TWM578400U - Projector light source heat dissipation structure - Google Patents

Abstract

A heat sink structure of a projector light source is connected in a preset projector, and has a circuit board, a light emitting component and a heat dissipation module, the circuit board is made of graphite material, the graphite material is porous and filled with high heat conductive metal, and the surface of the circuit board is set The driving circuit and the light-emitting element, the light-emitting element and the driving circuit are electrically connected, and the heat-dissipating module is connected to the bottom surface of the circuit board, whereby the driving circuit drives the light-emitting element to operate, and the porous heat-filling property of the graphite is matched with the porous inner filling. The high thermal conductivity metal, the thermal energy generated by the light-emitting component and the driving circuit is directly transmitted from the circuit board to the heat-dissipating module, and after the high-current input driving circuit, the circuit board and the heat-dissipating module can make the light-emitting component and the driving circuit work at rated performance. At the temperature, the light-emitting element and the driving circuit are cooled at a high temperature, and the stable working efficiency is maintained.

Description

Projector light source heat dissipation structure

The present invention relates to a heat dissipation structure, in particular to a high heat conduction and high heat dissipation, which enables a high-current electrical connection of a light-emitting element and a drive circuit to have a good heat dissipation when used at a high temperature, and maintains a stable working efficiency at a rated operating temperature of the projector light source. Heat dissipation structure.

With the advancement of light source technology, the light source in the projector has also been replaced by a traditional light bulb into a high-brightness light-emitting diode. When the light-emitting diode operates, a large amount of heat energy is generated, and the common heat-dissipating technology is nothing more than nothing. The fan is combined with a heat sink such as a heat sink fin and a heat pipe. However, the heat generated by the light emitting diode is directly transmitted to the connected circuit board, and the circuit board transmits heat energy to the heat sink. The circuit board is made of metal. Circuit board (Metal.Core Printed Circuit Board; MCPCB). However, although the metal circuit board has high thermal conductivity, it also has high heat collecting characteristics. Therefore, although the thermal energy can be quickly transmitted to the metal circuit board, However, it also causes a large amount of thermal energy accumulation; at the same time, electronic circuit components are themselves limited by the characteristics of the material. When the temperature at work is higher, that is, when the working temperature reaches a certain temperature, the working efficiency of the electronic circuit components will follow. Decrease, especially for light-emitting diodes, when the working temperature reaches a certain high temperature, the problem of light decay will occur, resulting in the projector being used when it is used. Decline in image quality, brightness, color and other qualities.

In view of the above shortcomings in the past, the creator is researching and improving the above shortcomings. Tao, finally, this creation is produced.

The main purpose of this creation is to provide a heat dissipation structure for a projector light source with high thermal conductivity and high heat dissipation.

The secondary purpose of this creation is to provide a projector light source heat dissipation structure that maintains a stable rated operating temperature after high current input.

The present invention is mainly connected to a preset projector. In order to achieve the above objects and functions, the technical means adopted by the present invention include: a circuit board having a driving circuit on the surface; a surface disposed on the surface of the circuit board, and a light-emitting element electrically connected to the driving circuit; and a heat-dissipating module disposed on a bottom surface of the circuit board; the circuit board is made of graphite, the graphite material is porous and filled with a high-heat-conducting metal, whereby the driving circuit drives the light-emitting element Action, due to the high thermal conductivity and high heat dissipation characteristics of graphite, combined with the highly thermally conductive metal filled in the porous body, the thermal energy generated by the light-emitting element and the driving circuit is directly transmitted from the circuit board to the heat-dissipating module, and the high-current input driving circuit, the circuit The board and the heat dissipation module are capable of maintaining the light emitting element and the driving circuit at a rated operating temperature.

According to the above configuration, the light emitting element may be an LED (Light Emitting Diode), a DMD (Digital Micromirror Device), or a DLP (Digital Light Processing).

According to the above structure, the heat dissipation module may be a heat dissipation fin, a heat conduction plate or a heat pipe.

According to the above structure, the heat dissipation module is further connected with a fan.

In order to obtain a more specific understanding of the above purposes, functions and features of this creation, the following figures are described as follows:

1‧‧‧ boards

2‧‧‧Drive circuit

3‧‧‧Lighting elements

4‧‧‧ Thermal Module

Figure 1 is a perspective view of a preferred embodiment of the present invention.

The creation of the projector is mainly connected to a preset projector. However, the structure of the projector is a mature technology and is not a technical feature of the present invention. It will not be described here; The structure of the creation mainly includes: a circuit board 1, a light-emitting component 3 and a heat dissipation module 4, wherein: the circuit board 1 is made of graphite, the graphite material is porous and filled with high thermal conductivity metal, and the surface of the circuit board 1 is set. A driving circuit 2, it should be noted that the present invention is made of a graphite material as a circuit board as described above. The graphite material contains a large number of micro-holes, and metal is injected into the micro-holes, and the injected metal is high thermal conductivity and high heat dissipation. The light-emitting element 3 is disposed on the surface of the circuit board 1 and electrically connected to the driving circuit 2, wherein the light-emitting element 3 can be an LED (Light Emitting Diode), a DMD (Digital Micromirror Device, a digital micro mirror element) or a DLE (Digital Light Processing); the heat dissipation module 4 is connected to the bottom surface of the circuit board 1 , wherein the heat dissipation module 4 may be a heat sink fin, a heat conducting plate or a heat pipe, and the heat sink module may further be connected to a fan (not shown).

Thereby, when the driving circuit 2 drives the light-emitting element 3 to operate, the heat energy generated by the light-emitting element 3 and the driving circuit 2 is directly transmitted by the circuit board 1 due to the high thermal conductivity and high heat-dissipating property of the graphite, and the highly thermally conductive metal filled in the porous body. To the heat dissipation module 4, the light-emitting element 3 is not caused to light, and the current is high. After the driving circuit 2 is input, the circuit board 1 and the heat dissipation module 4 can maintain the light-emitting element 3 and the driving circuit 2 at a stable rated operating temperature, so that the light-emitting element 3 and the driving circuit 2 can dissipate heat at a high temperature, and maintain stable operation. effectiveness.

In summary, the heat dissipation structure of the projector light source of the present invention is a novel and progressive creation, and a new type of patent is filed according to law; however, the content of the above description is only a description of the preferred embodiment of the present invention. Any changes, modifications, alterations or equivalent substitutions that extend from the technical means and scope of this creation shall fall within the scope of the patent application of this creation.

Claims (4)

A projector light source heat dissipation structure is connected to a preset projector, which comprises at least: a circuit board, the circuit board is made of graphite, the graphite material is porous and filled with high thermal conductivity metal, and the surface of the circuit board is set a driving circuit; a light-emitting element disposed on the surface of the circuit board and electrically connected to the driving circuit; a heat-dissipating module connected to the bottom surface of the circuit board; and when the driving circuit drives the light-emitting element to operate, due to high thermal conductivity of the graphite The high heat dissipation characteristics, combined with the high thermal conductivity metal filled in the porous body, enable the thermal energy generated by the light emitting element and the driving circuit to be directly transmitted from the circuit board to the heat dissipation module, and after the high current input driving circuit, the circuit board and the heat dissipation module can make the light emitting The components and drive circuitry are maintained at a stable rated operating temperature. The projector light source heat dissipation structure according to claim 1, wherein the light emitting element may be an LED (Light Emitting Diode), a DMD (Digital Micromirror Device), or a DLE (Digital Light) Processing, digital light source processing technology). The heat dissipation structure of the projector light source as described in claim 1, wherein the heat dissipation module may be a heat dissipation fin, a heat conduction plate or a heat pipe. The projector light source heat dissipation structure according to claim 1, wherein the heat dissipation module is further connected with a fan.