CN210897222U - Substrate wet processing equipment and recycling ring - Google Patents

Abstract

The present disclosure provides a substrate wet processing equipment and a recovery ring. The substrate wet processing equipment includes a rotating table, a liquid supply device, a liquid recovery device, and a plurality of gas recovery devices. The rotating table is configured to place a substrate. The liquid supply device is configured to apply a process liquid to the substrate. The liquid recovery device includes a recovery ring, which is configured to collect the process liquid and a gas-liquid mixture thereof. The recovery ring includes a plurality of areas and a plurality of gas extraction ports, and one of the gas extraction ports is correspondingly arranged in one of the areas. A plurality of gas recovery devices are respectively connected to the plurality of gas extraction ports of the recovery ring to collect the gas-liquid mixture in the corresponding areas of the recovery ring.

Description

Substrate wet processing equipment and recycling ring

technical field

The present disclosure relates to a wet processing device, in particular to a substrate wet processing device and a recycling ring.

Background technique

In the process of the semiconductor substrate, it is necessary to perform multiple processing steps on the component installation surface of the semiconductor substrate, including wet processing procedures such as etching and cleaning. As the process complexity of semiconductor substrates increases, a substrate wet processing machine has been developed, which adopts the design of one rotary table corresponding to multiple liquid recovery modules. The substrate wet processing machine can apply a variety of different chemical liquids to the substrate on the rotary table, and collect the chemical liquids through the corresponding recycling module. Various metal layers or other material thin film layers on the semiconductor substrate can be cleaned and etched by applying different chemical liquids.

In the traditional substrate wet processing machine, the recycling ring is designed with a single air extraction port. However, when a conventional substrate wet processing machine is used to clean and etch a large-area substrate, the volume of gas generated by the process reaction is very large. The design of a single air extraction port cannot handle the discharge of such a large amount of gas, so a large amount of gas cannot be effectively discharged out of the process chamber through the recovery ring. This will cause residual gas to stay in the recycling ring or the cavity of the substrate wet processing machine, thereby affecting the cleaning efficiency of the substrate, and even causing the exhaust gas to flow back to contaminate the substrate.

In view of this, it is necessary to propose a substrate wet processing equipment and a recycling ring to solve the problems existing in the prior art.

Utility model content

In order to solve the above-mentioned problems of the prior art, the purpose of the present disclosure is to provide a substrate wet processing equipment and a recovery ring, which can solve the problem of using a single gas extraction device in the traditional recovery ring through the design of a single recovery ring with multiple gas recovery devices. The design leads to the problem that a large amount of atmospheric gas cannot be discharged.

In order to achieve the above object, the present disclosure provides a substrate wet processing apparatus, which includes a rotary table, a liquid supply device, a liquid recovery device, and a plurality of gas recovery devices. The turntable is configured to place the substrate. A liquid supply is disposed above the turntable and configured to apply a process liquid to the substrate. A liquid recovery device is circumferentially arranged around the rotary table and is movable relative to the rotary table in a vertical direction, wherein the liquid recovery device includes a recovery ring configured to collect the process liquid and The mixed gas-liquid mixture and the recovery ring include a plurality of regions and a plurality of suction ports, and one of the suction ports is correspondingly arranged in one of the regions. A plurality of gas recovery devices are respectively connected to the plurality of gas suction ports of the recovery ring, so as to collect the gas-liquid mixture in corresponding regions of the recovery ring.

In a preferred embodiment, each of the gas recovery devices includes a bellows, an exhaust pipe, and a plenum. The bellows includes a first connection port and a second connection port, wherein the first connection port is connected with one of the suction ports of the recovery ring, so that the gas-liquid mixture in the recovery ring passes through the first connection port. A connection port enters the interior of the bellows. The exhaust pipe is connected with the second connection port of the bellows. A gas collecting tank is connected to the exhaust pipe and is configured to collect the gas-liquid mixture to discharge it.

In a preferred embodiment, the liquid recovery device includes a plurality of the recovery rings stacked along the vertical direction, and each of the gas recovery devices includes a plurality of the bellows and a plurality of the exhausts The plurality of bellows are connected to the air collecting box through the plurality of exhaust pipes, wherein the plurality of bellows are respectively connected to the air suction ports in the same area of the plurality of recovery rings.

In a preferred embodiment, the recovery ring includes a plurality of blocks, configured to divide the recovery ring into the plurality of regions, and the gas-liquid mixture in any two adjacent regions cannot pass through. The blocks communicate with each other.

In a preferred embodiment, the recovery ring further includes a receiving port and a dividing plate. The receiving port is aligned with the rotary table. A dividing plate is arranged inside the recovery ring to separate an inner annular space and an outer annular space, wherein the inner annular space receives the process liquid and the gas-liquid mixture thereof entering from the receiving port, And the dividing plate blocks the flow of the process liquid from the inner annular space to the outer annular space, and a plurality of through holes are formed on the dividing plate, so that the gas in the inner annular space is formed. The liquid mixture enters the outer annular space through the plurality of through holes, wherein the plurality of stoppers are provided in the outer annular space.

In a preferred embodiment, the recovery ring further includes a liquid collection port in communication with the inner ring space and configured to allow the process liquid to be discharged from the liquid collection port.

In a preferred embodiment, the recovery ring further comprises an annular upper cover, an annular bottom plate, and an outer annular wall. The annular bottom plate is arranged corresponding to the annular upper cover. The outer ring wall is connected with the outer peripheral edge of the annular upper cover and the outer peripheral edge of the annular bottom plate, wherein the plurality of air suction ports are arranged on the outer ring wall and are correspondingly connected with the plurality of gas recovery devices, Wherein the partition plate is arranged between the annular upper cover and the annular bottom plate, and the receiving opening is located between the inner peripheral edge of the annular upper cover and the inner peripheral edge of the annular bottom plate.

In a preferred embodiment, the liquid supply device comprises a plurality of nozzles.

The present disclosure also provides a recycling ring for substrate wet processing equipment, which includes an annular upper cover, an annular bottom plate, a receiving port, and an outer annular wall. The annular bottom plate is arranged corresponding to the annular upper cover. The receiving port is located between the inner peripheral edge of the annular upper cover and the inner peripheral edge of the annular bottom plate, and is aligned with the rotary table. The outer ring wall is connected with the outer peripheral edge of the annular upper cover and the outer peripheral edge of the annular bottom plate, wherein the outer ring wall is provided with a plurality of air suction ports.

In a preferred embodiment, the recovery ring further includes a plurality of blocks, disposed between the annular upper cover and the annular bottom plate, configured to divide the recovery ring into the plurality of regions, and wherein One of the air suction ports is correspondingly arranged in one of the regions.

Compared with the prior art, the substrate wet processing apparatus of the present disclosure adopts a design of connecting a plurality of gas recovery devices with a single recovery ring, which can enhance the gas extraction volume of the recovery ring, thereby preventing the reaction gas-liquid mixture from being caused by insufficient gas extraction volume. The problem of staying in the recycling loop. Furthermore, by adopting the design of the equal spacing between the plurality of air extraction ports of the recovery ring, the air extraction volume of the recovery ring can be evenly dispersed in the four gas recovery devices, thereby avoiding uneven air extraction, resulting in the reaction after the reaction. The gas-liquid mixture is trapped in a corner of the recovery ring.

Description of drawings

FIG. 1 shows a schematic diagram of a substrate wet processing workstation according to a preferred embodiment of the present disclosure.

FIG. 2 shows a schematic diagram of a substrate wet processing apparatus according to a preferred embodiment of the present disclosure.

FIG. 3 shows a partial perspective view of a substrate wet processing apparatus according to a preferred embodiment of the present disclosure.

FIG. 4 shows a partial perspective view of a recovery ring and a liquid recovery device of the substrate wet processing apparatus of FIG. 3 .

FIG. 5 shows a partial cross-sectional view of the substrate wet processing apparatus of FIG. 3 .

Detailed ways

In order to make the above-mentioned and other objects, features, and advantages of the present disclosure more clearly understood, the preferred embodiments of the present disclosure will be exemplified below, and will be described in detail in conjunction with the accompanying drawings.

Please refer to FIG. 1 , which shows a schematic diagram of a substrate wet processing workstation 1 according to a preferred embodiment of the present disclosure. The substrate wet processing workstation 1 is suitable for processing large-sized substrates. For example, in a fan-out panel level package process, the square substrate is wet etched or cleaned by a substrate processing apparatus. In order to increase the production capacity, the substrates have been developed towards large sizes in recent years. For example, the area size of the currently used substrates has reached 600mm x 600mm. The substrate wet processing workstation 1 includes an inlet 2 , an outlet 3 , a first conveying device 4 , a second conveying device 5 , and a plurality of substrate wet processing devices 6 . The substrate to be processed enters the substrate wet processing workstation 1 through the feeding port 2 . The first conveying device 4 conveys the substrate to the second conveying device 5 , and then the second conveying device 5 sends the substrate to one of the substrate wet processing equipments 6 according to process requirements. Specifically, in the present disclosure, different substrate wet processing equipments 6 use chemical solutions (such as acids, bases, organic solvents, etc.) with different properties, respectively, and separate gas extraction systems for gas collection and discharge to avoid different The gas of chemical potion interacts with each other and affects industrial safety.

Please refer to FIG. 2 , which shows a schematic diagram of a substrate wet processing apparatus 6 according to a preferred embodiment of the present disclosure. The substrate wet processing apparatus 6 includes a liquid supply device 61 and a rotary table 62 . The substrate 9 to be processed is placed on the turntable 62 . In this embodiment, the top of the rotary table 62 includes a vacuum chuck, and the substrate 9 can be fixed on the top of the rotary table 62 by the suction force applied by the vacuum chuck. The turntable 62 is provided with a drive mechanism for driving the turntable 62 to rotate about an axis. In other embodiments, the wafer may be fixed on the rotary table in other manners, such as using a clamping device. Furthermore, a liquid supply device 61 is provided above the rotary table 62 for applying the process liquid to the substrate 9 . In the present disclosure, when the substrate wet processing apparatus 6 is used to clean or etch a large area substrate 9, a sufficient amount of process liquid must be provided. Therefore, the chemical supply swing arm of the liquid supply device 61 includes a plurality of nozzles 611 , so that the process liquid can be instantly and evenly dispersed on the large-area substrate 9 . On the other hand, the liquid supply device 61 can apply a plurality of process liquids to the substrate 9 . Specifically, the liquid supply device 61 also includes a plurality of liquid transmission lines. The nozzles 611 are arranged to be aligned with the top of the rotary table 62, and one end of the plurality of liquid transmission lines is connected to the nozzles 611, and the other ends are respectively connected to supply ends of different process liquids. With this design, the liquid supply device 61 can be controlled to apply the corresponding process liquid to the substrate 9 on the turntable 62 according to process requirements, so as to perform operations such as etching or cleaning the substrate 9 .

Please refer to FIG. 3 , which shows a partial perspective view of the substrate wet processing apparatus 6 according to the preferred embodiment of the present disclosure. The substrate wet processing apparatus 6 also includes a liquid recovery device 63 and four gas recovery devices 64 . The liquid recovery device 63 is arranged around the turntable 62 to collect the process liquid thrown off from the surface of the substrate 9 on the turntable 62 by centrifugal force, and to discharge the process liquid. The four gas recovery devices 64 are correspondingly connected to the liquid recovery device 63 for discharging the collected gas-liquid mixture. The specific structures of the liquid recovery device 63 and the gas recovery device 64 in this embodiment will be described in detail later. On the other hand, the liquid recovery device 63 is connected with the lifting device to control the liquid recovery device 63 to move up and down relative to the rotary table 62 along a vertical direction. In addition, since the four gas recovery devices 64 are connected to the liquid recovery device 63, when the liquid recovery device 63 is raised and lowered, the four gas recovery devices 64 will rise or fall together with it.

As shown in FIG. 3 , the liquid recovery device 63 of the present disclosure includes three recovery rings stacked in a vertical direction, namely, a first recovery ring 631 , a second recovery ring 632 , and a third recovery ring 633 . In other embodiments, different numbers of recovery loops can also be used, but not limited to this. The first recovery ring 631, the second recovery ring 632, and the third recovery ring 633 are configured to collect a corresponding one of the process liquids and their mixed gas-liquid mixture. Through the control of the lifting device, the first recovery ring 631, the second recovery ring 632, and the third recovery ring 633 are moved synchronously together, so that the designated first recovery ring 631, the second recovery ring 632, or the third recovery ring can be recovered The rings 633 are moved into alignment with the turntable 62 , wherein the alignment means that the liquid receiving port of one of the first recovery rings 631 , the second recovery rings 632 , or the third recovery rings 633 is aligned with the substrate 9 on the turntable 62 . so that when the liquid supply device 61 applies the process liquid to the substrate 9 on the turntable 62 and the turntable 62 rotates, the process liquid thrown off by the centrifugal force on the surface of the substrate 9 on the turntable 62 can be removed by one of the adjacent ones. A recovery loop 631, a second recovery loop 632, or a third recovery loop 633 collects. That is, the substrate wet processing apparatus 6 of the present disclosure is a cleaning and etching apparatus with a mobile liquid recovery device 63, which can keep the substrate 9 on the rotary table 62 horizontally fixed without moving up and down. When the substrate wet processing process is performed, the designated recovery ring is controlled to move to the alignment turntable 62 according to the steps performed, and then a specific process liquid is sprayed onto the surface of the substrate 9 by the liquid supply device 61 above the substrate 9, and the turntable 62 The substrate 9 is driven to rotate to collect the specific process liquid and its mixed gas-liquid mixture.

Please refer to FIG. 4 , which shows a partial perspective view of the recovery ring and the liquid recovery device of the substrate wet processing apparatus 6 of FIG. 3 . Figure 4 illustrates the first recovery ring 631 at the first level. It should be understood that the structures of the remaining second recovery rings 632 and the third recovery rings 633 are substantially the same as those of the first recovery ring 631 . As shown in FIGS. 3 and 4 , the first recovery ring 631 includes an annular upper cover 6301, an annular bottom plate 6302, an outer annular wall 6303, a partition plate 6304, four stoppers 6306, a receiving port 6307, a liquid collection port 6308, and Four exhaust ports 6309. The annular upper cover 6301 is arranged corresponding to the annular bottom plate 6302 . Preferably, the annular bottom plate 6302 of the recovery ring located above is used as the annular upper cover 6301 of the recovery ring located below, so that the space inside each recovery ring can be maximized, the materials used in the liquid recovery device 63 can be saved, and the effective The overall volume of the liquid recovery device 63 is reduced. The outer ring wall 6303 of the first recovery ring 631 is connected with the outer peripheral edge of the annular upper cover 6301 and the outer peripheral edge of the annular bottom plate 6302 . The annular upper cover 6301 , the annular bottom plate 6302 , and the outer annular wall 6303 are connected to each other and define the inner space of the first recovery ring 631 . The receiving opening 6307 of the first recovery ring 631 is located between the inner peripheral edge of the annular upper cover 6301 and the inner peripheral edge of the annular bottom plate 6302 . When the designated first recovery ring 631 is moved to align with the rotary table 62, the receiving port 6307 of the first recovery ring 631 will be aligned with the rotary table 62, so that the first recovery ring 631 can receive the corresponding process liquid and its mixed gas-liquid mixture.

As shown in FIG. 4 , the partition plate 6304 of the first recovery ring 631 is disposed inside the first recovery ring 631 to separate the inner space of the first recovery ring 631 into an inner ring space 6310 and an outer ring space 6311 . The inner annular space 6310 is used to receive the process liquid entering from the receiving port 6307 and its mixed gas-liquid mixture, and the blocking by the partition plate 6304 can prevent the process liquid from flowing from the inner annular space 6310 to the outer annular space 6311 . A plurality of through holes 6305 are formed on the partition plate 6304 , so that the gas-liquid mixture in the inner annular space 6310 can enter the outer annular space 6311 through the plurality of through holes 6305 .

As shown in FIG. 4 , the four blocks 6306 of the first recovery ring 631 are configured to divide the first recovery ring 631 into four regions, namely the first region 6312 , the second region 6313 , the third region 6314 , and the fourth region 6315. Specifically, four stoppers 6306 are arranged in the outer annular space 6311 and are connected to the annular upper cover 6301 and the annular bottom plate 6302, so that the gas-liquid mixture in the two adjacent regions cannot communicate with each other through the stoppers 6306. Four air extraction ports 6309 are provided on the outer ring wall 6303 . It should be noted that one of the suction ports 6309 is correspondingly provided in one of the regions 6312 - 6315 of the first recovery ring 631 . In the present disclosure, the number of the suction ports 6309 corresponds to the number of the stoppers 6306 , and other numbers of the suction ports 6309 and the stoppers 6306 may also be used in other embodiments, but not limited thereto. Preferably, the four regions 6312-6315 separated by the four blocks 6306 are of similar or equal size. In addition, preferably, the distances between the four air suction ports 6309 are equal to each other. With this design, a uniform suction force can be applied to the substrate, thereby preventing the process liquid on the substrate from being directed by the atmospheric air in a single direction when the substrate is etched. Affected and biased to one side, resulting in uneven etching of the substrate.

As shown in FIG. 4 , the liquid collection port 6308 of the first recovery ring 631 communicates with the inner annular space 6310 and is configured to allow the process liquid to be discharged from the liquid collection port 6308 . Specifically, the liquid collection port 6308 is located at the lowest point of the horizontal position of the first recovery ring 631 , so that the process liquid collected by the first recovery ring 631 flows to the liquid collection port 6308 due to gravity. In addition, the liquid collection port 6308 of the first recovery ring 631 is connected to the corresponding recovery pipe, so as to discharge or recover the collected process liquid. For example, as shown in FIG. 5 , the third recovery ring 633 is connected to the recovery pipe 6316 , and the process liquid collected by the third recovery ring 633 is discharged through the path 71 . Optionally, the recovery pipe 6316 can be connected to a circulation system to return the processed process liquid to the liquid supply device of the substrate wet processing apparatus again.

As shown in FIG. 3 , the substrate wet processing apparatus of the present disclosure is provided with gas recovery devices 64 corresponding to the number of the suction ports 6309 of each recovery ring 631 - 633 , that is, four gas recovery devices 64 . In addition, the four gas recovery devices 64 are respectively connected to the four gas suction ports 6309 of each recovery ring 631-633 correspondingly, so as to collect the gas-liquid mixture in the corresponding regions of the recovery rings 631-633. In this embodiment, each gas recovery device 64 includes three bellows 641-643, three exhaust pipes 644-646, and one air collecting box 647, wherein the number of bellows 641-643 and exhaust pipes 644-646 Corresponds to the number of recovery rings 631-633. The first air box 641 of the first recovery ring 631 is connected to the air collecting box 647 through the first exhaust pipe 644 . The second air box 642 of the second recovery ring 632 is connected to the air collecting box 647 through the second exhaust pipe 645 . The third wind box 643 of the third recovery ring 633 is connected to the air collecting box 647 through the third exhaust pipe 646 . It should be noted that the first to third bellows 641-643 are respectively connected to the air suction ports in the same area of the first to third recovery rings 631-633, respectively. That is, a single gas recovery device 64 is used to collect the gas-liquid mixture in a single region of each recovery ring 631-633.

Please refer to FIG. 5 , which shows a partial cross-sectional view of the substrate wet processing apparatus 6 of FIG. 3 . FIG. 5 is an illustration of the third wind box 643 and the third exhaust pipe 646 connected to the third recovery ring 633 . It should be understood that the structures of the remaining bellows and exhaust pipes are substantially the same as those of the third bellows 643 and the third exhaust pipes 646 . In this embodiment, the third recovery ring 633 includes four third wind boxes 643 and four third exhaust pipes 646 . The third bellows 643 includes an upper surface 6431 , a lower surface 6432 , a side surface 6433 , a first connection port 6434 , a second connection port 6435 , and a cavity 6436 . The upper surface 6431 of the third bellows 643 is disposed opposite to the lower surface 6432 , and the side surface 6433 is located between the upper surface 6431 and the lower surface 6432 . The upper surface 6431 , the lower surface 6432 , and the side surface 6433 are connected to each other to form a cavity 6436 . The side surface 6433 of the third bellows 643 is formed with a first connection port 6434 , and the lower surface 6432 is formed with a second connection port 6435 . The first connection port 6434 of the third bellows 643 is connected to the air suction port of the third recovery ring 633 . As shown in FIG. 5 , the gas recovery device 64 applies negative pressure to the third recovery ring 633 , so that the third recovery ring 633 and the inside of the gas recovery device 64 generate a gas flow like the path 72 . Specifically, the gas-liquid mixture in the third recovery ring 633 enters the cavity 6436 of the third bellows 643 through the first connection port 6434 . In addition, the third exhaust pipe 646 is connected to the second connection port 6435 of the third air box 643 , so as to transmit the gas-liquid mixture to the air collecting box 647 . The gas collecting tank 647 may discharge the gas-liquid mixture collected from the first to third recovery rings 631-633.

To sum up, the substrate wet processing apparatus of the present disclosure adopts the design of connecting a plurality of gas recovery devices with a single recovery ring, which can enhance the gas extraction volume of the recovery ring, thereby preventing the gas-liquid mixture from being stagnant after the reaction due to insufficient gas extraction volume. problems in the recycling loop. Furthermore, by adopting the design of the equal spacing between the plurality of air extraction ports of the recovery ring, the air extraction volume of the recovery ring can be evenly dispersed in the four gas recovery devices, thereby avoiding uneven air extraction, resulting in the reaction after the reaction. The gas-liquid mixture is trapped in a corner of the recovery ring.

The above are only the preferred embodiments of the present disclosure. It should be pointed out that those skilled in the art can make several improvements and modifications without departing from the principles of the present disclosure, and these improvements and modifications should also be regarded as the protection of the present disclosure. scope.

Claims (10)

1. An apparatus for wet processing a substrate, comprising:

a rotation stage configured to place a substrate;

a liquid supply device disposed above the spin stage and configured to apply a process liquid to the substrate;

a liquid recovery device circumferentially disposed around the rotary table and movable in a vertical direction relative to the rotary table, wherein the liquid recovery device comprises a recovery ring configured to collect the process liquid and a gas-liquid mixture mixed therewith, and the recovery ring comprises a plurality of regions and a plurality of pumping ports, and one of the pumping ports is correspondingly disposed in one of the regions; and

and the gas recovery devices are respectively and correspondingly connected with the pumping holes of the recovery ring so as to collect the gas-liquid mixture in the corresponding area of the recovery ring.

2. The apparatus of claim 1, wherein each of the gas recovery devices comprises:

the air box comprises a first connecting port and a second connecting port, wherein the first connecting port is connected with the pumping port of one of the recovery rings, so that the gas-liquid mixture in the recovery rings enters the interior of the air box through the first connecting port;

the exhaust pipe is connected with the second connecting port of the air box; and

a gas collection tank connected to the exhaust pipe and configured to collect the gas-liquid mixture to discharge it.

3. The substrate wet processing apparatus of claim 2, wherein the liquid recovery device includes a plurality of the recovery rings stacked in the vertical direction, and each of the gas recovery devices includes a plurality of the bellows and a plurality of the exhaust pipes, and the plurality of bellows are connected to the gas collection box through the plurality of exhaust pipes, wherein the plurality of bellows are respectively connected to the pumping ports of the same region of the plurality of recovery rings.

4. The substrate wet processing apparatus of claim 1, wherein the recovery ring comprises a plurality of blocks configured to divide the recovery ring into the plurality of zones, and the gas-liquid mixtures in any two adjacent zones cannot flow through each other through the blocks.

5. The substrate wet processing apparatus of claim 4, wherein the recycle ring further comprises:

a receiving port aligned with the rotary table; and

a partition plate disposed inside the recovery ring to partition an inner ring space and an outer ring space, wherein the inner ring space receives the process liquid entering from the receiving port and the gas-liquid mixture mixed therewith, and the partition plate blocks the process liquid from flowing from the inner ring space to the outer ring space, and a plurality of through holes are formed in the partition plate such that the gas-liquid mixture in the inner ring space enters the outer ring space through the plurality of through holes, wherein the plurality of blocks are disposed in the outer ring space.

6. The apparatus of claim 5, wherein the recovery ring further comprises a liquid collection port in communication with the inner ring space and configured to allow the process liquid to drain from the liquid collection port.

7. The substrate wet processing apparatus of claim 5, wherein the recycle ring further comprises:

an annular upper cover;

the annular bottom plate is arranged corresponding to the annular upper cover; and

and an outer ring wall connected to an outer peripheral edge of the annular upper cover and an outer peripheral edge of the annular bottom plate, wherein the plurality of pumping ports are provided on the outer ring wall and connected to the plurality of gas recovery devices, respectively, wherein the partition plate is provided between the annular upper cover and the annular bottom plate, and the receiving port is provided between an inner peripheral edge of the annular upper cover and an inner peripheral edge of the annular bottom plate.

8. The apparatus of claim 1, wherein the liquid supply device comprises a plurality of nozzles.

9. A recycle ring for a substrate wet processing apparatus, comprising:

an annular upper cover;

the annular bottom plate is arranged corresponding to the annular upper cover;

a receiving opening between an inner periphery of the annular upper cover and an inner periphery of the annular base plate and aligned with the turntable; and

and the outer annular wall is connected with the outer periphery of the annular upper cover and the outer periphery of the annular bottom plate, and is provided with a plurality of pumping holes.

10. The recycling ring for a substrate wet processing apparatus according to claim 9, further comprising a plurality of stoppers disposed between the annular upper cover and the annular base plate, configured to divide the recycling ring into a plurality of regions, and wherein a pumping port is disposed in one of the regions.

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