TWM596970U - Precision alignment lamination device applied to flexible photomask or mold - Google Patents

Precision alignment lamination device applied to flexible photomask or mold Download PDF

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Publication number
TWM596970U
TWM596970U TW109202477U TW109202477U TWM596970U TW M596970 U TWM596970 U TW M596970U TW 109202477 U TW109202477 U TW 109202477U TW 109202477 U TW109202477 U TW 109202477U TW M596970 U TWM596970 U TW M596970U
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Taiwan
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module
template
unit
back plate
substrate
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TW109202477U
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Chinese (zh)
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邱建清
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樂恭系統股份有限公司
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Publication of TWM596970U publication Critical patent/TWM596970U/en

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Abstract

本創作係一種用於可撓性光罩或模具之精密對位貼合裝置,包括一固定座、一模件單元、一模板單元、一背板單元,該固定座中央具垂向透孔,該透孔周緣具側環壁;又該模件單元設於固定座上,具一環形模件框架及一模件;又該模板單元設於模件單元上方位置,並使模板單元與模件單元間具可抽氣之密閉下腔,又該模板單元具一可控變形之模板;又該背板單元設於模板單元上方位置,具一背板、一上腔蓋,該背板由不易變形材質製造並設於模板上方,又該模板、背板環周位置組合,並使背板與模板中央具可抽氣或注氣之密閉中腔,又該上腔蓋設於背板上方並與固定座固接,該上腔蓋與背板間具可抽氣或注氣之密閉上腔;藉此本創作可提升可撓性光罩或模具與基板更佳精確對位貼合功效。This creation is a precision alignment device for flexible masks or molds, including a fixed base, a modular unit, a template unit, and a backplane unit, the center of the fixed base has a vertical through hole, The perimeter of the through hole is provided with a side ring wall; the module unit is provided on a fixed base with an annular module frame and a module; and the template unit is provided above the module unit, and the template unit and the module There is a closed lower cavity that can be evacuated between the units, and the template unit has a template with controllable deformation; and the back plate unit is located above the template unit, and has a back plate and an upper cavity cover. The deformed material is manufactured and arranged above the template, and the template and the back plate are circumferentially combined, so that the back plate and the template have a closed central cavity that can be evacuated or injected, and the upper cavity cover is arranged above the back plate and It is fixedly connected to the fixed base, and the upper cavity cover and the back plate have a sealed upper cavity that can be evacuated or injected. With this creation, the flexible mask or mold and the substrate can be better and accurately aligned.

Description

用於可撓性光罩或模具之精密對位貼合裝置Precise positioning and fitting device for flexible mask or mold

本創作關於一種用於可撓性光罩或模具之精密對位貼合裝置,主要指一種可提供可撓性光罩或模具與基板較佳對位精度結構。This creation relates to a precision alignment bonding device for flexible masks or molds, mainly referring to a structure that can provide better alignment accuracy of flexible masks or molds and substrates.

隨著半導體精度之需求日益提升,該模件(如軟模光罩或模具)與基板間必須具精確平行度及相對位置,可防止曝光或壓印深度不均或位置誤差導致成品不良情況。With the increasing demand for semiconductor accuracy, the module (such as a soft mask or mold) and the substrate must have precise parallelism and relative position to prevent uneven exposure or imprinting depth or position error resulting in defective products.

習知壓印設備為提供模件與基板對位係設有對位機構,該對位機構主要具CCD攝影機分別移動至模件及基板位置標記取像分別取得模件與基板位置資訊,再令基板載台或模件載台根據取像對應之位置資料微調至精確相對位置。The conventional imprinting equipment is provided with a positioning mechanism for providing the alignment of the module and the substrate. The alignment mechanism mainly has a CCD camera to move to the position mark of the module and the substrate respectively to obtain the position information of the module and the substrate. The substrate stage or the module stage is fine-tuned to the precise relative position according to the position data corresponding to the imaging.

該可撓性模件進行對位貼合時係將模件周緣貼設於機台框架上,該模件中央有效貼合區為懸浮狀態,並藉由抽氣真空動作令模件變形或不抽氣回復或施以氣壓以令CCD攝影機可對模件及基板進行對位取像或作貼合動作。When the flexible module is aligned, the periphery of the module is placed on the machine frame, the effective bonding area in the center of the module is suspended, and the module is deformed or not Pumping back or applying air pressure to make the CCD camera can take the image or fit the module and the substrate.

然而該可撓性模件在對位或貼合過程中施以真空或施以氣壓易產生微量不可控之變形,其變形將造成降低對位貼合精度缺失。However, the application of vacuum or air pressure during the alignment or bonding process of the flexible module is likely to cause a small amount of uncontrollable deformation, and its deformation will cause a decrease in the accuracy of the alignment bonding.

本創作之目的在提供一種可提升模件與基板較佳對位貼合精度結構。The purpose of this creation is to provide a structure that can improve the better alignment accuracy of the module and the substrate.

本創作包括一固定座、一模件單元、一模板單元,該固定座中央具垂向透孔,該透孔周緣具側環壁;又該模件單元設於固定座上,具一環形模件框架,該模件框架設於固定座之透孔位置並組設模件;又該模板單元設於固定座之透孔內及模件單元上方位置,並使模板單元與模件單元間具可抽氣之密閉下腔,又該模板單元具一較模件可控變形之模板;又該背板單元設於固定座之透孔內及模板單元上方位置,具一背板、一上腔蓋,該背板由不易變形材質製造並設於模板上方,又該模板、背板環周位置組合,並使背板與模板中央具可抽氣或注氣之密閉中腔,又該上腔蓋設於背板上方並與固定座固接,該上腔蓋與背板間具可抽氣或注氣之密閉上腔。This creation includes a fixed base, a module unit, and a template unit. The center of the fixed base has a vertical through hole, and the periphery of the through hole has a side ring wall; and the module unit is provided on the fixed base and has a ring mold Frame, the module frame is set in the through hole of the fixing seat and the module is assembled; and the template unit is set in the through hole of the fixing seat and above the module unit, and the template unit and the module unit are provided with An airtight closed lower cavity, and the template unit has a template that can be controlled to deform compared with the module; and the back plate unit is provided in the through hole of the fixed seat and above the template unit, and has a back plate and an upper cavity Cover, the back plate is made of a non-deformable material and is arranged above the template, and the template and the back plate are circumferentially combined, so that the back plate and the template have a closed central cavity that can be evacuated or injected, and the upper cavity The cover is arranged above the back plate and fixedly connected with the fixing seat. There is a sealed upper cavity between the upper cavity cover and the back plate which can be evacuated or injected.

進一步該背板頂緣設置垂向可撓性定向元件與固定座接合。Further, the top edge of the back plate is provided with a vertically flexible directional element to be engaged with the fixing seat.

本創作在精密對位貼合過程中該可撓性模件可真空吸附與模板貼合,可避免模件在對位或貼合過程中產生不可控變形,又藉由可精密氣壓升降之背板間接加壓提升模板、模件變形量控制,又該可精密氣壓升降之背板及垂向可撓性定向元件可避免產生升降重複位置設差,可提升對位及貼合精度。In this creation, the flexible module can be vacuum adsorbed and attached to the template during the precise alignment and bonding process, which can avoid the uncontrollable deformation of the module during the alignment or bonding process. The indirect pressure of the board lifts the template and the deformation of the module is controlled. The back plate and vertical flexible directional element that can be lifted by precise air pressure can avoid the difference of the repeating position of the lift, and can improve the positioning and fitting accuracy.

請參閱圖一、二,本創作包括一固定座1、一模件單元2、一模板單元3、一背板單元4,該固定座1中央具垂向透孔11,該透孔11周緣具側環壁12。Please refer to Figures 1 and 2. This creation includes a fixed base 1, a modular unit 2, a template unit 3, and a backplane unit 4. The center of the fixed base 1 has a vertical through hole 11, and the through hole 11 has a peripheral edge侧环墙12.

模件單元2設於固定座1上,具一環形模件框架21、一環形下腔蓋22,該模件框架21設於固定座1之透孔11位置並組設模件211,該模件211為可撓性光罩或模具,又該下腔蓋22設於固定座1下方,該模件框架21設於下腔蓋22上方位置。The module unit 2 is set on the fixing base 1 and has an annular module frame 21 and an annular lower cavity cover 22. The module frame 21 is set at the position of the through hole 11 of the fixing base 1 and the module 211 is assembled. The component 211 is a flexible photomask or mold, and the lower cavity cover 22 is disposed below the fixing base 1, and the module frame 21 is disposed above the lower cavity cover 22.

模板單元3設於固定座1之透孔11內及模件單元2上方位置,具一模板31、一連結框32,該模板31由可控變形量之可撓性高分子材料製造平板形體,並設於模件211上方位置,又該連結框32為中空環形體設於模板31之環周下方位置,並使模板31、連結框32與模件211及下腔蓋22間具密閉下腔5,並可由抽氣裝置(圖中未顯示)對下腔5抽氣施以真空使模件211可貼附模板31。The template unit 3 is provided in the through hole 11 of the fixing base 1 and above the module unit 2, and has a template 31 and a connecting frame 32. The template 31 is made of a flexible polymer material with a controllable deformation amount to make a flat body. It is arranged above the module 211, and the connecting frame 32 is a hollow ring-shaped body arranged at a position below the circumference of the template 31, and the template 31, the connecting frame 32 and the module 211 and the lower cavity cover 22 have a sealed lower cavity 5. A vacuum can be applied to the lower chamber 5 by a suction device (not shown in the figure) to apply vacuum so that the module 211 can be attached to the template 31.

背板單元4設於固定座1之透孔11內及模板單元3上方位置,具一背板41、一上腔蓋42,該背板41由不易變形鋼性材質製造並設於模板31上方,並由接合元件(圖中未顯示)穿插連結框32及模板31、背板41環周位置組合,並使背板41與模板31中央具可由抽氣或注氣裝置(圖中未顯示)抽氣或注氣之密閉中腔6,又該背板41環周設置可滑動氣密環411與固定座1之透孔11側環壁12密合,又該背板41頂緣設置垂向可撓性定向元件412與固定座1接合,該垂向可撓性定向元件412可為彈簧鋼,並使背板41可對應固定座1定向上、下位移;又該上腔蓋42設於背板41上方並與固定座1固接,又該上腔蓋42與背板41間設定具可由抽氣或注氣裝置(圖中未顯示)抽氣或注氣之密閉上腔7。The back plate unit 4 is provided in the through hole 11 of the fixing base 1 and above the template unit 3, and has a back plate 41 and an upper cavity cover 42. The back plate 41 is made of a non-deformable steel material and is arranged above the template 31 , And the connecting frame 32 and the template 31 and the circumferential position of the back plate 41 are combined by the joining element (not shown), and the center of the back plate 41 and the template 31 can be evacuated or injected with air (not shown) The airtight or sealed air cavity 6 is provided with a sliding airtight ring 411 around the back plate 41 and the through-hole 11 side ring wall 12 of the fixing seat 1 is tightly closed, and the top edge of the back plate 41 is provided with a vertical direction The flexible directional element 412 is engaged with the fixed base 1, the vertical flexible directional element 412 can be spring steel, and the back plate 41 can be oriented upward and downward displacement corresponding to the fixed base 1; and the upper cavity cover 42 is provided at Above the back plate 41 is fixedly connected to the fixing base 1, and the upper chamber cover 42 and the back plate 41 are set to a sealed upper chamber 7 which can be evacuated or injected by an air extraction or injection device (not shown).

請參閱圖三~五,本創作實施時可於本對位貼合裝置下方設置可升降及調整位置之基板載台8,該基板載台8設置基板81,又設置CCD攝影機(圖中未顯示)對設定之模件211與基板81之貼合位置A進行對焦取像,該對位及貼合步驟為:Please refer to Figures 3 to 5, during the implementation of this creation, a substrate stage 8 that can be raised and lowered and adjusted in position can be provided below the alignment bonding device. The substrate stage 8 is provided with a substrate 81 and a CCD camera (not shown in the figure) ) Focusing on the bonding position A of the set module 211 and the substrate 81, the positioning and bonding steps are:

S1.如圖三所示,令下腔5於對位過程維持抽氣形成真空負壓使模件211與模板31貼附,又令中腔6抽氣形成真空負壓,令上腔7注氣形成正壓,並使模板31與背板41貼附使模件211位於模件211與基板81之貼合位置A。S1. As shown in FIG. 3, the lower chamber 5 is maintained to evacuate during the alignment process to form a vacuum negative pressure, so that the module 211 is attached to the template 31, and the central chamber 6 is evacuated to form a vacuum negative pressure, and the upper chamber 7 is injected. The gas forms a positive pressure, and the template 31 and the back plate 41 are attached so that the module 211 is located at the bonding position A of the module 211 and the substrate 81.

S2.CCD攝影機對模件211進行取像,取得模件211位置資訊。S2. The CCD camera photographs the module 211, and obtains the position information of the module 211.

S3.如圖四所示,對上腔7抽氣使背板41上升,該下、中腔5、6維持抽氣,並使模件211向上彎曲使模件211脫離該模件211與基板81之貼合位置A。S3. As shown in FIG. 4, the upper cavity 7 is evacuated to raise the back plate 41, and the lower and middle cavities 5, 6 are maintained to evacuate, and the module 211 is bent upward so that the module 211 is separated from the module 211 and the substrate 81 is the fitting position A.

S4.令基板載台8上升使基板81位於該模件211與基板81之貼合位置,並由CCD攝影機進行對焦取像取得基板81位置資訊。S4. The substrate stage 8 is raised so that the substrate 81 is located at the bonding position of the module 211 and the substrate 81, and the position information of the substrate 81 is acquired by focusing and imaging by a CCD camera.

S5.計算該模件211位置資訊與基板81位置資訊之定位差並調整基板載台8位置。S5. Calculate the positioning difference between the position information of the module 211 and the position information of the substrate 81 and adjust the position of the substrate stage 8.

S6.如圖五所示,令中、上腔6、7注氣形成正壓,且上腔7壓力大於中腔6,下腔5維持抽氣,並使背板41下移,該模板31及模件211回復,並使模件211位於該模件211與基板81之貼合位置A與基板81貼合。S6. As shown in Figure 5, the middle and upper chambers 6 and 7 are injected with gas to form a positive pressure, and the pressure in the upper chamber 7 is greater than that in the middle chamber 6. The lower chamber 5 maintains pumping and moves the back plate 41 downward. The template 31 The module 211 is restored, and the module 211 is located at the bonding position A of the module 211 and the substrate 81 and the substrate 81 is bonded.

該S6步驟後可對基板81進行對位曝光或模具壓印成型。After the step S6, the substrate 81 may be subjected to alignment exposure or mold stamping.

本創作又包括脫模S7步驟,該S7令中、上腔6、7不加任何氣壓,該下腔5注氣產生正壓,使模件211與基板81分離。This creation also includes the step S7 of demolding. In this S7, no air pressure is added to the middle and upper chambers 6, 7 and the lower chamber 5 is injected with gas to generate positive pressure, so that the module 211 is separated from the substrate 81.

本創作S3步驟該模件211可貼靠模板31向上彎曲不會形成懸浮狀態,又該S6步驟可令模件211配合模板31回復,不會產生不可控變形,又該背板41配合垂向可撓性定向元件412上、下移可使背板41具精確上、下位移路徑,並可提升較佳對位貼合精度(如微米級)。In step S3 of this creation, the module 211 can be bent upward against the template 31 without forming a suspended state, and in step S6, the module 211 can be restored with the template 31 without uncontrollable deformation, and the back plate 41 can be aligned with the vertical The upward and downward movement of the flexible directional element 412 can make the back plate 41 have a precise upward and downward displacement path, and can improve the better alignment accuracy (such as micron level).

本創作結構在精密對位貼合過程中該可撓性模件211可真空吸附與模板31貼合,可避免模件211在對位或貼合過程中產生不可控變形,又藉由可精密升降之背板41間接加壓提升模板31、模件211變形量控制,又該可精密升降之背板41可避免產生升降重複位置誤差,可提升對位及貼合精度。In this creative structure, the flexible module 211 can be vacuum-adsorbed and attached to the template 31 during the precise alignment bonding process, which can prevent the module 211 from generating uncontrollable deformation during the alignment or bonding process. The lifting back plate 41 indirectly presses the lifting template 31 and the deformation control of the module 211, and the precision lifting back plate 41 can avoid the occurrence of repeated lifting and lowering position errors, and can improve the alignment and fitting accuracy.

是以由以上所述,本創作可提升可撓性光罩或模具與基板更佳精確對位貼合功效,並前述實施例為本創作例示,並非本創作限制,凡依據本創作精神所為之等效改變亦應屬於本創作範疇內。 【圖號說明】 Therefore, as mentioned above, this creation can improve the effect of better precise alignment between the flexible mask or the mold and the substrate, and the foregoing embodiment is an example of the creation, not a limitation of this creation, which is based on the spirit of this creation Equivalent changes should also fall within the scope of this creation. 【Explanation of drawing number】

1:固定座 11:透孔 12:側環壁 2:模件單元 21:模件框架 211:模件 22:下腔蓋 3:模板單元 31:模板 32:連結框 4:背板單元 41:背板 411:氣密環 412:垂向可撓性定向元件 42:上腔蓋 5:下腔 6:中腔 7:上腔 8:基板載台 81:基板 1: fixed seat 11: Through hole 12: Side ring wall 2: Modular unit 21: Modular frame 211: Modular 22: Lower chamber cover 3: template unit 31: Template 32: Link box 4: backplane unit 41: backplane 411: Airtight ring 412: Vertical flexible directional element 42: Upper chamber cover 5: Lower cavity 6: middle cavity 7: upper cavity 8: substrate stage 81: substrate

圖一係本創作之分解圖。Figure 1 is an exploded view of this creation.

圖二係本創作之立體組合剖視圖。Figure 2 is a three-dimensional sectional view of this creation.

圖三係本創作對應S1步驟動作示意圖。Figure 3 is a schematic diagram of the action corresponding to step S1 in this creation.

圖四係本創作對應S3步驟動作示意圖。Figure 4 is a schematic diagram of the actions corresponding to step S3 in this creation.

圖五係本創作對應S6步驟動作示意圖。Figure 5 is a schematic diagram of the action corresponding to step S6 in this creation.

1:固定座 1: fixed seat

11:透孔 11: Through hole

12:側環壁 12: Side ring wall

2:模件單元 2: Modular unit

21:模件框架 21: Modular frame

211:模件 211: Modular

22:下腔蓋 22: Lower chamber cover

3:模板單元 3: template unit

31:模板 31: Template

32:連結框 32: Link box

4:背板單元 4: backplane unit

41:背板 41: backplane

412:垂向可撓性定向元件 412: Vertical flexible directional element

42:上腔蓋 42: Upper chamber cover

Claims (10)

一種用於可撓性光罩或模具之精密對位貼合裝置,包括: 一固定座,中央具垂向透孔,該透孔周緣具側環壁; 一模件單元,設於固定座上,具一環形模件框架,該模件框架設於固定座之透孔位置並組設模件; 一模板單元,設於固定座之透孔內及模件單元上方位置,並使模板單元與模件單元間具可抽氣之密閉下腔,又該模板單元具一較模件可控變形之模板; 一背板單元,設於固定座之透孔內及模板單元上方位置,具一背板、一上腔蓋,該背板由不易變形材質製造並設於模板上方,又該模板、背板環周位置組合,並使背板與模板中央具可抽氣或注氣之密閉中腔,又該上腔蓋設於背板上方並與固定座固接,該上腔蓋與背板間具可抽氣或注氣之密閉上腔。 A precision alignment and bonding device for flexible masks or molds, including: A fixed seat with a vertical through hole in the center, and a side ring wall on the periphery of the through hole; A module unit, which is arranged on the fixing base and has an annular module frame, which is arranged at the through hole position of the fixing base and sets up the module; A formwork unit is provided in the through hole of the fixing seat and above the module unit, and the airtight lower cavity between the formwork unit and the module unit can be evacuated, and the formwork unit has a controllable deformation than the module template; A backboard unit is provided in the through hole of the fixing seat and above the template unit. It has a backboard and an upper cavity cover. The backboard is made of a non-deformable material and is arranged above the template. The template and backplate ring The combination of the peripheral positions makes the back plate and the center of the template have a sealed middle cavity that can be evacuated or injected, and the upper cavity cover is provided above the back plate and fixedly connected to the fixed seat, and there is a space between the upper cavity cover and the back plate Airtight upper chamber for pumping or insufflation. 如請求項1所述之用於可撓性光罩或模具之精密對位貼合裝置,其中該背板環周設置可滑動氣密環與固定座之透孔側環壁密合。The precision alignment bonding device for a flexible reticle or mold as described in claim 1, wherein a slidable airtight ring is provided around the back plate ring and is in close contact with the through-hole side ring wall of the fixing seat. 如請求項1所述之用於可撓性光罩或模具之精密對位貼合裝置,其中該背板頂緣設置垂向可撓性定向元件與固定座接合。The precision alignment bonding device for a flexible mask or mold as described in claim 1, wherein the top edge of the back plate is provided with a vertical flexible directional element to be engaged with the fixing seat. 如請求項3所述之用於可撓性光罩或模具之精密對位貼合裝置,其中該垂向可撓性定向元件為彈簧鋼。The precision alignment bonding device for a flexible mask or mold as described in claim 3, wherein the vertical flexible directional element is spring steel. 如請求項1所述之用於可撓性光罩或模具之精密對位貼合裝置,其中該模件為可撓性光罩或模具。The precision alignment bonding device for a flexible mask or mold as described in claim 1, wherein the module is a flexible mask or mold. 如請求項1所述之用於可撓性光罩或模具之精密對位貼合裝置,其中該模件單元更包括一下腔蓋,該下腔蓋設於固定座下方,該模件框架設於下腔蓋上方位置。The precision alignment bonding device for a flexible mask or mold as described in claim 1, wherein the module unit further includes a lower cavity cover, the lower cavity cover is disposed under the fixing seat, and the module frame is disposed Above the lower chamber cover. 如請求項1所述之用於可撓性光罩或模具之精密對位貼合裝置,其中該模板由可控變形量之可撓性高分子材料製造平板形體。The precise alignment bonding device for a flexible mask or mold as described in claim 1, wherein the template is made of a flexible polymer material with a controllable deformation amount to form a flat plate. 如請求項1所述之用於可撓性光罩或模具之精密對位貼合裝置,其中該模板單元更包括一連結框,該連結框為中空環形體設於模板之環周下方位置,並使模板、連結框與模件及下腔蓋間具密閉下腔,又由接合元件穿插連結框及模板、背板環周位置組合。The precision alignment bonding device for a flexible photomask or mold as described in claim 1, wherein the template unit further includes a connecting frame, the connecting frame is a hollow ring-shaped body provided at a position below the circumference of the template, The lower cavity is sealed between the template, the connecting frame and the module and the lower cavity cover, and the circumferential position of the connecting frame, the template and the back plate is combined by the joining element. 如請求項1所述之用於可撓性光罩或模具之精密對位貼合裝置,其中該對位貼合裝置下方設置可升降及調整位置之基板載台,又設置CCD攝影機對設定模件與基板之貼合位置進行對焦取像,該對位及貼合步驟為: S1.令下腔於對位過程維持抽氣形成真空負壓使模件與模板貼附,又令中腔抽氣形成真空負壓,令上腔注氣形成正壓,並使模板與背板貼附使模件位於模件與基板之貼合位置; S2.CCD攝影機對模件進行取像,取得模件位置資訊; S3.對上腔抽氣使背板上升,該下、中腔維持抽氣,並使模件脫離該模件與基板之貼合位置; S4.令基板載台上升使基板位於該模件與基板之貼合位置,並由CCD攝影機進行對焦取像取得基板位置資訊; S5.計算該模件位置資訊與基板位置資訊之定位差並調整基板載台位置; S6.令中、上腔注氣形成正壓,且上腔壓力大於中腔,下腔維持抽氣,並使背板下移及該模板及模件回復,並使模件位於該模件與基板之貼合位置與基板貼合。 The precise alignment bonding device for flexible masks or molds as described in claim 1, wherein a substrate stage capable of raising and lowering and adjusting position is provided under the alignment bonding device, and a CCD camera is used to set the mold Focusing on the bonding position of the piece and the substrate, the alignment and bonding steps are: S1. Maintain the suction of the lower chamber during the alignment process to form a vacuum negative pressure, so that the module and the template are attached, and the middle chamber is suctioned to form a vacuum negative pressure, and the upper chamber is injected with gas to form a positive pressure, and the template and the back plate Attaching makes the module located at the bonding position of the module and the substrate; S2. The CCD camera captures the module and obtains the module position information; S3. Pumping the upper cavity to raise the backplane, the lower and middle cavities maintain pumping, and the module is separated from the bonding position of the module and the substrate; S4. The substrate stage is raised so that the substrate is located at the bonding position of the module and the substrate, and the CCD camera is used to focus and acquire the substrate position information; S5. Calculate the positioning difference between the position information of the module and the position information of the substrate and adjust the position of the substrate stage; S6. Inflate the air in the middle and upper chambers to form a positive pressure, and the pressure in the upper chamber is greater than the middle chamber. The lower chamber maintains suction, and the back plate moves down and the template and module are restored, and the module is located between the module and The bonding position of the substrate is bonded to the substrate. 如請求項1所述之用於可撓性光罩或模具之精密對位貼合裝置,其中更包括脫模S7步驟,該S7令中、上腔不加任何氣壓,該下腔注氣產生正壓,使模件與基板分離。The precision alignment device for flexible masks or molds as described in claim 1, which further includes a demolding step S7, which does not add any air pressure to the middle and upper chambers, and the lower chamber generates gas injection Positive pressure separates the module from the substrate.
TW109202477U 2020-03-06 2020-03-06 Precision alignment lamination device applied to flexible photomask or mold TWM596970U (en)

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