TWM583130U - Light emitting diode structure - Google Patents

Abstract

A light emitting diode structure includes an electrical support set, a package cup, a protection element, and at least one light emitting element. The electrical stent set includes a first stent and a second stent that are separated from one another, wherein the second stent includes a first zone and a second zone. The package cup is located above the electrical support set and has a first bracket and a portion of the second bracket with an opening exposing a portion. The protective element is covered by the package cup and disposed on the second bracket. The light emitting component is disposed in the opening and electrically connected to the first bracket and the second bracket.

Description

Light-emitting diode structure

The present invention relates to a light-emitting diode structure, and more particularly to a light-emitting diode structure including a protective element.

In general, the light emitting diode structure can include a protective element. The protection element forms a parallel loop with the LED chip, and provides a current venting path when a reverse glitch occurs. If the protective element is disposed in the accommodating portion of the illuminating diode structure together with the illuminating diode chip, the protective element may absorb light and cause a problem of a decrease in luminous efficiency of the illuminating diode structure or a problem of insufficient wiring space in the accommodating portion. .

In view of this, it is an object of the present invention to provide a light emitting diode structure that can solve the above problems.

In order to achieve the above object, an aspect of the present invention is to provide a light emitting diode structure. The light emitting diode structure comprises an electrical support set, a package cup, a protection element and at least one light emitting element. The electrical stent set includes a first stent and a second stent separated from each other, wherein the second stent includes the first region and the first Second District. The package cup is located above the electrical support set and has a first bracket and a portion of the second bracket with an opening exposing a portion. The protective element is covered by the package cup and disposed on the second bracket. The light emitting component is disposed in the opening and electrically connected to the first bracket and the second bracket.

According to an embodiment of the invention, the protection element is a Zener diode.

According to an embodiment of the invention, the first bracket and the second bracket are coplanar.

According to an embodiment of the present invention, the periphery of the package cup defines a peripheral area, and the area of the opening accounts for more than 40% of the peripheral area.

According to an embodiment of the invention, the first zone and the second zone are separated from one another.

According to an embodiment of the invention, the first zone and the second zone are integrally formed.

According to an embodiment of the present invention, the second bracket has a first protruding portion disposed on the first side of the second bracket, and the packaging cup covers the first protruding portion.

According to an embodiment of the present invention, the second bracket has a second protrusion disposed on a second side opposite the first side, and the package cup covers the second protrusion.

According to an embodiment of the present invention, the protection element is disposed on the second region of the second bracket and adjacent to the first protrusion.

According to an embodiment of the present invention, the LED structure further includes a conductive paste disposed between the protection component and the second bracket.

10, 20a, 20b, 20c‧‧‧Lighting diode structure

110‧‧‧First conductive bracket

120‧‧‧Second conductive bracket

130‧‧‧Package cup

132‧‧‧ openings

140‧‧‧Lighting elements

150‧‧‧protective components

210‧‧‧Electrical stent group

212‧‧‧First bracket

212S‧‧‧ first side

212S”‧‧‧ second side

212P‧‧‧First bulge

212P"‧‧‧second bulge

214‧‧‧second bracket

214S‧‧‧ first side

214S”‧‧‧ second side

214P‧‧‧First bulge

214P”‧‧‧second bulge

2141‧‧‧First District

2142‧‧‧Second District

220‧‧‧Package cup

222‧‧‧ openings

230‧‧‧protective components

240‧‧‧Lighting elements

250‧‧‧ conductive adhesive

252‧‧‧ solid crystal glue

260‧‧‧Packaging materials

3-3’, 5-5’‧‧‧ segments

D1‧‧ Direction

The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood. The description of the drawings is as follows: FIG. 1 is a cross-sectional view showing the structure of a light-emitting diode of a comparative example of the present invention.

FIG. 2 is a schematic top view showing the structure of the light emitting diode according to an embodiment of the present invention.

Fig. 3 is a cross-sectional view showing the line 3-3' along the second drawing of the second embodiment of the present invention.

FIG. 4 is a top plan view showing the structure of a light emitting diode according to another embodiment of the present invention.

Fig. 5 is a cross-sectional view showing the fourth section of the present invention along line 5-5'.

FIG. 6 is a top plan view showing the structure of the light emitting diode according to still another embodiment of the present invention.

The description of the present invention has been described in detail with reference to the embodiments of the present invention and the specific embodiments thereof. The embodiments disclosed herein may be combined or substituted with each other in an advantageous manner, and other embodiments may be added to an embodiment without further description or description.

In the following description, many specific details will be described in detail so that The reader is fully aware of the following embodiments. However, embodiments of the present invention may be practiced without these specific details. In other instances, well-known structures and devices are only schematically shown in the drawings in order to simplify the drawings.

FIG. 1 is a cross-sectional view showing a light emitting diode structure 10 of a comparative example of the present invention. The light emitting diode structure 10 of the comparative example includes a first conductive support 110, a second conductive support 120, a package cup 130, a light emitting diode wafer 140, and a protection element 150. The package cup 130 is disposed above the first conductive bracket 110 and the second conductive bracket 120, and the package cup 130 has an opening 132 exposing a portion of the first conductive bracket 110 and a portion of the second conductive bracket 120. The LED body 140 and the protective component 150 are disposed in the opening 132 and electrically connected to the first conductive bracket 110 and the second conductive bracket 120. In general, the protective element 150 is a Zener diode whose appearance is black in color. If the Zener diode is placed in the opening 132 together with the LED chip 140, a portion of the light emitted from the LED wafer 140 is partially absorbed by the Zener diode, so that the LED structure 10 is The brightness is reduced. In order to improve the light-emitting efficiency of the light-emitting diode structure 10, the manufacturer usually removes the Zener diode, but this may cause the light-emitting diode chip 140 to generate a light-emitting diode wafer due to the reverse current. 140 failure problem.

One aspect of the present invention is to provide a light emitting diode structure. The light emitting diode structure embeds the protective element in the package cup such that the protection element and the light emitting element are spaced apart from each other. In such a configuration, the light emitted by the light-emitting element does not illuminate the protective element, so that in addition to avoiding the light absorption by the protective element, the luminous efficiency of the light-emitting diode structure is lowered. The problem can also improve the antistatic ability of the light-emitting element.

FIG. 2 is a schematic top view of a light emitting diode structure 20a according to an embodiment of the present invention. Fig. 3 is a cross-sectional view showing the line 3-3' along the second drawing of the second embodiment of the present invention. Referring to FIG. 2 and FIG. 3 simultaneously, the LED structure 20a includes an electrical support group 210, a package cup 220, a protection element 230, and at least one light-emitting element 240. In particular, the electrical stent set 210 includes a first stent 212 and a second stent 214 that are isolated from each other. Here, "separated" means not only spatial separation but also electrical isolation. In more detail, the first bracket 212 and the second bracket 214 are arranged to extend in the first direction D1. The first direction D1 is also the extending direction of the electrical support group 210. In various embodiments, the first bracket 212 and the second bracket 214 are coplanar. In an embodiment, the second bracket 214 includes a first zone 2141 and a second zone 2142, wherein the first zone 2141 and the second zone 2142 are aligned in a direction perpendicular to the first direction D1. In the present embodiment, the first zone 2141 and the second zone 2142 of the second bracket 214 are separated from each other. In more detail, the second zone 2142 of the second bracket 214 may have the same or opposite polarity as the first zone 2141 or the second zone 2142 has no polarity. In various embodiments, the electrical support set 210 is made of a metal material having good electrical and thermal conductivity and is formed by stamping. The above-mentioned metal material having good electrical and thermal conductivity may be copper, iron or other metal plate or alloy plate which is excellent in electrical conductivity. That is to say, the material of the electrical support group 210 may be copper, iron or other metal or alloy with good electrical conductivity and thermal conductivity.

In some embodiments, the first bracket 212 has a first protruding portion 212P and a second protruding portion 212P" respectively disposed on the first bracket 212 One side 212S and second side 212S". In some embodiments, the first region 2141 of the second bracket 214 also has a first protrusion 214P and a second protrusion 214P" respectively disposed on the second bracket 214 One side 214S and second side 214S". In various embodiments, the above-described projections 212P, 212P", 214P, and 214P" may have a rectangular, semi-circular, elliptical, or other irregularly shaped cross-sectional profile.

The package cup 220 is located above the electrical support set 210 and has an opening 222 exposing a portion of the first support 212 and a portion of the second support 214. In various embodiments, the periphery of the package cup 220 defines a peripheral area, and the area of the opening 222 occupies more than 40% of the peripheral area. In some embodiments, the inner face of the opening 222 can be reflective, and the package cup 220 can act as a reflective cup that reflects the light emitted by the light-emitting element 240. The package cup 220 may be constructed of a thermoset or thermoplastic material. In various embodiments, the package cup 220 covers the first protrusion 212P and the second protrusion 212P" of the first bracket 212. In various embodiments, the package cup 220 covers the second bracket 214 A protrusion 214P and a second protrusion 214P". In some embodiments, the package cup 220 can be formed by injection molding. Since the first protruding portion 212P and the second protruding portion 212P" of the first bracket 212 and the first protruding portion 214P and the second protruding portion 214P" of the second bracket 214 are protruded from the package cup 220, The fastening of the package cup 220 is enhanced to enhance the bonding force between the package cup 220 and the electrical support group 210, and the external force is applied to cause the electrical support group 210 to fall off the package cup 220. The protrusions 212P, 212P", 214P, and 214P" embedded in the package cup 220 can increase the bonding force between the electrical holder group 210 and the package cup 220, In addition to the effect of the external force causing the electrical support group 210 to fall off the package cup 220, the protrusions 212P, 212P", 214P and 214P" formed by the stamping can further increase the travel path of the water gas to increase the water. The time during which the gas penetrates into the opening 222 of the package cup 220 can extend the useful life of the light-emitting element 240 that is subsequently disposed within the opening 222 of the package cup 220.

The protection element 230 is covered by the package cup 220 and disposed on the second bracket 214. The protection element 230 is used to protect the circuit loop of the light-emitting element 240. In an embodiment, the protection element 230 is disposed on the second region 2142 of the second bracket 214 and adjacent to the first protrusion 214P. In various embodiments, the protection element 230 can be a voltage stabilizing element, such as a Zener diode. In an example, the protection element 230 can be a bidirectional Zener diode. In more detail, in the present embodiment, when the second region 2142 of the second bracket 214 does not have a polarity, the protection member 230 is fixed on the second region 2142 by the solid crystal adhesive 252 and is wired. Bonding is electrically connected to the first region 2141 of the first bracket 212 and the second bracket 214, respectively. In other embodiments, when the second region 2142 of the second bracket 214 has the same polarity as the first region 2141, the protective member 230 is fixed on the second region 2142 by the conductive adhesive 250 and is connected by wire bonding. ) electrically connected to the first bracket 212 . In other embodiments, when the second region 2142 of the second bracket 214 has a different polarity from the first region 2141, the protection component 230 is fixed on the second region 2142 by the conductive adhesive 250 and is connected by wire bonding. The first region 2141 is electrically connected to the second bracket 214.

The light emitting element 240 is disposed in the opening 222 and electrically connected to the first bracket 212 and the second bracket 214. In the present embodiment, the light emitting element 240 The first bracket 212 is exposed on the exposed opening 222, and is electrically connected to the first bracket 212 and the second bracket 214 respectively by wire bonding. In some embodiments, the light emitting element 240 may be a red light emitting diode chip, a green light emitting diode chip, a blue light emitting diode chip, or a white light emitting diode chip, but is not limited thereto. In other embodiments, the light-emitting elements 240 are disposed on the exposed second bracket 214 in the opening 222, and are electrically connected to the first bracket 212 and the second bracket 214, respectively, by wire bonding. In other embodiments, the light-emitting element 240 can also be bridged to the bare first bracket 212 and the second bracket 214 by flip chip bonding.

Since the protection element 230 is embedded in the package cup 220, the protection element 230 and the light-emitting element arrangement area are spaced apart from each other. In such an arrangement, the light emitted from the light-emitting element 240 does not illuminate the protective element 230, and thus the problem that the light-emitting efficiency of the light-emitting diode structure 20a is lowered is avoided in addition to the absorption of the light by the protective element 230.

In some embodiments, as shown in FIG. 3, the LED structure 20a further includes an encapsulation material 260 filling the opening 222 to protect the exposed first bracket 212, the second bracket 214, and the light emitting element 240. In an embodiment, encapsulation material 260 can comprise a polymeric material such as polyphthalamide (PPA). In another embodiment, the encapsulating material 260 may be doped with phosphor powder (not shown), so that when the light emitted by the light-emitting element 240 is irradiated to the phosphor powder to excite visible light of another color, the light is emitted. The light emitted by the element 240 can be mixed with the light excited by the phosphor to produce a light mixing effect.

FIG. 4 is a schematic top view of a light emitting diode structure 20b according to another embodiment of the present invention. Fig. 5 is a cross-sectional view showing the fourth section of the present invention along line 5-5'. The LED structure 20b includes an electrical support group 210, a package cup 220, a protection element 230, and at least one light-emitting element 240. In order to facilitate the comparison with the above embodiments and simplify the description, the same components are denoted by the same reference numerals in the following embodiments, and the differences between the embodiments are mainly explained, and the weight is no longer The section is repeated.

As shown in FIG. 4 and FIG. 5, in the present embodiment, the first region 2141 and the second region 2142 of the second bracket 214 are integrally formed to increase the rigidity of the second bracket 214. That is, the first region 2141 and the second region 2142 of the second bracket 214 have the same polarity. In some embodiments, the LED structure 20b further includes a conductive paste 250 disposed between the protection component 230 and the second bracket 214. Therefore, the protective component 230 can be fixed on the second bracket 214 by the conductive adhesive 250 and electrically connected to the first bracket 212 by wire bonding.

In the present embodiment, the number of the light-emitting elements 240 is two, and is respectively disposed on the first bracket 212 and the second bracket 214 exposed in the opening 222. The two light-emitting elements 240 are electrically connected to the first bracket 212 and the second bracket 214 by wire bonding, respectively.

FIG. 6 is a schematic top view of a light emitting diode structure 20c according to still another embodiment of the present invention. The LED structure 20c includes an electrical support group 210, a package cup 220, a protection element 230, and at least one light-emitting element 240. In order to facilitate comparison and simplification of the above embodiments The same elements are denoted by the same reference numerals in the following embodiments, and the differences between the embodiments are mainly described, and the repeated parts are not described again.

The light emitting diode structure 20c is different from the light emitting diode structure 20b in that the number of the light emitting elements 240 is one, and the light emitting elements 240 are bridged to the bare by flip chip bonding. A bracket 212 and a second bracket 214.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Any one skilled in the art can make various changes and retouchings without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

Claims (10)

A light-emitting diode structure comprising: an electrical support set comprising a first support and a second support separated from each other, wherein the second support comprises a first zone and a second zone; a package cup is located Above the electrical support set, and having an opening to expose a portion of the first bracket and a portion of the second bracket; a protection component covered by the package cup and disposed on the second bracket; and at least one light emitting component And disposed in the opening and electrically connecting the first bracket and the second bracket. The light emitting diode structure of claim 1, wherein the protective element is a Zener diode. The light emitting diode structure of claim 1, wherein the first bracket and the second bracket are coplanar. The light emitting diode structure of claim 1, wherein a periphery of the package cup defines a peripheral area, and an area of the opening accounts for more than 40% of the peripheral area. The light emitting diode structure of claim 1, wherein the first region and the second region are separated from each other. The light emitting diode structure according to claim 1, wherein The first zone and the second zone are integrally formed. The illuminating diode structure of claim 1, wherein the second bracket has a first protrusion disposed on a first side of the second bracket, and the package cup covers the first protrusion. The illuminating diode structure of claim 7, wherein the second bracket has a second protrusion disposed on a second side opposite the first side, and the package cup covers the second protrusion . The light emitting diode structure of claim 7, wherein the protective element is disposed on the second region of the second bracket adjacent to the first protruding portion. The light emitting diode structure of claim 1, further comprising a conductive adhesive disposed between the protective component and the second support.