TWM596133U - Substrate wet processing apparatus and recycle ring - Google Patents

Abstract

The present disclosure provides a substrate wet processing equipment and a recycling ring. The substrate wet processing equipment includes a rotary table, a liquid supply device, a liquid recovery device, and a plurality of gas recovery devices. The rotary table is configured to place the substrate. The liquid supply device is configured to apply process liquid to the substrate. The liquid recovery device includes a recovery ring configured to collect the process liquid and its mixed gas-liquid mixture. The recovery ring includes a plurality of areas and a plurality of suction ports, and one of the suction ports is correspondingly provided in one of the areas. A plurality of gas recovery devices are respectively connected to the plurality of air extraction ports of the recovery ring to collect the gas-liquid mixture in the corresponding area of the recovery ring.

Description

Substrate wet processing equipment and recycling ring

The present disclosure relates to a wet processing equipment, in particular to a substrate wet processing equipment and a recycling ring.

In the manufacturing process of the semiconductor substrate, it is necessary to perform multiple processing steps on the device mounting surface of the semiconductor substrate, including wet processing procedures such as etching and cleaning. With the increase in the complexity of the manufacturing process of semiconductor substrates, a substrate wet processing machine has been developed, which adopts a design of a rotary table corresponding to multiple liquid recovery modules. The substrate wet processing machine can apply a variety of different chemical liquids to the substrate on the rotating table, and collect the chemical liquids through the corresponding recovery module. By applying different chemical liquids, various metal layers or thin film layers of other materials on the semiconductor substrate can be cleaned and etched.

In the traditional substrate wet processing machine, the recovery ring is designed with a single suction port. However, when a conventional substrate wet processing machine is used to clean and etch a large-area substrate, the volume of gas generated by the process reaction is very large. The design of a single suction port cannot support the discharge of such a large amount of gas, so a large amount of gas cannot be effectively discharged out of the process chamber through the recovery ring. This will cause residual gas to stay in the recovery ring or the cavity of the substrate wet processing machine, which will affect the cleaning efficiency of the substrate, and even cause the exhaust gas to return to pollute the substrate.

In view of this, it is necessary to propose a substrate wet processing equipment and a recycling ring to solve the problems in the conventional technology.

In order to solve the above-mentioned problems of the conventional technology, the purpose of the present disclosure is to provide a substrate wet processing equipment and a recycling ring, which can solve the problem of the traditional recycling ring adopting a single extraction by designing a single recycling ring with a plurality of gas recycling devices Due to the design, there is a problem that large amounts of large gas cannot be discharged.

To achieve the above objective, the present disclosure provides a substrate wet processing apparatus including a rotating table, a liquid supply device, a liquid recovery device, and a plurality of gas recovery devices. The rotating table is configured to place a substrate. The liquid supply device is disposed above the rotating table and is configured to apply a process liquid to the substrate. The liquid recovery device is arranged around the rotating table and can move relative to the rotating table along a vertical direction, wherein the liquid recovery device includes a recovery ring configured to collect the process liquid and its mixed The gas-liquid mixture and the recovery ring include a plurality of areas and a plurality of suction ports, and one of the suction ports is correspondingly provided in one of the areas. A plurality of gas recovery devices are respectively connected to the plurality of air extraction ports of the recovery ring to collect the gas-liquid mixture in the corresponding area of the recovery ring.

In a preferred embodiment, each of the gas recovery devices includes a wind box, an exhaust pipe, and a gas collecting box. The wind box includes a first connection port and a second connection port, wherein the first connection port is connected to one of the suction ports of the recovery ring, so that the gas-liquid mixture in the recovery ring passes through the first connection port Enter the inside of the bellows. The exhaust pipe is connected to the second connection port of the bellows. A gas collecting box is connected to the exhaust pipe, and is configured to collect the gas-liquid mixture to discharge it.

In a preferred embodiment, the liquid recovery device includes a plurality of the recovery rings stacked along the vertical direction, and each of the gas recovery devices includes a plurality of the wind boxes and a plurality of the exhaust pipes, and the A plurality of wind boxes are connected to the gas collection box through the plurality of exhaust pipes, wherein the plurality of wind boxes are respectively connected to the air extraction ports in the same area of the plurality of recovery rings.

In a preferred embodiment, the recovery ring includes a plurality of stoppers configured to divide the recovery ring into the plurality of regions, and the gas-liquid mixture in any two adjacent regions cannot pass through the stoppers Circulate with each other.

In a preferred embodiment, the recycling ring further includes a receiving port and a partition plate. The receiving port is aligned with the rotary table. A partition plate is provided inside the recovery ring to separate an inner ring space and an outer ring space, wherein the inner ring space receives the process liquid and its mixed gas-liquid mixture entering from the receiving port, and the split The baffle blocks the process liquid from flowing from the inner ring space to the outer ring space, and the partition plate is formed with a plurality of through holes, so that the gas-liquid mixture in the inner ring space enters the through the plurality of through holes The outer ring space, wherein the plurality of stoppers are arranged in the outer ring space.

In a preferred embodiment, the recovery ring further includes a liquid collection port that communicates with the inner ring space and is configured to allow the process liquid to be discharged from the liquid collection port.

In a preferred embodiment, the recycling ring further includes an annular upper cover, an annular bottom plate, and an outer annular wall. An annular bottom plate is provided corresponding to the annular upper cover. The outer ring wall is connected to the outer periphery of the ring-shaped upper cover and the outer periphery of the ring-shaped bottom plate, wherein the plurality of suction ports are provided on the outer ring wall and are correspondingly connected to the plurality of gas recovery devices, wherein the partition plate is provided Between the annular upper cover and the annular bottom plate, and the receiving port is located between the inner peripheral edge of the annular upper cover and the inner peripheral edge of the annular bottom plate.

In a preferred embodiment, the liquid supply device includes a plurality of nozzles.

The present disclosure also provides a recycling ring for substrate wet processing equipment, which includes an annular upper cover, an annular bottom plate, a receiving port, and an outer annular wall. An annular bottom plate is provided corresponding to the annular upper cover. The receiving port is located between the inner periphery of the ring-shaped upper cover and the inner periphery of the ring-shaped bottom plate, and is aligned with the rotating table. The outer ring wall is connected to the outer periphery of the ring-shaped upper cover and the outer periphery of the ring-shaped bottom plate, wherein the outer ring wall is provided with a plurality of suction ports.

In a preferred embodiment, the recovery ring further includes a plurality of stoppers disposed between the ring-shaped upper cover and the ring-shaped bottom plate, configured to divide the recovery ring into the plurality of regions, and one of the exhaust ports corresponds to Set in one of the areas.

Compared with the prior art, the design of the substrate wet processing equipment of the present disclosure by using a single recovery ring connected to a plurality of gas recovery devices can enhance the extraction volume of the recovery ring, thereby preventing the reaction of the gas-liquid mixture due to insufficient exhaust volume Problems stuck in the recycling ring. Furthermore, by using the equal-distance design of the extraction ports of the recovery ring, the extraction volume of the recovery ring can be evenly distributed among the four gas recovery devices, thereby avoiding the gas-liquid after the reaction due to the uneven extraction volume The mixture stays in a corner of the recycling ring.

In order to make the above-mentioned and other objects, features, and advantages of the present disclosure more obvious and understandable, the preferred embodiments of the present disclosure will be specifically described below, and in conjunction with the accompanying drawings, detailed descriptions are as follows.

Please refer to FIG. 1, which shows a schematic diagram of a substrate wet processing workstation 1 according to a preferred embodiment of the present disclosure. The substrate wet processing workstation 1 is suitable for processing large-sized substrates. For example, in a fan-out panel-level package (fan-out panel level package) process, the substrate processing device performs wet etching or cleaning on the square substrate. In order to increase production capacity, the substrates have been developed toward large sizes in recent years. For example, the area of substrates currently used has reached 600 mm x 600 mm. The substrate wet processing workstation 1 includes a material inlet 2, a material outlet 3, a first conveying device 4, a second conveying device 5, and a plurality of substrate wet processing equipment 6. The substrate to be processed enters the substrate wet processing workstation 1 via the material inlet 2. The first transfer device 4 transfers the substrate to the second transfer device 5, and then the second transfer device 5 transfers the substrate to one of the substrate wet processing equipment 6 according to the process requirements. Specifically, in the present disclosure, different substrate wet processing equipment 6 respectively use chemical liquids of different properties (such as acids, alkalis, organic solvents, etc.), and each uses a separate pumping system for gas collection and discharge to avoid different The gas of the nature chemical potion reacts interactively, affecting industrial safety.

Please refer to FIG. 2, which shows a schematic diagram of a substrate wet processing apparatus 6 according to a preferred embodiment of the present disclosure. The substrate wet processing apparatus 6 includes a liquid supply device 61 and a rotary table 62. The substrate 9 to be processed is placed on the turntable 62. In this embodiment, the top of the rotating table 62 includes a vacuum chuck, and the suction force applied by the vacuum chuck allows the substrate 9 to be fixed on the top of the rotating table 62. The rotating table 62 is provided with a driving mechanism for driving the rotating table 62 to rotate about an axis. In other embodiments, other methods may be used to fix the wafer on the rotating table, such as a clamping device. Furthermore, the liquid supply device 61 is provided above the turntable 62 and is used to apply process liquid to the substrate 9. In the present disclosure, when the substrate wet processing apparatus 6 is used to clean or etch a large-area substrate 9, a sufficiently large amount of process liquid must be provided. Therefore, the chemical supply swing arm of the liquid supply device 61 includes a plurality of nozzles 611, so that the process liquid can be instantly and evenly dispersed on the large-area substrate 9. On the other hand, the liquid supply device 61 can apply a plurality of process liquids to the substrate 9. Specifically, the liquid supply device 61 further includes a plurality of liquid transmission lines. The nozzle 611 is arranged to be aligned with the top of the rotating table 62, and one end of the plurality of liquid transmission lines is connected to the nozzle 611, and the other ends are respectively connected to different process liquid supply ends. With this design, the liquid supply device 61 can be controlled to apply the corresponding process liquid to the substrate 9 on the turntable 62 according to the process requirements, so as to perform etching or cleaning operations on the substrate 9.

Please refer to FIG. 3, which shows a partial perspective view of the substrate wet processing apparatus 6 of the preferred embodiment of the present disclosure. The substrate wet processing apparatus 6 also includes a liquid recovery device 63 and four gas recovery devices 64. The liquid recovery device 63 is circumferentially arranged around the rotating table 62 for collecting process liquid thrown off from the surface of the substrate 9 on the rotating table 62 due to centrifugal force and discharging the process liquid. The four gas recovery devices 64 are correspondingly connected to the liquid recovery device 63 for discharging the collected gas-liquid mixture. The specific structures of the liquid recovery device 63 and the gas recovery device 64 of this embodiment will be described in detail later. On the other hand, the liquid recovery device 63 is connected to the lifting device to control the liquid recovery device 63 to move up and down relative to the rotary table 62 in a vertical direction. In addition, since the four gas recovery devices 64 are connected to the liquid recovery device 63, when the liquid recovery device 63 moves up and down, the four gas recovery devices 64 will rise or fall together.

As shown in FIG. 3, the liquid recovery device 63 of the present disclosure includes three recovery rings stacked vertically, namely a first recovery ring 631, a second recovery ring 632, and a third recovery ring 633. In other embodiments, different numbers of recycling rings may be used, which is not limited thereto. The first recovery ring 631, the second recovery ring 632, and the third recovery ring 633 are configured to collect one of the corresponding process liquids and their mixed gas-liquid mixture. By the control of the lifting device, the first recovery ring 631, the second recovery ring 632, and the third recovery ring 633 move synchronously, so that the designated first recovery ring 631, second recovery ring 632, or third The recovery ring 633 moves to be aligned with the rotary table 62, where alignment means that one of the first recovery ring 631, the second recovery ring 632, or the third recovery ring 633 liquid receiving port and the substrate 9 on the rotary table 62 Adjacent, so that when the liquid supply device 61 applies process liquid to the substrate 9 on the rotating table 62, and the rotating table 62 rotates, the process liquid thrown off the surface of the substrate 9 on the rotating table 62 due to centrifugal force can be one of the adjacent The first recovery ring 631, the second recovery ring 632, or the third recovery ring 633 is collected. That is to say, the substrate wet processing apparatus 6 of the present disclosure is a cleaning and etching apparatus having a movable liquid recovery device 63, which can keep the substrate 9 on the rotating table 62 fixed horizontally without moving up and down. When the substrate wet processing process is performed, the designated recovery ring is controlled to move to the alignment rotating table 62 according to the steps performed, and then the liquid supply device 61 above the substrate 9 sprays a specific process liquid onto the surface of the substrate 9 and the rotating table 62 The substrate 9 is driven to rotate to collect the specific process liquid and its mixed gas-liquid mixture.

Please refer to FIG. 4, which shows a partial perspective view of the recovery ring and liquid recovery device of the substrate wet processing apparatus 6 of FIG. 3. FIG. 4 illustrates the first recycling ring 631 located on the first floor. It should be understood that the structures of the remaining second recovery ring 632 and the third recovery ring 633 are substantially the same as the structure of the first recovery ring 631. As shown in FIGS. 3 and 4, the first recovery ring 631 includes a ring-shaped upper cover 6301, a ring-shaped bottom plate 6302, an outer ring wall 6303, a partition plate 6304, four stoppers 6306, a receiving port 6307, a liquid collection port 6308, And four suction ports 6309. The ring-shaped upper cover 6301 is provided corresponding to the ring-shaped bottom plate 6302. Preferably, the annular bottom plate 6302 of the recovery ring located above serves as the annular upper cover 6301 of the recovery ring located below, which maximizes the space inside each recovery ring, saves the material used by the liquid recovery device 63, and effectively The overall volume of the liquid recovery device 63 is reduced. The outer ring wall 6303 of the first recovery ring 631 is connected to the outer periphery of the ring-shaped upper cover 6301 and the outer periphery of the ring-shaped bottom plate 6302. The ring-shaped upper cover 6301, the ring-shaped bottom plate 6302, and the outer ring wall 6303 are connected to each other and define an internal space of the first recovery ring 631. The receiving port 6307 of the first recovery ring 631 is located between the inner periphery of the annular upper cover 6301 and the inner periphery of the annular bottom plate 6302. When the designated first recovery ring 631 moves to the alignment rotary table 62, the receiving port 6307 of the first recovery ring 631 will be aligned with the rotary table 62, so that the first recovery ring 631 can receive the corresponding process liquid through the receiving port 6307 And their mixed gas-liquid mixture.

As shown in FIG. 4, the partition plate 6304 of the first recovery ring 631 is provided inside the first recovery ring 631 to partition the inner space of the first recovery ring 631 into an inner ring space 6310 and an outer ring space 6311. The inner ring space 6310 is used to receive the process liquid and its mixed gas-liquid mixture entering from the receiving port 6307, and the blocking plate 6304 prevents the process liquid from flowing from the inner ring space 6310 to the outer ring space 6311. A plurality of through holes 6305 are formed on the partition plate 6304, so that the gas-liquid mixture in the inner ring space 6310 can enter the outer ring space 6311 through the through holes 6305.

As shown in FIG. 4, the four stoppers 6306 of the first recovery ring 631 are configured to divide the first recovery ring 631 into four areas, namely the first area 6312, the second area 6313, the third area 6314, and the fourth Area 6315. Specifically, the four stoppers 6306 are provided in the outer ring space 6311, and are connected to the ring-shaped upper cover 6301 and the ring-shaped bottom plate 6302, so that the gas-liquid mixture in the two adjacent areas cannot circulate through the block 6306. Four suction ports 6309 are provided on the outer ring wall 6303. It should be noted that one of the suction ports 6309 is correspondingly disposed in one of the regions 6312~6315 of the first recovery ring 631. In the present disclosure, the number of suction ports 6309 corresponds to the number of stops 6306, and in other embodiments, other numbers of suction ports 6309 and stops 6306 may be used, but not limited thereto. Preferably, the sizes of the four regions 6312~6315 separated by the four stoppers 6306 are similar or equal. Moreover, preferably, the four suction ports 6309 are equally spaced from each other, so that the design can apply uniform suction to the substrate, thereby avoiding that the process liquid on the substrate is oriented in a single direction when the substrate is etched. The air flow is biased to one side, resulting in uneven etching of the substrate.

As shown in FIG. 4, the liquid collection port 6308 of the first recovery ring 631 communicates with the inner ring space 6310 and is configured to allow process liquid to be discharged from the liquid collection port 6308. Specifically, the liquid collection port 6308 is located at the lowest point of the horizontal position of the first recovery ring 631, so that the process liquid collected by the first recovery ring 631 flows to the liquid collection port 6308 due to gravity. In addition, the liquid collection port 6308 of the first recovery ring 631 is connected to the corresponding recovery pipe, and then the collected process liquid is discharged or recovered. For example, as shown in FIG. 5, the third recovery ring 633 is connected to the recovery pipe 6316, and the process liquid collected by the third recovery ring 633 is discharged through the path 71. Optionally, the recovery pipe 6316 can be connected to the circulation system to return the processed process liquid to the liquid supply device of the substrate wet processing equipment again.

As shown in FIG. 3, the substrate wet processing apparatus of the present disclosure is provided with a gas recovery device 64 corresponding to the number of exhaust ports 6309 of each recovery ring 631 to 633, that is, four gas recovery devices 64. In addition, the four gas recovery devices 64 are respectively connected to the four suction ports 6309 of each recovery ring 631-633 to collect the gas-liquid mixture in the corresponding area of the recovery rings 631-633. In this embodiment, each gas recovery device 64 includes three wind boxes 641-643, three exhaust pipes 644-646, and a gas collecting box 647, wherein the wind boxes 641-643 and the exhaust pipes 644-646 The number corresponds to the number of recycling rings 631~633. The first air box 641 of the first recovery ring 631 is connected to the air collection box 647 through the first exhaust pipe 644. The second air box 642 of the second recovery ring 632 is connected to the air collection box 647 through the second exhaust pipe 645. The third air box 643 of the third recovery ring 633 is connected to the air collection box 647 through the third exhaust pipe 646. It should be noted that the first to third air boxes 641 to 643 are correspondingly connected to the air extraction ports in the same area of the first to third recovery rings 631 to 633, respectively. In other words, a single gas recovery device 64 is used to collect the gas-liquid mixture in a single area of each recovery ring 631-633.

Please refer to FIG. 5, which shows a partial cross-sectional view of the substrate wet processing apparatus 6 of FIG. Fig. 5 illustrates the third air box 643 and the third exhaust pipe 646 connected to the third recovery ring 633. It should be understood that the structures of the remaining wind boxes and exhaust pipes are substantially the same as the structures of the third wind boxes 643 and third exhaust pipes 646. In the present embodiment, the third recovery ring 633 includes four third air boxes 643 and four third exhaust pipes 646. The third bellows 643 includes an upper surface 6431, a lower surface 6432, a side surface 6433, a first connection port 6434, a second connection port 6435, and a cavity 6436. The upper surface 6431 and the lower surface 6432 of the third bellows 643 are opposed to each other, and the side surface 6433 is located between the upper surface 6431 and the lower surface 6432. The upper surface 6431, the lower surface 6432, and the side surface 6433 are connected to each other to form a cavity 6436. The side surface 6433 of the third bellows 643 is formed with a first connection port 6434, and the lower surface 6432 is formed with a second connection port 6435. The first connection port 6434 of the third bellows 643 is connected to the exhaust port of the third recovery ring 633. As shown in FIG. 5, the gas recovery device 64 applies a negative pressure to the third recovery ring 633 so that the inside of the third recovery ring 633 and the gas recovery device 64 generates an air flow like the path 72. Specifically, the gas-liquid mixture in the third recovery ring 633 enters the cavity 6436 of the third air box 643 via the first connection port 6434. In addition, the third exhaust pipe 646 is connected to the second connection port 6435 of the third air box 643, and further transmits the gas-liquid mixture to the gas collecting box 647. The gas collecting tank 647 can discharge the gas-liquid mixture collected from the first to third recovery rings 631-633.

In summary, the design of the substrate wet processing equipment of the present disclosure by using a single recovery ring connected to a plurality of gas recovery devices can strengthen the extraction volume of the recovery ring, thereby preventing the reaction of the gas-liquid mixture from remaining due to insufficient exhaust volume Problems in the recycling ring. Furthermore, by using the equal-distance design of the extraction ports of the recovery ring, the extraction volume of the recovery ring can be evenly distributed among the four gas recovery devices, thereby avoiding the gas-liquid after the reaction due to the uneven extraction volume The mixture stays in a corner of the recycling ring.

The above are only the preferred embodiments of the present disclosure. It should be pointed out that for those skilled in the art, without departing from the principles of the present disclosure, a number of improvements and retouchings can be made, and these improvements and retouchings should also be regarded as the present disclosure. protected range.

1: substrate wet processing workstation

2: feeding port

3: Outlet

4: The first transmission device

5: Second conveyor

6: substrate wet processing equipment

61: Liquid supply device

611: Nozzle

62: Rotating table

63: Liquid recovery device

631: The first recycling ring

632: Second recovery ring

633: The third recycling ring

6301: Ring cover

6302: Ring bottom plate

6303: Outer ring wall

6304: Divider

6305: through hole

6306: Stop

6307: Receive port

6308: Liquid collection port

6309: Suction port

6310: inner ring space

6311: outer ring space

6312: First area

6313: Second area

6314: Third area

6315: Fourth area

6316: Recovery tube

64: Gas recovery device

641: The first bellows

642: Second bellows

643: Third bellows

6431: upper surface

6432: Lower surface

6433: Side surface

6434: the first connection port

6435: Second connection port

6436: cavity

644: The first exhaust pipe

645: Second exhaust pipe

646: Third exhaust pipe

647: Gas tank

71, 72: Path

9: substrate

Figure 1 shows a schematic diagram of a substrate wet processing workstation of the preferred embodiment of the present disclosure; FIG. 2 shows a schematic diagram of a substrate wet processing apparatus according to a preferred embodiment of the present disclosure; Figure 3 shows a partial perspective view of a substrate wet processing apparatus of a preferred embodiment of the present disclosure; Figure 4 shows a partial perspective view of the recovery ring and liquid recovery device of the substrate wet processing equipment of Figure 3; and Figure 5 shows a partial cross-sectional view of the substrate wet processing apparatus of Figure 3.

63: Liquid recovery device

631: The first recycling ring

632: Second recovery ring

633: The third recycling ring

6301: Ring cover

64: Gas recovery device

641: The first bellows

642: Second bellows

643: Third bellows

644: The first exhaust pipe

645: Second exhaust pipe

646: Third exhaust pipe

647: Gas tank

Claims (10)

A substrate wet processing device includes: a rotating table configured to place a substrate; a liquid supply device provided above the rotating table and configured to apply a process liquid to the substrate; and a liquid recovery device provided circumferentially Around the rotating table, and can move relative to the rotating table along a vertical direction, wherein the liquid recovery device includes a recovery ring configured to collect the process liquid and its mixed gas-liquid mixture, and the recovery ring It includes a plurality of areas and a plurality of suction ports, and one of the suction ports is correspondingly set in one of the areas; and a plurality of gas recovery devices are respectively connected to the plurality of suction ports of the recovery ring to collect the recovery ring The gas-liquid mixture in the corresponding area. The substrate wet processing apparatus according to claim 1, wherein each of the gas recovery devices includes: an air box including a first connection port and a second connection port, wherein one of the first connection port and the recovery ring The suction port is connected so that the gas-liquid mixture in the recovery ring enters the inside of the wind box through the first connection port; an exhaust pipe is connected to the second connection port of the wind box; and an air collection box , Connected to the exhaust pipe, configured to collect the gas-liquid mixture to discharge it. The substrate wet processing apparatus according to claim 2, wherein the liquid recovery device includes a plurality of the recovery rings stacked along the vertical direction, and each of the gas recovery devices includes a plurality of the wind boxes and a plurality of the exhaust pipes And the plurality of wind boxes are connected to the gas collecting box through the plurality of exhaust pipes, wherein the plurality of wind boxes are respectively connected to the exhaust ports of the same area of the plurality of recovery rings. The substrate wet processing apparatus according to claim 1, wherein the recovery ring includes a plurality of stoppers configured to divide the recovery ring into the plurality of areas, and the gas-liquid mixture in any two adjacent areas cannot pass through the Blocks and circulate with each other. The substrate wet processing apparatus according to claim 4, wherein the recycling ring further includes: a receiving port aligned with the rotary table; and a partition plate disposed inside the recycling ring to separate an inner ring space and a An outer ring space, wherein the inner ring space receives the process liquid entering from the receiving port and the mixed gas-liquid mixture, and the partition plate blocks the flow of the process liquid from the inner ring space to the outer ring space, and The partition plate is formed with a plurality of through holes, so that the gas-liquid mixture in the inner ring space enters the outer ring space through the plurality of through holes, wherein the plurality of stoppers are disposed in the outer ring space. The substrate wet processing apparatus according to claim 5, wherein the recovery ring further includes a liquid collection port, communicating with the inner ring space, and configured to allow the process liquid to be discharged from the liquid collection port. The substrate wet processing apparatus according to claim 5, wherein the recovery ring further includes: a ring-shaped upper cover; a ring-shaped bottom plate corresponding to the ring-shaped upper cover; and an outer ring wall, the outer periphery of the ring-shaped upper cover and the ring-shaped bottom plate The outer periphery is connected, wherein the plurality of suction ports are provided on the outer ring wall and are correspondingly connected to the plurality of gas recovery devices, wherein the partition plate is provided between the ring-shaped upper cover and the ring-shaped bottom plate, and the receiving port Located between the inner periphery of the ring-shaped upper cover and the inner periphery of the ring-shaped bottom plate. The substrate wet processing apparatus according to claim 1, wherein the liquid supply device includes a plurality of nozzles. A recycling ring for substrate wet processing equipment, including: A ring-shaped upper cover; a ring-shaped bottom plate corresponding to the ring-shaped upper cover; a receiving port located between the inner periphery of the ring-shaped upper cover and the inner periphery of the ring-shaped bottom plate and aligned with the rotary table; and an outer ring wall, It is connected with the outer periphery of the ring-shaped upper cover and the outer periphery of the ring-shaped bottom plate, wherein the outer ring wall is provided with a plurality of suction ports. The recycling ring for substrate wet processing equipment according to claim 9, wherein the recycling ring further includes a plurality of stoppers, is disposed between the annular upper cover and the annular bottom plate, and is configured to divide the recycling ring into the plural regions , And one of the suction ports is correspondingly provided in one of the areas.

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