TWM574334U - Ceramic substrate provided with surrounding wall and arranged with circuit layout - Google Patents

Abstract

A ceramic substrate having a circuit around a wall, the substrate comprising: a ceramic substrate body including an upper surface and a lower surface; and a metal circuit layer disposed on at least the upper surface for providing at least one electronic component, wherein the substrate The metal circuit layer comprises at least a plurality of metal pads/wires independent of each other, and the mutually independent pads/wires are spaced apart; at least one insulating surrounding wall surrounding at least part of the metal circuit layer, the insulating surrounding wall is a The insulating surrounding wall and the ceramic substrate body together form an accommodating space partially surrounding the electronic component; and the gel substrate is at least partially filled with the space, so that the above-mentioned interval is formed by clamping The pads/wires are insulated from each other.

Description

Ceramic substrate with circuit layout around the wall

The present invention relates to a ceramic substrate, and more particularly to a ceramic substrate having a circuit disposed around a wall.

With the rapid evolution of technology, optical products such as mobile phone flashlights, identification systems, automotive headlights, fishing lights, engineering lighting or landscape lighting are all developing with high efficiency and miniaturization, among which optical products are most commonly used. The technology is LED (light-emitting diode) and VCSEL (vertical cavity surface-emitting laser), but due to limitations in process technology, the miniaturization of component size has reached the bottleneck.

The package structure of the general optical component comprises a substrate and a surrounding wall of the connecting substrate, and the die is disposed in the accommodating space formed by the substrate and the surrounding wall, and finally encapsulated by a colloid, a plastic piece or a glass piece, wherein the surrounding wall is The luminous efficacy and color temperature uniformity of optical products have a great influence. Nowadays, the most common process is to connect the metal surrounding the substrate to the substrate by soldering, electroplating or aluminum bonding. However, due to the conductive properties of the surrounding wall of the metal, the planning of the circuit is limited, and the relationship between the process technology and the metal is used. The substrate surrounding the wall can only be reduced to a size of 35 mm square, and it is difficult to achieve the goal of miniaturization. On the other hand, if a high-precision photoresist film exposure development technique is used to form a surrounding wall on the substrate, the process is complicated and time-consuming, The cost of production has been greatly increased. In addition, all of the above methods have the problem of high process temperature, and then the production The material with different expansion coefficients is deformed by thermal stress, which greatly reduces the yield of the process.

Therefore, how to propose a method for forming a surrounding wall on a ceramic substrate and a ceramic substrate can reduce the process temperature, improve the overall manufacturing yield, improve the luminous efficiency and color temperature uniformity, and avoid the limitation of circuit configuration, which is urgently needed for the present day. The topic of hard work.

In view of the above shortcomings, the main object of the present invention is to provide a ceramic substrate with a circuit around the wall, which can greatly reduce the process temperature and reduce the structural deformation of the structure, thereby improving the manufacturing yield of the ceramic substrate.

Another object of the present invention is to provide a ceramic substrate with a circuit around the wall, which effectively improves the luminous efficiency and color temperature uniformity of the crystal grains disposed on the ceramic substrate.

A further object of the present invention is to provide a ceramic substrate having a circuit around the wall, which additionally ensures that the metal pads/wires of the metal circuit layer are insulated from each other.

To achieve the above object, the present invention provides a circuit-mounted ceramic substrate having a surrounding wall, the substrate comprising: a ceramic substrate body including an upper surface and a lower surface opposite to the upper surface; a layout on at least the upper surface a metal circuit layer for providing at least one electronic component, wherein the metal circuit layer comprises at least a plurality of metal pads/wires independent of each other, and wherein the mutually independent pads/wires are spaced apart; at least one surrounds at least a portion of the metal The insulating layer surrounds the wall, the insulating surrounding wall is made of a gel substrate, and the insulating surrounding wall extends from the upper surface toward the metal circuit layer and has a height higher than the metal circuit layer, so that the insulating surround The wall and the ceramic substrate body together form an accommodating space partially surrounding the electronic component; and the gel substrate is at least partially filled with the space so that the pads/wires sandwiching the space are insulated from each other.

Compared with the prior art, the present invention discloses a ceramic substrate with a circuit around the wall, which is made of a rubber substrate as an insulating surrounding wall, and is formed by insulating the surrounding wall on the ceramic substrate by low temperature heating and pressing. In the above, the process temperature is greatly reduced, the structure is thermally deformed, and some of the adhesive substrates are filled with the spacer/wire spacing of the metal circuit layers, ensuring that the metal pads/wires are insulated from each other; The characteristic adhesive substrate can choose to reflect the crystal light in the installation to enhance the luminous efficiency, or absorb the wide-angle illumination to avoid mutual interference between the different crystal grains, so that it can be used as a face recognition or vehicle identification system. When the light source is used, each surrounding wall can be more miniaturized, and the overall volume is reduced or a higher resolution is obtained.

1~4‧‧‧Steps

10, 10', 10" ‧ ‧ ceramic substrates

11, 11'‧‧‧ Ceramic substrate body

12, 12'‧‧‧ metal circuit layer

13, 13’ ‧ ‧ interval

14, 14', 14" ‧ ‧ insulated surrounding wall

15, 15'‧‧‧ accommodating space

21‧‧‧Upper mold

22‧‧‧ Lower mold

23‧‧‧Offset mold

24‧‧‧Gummy substrate

111, 111'‧‧‧ upper surface

112, 112'‧‧‧ lower surface

121, 121'‧‧‧Metal pads

122, 122’‧‧‧Metal joints

123, 123’‧‧‧Metal wire

221‧‧‧ Groove

222‧‧‧ protruding parts

141‧‧‧dividing slot

30, 40‧‧‧Lighting diodes

31, 41‧‧‧ grain

32, 42‧‧‧ wires

33‧‧‧ lenses

43‧‧‧ lens

A, B‧‧‧ dotted line

FIG. 1 is a flow chart for manufacturing a ceramic substrate with a circuit disposed around a wall.

Figure 2 is a schematic view showing the steps of the first preferred embodiment of Figure 1.

3 is a schematic view showing another step of the first preferred embodiment of FIG. 1.

Figure 4 is a partial enlarged view of the ceramic substrate with circuit in the surrounding wall of Figure 3.

FIG. 5 is a perspective structural view showing a first preferred embodiment of a ceramic substrate having a circuit disposed around a wall.

Fig. 6 is a perspective structural view showing the embodiment of Fig. 5 as a light-emitting diode.

Figure 7 is a cross-sectional view of the light emitting diode of Figure 6.

Figure 8 is a cross-sectional view showing a second preferred embodiment of a ceramic substrate having a circuit disposed around a wall.

Fig. 9 is a cross-sectional view showing the embodiment of Fig. 8 as a light-emitting diode.

The following describes the implementation of the present invention by a specific embodiment, and is familiar with this. Those skilled in the art can easily understand the advantages and effects of the present invention by the contents disclosed in this specification.

The structure, the proportions, the sizes and the like of the drawings are only used to cope with the disclosure of the specification, and are intended to be understood and read by those skilled in the art, and are not intended to limit the conditions under which the creation can be implemented. The modification of any structure, the adjustment of the size or the change of the proportional relationship shall be regarded as the scope of implementation of the creation without any substantial change in the technical content.

The manufacturing flow chart of the ceramic substrate with the circuit arranged around the wall is as shown in FIG. 1. First, in step 1, the ceramic substrate body 11 is bonded to the lower surface of the upper mold 21 by, for example, vacuum suction, as shown in FIG. The side forming the surrounding wall faces the lower mold 22, and the release mold 23 is placed on the lower mold 22; then, as shown in step 2, the adhesive substrate 24 is injected into the side of the release mold 23 close to the upper mold 21. In this example, the gelatinous substrate 24 is a liquid and thermosetting silicone. Of course, those skilled in the art can also arbitrarily select, for example, an epoxy resin or other resin having a curing property of cooling or ultraviolet light irradiation. A gelatinous substrate or a composite gelatinous substrate obtained by adding a functional material such as a phosphor powder, a light absorbing material or a reflective material does not hinder the implementation of the present invention.

The insulating surrounding wall is formed on the ceramic substrate by the manufacturing method. Referring to the enlarged schematic view of FIG. 4, the ceramic substrate 10 mainly includes a ceramic substrate body 11 and a metal circuit layer 12 that has been disposed on the ceramic substrate body 11. The ceramic substrate body 11 includes an upper surface 111 and a lower surface 112 opposite to the upper surface 111. The metal circuit layer 12 includes a metal pad 121 disposed on the upper surface 111, a line (not shown), a metal wire 123 extending through the ceramic substrate body 11, And the metal contacts 122 disposed on the lower surface 112. Since the metal wires 123 lead to the metal pads 121 and the metal contacts 122, electronic components such as LED dies to be mounted on the metal pads 121 in the future may be via metal. Contact 122 is used to obtain an enable current or electrical signal.

Next, as described in step 3, the upper mold 21 and the lower mold 22 are in close proximity to each other, and the ceramic substrate body 11 and the adhesive substrate 24 are heated and pressed at a temperature lower than 300 degrees. At this time, the adhesive substrate 24 is mainly The cavity of the lower mold 22 is squeezed and gradually joined to the ceramic substrate body 11 during the pressing process, especially after the mold clamping, the adhesive substrate will be as shown in FIG. 4 due to the influence of pressure and temperature. The cavity is filled and also extruded into the space 13 between tens to hundreds of micrometers (μm) between the metal pads 121, so that the metal pads 121 are insulated from each other. The colloidal substrate 24, which is simultaneously filled into the recess 221 of the lower mold 22, is gradually solidified on the ceramic substrate body 11 to form an insulating surrounding wall 14 surrounding the portion of the metal circuit layer 12.

As shown in FIG. 3, FIG. 4 and step 4, when demolding, the upper mold 21 and the lower mold 22 are gradually separated from each other. Due to the action of the release mold 23, the formed insulating surrounding wall 14 does not adhere to the lower mold at all. 22, firmly bonded to the ceramic substrate body 11, extending from the upper surface 111 toward the metal circuit layer 12 and having a height higher than the metal circuit layer 12, so that the insulating surrounding wall 14 and the ceramic substrate body 11 are formed together for electronic components. The accommodation space 15. The size of the accommodating space 15 and the height and size of the insulating surrounding wall 14 are determined by the pitch and shape of the recess 221 of the lower mold 22. A protrusion 222 may be formed in the recess 221, so that the insulating surrounding wall 14 is formed with a dividing groove 141 corresponding to the protruding portion 222, so that the ceramic substrate 10 can be easily divided into smaller units; of course, according to the conditions of the cutting instrument It is determined whether or not the protrusion 222 or the protrusion 222 of a different shape is formed in the groove 221.

The adjacent insulating surrounding wall 14 in the ceramic substrate 10 and the accommodating space 15 formed by the surrounding thereof can be cut as a space for arranging the LED dies; of course, as will be readily understood by those skilled in the art, if the ceramic substrate is to be used The VCSEL for manufacturing a poly unit cell can be used as it is without division. The first preferred implementation of the ceramic substrate with a circuit around the wall For example, as shown in FIG. 5, in this example, the ceramic substrate 10' is divided into a single body via the entire ceramic substrate 10 in the previous example, and the ceramic substrate 10' includes a ceramic substrate body 11', a metal circuit layer 12', and an insulating surrounding wall 14. ', wherein the metal circuit layer 12' includes a metal pad 121' disposed on the upper surface 111', a metal contact 122' on the lower surface 112', and a metal wire 123' electrically conducting both.

6 and FIG. 7 are a ceramic substrate 10' of FIG. 5, a light-emitting diode die 31 is soldered on the metal pad, and the wire 32 is electrically connected from the upper surface of the light-emitting diode die 31 to guide the wire 32 to Another metal pad is then filled with a light-transmissive glue in the accommodating space for packaging, and finally the lens 33 is mounted above the light-transmitting glue, and finally a complete light-emitting diode 30 is formed, wherein FIG. 7 is the same as FIG. A cross-sectional view of the light-emitting diode 30 cut along the broken line A. The die 31 is mounted on the metal pad 121' of the upper surface 111' by mounting or spot welding, and then electrically connected to the other metal pad 121' of the upper surface 111' by the wire 32, thereby, the die 31 is permeable to the external power source and illuminates through the two metal contacts 122' of the lower surface 112'. The space 13' between the two metal pads 121' of the upper surface 111' has a cured gel substrate, so that the two metal pads 121' can be prevented from being damaged due to high temperature deformation or short circuit during soldering. .

In the process of filling the encapsulant into the accommodating space 15', the insulating surrounding wall 14' can avoid the overflow of the encapsulant, and can also be added to the colloidal substrate by using materials with different characteristics or using colloidal bases of different materials. The material allows the shaped insulation to surround the wall 14' to have different effects. For example, when a highly transparent colloidal substrate is used, the illuminating angle of the illuminating diode can be increased; when a highly reflective material is added, the illuminating light can be concentrated to prevent the light from interfering with the adjacent illuminating element; if the luminescent powder is added, the color can be matched. Improve color temperature uniformity or adjust color rendering. Of course, even in a accommodating space, for example, three pairs or more pairs of metal pads are formed, and at least one red, green and blue three-color dies are arranged in one surrounding wall to form a white color with good color rendering. LED.

A second preferred embodiment of the ceramic substrate having a circuit disposed around the wall is shown in FIG. 8 and FIG. 9. The same portions as in the previous example are not described herein again, and only the differences are explained. The structure surrounding the wall is not limited to the rectangular structure in the foregoing embodiment, and a different structure may be used to form the insulating surrounding wall on the ceramic substrate. 9 is a light-emitting diode 40 formed of a die 41 for a light-emitting diode, a wire 42 and a lens 43 in the ceramic substrate 10" of FIG. 8, wherein FIG. 9 is made of the ceramic substrate 10" of FIG. A cross-sectional view of the light-emitting diode 40 cut along the broken line B. In this example, the insulating surrounding wall 14" is formed in a circular ring shape on the ceramic substrate 10", so that a circular lens 43 can be disposed above the insulating surrounding wall 14", meaning that the manufacturing is performed according to the technique disclosed in the present application. It has great flexibility and can manufacture different shapes of products according to different market demands.

The creation of a ceramic substrate with a circuit around the wall, through the molding method, the liquid gelatinous substrate is formed into a solid insulating surrounding wall on the ceramic substrate, thereby greatly reducing the high temperature environment in the existing process. Preventing the ceramic substrate from thermal stress and expansion and contraction due to high temperature, resulting in a decrease in product yield; in addition, it can also improve the positional accuracy of the insulating surrounding wall formed on the ceramic substrate, avoiding errors or misalignment caused by the electric welding process, and simultaneously simplifying the operation. Process. On the other hand, the liquid gelatinous substrate is also filled into the gaps in the metal pads or wires in the metal circuit layer, and after the gel substrate is cured, it is ensured that the metal pads or wires which should be independent of each other are insulated from each other. In addition, the method proposed by the present invention is more suitable for forming various shapes of insulating surrounding walls on a ceramic substrate, which meets various market demands.

However, the above is only the preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto. Any simple equivalent changes and modifications made according to the scope of the patent application and the contents of the specification should still be It is within the scope of this creation. After the description of the preferred embodiment of the present invention, those skilled in the art should be able to understand that the case is a novel and advanced. Step by step and the practicality of the industry, the development value.

Claims (4)

A ceramic substrate having a circuit around a wall, the substrate comprising: a ceramic substrate body including an upper surface and a lower surface opposite to the upper surface; a metal circuit layer disposed on at least the upper surface for at least An electronic component, wherein the metal circuit layer comprises at least a plurality of metal pads/wires independent of each other, and wherein the mutually independent pads/wires are spaced apart; at least one insulating surrounding wall surrounding at least a portion of the metal circuit layer, The insulating surrounding wall is made of a gel substrate, and the insulating surrounding wall extends from the upper surface toward the metal circuit layer and has a height higher than the metal circuit layer, so that the insulating surrounding wall and the ceramic substrate body are formed together. An accommodating space partially surrounding the electronic component; and the adhesive substrate is at least partially filled with the space so that the pads/wires sandwiching the space forming the space are insulated from each other. The ceramic substrate having a circuit around the wall according to the first aspect of the invention, wherein the adhesive substrate is silicone. A circuit-mounted ceramic substrate having a surrounding wall as described in claim 1, wherein the gel substrate is an epoxy resin. The ceramic substrate having a circuit around the wall according to claim 1, wherein the insulating surrounding wall is perpendicular to the ceramic substrate body.