TWM575517U - Cooling module - Google Patents

Abstract

A refrigeration assembly is provided with a first heat exchange element and a second heat exchange element in surface contact on opposite sides of a uniformly cooled wafer, the first body of the first heat exchange element and the second heat exchange element The heat exchange fluid can flow into and out of the second body; the cooling chip, the first heat exchange element and the second heat exchange element are all set in a vacuum accommodating space formed by a housing; the cooling chip is passed in The current generates heat absorption and heat release on opposite sides, and the first heat exchange element and the second heat exchange element respectively generate heat exchange on the cooling chip. The heat exchange fluid that heats up and down by heat exchange heat Provide to the equipment needed.

Description

Refrigeration components

This creation is related to the field of heat exchange devices, especially a refrigeration component that can improve refrigeration efficiency.

Thermoelectric Cooling Chip (Thermoelectric Cooling Chip) is a semiconductor element made of N-type semiconductor and P-type semiconductor materials connected into a galvanic pair through a circuit. After passing a DC current into the circuit, energy transfer can be generated and can be freely controlled for cooling , Heating, temperature control. The temperature difference between the two sides of the wafer is affected by the magnitude of the current. The greater the current, the greater the temperature difference.

Compared with the use of compressors and refrigerants for general refrigeration cycles, the refrigeration chip has the following characteristics: no mechanical parts and no noise; no refrigerant is used, which is more environmentally friendly; small and lightweight, the shape is easy to select; only the input current is Can be cooled or heated; long life, simple operation and easy maintenance. However, due to the low energy conversion efficiency of the cooling chip (generally about 40% to 50%), the cooling chip cannot be directly used in large air conditioners or large refrigerators.

The purpose of this creation is to provide a refrigeration assembly that enables the refrigeration chip to improve energy conversion efficiency in practical applications, and thus can be applied to larger air conditioners or cooling devices.

The refrigeration assembly provided by the present invention is characterized in that a first heat exchange element and a second heat exchange element are respectively provided on the opposite sides of the uniformly cooled wafer in surface contact, and the first body and the first heat exchange element of the first heat exchange element The heat exchange fluid can flow into and out of the second body of the two heat exchange elements; the cooling wafer, the first heat exchange element, and the second heat exchange element can be disposed in a vacuum-containing space formed by a housing; When the cold wafer is energized, it produces heat absorption and heat release on the opposite sides, and the first heat exchange element and the second heat exchange element respectively generate heat exchange on the cooling chip, and the heat is heated and cooled by the heat exchange. The exchange fluid can provide heat to the equipment needed.

One of the embodiments of the refrigeration assembly provided by this creation may include: a uniformly cooled wafer that generates heat absorption on the first side after being energized and generates heat on the opposite second side; a first heat exchange element , Surface-attached to the first side of the refrigerated wafer, the first heat exchange element has a first body, the first body has a first inner space, at least one first communicating with the first inner space An inlet and at least one first outlet communicating with the first inner space, a heat exchange fluid flows into the first inner space from the first inlet and flows out through the first outlet; and a second heat exchange element, surface-contacting Attached to the second side of the refrigerated wafer, the second heat exchange element has a second body with a second inner space, at least one second inlet communicating with the second inner space, and at least A second outlet communicating with the second inner space, a heat exchange fluid flows into the second inner space from the second inlet and flows out through the second outlet. By the heat exchange fluid flowing in the first heat exchange element and the second heat exchange element to absorb or release heat, the energy conversion efficiency of the refrigeration component can be greatly improved.

Another embodiment of the refrigeration assembly provided by the present invention may further include a housing having an accommodating space, at least one first fluid inlet through hole communicating with the accommodating space, and at least one communicating with the accommodating space The second fluid flows out of the through hole, the cooling wafer, the first heat exchange element and the second heat exchange element are arranged in the accommodating space, the first inlet and the first outlet of the first heat exchange element A first fluid input tube and a first fluid output tube are respectively connected, and the first fluid input tube and the first fluid output tube extend through the first fluid inlet through hole and the first fluid outlet through hole respectively Outside the housing, the second inlet and the second outlet of the second heat exchange element are respectively connected to a second fluid input tube and a second fluid output tube, and the second fluid input tube and the second fluid The output tube extends through the second fluid inlet through hole and the second fluid outlet through hole to the outside of the housing, and the accommodating space of the housing is formed as a vacuum.

In the refrigeration assembly provided by this work, the first body in the first heat exchange element and the second body in the second heat exchange element may be made of copper or copper alloy material, or both made of aluminum or aluminum alloy material Or, the first body is made of copper or copper alloy material, and the second body is made of aluminum or aluminum alloy material; or, the first body is made of aluminum or aluminum alloy material, and the second body is made of It is made of copper or copper alloy material; the aforementioned copper or copper alloy and aluminum or aluminum alloy both have excellent thermal conductivity, so that better heat exchange efficiency can be obtained.

The following describes the implementation of this creation in more detail with the help of diagrams and component symbols, so that those skilled in the art can implement it after studying this manual.

First Embodiment FIGS. 1 to 2 show the first embodiment of the refrigeration assembly 1 of the present invention, which may include a uniformly cooled wafer 11, a first heat exchange element 12 and a second heat exchange element 13. Among them, the cooling wafer 11 is a semiconductor element formed by an N-type semiconductor and a P-type semiconductor material connected into a galvanic pair through a circuit. When a DC current is passed into the circuit, energy transfer can be generated, so that the cooling wafer 11 One side produces an endothermic effect to lower the temperature, and the opposite side produces an exothermic effect to increase the temperature.

The first heat exchange element 12 has a first body 120 which can be formed into a rectangular body or other shape having a hollow first inner space 121 using a copper alloy material or an aluminum alloy material, and the first body 120 At a suitable position on the side wall of 120, at least one first inlet 122 communicating the first inner space 121 and the outside, and at least one first outlet 123 communicating the first inner space 121 and the outside are provided; for example, the first inlet 122 may be connected to The first outlets 123 are respectively disposed on opposite sides of the first body 120, or the first inlet 122 and the first outlet 123 are disposed on the same side of the first body 120.

The second heat exchange element 13 has a second body 130, which can be formed into a rectangular body or other shape with a hollow second inner space 131 using copper or copper alloy material, or aluminum or aluminum alloy material , And at least one second inlet 132 connecting the second inner space 131 and the outside, and at least one second outlet 133 connecting the second inner space 131 and the outside at appropriate positions on the side wall of the second body 130; for example, may The second inlet 132 and the second outlet 133 are respectively disposed on opposite sides of the second body 130, or the second inlet 132 and the second outlet 133 are disposed on the same side of the second body 130.

In the first embodiment of the present invention, when the cooling wafer 11 is combined with the first heat exchange element 12 and the second heat exchange element 13 to form the cooling assembly 1, a heat conductive adhesive may be applied to the opposite side of the cooling wafer 11 The two sides, that is, the first side and the second side, then adhere the first side of the cooling chip 11 to the outer side wall of the first body 120 of the first heat exchange element 12 through the thermally conductive adhesive, and cool through the thermally conductive adhesive The second side of the chip 11 is adhered to the outer side wall of the second body 130 of the second heat exchange element 13.

When the refrigeration assembly 1 of the present invention is used, it is necessary to connect a first fluid input pipe 124A and a first fluid output pipe 124B at the first inlet 122 and the first outlet 123 of the first heat exchange element 12 respectively, and at the first The second inlet 132 and the second outlet 133 of the two heat exchange elements 13 are respectively connected to a second fluid input pipe 134A and a second fluid output pipe 134B, and then the heat exchange fluid passes through the first fluid input pipe 124A and the second fluid The input tube 134A is input into the first body 120 and the second body 130 respectively; the heat exchange fluid may be water or any suitable fluid. When the cooling wafer 1 is energized, the first side can reduce the temperature due to heat absorption, and the second side can increase the temperature due to heat release; or conversely, the first side can increase the temperature due to heat release, and The second side reduces the temperature due to heat absorption. At this time, the heat exchange fluids in the first body 120 and the second body 130 can release heat or absorb heat to the first side and the second side of the cooling wafer 11 for heat exchange, and then pass the heat exchange fluid through the first The one fluid output tube 124B and the second fluid output tube 134B flow out, and the heat exchange fluid after flowing out can be dissipated by another heat exchange device (not shown in the figure) and then recycled.

The aforementioned refrigeration assembly 1 of the present invention is suitable for application in an air-conditioning system that needs to reduce the temperature to replace the traditional refrigerant, so as to avoid the damage of the refrigerant to the environment. Specifically, the heat-exchanged fluid after cooling in the cooling assembly 1 can be used to absorb the heat in the room to cool the room, and the heat-exchange fluid after absorbing the indoor heat returns to the cooling assembly 1 and is then cooled to cool Absorbs heat indoors, so it works endlessly.

The aforementioned refrigeration assembly 1 of the present invention can also be used in an air-conditioning system that requires heating to replace a conventional heater. Specifically, the heat exchange fluid after the temperature rise in the refrigeration assembly 1 can be used to release heat to the room to warm the room, and the heat exchange fluid after the heat release returns to the refrigeration unit 1 and then the temperature is raised In order to release heat to the room again, such a cycle of operation.

"Second Embodiment" FIGS. 3 to 4 show a second embodiment of the refrigeration assembly 1 of the present invention, which may include a uniformly cooled wafer 11, a first heat exchange element 12, a second heat exchange element 13 and a壳 14。 The shell 14. The structure and combination relationship of the cooling wafer 11, the first heat exchange element 12 and the second heat exchange element 13 are the same as those in the first embodiment described above, so the description will not be repeated here.

In the second embodiment of the present invention, the housing 14 is formed with an accommodating space 140, and at least one first fluid inlet through hole 141A connecting the accommodating space 140 and the outside is provided on the side wall or end of the housing 14 The first fluid outflow through hole 141B, at least one second fluid inflow through hole 142A and the second fluid outflow through hole 142B that connect the accommodating space 140 with the outside; the cooling wafer 11, the first heat exchange element 12 and the second The heat exchange element 13 is assembled in the accommodation space 140 of the housing 14 after being combined in the foregoing first embodiment, and a first fluid is connected to the first inlet 122 and the first outlet 123 of the first heat exchange element 12 respectively An input pipe 124A and a first fluid output pipe 124B, and the first fluid input pipe 124A extends through the first fluid into the through hole 141A and extends out of the housing 14, the first fluid output pipe 124B flows out of the through hole through the first fluid 141B extends outside the housing 14; the second inlet 132 and the second outlet 133 of the second heat exchange element 13 are respectively connected to a second fluid input tube 134A and a second fluid output tube 134B, and the second fluid input tube 134A and The second fluid output tube 134B extends out of the outside of the housing 14 through the second fluid inlet through hole 142A and the second fluid outlet through hole 142B; the gap between the first fluid inlet through hole 141A and the first fluid input tube 124A, The gap between the first fluid outflow hole 141B and the first fluid output tube 124B, the gap between the second fluid entry through hole 142A and the second fluid input tube 134A, and the second fluid outflow through hole 142B and the second fluid The gap between the output pipes 134B can be sealed with a caulking agent, and then the air in the accommodating space 140 of the housing 14 is completely evacuated by a vacuum pumping device to form the accommodating space 140 into a vacuum.

With the refrigeration assembly of the second embodiment described above, since the accommodating space 140 is vacuum without air as a heat transfer medium, the refrigeration chip 11, the first heat exchange element 12, and the second heat exchange element 13 are in a vacuum When the inside of the casing 14 is in operation, heat loss can be avoided while maintaining a constant temperature, thereby further improving energy conversion efficiency.

The above are only the preferred embodiments for explaining this creation, and are not intended to restrict the creation in any way, so any modifications or changes made to this creation under the same spirit of invention , Should still be included in the scope of protection of this creative intention.

1‧‧‧Refrigeration components

11‧‧‧Refrigeration chip

12‧‧‧The first heat exchange element

120‧‧‧The first body

121‧‧‧First inner space

122‧‧‧First entrance

123‧‧‧ First exit

124A‧‧‧First fluid input tube

124B‧‧‧The first fluid output tube

13‧‧‧Second heat exchange element

130‧‧‧Second body

131‧‧‧Second inner space

132‧‧‧Second entrance

133‧‧‧Second exit

134A‧‧‧Second fluid input tube

134B‧‧‧Second fluid output tube

14‧‧‧Housing

140‧‧‧accommodation space

141A‧‧‧First fluid enters through hole

141B‧‧‧The first fluid flows out through the hole

142A‧‧‧The second fluid enters the through hole

142B‧‧‧Second fluid outflow through hole

Fig. 1 is a perspective external view showing a first embodiment of the inventive refrigeration assembly; Fig. 2 is a plan cross-sectional view showing the structure of the first embodiment of the creation refrigeration assembly in the direction II-Ⅱ of Fig. 1; Fig. 3 is a display The perspective external view of the second embodiment of the inventive refrigeration assembly; and FIG. 4 is a plan sectional view showing the structure of the second embodiment of the inventive refrigeration assembly along the direction IV-IV of FIG. 3.

Claims (2)

A refrigerating assembly, comprising: consistently cooled wafer, which generates heat absorption effect on the first side and heat release effect on the opposite second side after being energized; a first heat exchange element, which is attached to the cooling surface in contact On the first side of the chip, the first heat exchange element has a first body with a first inner space, at least one first inlet communicating with the first inner space, and at least one communicating with the first The first outlet of the inner space, a heat exchange fluid flows into the first inner space from the first inlet and flows out through the first outlet. The first system is made of copper, copper alloy, aluminum, or aluminum alloy material; And a second heat exchange element attached to the second side of the refrigerated wafer in surface contact, the second heat exchange element has a second body, the second body has a second inner space, and at least one communicates with the A second inlet of the second inner space and at least one second outlet communicating with the second inner space, a heat exchange fluid flows into the second inner space from the second inlet and flows out through the second outlet, the second The system is made of copper, copper alloy, aluminum, or aluminum alloy materials. The refrigeration assembly as described in item 1 of the patent application scope, further comprising a housing having an accommodating space, at least one first fluid inlet through-hole communicating with the accommodating space, and at least one communicating with the accommodating space The second fluid in the setting space flows out of the through hole, the cooling wafer, the first heat exchange element and the second heat exchange element are disposed in the accommodating space, the first inlet of the first heat exchange element and the first An outlet is connected to a first fluid input tube and a first fluid output tube respectively, and the first fluid input tube and the first fluid output tube pass through the first fluid inlet through hole and the first fluid out through hole respectively Extending out of the outer shell, the second inlet and the second outlet of the second heat exchange element are respectively connected to a second fluid input tube and a second fluid output tube, and the second fluid input tube and the second fluid output tube are connected The two fluid output tubes extend out of the outside of the housing through the second fluid inlet through hole and the second fluid outlet through hole, respectively, and the accommodating space of the housing is formed as a vacuum.