溝填區255。The cross-sectional views of FIGS. 2B to 2D show a manufacturing process of a system 2000 embedded with a thermal conductive adhesive containing carbon black as shown in FIG. 2A. First, as shown in FIG. 2B, a heating element 100 is provided, an insulating coating 250 is formed on the surface 100A of the heating element 100, and the insulating coating 250 has a surface exposing the heating element 100 100A ditch fill area 255.

其次，如圖2C所示，然後提供一含碳黑導熱膠材，選擇性地將含碳黑導熱膠材嵌入於該絕緣塗層250的該溝填區255內，然後照光或加熱固化以在該會發熱的元件100的表面100A上形成一含碳黑導熱膠材的散熱路徑圖案200，使該會發熱的元件100可藉由該含碳黑導熱膠材的散熱路徑圖案200將熱散除，提供一種嵌入含碳黑導熱膠材的系統。如上所述之含碳黑導熱膠材，包含：一膠材，以及複數碳黑粉末，均勻摻混於該膠材內，該等碳黑粉末在該含碳黑導熱膠材中的含量為大於或等於30重量百分比。上述膠材為一種高分子樹脂，可選自例如但不限於環氧系樹脂、醇酸系樹脂、丙稀酸系樹脂、氰基丙烯酸酯系樹脂、聚氨酯系樹脂、酚醛系樹脂、聚二甲基矽氧烷系(Polydimethylsiloxane，PDMS) 樹脂以及氯乙烯-醋酸乙烯共聚物系樹脂所構成之族群其中之一或其組合。此外，上述該等碳黑粉末之粒徑為微米或奈米等級。此外，上述含碳黑導熱膠材之導熱係數乃大於或等於0.25瓦·公尺 -1克爾文 -1(Wm -1K -1)。 Secondly, as shown in FIG. 2C, a carbon black-containing thermal conductive adhesive material is then provided, and the carbon black-containing thermal conductive adhesive material is selectively embedded in the trench filling area 255 of the insulating coating 250, and then illuminated or heated to cure A heat dissipation path pattern 200 containing carbon black thermal conductive adhesive is formed on the surface 100A of the heat-generating component 100, so that the heat-generating component 100 can dissipate the heat through the heat dissipation path pattern 200 containing the carbon black thermal conductive adhesive , Provides a system for embedding carbon black thermal conductive adhesive. The carbon black-containing thermal conductive adhesive material as described above includes: a plastic material and a plurality of carbon black powders uniformly mixed in the plastic material, and the content of the carbon black powder in the carbon black thermal conductive adhesive material is greater than Or equal to 30 weight percent. The above-mentioned glue material is a polymer resin, which can be selected from, for example, but not limited to, epoxy resins, alkyd resins, acrylic resins, cyanoacrylate resins, polyurethane resins, phenolic resins, polydimethylsiloxanes One or a combination of polydimethylsiloxane (PDMS) resins and vinyl chloride-vinyl acetate copolymer resins. In addition, the particle size of the carbon black powders is micron or nanometer level. In addition, the thermal conductivity of the aforementioned carbon black-containing thermal conductive adhesive is greater than or equal to 0.25 watt·meter -1 kelvin- 1 (Wm -1 K -1 ).

然後，如圖2D所示，於該含碳黑導熱膠材的散熱路徑圖案200上形成至少一個熱感應器300，使得該會發熱的元件100之散熱情況可藉由該熱感應器300獲得監控。Then, as shown in FIG. 2D, at least one thermal sensor 300 is formed on the heat dissipation path pattern 200 of the thermal conductive adhesive containing carbon black, so that the heat dissipation of the heat-generating component 100 can be monitored by the thermal sensor 300 .

圖2B’~2D’的剖面圖所繪示者為另一種製造如圖2A所示之一種嵌入含碳黑導熱膠材的系統2000的製程。首先，如圖2B’所示，提供一個會發熱的元件100，其次選擇性地將一含碳黑導熱膠材嵌入於該會發熱的元件100的表面100A上，以形成一含碳黑導熱膠材的散熱路徑圖案200，使該會發熱的元件可藉由該含碳黑導熱膠材的散熱路徑圖案將熱散除。如上所述之含碳黑導熱膠材，包含：一膠材，以及複數碳黑粉末，均勻摻混於該膠材內，該等碳黑粉末在該含碳黑導熱膠材中的含量為大於或等於30重量百分比。上述膠材為一種高分子樹脂，可選自例如但不限於環氧系樹脂、醇酸系樹脂、丙稀酸系樹脂、氰基丙烯酸酯系樹脂、聚氨酯系樹脂、酚醛系樹脂、聚二甲基矽氧烷系(Polydimethylsiloxane，PDMS) 樹脂以及氯乙烯-醋酸乙烯共聚物系樹脂所構成之族群其中之一或其組合。此外，上述該等碳黑粉末之粒徑為微米或奈米等級。此外，上述含碳黑導熱膠材之導熱係數乃大於或等於0.25瓦·公尺 -1克爾文 -1(Wm -1K -1)。 The cross-sectional views of FIGS. 2B'-2D' show another manufacturing process of the system 2000 embedded with a carbon black thermal conductive adhesive as shown in FIG. 2A. First, as shown in FIG. 2B', a heat-generating component 100 is provided, and secondly, a carbon black-containing thermal conductive adhesive is selectively embedded on the surface 100A of the heat-generating component 100 to form a carbon black-containing thermal conductive adhesive The heat dissipation path pattern 200 of the material allows the heat-generating component to dissipate heat through the heat dissipation path pattern of the carbon black-containing thermal conductive adhesive. The carbon black-containing thermal conductive adhesive material as described above includes: a plastic material and a plurality of carbon black powders uniformly mixed in the plastic material, and the content of the carbon black powder in the carbon black thermal conductive adhesive material is greater than Or equal to 30 weight percent. The above-mentioned glue is a polymer resin, which can be selected from, for example, but not limited to, epoxy resins, alkyd resins, acrylic resins, cyanoacrylate resins, polyurethane resins, phenolic resins, polydimethylsiloxanes One or a combination of polydimethylsiloxane (PDMS) resins and vinyl chloride-vinyl acetate copolymer resins. In addition, the particle size of the carbon black powders is micron or nanometer level. In addition, the thermal conductivity of the aforementioned carbon black-containing thermal conductive adhesive is greater than or equal to 0.25 watt·meter -1 kelvin- 1 (Wm -1 K -1 ).

然後，如圖2C’所示，形成一絕緣塗層250於該會發熱的元件100的表面100A，且該絕緣塗層250圍繞該該含碳黑導熱膠材的散熱路徑圖案200，提供一種嵌入含碳黑導熱膠材的系統。Then, as shown in FIG. 2C', an insulating coating 250 is formed on the surface 100A of the heat-generating component 100, and the insulating coating 250 surrounds the heat dissipation path pattern 200 of the carbon black-containing thermally conductive adhesive, providing an embedded System containing carbon black thermal conductive adhesive.

最後，如圖2D’所示，於該含碳黑導熱膠材的散熱路徑圖案200上形成至少一個熱感應器300，使得該會發熱的元件100之散熱情況可藉由該熱感應器300獲得監控。Finally, as shown in FIG. 2D', at least one thermal sensor 300 is formed on the heat dissipation path pattern 200 of the thermal conductive adhesive containing carbon black, so that the heat dissipation of the heat-generating component 100 can be obtained by the thermal sensor 300 monitor.

此外，本實施例二所揭示的一種嵌入含碳黑導熱膠材的系統2000， 更可導入至少一個冷卻裝置(未繪示)，該冷卻裝置可在該會發熱的元件100之散熱情況異常時啟動冷卻處理，使該會發熱的元件降溫。In addition, the system 2000 with embedded carbon black thermal conductive adhesive disclosed in the second embodiment can further introduce at least one cooling device (not shown), which can be used when the heat dissipation of the heating element 100 is abnormal. Start the cooling process to cool down the heating element.

實施例三Example three

圖3A的剖面圖為根據本新型實施例三所繪示的一種含碳黑導熱膠材的導熱片3000。圖3B的剖面圖為根據本新型實施例三所繪示的另一種含碳黑導熱膠材的導熱片3000’。3A is a cross-sectional view of a thermal conductive sheet 3000 containing a carbon black thermal conductive adhesive according to the third embodiment of the present invention. 3B is a cross-sectional view of another thermal conductive sheet 3000' containing carbon black thermal conductive adhesive according to the third embodiment of the present invention.

如圖3A所示，根據本新型實施例三所繪示的一種含碳黑導熱膠材的導熱片3000，包括：一基材350，具有相對的第一表面350A以及第二表面350B，以及一含碳黑導熱膠材構成的散熱路徑圖案380，藉由例如但不限於塗佈製程或噴墨製程，形成於該基材的該第一表面350A。如上所述之含碳黑導熱膠材，包含：一膠材，以及複數碳黑粉末，均勻摻混於該膠材內，該等碳黑粉末在該含碳黑導熱膠材中的含量為大於或等於30重量百分比。上述膠材為一種高分子樹脂，可選自例如但不限於環氧系樹脂、醇酸系樹脂、丙稀酸系樹脂、氰基丙烯酸酯系樹脂、聚氨酯系樹脂、酚醛系樹脂、聚二甲基矽氧烷系(Polydimethylsiloxane，PDMS) 樹脂以及氯乙烯-醋酸乙烯共聚物系樹脂所構成之族群其中之一或其組合。此外，上述該等碳黑粉末之粒徑為微米或奈米等級。此外，上述該含碳黑導熱膠材之導熱係數乃大於或等於0.25瓦·公尺 -1克爾文 -1(Wm -1K -1)。 As shown in FIG. 3A, according to the third embodiment of the present invention, a thermal conductive sheet 3000 containing a carbon black thermal conductive adhesive includes: a substrate 350 having opposite first and second surfaces 350A and 350B, and a The heat dissipation path pattern 380 composed of a carbon black thermally conductive adhesive is formed on the first surface 350A of the substrate by, for example, but not limited to, a coating process or an inkjet process. The carbon black-containing thermal conductive adhesive material as described above includes: a plastic material and a plurality of carbon black powders uniformly mixed in the plastic material, and the content of the carbon black powder in the carbon black thermal conductive adhesive material is greater than Or equal to 30 weight percent. The above-mentioned glue material is a polymer resin, which can be selected from, for example, but not limited to, epoxy resins, alkyd resins, acrylic resins, cyanoacrylate resins, polyurethane resins, phenolic resins, polydimethylsiloxanes One or a combination of polydimethylsiloxane (PDMS) resins and vinyl chloride-vinyl acetate copolymer resins. In addition, the particle size of the carbon black powders is micron or nanometer level. In addition, the thermal conductivity of the above-mentioned carbon black-containing thermal conductive adhesive is greater than or equal to 0.25 watt·meter -1 Kelvin- 1 (Wm -1 K -1 ).

如圖3B所示，根據本新型實施例三所繪示的另一種嵌入含碳黑導熱膠材的導熱片3000’，包括：一基材350，具有相對的第一表面350A以及第二表面350B，以及一含碳黑導熱膠材構成的散熱路徑圖案380，塗佈於該基材的該第一表面350A、第二表面350B。如上所述之含碳黑導熱膠材，包含：一膠材，以及複數碳黑粉末，均勻摻混於該膠材內，該等碳黑粉末在該含碳黑導熱膠材中的含量為大於或等於30重量百分比。上述膠材為一種高分子樹脂，可選自例如但不限於環氧系樹脂、醇酸系樹脂、丙稀酸系樹脂、氰基丙烯酸酯系樹脂、聚氨酯系樹脂、酚醛系樹脂、聚二甲基矽氧烷系(Polydimethylsiloxane，PDMS) 樹脂以及氯乙烯-醋酸乙烯共聚物系樹脂所構成之族群其中之一或其組合。此外，上述該等碳黑粉末之粒徑為微米或奈米等級。此外，上述含碳黑導熱膠材之導熱係數乃大於或等於0.25瓦·公尺 -1克爾文 -1(Wm -1K -1)。 As shown in FIG. 3B, according to the third embodiment of the present invention, another thermal conductive sheet 3000' embedded with a carbon black thermal conductive adhesive material includes: a substrate 350 having a first surface 350A and a second surface 350B opposite to each other , And a heat dissipation path pattern 380 composed of a carbon black thermal conductive adhesive material, coated on the first surface 350A and the second surface 350B of the substrate. The carbon black-containing thermal conductive adhesive material as described above includes: a plastic material and a plurality of carbon black powders uniformly mixed in the plastic material, and the content of the carbon black powder in the carbon black thermal conductive adhesive material is greater than Or equal to 30 weight percent. The above-mentioned glue is a polymer resin, which can be selected from, for example, but not limited to, epoxy resins, alkyd resins, acrylic resins, cyanoacrylate resins, polyurethane resins, phenolic resins, polydimethylsiloxanes One or a combination of polydimethylsiloxane (PDMS) resins and vinyl chloride-vinyl acetate copolymer resins. In addition, the particle size of the carbon black powders is micron or nanometer level. In addition, the thermal conductivity of the aforementioned carbon black-containing thermal conductive adhesive is greater than or equal to 0.25 watt·meter -1 kelvin- 1 (Wm -1 K -1 ).

實施例四Example four

圖4A的剖面圖為根據本新型實施例四所繪示的一種嵌入含碳黑導熱膠材的導熱片3000的系統4000。圖4B的剖面圖為根據本新型實施例四所繪示的另一種嵌入含碳黑導熱膠材的導熱片3000’的系統4000’。 圖4C的剖面圖為根據本新型實施例四所繪示的又一種嵌入含碳黑導熱膠材的導熱片3000的系統4000”。圖4D的剖面圖為根據本新型實施例四所繪示的再一種嵌入含碳黑導熱膠材的導熱片3000’的系統4000’”。FIG. 4A is a cross-sectional view of a system 4000 in which a thermal conductive sheet 3000 embedded with a carbon black thermal conductive adhesive is drawn according to the fourth embodiment of the present invention. Fig. 4B is a cross-sectional view of another system 4000’ in which a thermal conductive sheet 3000’ embedded with a carbon black thermal conductive adhesive is drawn according to the fourth embodiment of the present invention. The cross-sectional view of FIG. 4C is another system 4000" of the thermal conductive sheet 3000 embedded with the carbon black thermally conductive adhesive according to the fourth embodiment of the present invention. The cross-sectional view of FIG. 4D is the fourth embodiment of the present invention. Another system 4000'" embedded with a thermal conductive sheet 3000' containing carbon black thermal conductive adhesive.

如圖4A所示的一種嵌入含碳黑導熱膠材的導熱片的系統4000，包括：複數個會發熱的元件400，以及一如實施例三所述之含碳黑導熱膠材的導熱片3000，且該等會發熱的元件400與該導熱片3000中塗佈有該含碳黑導熱膠材的該第一表面350A接觸，藉此該等會發熱的元件400可藉由該導熱片3000中的該第一表面350A所形成的該含碳黑導熱膠材構成的散熱路徑圖案380將熱散除。As shown in FIG. 4A, a system 4000 for embedding a thermally conductive sheet containing carbon black thermally conductive adhesive includes: a plurality of elements 400 that generate heat, and a thermally conductive sheet 3000 containing carbon black thermally conductive adhesive as described in the third embodiment , And the heat-generating components 400 are in contact with the first surface 350A coated with the carbon black thermal conductive adhesive in the thermal conductive sheet 3000, so that the heat-generating components 400 can be used in the thermal conductive sheet 3000 The heat dissipation path pattern 380 formed by the carbon black-containing thermal conductive adhesive formed on the first surface 350A dissipates heat.

如圖4B所示的另一種嵌入含碳黑導熱膠材的導熱片的系統4000’，包括：複數個會發熱的元件400，以及一如實施例三所述之含碳黑導熱膠材的導熱片3000’，且該等會發熱的元件400與該導熱片3000’中塗佈有該含碳黑導熱膠材的該第一表面350A及該第二表面350B接觸，藉此該等會發熱的元件400可藉由該導熱片3000’中的該第一表面350A及該第二表面350B所形成的該含碳黑導熱膠材構成的散熱路徑圖案380將熱散除。As shown in FIG. 4B, another system 4000' embedded with a thermal conductive sheet containing carbon black thermal conductive adhesive includes: a plurality of heat-generating components 400, and the thermal conductivity of the carbon black thermal conductive adhesive as described in the third embodiment The first surface 350A and the second surface 350B coated with the carbon black thermal conductive adhesive in the thermal conductive sheet 3000', and the heat-generating elements 400 contact, thereby the thermal conductive sheet 3000' The device 400 can dissipate heat by the heat dissipation path pattern 380 formed by the carbon black-containing thermal conductive adhesive formed by the first surface 350A and the second surface 350B of the thermal conductive sheet 3000 ′.

實施例四所述的該等會發熱的元件400可為例如但不限於半導體元件、半導體元件封裝體、發光二極體元件、發光二極體封裝體、燈具、電池或電池模組。The heat-generating components 400 described in the fourth embodiment can be, for example, but not limited to, semiconductor components, semiconductor component packages, light-emitting diode components, light-emitting diode packages, lamps, batteries, or battery modules.

此外，如圖4A所示的一種嵌入含碳黑導熱膠材的導熱片的系統4000，更可更包括至少一個熱感應器450，形成一如圖4C所示的又一種嵌入含碳黑導熱膠材的導熱片的系統4000”，使得該或該等會發熱的元件400之散熱情況可藉由該熱感應器450獲得監控。再者，如圖4C所示的又一種嵌入含碳黑導熱膠材的導熱片的系統4000”更可包括至少一個冷卻裝置(未繪示)，該冷卻裝置可在該或該等會發熱的元件400之散熱情況異常時啟動冷卻處理，使該或該等會發熱的元件降溫。In addition, as shown in FIG. 4A, a system 4000 embedded with a thermal conductive sheet containing carbon black thermally conductive adhesive may further include at least one thermal sensor 450 to form another embedded carbon black thermally conductive adhesive as shown in FIG. 4C The system 4000" of the thermal conductive sheet of the material, so that the heat dissipation of the heat-generating component 400 can be monitored by the thermal sensor 450. Furthermore, as shown in FIG. 4C, there is another embedded carbon black thermal conductive adhesive The system 4000" of the thermal conductive sheet of the material may further include at least one cooling device (not shown). The cooling device can start a cooling process when the heat dissipation of the heat-generating element 400 is abnormal, so that the Heat-generating components cool down.

此外，如圖4B所示的又一種嵌入含碳黑導熱膠材的導熱片的系統4000’，更可更包括至少一個熱感應器450，形成一如圖4D所示的再一種嵌入含碳黑導熱膠材的導熱片的系統4000’”，使得該或該等會發熱的元件400之散熱情況可藉由該熱感應器450獲得監控。再者，如圖4D所示的再一種嵌入含碳黑導熱膠材的導熱片的系統4000’”更可包括至少一個冷卻裝置(未繪示)，該冷卻裝置可在該或該等會發熱的元件400之散熱情況異常時啟動冷卻處理，使該或該等會發熱的元件降溫。In addition, as shown in FIG. 4B, another system 4000' embedded with a thermal conductive sheet containing carbon black thermally conductive adhesive may further include at least one thermal sensor 450 to form another embedded carbon black as shown in FIG. 4D The system 4000'" of the thermal conductive sheet of the thermally conductive adhesive allows the heat dissipation of the heat-generating component 400 to be monitored by the thermal sensor 450. Furthermore, as shown in FIG. 4D, another embedded carbon-containing The system 4000'" of the thermally conductive sheet made of black thermally conductive adhesive may further include at least one cooling device (not shown). The cooling device can initiate a cooling process when the heat dissipation of the heat-generating component or components 400 is abnormal, so that the Or cooling down the components that generate heat.

雖然本新型已以實施例揭露如上，然其並非用以限定本新型，任何熟習此技藝者，在不脫離本新型之精神和範圍內，當可作各種之更動與潤飾，因此本新型之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone who is familiar with this technique can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be subject to the definition of the attached patent scope.

100、400:會發熱的元件 100A:會發熱的元件的表面 20:含碳黑導熱膠材的薄膜 200:含碳黑導熱膠材的散熱路徑圖案 250:絕緣塗層 255:溝填區 300、450:熱感應器 350:基材 350A:第一表面 350B:第二表面 380:含碳黑導熱膠材構成的散熱路徑圖案 1000、2000:嵌入含碳黑導熱膠材的系統 3000、3000’:含碳黑導熱膠材的導熱片 4000、4000’:嵌入含碳黑導熱膠材的導熱片的系統 400”、400’”:嵌入含碳黑導熱膠材的導熱片的系統 100, 400: components that generate heat 100A: The surface of the component that generates heat 20: Film containing carbon black thermal conductive adhesive 200: The heat dissipation path pattern of the carbon black thermal conductive adhesive 250: insulating coating 255: Ditch Filling Area 300, 450: thermal sensor 350: Substrate 350A: first surface 350B: second surface 380: Heat dissipation path pattern composed of carbon black thermal conductive adhesive 1000, 2000: Embedded system with carbon black thermal conductive adhesive 3000, 3000’: Thermal conductive sheet containing carbon black thermal conductive adhesive 4000, 4000’: System with embedded thermal conductive sheet containing carbon black thermal conductive adhesive 400", 400'": System with embedded thermal conductive sheet containing carbon black thermal conductive adhesive

圖1A的立體圖為根據本新型實施例一所繪示的一種嵌入含碳黑導熱膠材的系統1000。FIG. 1A is a perspective view of a system 1000 in which a carbon black-containing thermal conductive adhesive is embedded according to the first embodiment of the present invention.

圖1B~1C是沿圖1A的剖面線I-I’所繪示的剖面圖，用以顯示製造如圖1A所示之一種嵌入含碳黑導熱膠材的系統1000的製程。1B to 1C are cross-sectional views drawn along the cross-sectional line I-I' of FIG. 1A to show the manufacturing process of a system 1000 embedded with a carbon black thermal conductive adhesive as shown in FIG. 1A.

圖1B’~1D’ 是沿圖1A的剖面線I-I’所繪示的剖面圖，用以顯示另一種製造如圖1A所示之一種嵌入含碳黑導熱膠材的系統1000的製程。1B'~1D' are cross-sectional views drawn along the cross-sectional line I-I' of FIG. 1A to show another manufacturing process of a system 1000 embedded with a carbon black thermal conductive adhesive as shown in FIG. 1A.

圖2A的立體圖為根據本新型實施例一所繪示的一種嵌入含碳黑導熱膠材的系統2000。FIG. 2A is a three-dimensional view of a system 2000 with embedded carbon black thermal conductive adhesive according to the first embodiment of the present invention.

圖2B~2D是沿圖2A的剖面線II-II’所繪視的剖面圖，用以顯示製造如圖2A所示之一種嵌入含碳黑導熱膠材的系統2000的製程。2B~2D are cross-sectional views drawn along the cross-sectional line II-II' of FIG. 2A, and are used to show the manufacturing process of the system 2000 embedded with carbon black thermal conductive adhesive as shown in FIG. 2A.

圖2B’~2D’ 是沿圖2A的剖面線II-II’所繪視的剖面圖，用以顯示另一種製造如圖2A所示之一種嵌入含碳黑導熱膠材的系統2000的製程。2B'~2D' are cross-sectional views drawn along the section line II-II' of FIG. 2A, for showing another manufacturing process of the system 2000 embedded with carbon black thermal conductive adhesive as shown in FIG. 2A.

圖3A的剖面圖為根據本新型實施例三所繪示的一種含碳黑導熱膠材的導熱片3000。3A is a cross-sectional view of a thermal conductive sheet 3000 containing a carbon black thermal conductive adhesive according to the third embodiment of the present invention.

圖3B的剖面圖為根據本新型實施例三所繪示的另一種含碳黑導熱膠材的導熱片3000’。3B is a cross-sectional view of another thermal conductive sheet 3000' containing carbon black thermal conductive adhesive according to the third embodiment of the present invention.

圖4A的剖面圖為根據本新型實施例四所繪示的一種嵌入含碳黑導熱膠材的導熱片的系統4000。FIG. 4A is a cross-sectional view of a system 4000 of a thermal conductive sheet embedded with a carbon black thermal conductive adhesive according to the fourth embodiment of the present invention.

圖4B的剖面圖為根據本新型實施例四所繪示的另一種嵌入含碳黑導熱膠材的導熱片的系統4000’。Fig. 4B is a cross-sectional view of another system 4000' with a thermal conductive sheet embedded with a carbon black thermal conductive adhesive according to the fourth embodiment of the present invention.

圖4C的剖面圖為根據本新型實施例四所繪示的又一種嵌入含碳黑導熱膠材的導熱片的系統4000”。The cross-sectional view of FIG. 4C is another system 4000" of a thermal conductive sheet embedded with a carbon black thermal conductive adhesive according to the fourth embodiment of the present invention.

圖4D的剖面圖為根據本新型實施例四所繪示的再一種嵌入含碳黑導熱膠材的導熱片的系統4000’”。Fig. 4D is a cross-sectional view of another system 4000'" with a thermal conductive sheet embedded with a carbon black thermal conductive adhesive according to the fourth embodiment of the present invention.

100:會發熱的元件 100: Components that generate heat

100A:會發熱的元件的表面 100A: The surface of the component that generates heat

200:含碳黑導熱膠材的散熱路徑圖案 200: The heat dissipation path pattern of the carbon black thermal conductive adhesive

300:熱感應器 300: Thermal sensor

1000:嵌入含碳黑導熱膠材的系統 1000: Embedded system with carbon black thermal conductive adhesive

Claims (10)

一種嵌入含碳黑導熱膠材的系統，包括： 一個會發熱的元件；以及 一個含碳黑導熱膠材構成的散熱路徑圖案，形成於該會發熱的元件上。 A system embedded with carbon black thermal conductive adhesive material, including: A component that generates heat; and A heat dissipation path pattern composed of a carbon black thermal conductive adhesive is formed on the heat generating element. 如請求項1所述之嵌入含碳黑導熱膠材的系統，更包括一絕緣塗層，形成於該會發熱的元件表面，使得該含碳黑導熱膠材構成的散熱路徑圖案被該絕緣塗層所圍繞。As described in claim 1, the system for embedding a carbon black-containing thermal conductive adhesive further includes an insulating coating formed on the surface of the heat-generating component, so that the heat dissipation path pattern formed by the carbon black-containing thermal conductive adhesive is coated by the insulating coating. Surrounded by layers. 如請求項1或2所述之嵌入含碳黑導熱膠材的系統，該會發熱的元件為半導體元件、半導體元件封裝體、發光二極體元件、發光二極體封裝體、燈具、電池或電池模組。As described in claim 1 or 2, the embedded carbon black thermal conductive adhesive system, the heat-generating components are semiconductor components, semiconductor component packages, light-emitting diode components, light-emitting diode packages, lamps, batteries or Battery module. 如請求項3所述之嵌入含碳黑導熱膠材的系統，該散熱路徑上更包括至少一個熱感應器，使得該會發熱的元件之散熱情況可藉由該熱感應器獲得監控。As described in claim 3, in the system embedded with a thermal conductive adhesive containing carbon black, the heat dissipation path further includes at least one thermal sensor, so that the heat dissipation of the heat-generating component can be monitored by the thermal sensor. 如請求項4所述之嵌入含碳黑導熱膠材的系統，更包括至少一個冷卻裝置，該冷卻裝置可在該會發熱的元件之散熱情況異常時啟動冷卻處理，使該會發熱的元件降溫。As described in claim 4, the system for embedding a thermal conductive adhesive containing carbon black further includes at least one cooling device that can initiate a cooling process when the heat dissipation of the heat-generating component is abnormal, so as to cool the heat-generating component . 一種含碳黑導熱膠材的導熱片，包括： 一基材，具有相對的第一表面以及第二表面；以及 一含碳黑導熱膠材構成的散熱路徑圖案，形成於該基材的該第一表面及/或該第二表面。 A thermal conductive sheet containing carbon black thermal conductive adhesive material, including: A substrate having opposite first and second surfaces; and A heat dissipation path pattern composed of a carbon black thermal conductive adhesive is formed on the first surface and/or the second surface of the substrate. 一種嵌入含碳黑導熱膠材的導熱片的系統，包括： 一個或一個以上的會發熱的元件；以及 一如請求項6所述之含碳黑導熱膠材的導熱片，且該或該等會發熱的元件與該含碳黑導熱膠材的導熱片中形成有該含碳黑導熱膠材構成的散熱路徑圖案的該第一表面及/或該第二表面接觸，藉此使該或該等會發熱的元件可藉由該含碳黑導熱膠材的導熱片中的該第一表面及/或該第二表面所形成的該含碳黑導熱膠材構成的散熱路徑圖案將熱散除。 A system for embedding a thermal conductive sheet containing carbon black thermal conductive adhesive material, including: One or more heating elements; and A thermally conductive sheet containing carbon black thermally conductive adhesive material as described in claim 6, and the thermally conductive sheet containing the carbon black thermally conductive adhesive material and the heat-generating component(s) are formed with the carbon black thermally conductive adhesive material The first surface and/or the second surface of the heat dissipation path pattern are in contact with each other, so that the heat-generating element(s) can use the first surface and/or the first surface and/or the thermal conductive sheet of the carbon black-containing thermal conductive adhesive The heat dissipation path pattern formed by the carbon black-containing thermal conductive adhesive formed on the second surface dissipates heat. 如請求項7所述的的嵌入含碳黑導熱膠材的導熱片的系統，該或該等會發熱的元件為半導體元件、半導體元件封裝體、發光二極體元件、發光二極體封裝體、燈具、電池或電池模組。The system for embedding a thermally conductive sheet containing a carbon black thermally conductive adhesive as described in claim 7, wherein the component or components that generate heat are semiconductor components, semiconductor component packages, light-emitting diode components, and light-emitting diode packages , Lamps, batteries or battery modules. 如請求項7或8所述之嵌入含碳黑導熱膠材的導熱片的系統，更包括至少一個熱感應器，使得該或該等會發熱的元件之散熱情況可藉由該熱感應器獲得監控。As described in claim 7 or 8, the system embedded with a thermal conductive sheet containing carbon black thermal conductive adhesive further includes at least one thermal sensor, so that the heat dissipation of the heat-generating component or components can be obtained by the thermal sensor monitor. 如請求項9所述之嵌入含碳黑導熱膠材的導熱片的系統，更包括至少一個冷卻裝置，該冷卻裝置可在該或該等會發熱的元件之散熱情況異常時啟動冷卻處理，使該或該等會發熱的元件降溫。As described in claim 9, the system for embedding a thermal conductive sheet containing a carbon black thermal conductive adhesive further includes at least one cooling device, which can initiate a cooling process when the heat dissipation of the heat-generating component or components is abnormal, so that The heat-generating component or components cools down.
TW109203398U 2020-03-25 2020-03-25 System embedded with a carbon black thermal conductive glue, thermal conductive film containing a carbon black thermal conductive glue and system embedded with the same TWM598847U (en)

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