TWM595885U - Circuit pattern inspection device - Google Patents

Abstract

The present invention is to provide a circuit pattern detection device for detecting a circuit pattern formed on a semiconductor substrate. The circuit pattern detection device includes a light source unit and a receiving unit, wherein the light source unit has a position above the circuit pattern The first light source, the receiving unit has a first receiver located above the line pattern for receiving the first image pattern from the line pattern, and a side located on the side of the line pattern for receiving the line pattern The second receiver of the second image pattern defines a normal line passing through the semiconductor substrate, and the second receiver is disposed obliquely at an angle with the normal line.

Description

Line pattern detection device

The present invention relates to a detection device, in particular to a line pattern detection device for detecting patterned lines formed on a semiconductor substrate.

With the increasing functional requirements of electronic products and the requirements of lighter, thinner and shorter components, the size and line width of semiconductor chips are also becoming smaller and smaller, in order to meet the requirements of the size and performance of the required semiconductor devices. However, whether the line width of semiconductor chips can meet the requirements, especially when the line width process of semiconductor chips has been required to the nano-level, yellow light lithography is a key technology.

Yellow light lithography is a miniaturization technology, which uses a photomask with a predetermined pattern as a mask to form a circuit pattern corresponding to the pattern of the mask on a semiconductor substrate. After that, the subsequent process is performed based on the circuit pattern, and then, different lamination processes are performed to obtain the required semiconductor device. Therefore, when an error or defect occurs in the line width, size or shape of the circuit pattern formed after the lithography, it will affect the subsequent process and the characteristics of the final device. Therefore, after each lithography process, the formed circuit pattern is inspected to ensure the accuracy of the formed circuit pattern, so as not to affect the subsequent process.

The current method for detecting the circuit pattern formed on the semiconductor substrate after the lithography is to use a single imaging device, and obtain the circuit pattern at different angles by tilting the semiconductor substrate or the carrier base. Image, to fully detect the pattern quality of the circuit pattern.

Therefore, the purpose of the present invention is to provide a circuit pattern detection device for detecting patterned lines formed on a semiconductor substrate.

Therefore, the circuit pattern detection device of the present invention includes a light source unit and a receiving unit.

The light source unit has a first light source located above the line pattern.

The receiving unit has a first receiver located above the line pattern for receiving the first image pattern from the line pattern, and a side located on the side of the line pattern for receiving the second image pattern from the line pattern The second receiver defines a normal line passing through the semiconductor substrate, and the second receiver is inclined at an angle with the normal line.

The effect of the present invention lies in: by setting different lateral receivers at different angles, therefore, it is possible to simultaneously receive and detect image data of more than two different angles of the circuit pattern without rotating the semiconductor substrate.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same number. In addition, the drawings only show the spatial relationship between the elements, not the actual size or relative proportional relationship of the elements.

The novel circuit pattern detection device can be used to detect a patterned circuit formed on a semiconductor substrate. In the following embodiments, the patterned circuit is an example of a circuit pattern formed through yellow light, etching and other processes. However, the actual circuit pattern is not limited to this.

Referring to FIG. 2, a first embodiment of the novel circuit pattern detection device is used to detect the circuit pattern 12 formed on a semiconductor substrate 11.

The circuit pattern detecting device includes a light source unit 2, a receiving unit 3, a support frame 4, and a processing unit 5.

The light source unit 2 has a first light source 21 located above the circuit pattern 12 of the semiconductor substrate 11, wherein the first light source 21 may be a linear light source or a point light source, and the first light source 21 may be selected from White light, or a light source of light with a predetermined wavelength, such as red light and green light.

The receiving unit 3 has a first receiver 31 above the top surface of the circuit pattern 12 for receiving the first image pattern from the circuit pattern 12, and a side located on the side of the circuit pattern 12, and the semiconductor The substrate 11 is disposed at an angle and used to receive the second receiver 32 of the second image pattern from the circuit pattern 12. The first and second receivers 31 and 32 may be microscopes or cameras, and may be light field or dark field microscopes or cameras.

In detail, a normal N passing through the semiconductor substrate 11 is defined. The angle between the second receiver 32 and the normal N is a first angle θ1. The first angle θ1 is greater than 0 degrees and not greater than 90 degrees. . Preferably, the first angle θ1 is between 10 degrees and 80 degrees. In addition, considering the complexity of the received image pattern processing, more preferably, the first angle θ1 is between 15 degrees and 60 degrees.

The circuit pattern 12 has a plurality of first patterns 121 arranged along the first direction X, and each first pattern 121 is along a second direction Y perpendicular to the first direction X and parallel to the surface of the semiconductor substrate 11 As an example, the second receiver 32 may be located in the first direction X and disposed on the sides of the first patterns 121. Since the sides of the circuit pattern 12 are inclined at an angle to the circuit pattern 12 The second receiver 32, therefore, can use the first and second receivers 31, 32 to cooperate to receive the forward and lateral first and second image patterns from the line pattern 12, without the need to make the semiconductor The side image of the circuit pattern 12 (the first patterns 121) can only be obtained after the substrate 11 is tilted at an angle. In addition, when obtaining image patterns of different sides of the first patterns 121 or different angles of the same side, it is only necessary to rotate the semiconductor substrate 11 in a plane.

It should be further explained that, when the circuit pattern 12 is a pattern arranged in multiple different directions, the side images of the patterns in different arrangement directions can also be obtained by rotating the semiconductor substrate 11 in a plane.

The supporting frame 4 is used to fix the light source unit 2 and the receiving unit 3. The support frame 4 may be an arc-shaped or inverted U-shaped support piece 41, or may have a plurality of support pieces 41 separated and supported and fixed to the light source unit 2 and the receiving unit 3, as long as they are available for fixing The light source unit 2 and the receiving unit 3 are sufficient, and need not be limited. In this embodiment, the support frame 4 is described by taking an approximately U-shaped support piece 41 as an example, but the actual implementation is not limited to this.

Referring to FIG. 2, it should be noted that the light source unit 2 of the first embodiment may further have a second light source 22. The second light source 22 may be correspondingly disposed opposite to the second receiver 32 for The second receiver 32 is provided to detect the required light. The second light source 22 may also be selected to emit white light, or light with a predetermined wavelength, such as red light, green light, etc., and may have the same wavelength wave or different wavelengths as the first light source 21.

Because different wavelength light sources have different interference and diffraction results for different pitches, the wavelength selection through the first and second light sources 21, 21 can cause the circuit pattern 12 to be caused by the focus error of the yellow light exposure process Defocus or defects of different patterns of the circuit pattern 12 have better recognition.

The processing unit 5 is signal-connected to the receiving unit 3 to compare image patterns received from different receivers (first and second receivers 31, 32); or to receive images from different receivers ( The image patterns of the first and second receivers 31, 32) are compared with the standard image pattern of the circuit pattern 12, or are compared with the image patterns obtained from another same circuit pattern to obtain the circuit pattern 12 Test results.

Referring to FIG. 3, a second embodiment of the novel circuit pattern detection device has substantially the same structure as the first embodiment, except that the receiving unit 3 of the second embodiment further has a third receiver 33.

The third receiver 33 is inclined at a second angle θ2 to the normal N passing through the semiconductor substrate 11, and is used to receive the third receiver 33 of the third image pattern from the circuit pattern 12.

The third receiver 33 and the second receiver 32 can be located on the same side or different sides, and the first angle θ1 and the second angle θ2 can also be viewed as the positions of the third receiver 33 and the second receiver 32 The relationship may be the same or different.

Specifically, when the third receiver 33 and the second receiver 32 are located on different sides, for example, when the third receiver 33 and the second receiver 32 are located on different sides of the first patterns 121, respectively The first angle θ1 and the second angle θ2 may be the same or different. By arranging the second receiver 32 and the third receiver 33 at different positions corresponding to the circuit pattern 12, the semiconductor substrate 11 can be transmitted through the first and second without rotating or tilting the semiconductor substrate 11 as is conventional 3. The three receivers 31, 32, 33 receive the front and side images of the line pattern 12. By arranging the angle (the first angle θ1, the second angle θ2) between the second receiver 32 and the third receiver 33 and the semiconductor substrate 11, the sides of the circuit pattern 12 at different angles can be further received Image pattern.

In addition, when the second receiver 32 and the third receiver 33 are located on the same side, the first angle θ1 and the second angle θ2 can be set to be different. In this way, the front surface and the same side of the circuit pattern 12 can be received at different angles by the first receiver 31 and the second receiver 32 and the third receiver 33 arranged at the same side but at different angles Location image. Therefore, by comparing the pattern images received by the second receiver 32 and the third receiver 33, the line pattern 12 can be detected more completely.

In addition, it should be noted that by rotating the semiconductor substrate 11 through a plane to change the angle of the second receiver 32 and the third receiver 33 and the line pattern 12, the second receiver 32 and the first The three receivers 33 receive side image patterns of the pattern of the circuit pattern 12 in different arrangement directions, or image patterns of the same pattern from different angles, to further detect the circuit pattern 12.

In some embodiments, the top-view planes of the first, second, and third receivers 31, 32, and 33 form a right triangle, and the first receiver 31 is located at the vertex of the right angle.

In addition, it should be noted that the light source unit 2 of the foregoing second embodiment may further include a third light source 23. The third light source 23 and the third receiver 33 are arranged opposite to each other. The third light source 23 may also be selected to emit white light, or light with a predetermined wavelength such as red light, green light, etc. The three light sources 23 and the first and second light sources 21 and 22 may respectively have the same wavelength wave or different wavelengths. The first, second, second, and third light sources 21, 22, and 23 can provide the receiving unit 3 with sufficient sensing light sources and more flexible sensing wavelength selection, so as to have a better recognition result for the circuit pattern 12.

Referring to FIG. 4, in some embodiments, the circuit pattern detection device of the present invention may further include an adsorption unit 6 that can adsorb volatile organic compounds to prevent the circuit pattern 12 from being exposed to volatile organic compounds or the environment generated during the illumination process The volatile organic compounds contaminate the light source unit 2 and the receiving unit 3, causing damage to the detection equipment or detection errors.

The adsorption unit 6 is selected from at least one of porous adsorption materials such as activated carbon, ion exchange resin, and polymer, and is disposed adjacent to at least one of the light source unit 2 and the receiving unit 3, In order to effectively adsorb the volatile organic compounds close to the light source unit 2 and the receiving unit 3.

In summary, the circuit pattern detection device of the present invention passes through the first receiver 31 disposed above the circuit pattern 12 and the second receiver 32 and/or the third receiver 33 disposed on the side of the circuit pattern 12 Coordination, therefore, the semiconductor substrate 11 can be used to receive image patterns on different sides of the circuit pattern 12 without tilting. In addition, through the lateral receivers (second receiver 32 and/or third receiver 33) ) Can also receive image patterns from different angles of the circuit pattern 12 to further detect the circuit pattern 12, which can indeed achieve the purpose of new cost.

However, the above are only examples of the new model. When the scope of the new model cannot be limited by this, any simple equivalent changes and modifications made according to the patent application scope and patent specification content of the new model are still regarded as Within the scope of this new patent.

11: Semiconductor substrate 33: Third receiver 12: Line pattern 4: Support frame 2: Light source unit 5: Processing unit 21: The first light source 6: Adsorption unit 22: Second light source X: first direction 23: third light source Y: Second direction 3: receiving unit N: normal 31: The first receiver θ1: first angle 32: Second receiver θ1: second angle

Other features and functions of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: FIG. 1 is a schematic diagram illustrating a first embodiment of the novel circuit pattern detection device; 2 is a schematic diagram illustrating another aspect of the light source unit of the first embodiment of the present invention; 3 is a schematic plan view illustrating the relative positions of the first, second, and third receivers of the second embodiment of the novel circuit pattern detection device; and FIG. 4 is a schematic diagram illustrating that the novel circuit pattern detection device further has an adsorption unit.

11: Semiconductor substrate

12: Line pattern

2: Light source unit

21: The first light source

3: receiving unit

31: The first receiver

32: Second receiver

4: Support frame

5: Processing unit

X: first direction

Y: Second direction

N: normal

θ1: first angle

Claims (13)

A circuit pattern detection device for detecting circuit patterns formed on a semiconductor substrate, including: A light source unit having a first light source located above the line pattern, and A receiving unit has a first receiver above the line pattern for receiving the first image pattern from the line pattern, and a side on the line pattern for receiving the second image from the line pattern The second receiver of the pattern defines a normal line passing through the semiconductor substrate, and the second receiver is disposed obliquely at an angle with the normal line. The line pattern detection device according to claim 1, wherein the angle between the second receiver and the normal is between 10 degrees and 80 degrees. The line pattern detection device according to claim 1, wherein the light source unit further has a second light source located opposite to the second receiver, and the wavelengths of the second light source and the first light source can be Same or different. The line pattern detection device according to claim 1, wherein the receiving unit further has a third receiver for receiving a third image pattern from the line pattern, the second receiver and the third receiving The angle between the device and the normal can be the same or different. The line pattern detection device according to claim 1, wherein the receiving unit further has a third receiver for receiving a third image pattern from the line pattern, the second receiver and the third receiving The device can be on the same side or different sides. The line pattern detection device according to claim 4 or 5, wherein the second receiver and the third receiver may be selected from a bright field receiver or a dark field receiver. The line pattern detection device according to claim 4 or 5, wherein the light source unit further has a third light source located in a reverse position with the third receiver, and the wavelengths of the first, second, and third light sources can be Same or different. The line pattern detection device according to claim 4, wherein the angle between the second receiver and the third receiver is different from the normal. The line pattern detection device according to claim 4, wherein the top-view planes of the first, second, and third receivers form a right triangle, and the first receiver is located at a vertex at a right angle. The line pattern detection device according to item 1 of the request item, further includes a processing unit signal-connected to the receiving unit, which can be used for a different image pattern than that received by the receiving unit. The circuit pattern detection device according to claim 1, further comprising an adsorption unit selected from materials that can adsorb volatile organic compounds, and located on the side of at least one of the light source unit and the receiving unit. The line pattern detection device according to claim 11, wherein the material of the adsorption unit includes at least one of activated carbon, ion exchange resin, and high molecular polymer. The circuit pattern detection device according to claim 1 further includes a support frame for supporting and fixing the light source unit and the support unit.

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