CN111148338A - Method for forming surrounding wall on ceramic substrate with circuit and substrate - Google Patents
Method for forming surrounding wall on ceramic substrate with circuit and substrate Download PDFInfo
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- CN111148338A CN111148338A CN201911060820.9A CN201911060820A CN111148338A CN 111148338 A CN111148338 A CN 111148338A CN 201911060820 A CN201911060820 A CN 201911060820A CN 111148338 A CN111148338 A CN 111148338A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a method for forming a surrounding wall on a ceramic substrate distributed with a circuit, which forms at least one insulating surrounding wall on the ceramic substrate, wherein the ceramic substrate is provided with a ceramic substrate body and a metal circuit layer, the ceramic substrate body comprises an upper surface and a lower surface, the metal circuit layer is distributed on at least the upper surface and is provided with at least one electronic component, the metal circuit layer comprises at least a plurality of mutually independent metal connecting pads/wires, and intervals exist among the mutually independent connecting pads/wires; the exhaust holes penetrating through the ceramic substrate body are arranged in the range of each insulating surrounding wall in the ceramic substrate body and are not distributed with the metal circuit layer, so that the additional effect of pressure relief is provided when the electronic component generates heat to generate hot gas expansion or decomposes to generate gas. The invention also discloses a ceramic substrate with a surrounding wall and a circuit.
Description
Technical Field
The present invention relates to a ceramic substrate and a method for fabricating the same, and more particularly, to a method for forming a surrounding wall on a ceramic substrate on which a circuit is disposed and the substrate.
Background
With the continuous and rapid development of technology, optical products such as mobile phone flash lamps, identification systems, automobile headlamps, fishing light collectors, engineering lighting or landscape lighting are developed in high efficiency and miniaturization, wherein the most commonly applied technologies for optical products are LEDs (light emitting diodes) and VCSELs (vertical cavity surface emitting lasers), but the current process technology limits limit causes the miniaturization of the component size to be a bottleneck, and the adhesion between the retaining wall and the ceramic substrate is very poor, which leads to the great reduction of the product yield.
Generally, the package structure of an optical device includes a substrate and a surrounding wall linking the substrate, and a die is disposed in an accommodating space formed by the substrate and the surrounding wall, and finally, the package is completed by a glue, a plastic sheet or a glass sheet, wherein the surrounding wall has a great influence on the luminous efficacy and the color temperature uniformity of the optical product. The most common process of the prior art is to connect the metal surrounding wall to the substrate by welding, electroplating or aluminum plate bonding, but the metal surrounding wall has conductive characteristics, so that the layout of the circuit is limited, and in addition to the relationship of the process technology, the substrate using the metal surrounding wall can only be reduced to a size of 35mm square at most, and the miniaturization is difficult to achieve; on the other hand, if the high-precision photoresist film exposure and development technique is used to form the surrounding wall on the substrate, the production cost is greatly increased due to the complicated process and time-consuming operation. In addition, the above methods all have the problem of high process temperature, and further generate the phenomenon of thermal stress deformation of materials with different expansion coefficients, so that the yield of the process is greatly reduced.
Particularly, in the trend of greatly miniaturizing the optical structures such as LED dies and optical sensor dies, if the circuit protection components used in combination cannot be correspondingly miniaturized and still occupy the same circuit area as before to mount such circuit protection components, the benefit of miniaturizing the optical structure will be greatly eroded.
Therefore, it is an urgent need to provide a method for forming a surrounding wall on a ceramic substrate, which can reduce the process temperature, increase the overall manufacturing yield, ensure the stability in a high-temperature installation or operation environment, and even further hide the protection components of the circuit, thereby making the accommodation space miniaturized.
Disclosure of Invention
In view of the above-mentioned deficiencies of the prior art, it is desirable to provide a method for forming a surrounding wall on a ceramic substrate with a circuit thereon, which can greatly reduce the process temperature and the thermal deformation of the structure, thereby increasing the yield of the ceramic substrate; in addition, it is desirable to provide a ceramic substrate with a surrounding wall and a circuit layout, which can additionally ensure the insulation between the metal pads/wires and the metal contacts of the metal circuit layer, and can improve the surge protection problem.
According to an embodiment, the present invention provides a ceramic substrate with a surrounding wall and a circuit, the substrate comprising: a ceramic substrate body including an upper surface and a lower surface opposite to the upper surface; a metal circuit layer arranged on at least the upper surface for arranging at least one electronic component, wherein the metal circuit layer comprises at least a plurality of mutually independent metal connecting pads/wires, and intervals are reserved among the mutually independent connecting pads/wires; at least one insulation surrounding wall surrounding at least part of the metal circuit layer, wherein the insulation surrounding wall is made of a rubber base material, extends from the upper surface to the direction of the metal circuit layer and is higher than the metal circuit layer in height, so that the insulation surrounding wall and the ceramic substrate body jointly form an accommodating space partially surrounding the electronic component; and the adhesive base material is at least partially filled into the interval, so that the pads/wires clamped to form the interval are insulated from each other.
According to an embodiment, the present invention provides a method for forming a surrounding wall on a ceramic substrate having a circuit thereon, wherein at least one insulating surrounding wall is formed on a ceramic substrate, the ceramic substrate has a ceramic substrate body and a metal circuit layer, the ceramic substrate body includes an upper surface and a lower surface opposite to the upper surface, the metal circuit layer is disposed on at least the upper surface for disposing at least one electronic component, wherein the metal circuit layer includes at least a plurality of metal pads/wires independent of each other, and there is a space between the pads/wires independent of each other, the method includes the following steps:
a) arranging the ceramic substrate body on an upper die, and arranging a release film on a lower die, wherein the metal circuit layer is arranged towards the lower die;
b) injecting a liquid adhesive base material into one side of the release film close to the upper die;
c) the upper die and the lower die are close to each other, the ceramic substrate body and the adhesive base material are heated and pressed, so that the adhesive base material is at least partially filled into the gap, the pad/wire gaps which are clamped to form the gap are insulated from each other, and the adhesive base material is solidified to form at least one insulating surrounding wall which surrounds at least part of the metal circuit layer; and
d) the upper die and the lower die are mutually far away from each other, so that the ceramic substrate body is separated from the release film, wherein the insulating surrounding wall extends from the upper surface to the direction of the metal circuit layer and is higher than the metal circuit layer, and the insulating surrounding wall and the ceramic substrate body jointly form an accommodating space which partially surrounds the electronic component.
Compared with the prior art, the method for forming the surrounding wall on the ceramic substrate with the circuit and the substrate provided by the invention take the adhesive base material as the insulating surrounding wall, and form the insulating surrounding wall on the ceramic substrate in a low-temperature heating and pressing mode, thereby greatly reducing the processing temperature, reducing the thermal deformation of the structure, and simultaneously filling partial adhesive base material into the intervals of the mutually independent pads/wires of the metal circuit layer to ensure that the metal pads/wires are mutually insulated; the protection component can be further arranged at least partially at the surrounding wall, so that the whole circuit component is smoothly miniaturized. And when the surrounding wall is additionally provided with the conductive port, the conductive port can be matched with other component devices to be conducted, and further better circuit layout using flexibility is provided.
When a punching step is added before step a) or after step d), at least one vent hole is formed in the ceramic substrate body within the range of the insulating surrounding wall and at the position where the metal circuit layer is not laid out, and a vent hole penetrating through the ceramic substrate body is arranged in each predetermined insulating surrounding wall and at the position where the predetermined metal circuit layer is not laid out in the ceramic substrate body, so that the gas caused by temperature difference can be expanded and decompressed during surface mounting or use of the circuit component, the structure of the package is ensured not to be cracked and damaged, the product yield and the operation stability are improved, and the protection component can be further arranged at least partially at the surrounding wall, thereby smoothly miniaturizing the whole circuit component.
Drawings
FIG. 1 is a flow chart of a first preferred embodiment of the method of forming a surrounding wall on a ceramic substrate having a circuit disposed thereon according to the present invention.
FIG. 2 is a schematic diagram of the mold closing step of the embodiment of FIG. 1.
FIG. 3 is a schematic diagram of the demolding step of the embodiment of FIG. 1.
Fig. 4 is a partially enlarged view of a ceramic substrate formed with an insulating surrounding wall manufactured in the embodiment of fig. 1.
Fig. 5 is the ceramic substrate of fig. 4 before cutting.
FIG. 6 is a perspective view of a ceramic substrate with surrounding walls and a circuit thereon according to a first preferred embodiment of the present invention.
Fig. 7 is a perspective view of the embodiment of fig. 6 as a light emitting diode.
Fig. 8 is a cross-sectional view of the light emitting diode of fig. 7.
FIG. 9 is a cross-sectional view of a second preferred embodiment of a ceramic substrate with surrounding walls and circuitry according to the present invention.
FIG. 10 is an enlarged partial view of a second preferred embodiment of a ceramic substrate with surrounding walls and circuitry including a circuit protection device according to the present invention.
FIG. 11 is a flow chart of a second preferred embodiment of the method of forming a surrounding wall on a ceramic substrate with circuitry thereon according to the present invention.
FIG. 12 is a cross-sectional view of a ceramic substrate with surrounding walls and a circuit layout according to a third preferred embodiment of the present invention.
FIG. 13 is a top view of a fourth preferred embodiment of an LED with a surrounding wall and a circuit layout on a ceramic substrate according to the present invention.
FIG. 14 is a cross-sectional view of a light emitting diode of a fourth preferred embodiment of a ceramic substrate with surrounding walls and a circuit layout according to the present invention.
FIG. 15 is a cross-sectional view of a wall-shaped metal conducting port of a fourth preferred embodiment of a ceramic substrate with surrounding walls and a circuit layout according to the present invention.
FIG. 16 is a top view of a wall-shaped metal conducting port of a fifth preferred embodiment of a ceramic substrate with surrounding walls and a circuit layout according to the present invention.
FIG. 17 is a cross-sectional view of a ceramic substrate with surrounding walls and a circuit layout according to a fifth preferred embodiment of the present invention.
Wherein:
10. 10 ', 10' are ceramic substrates; 11. 11 ', 11 ", 51"' is a ceramic substrate body;
12. 12 ', 12 ", 52'" is a metal circuit layer; 13 'and 13' are exhaust holes;
14 is an interval; 15. 15 ', 15 "', 74" "are insulating surrounding walls;
16. 16' is a containing space;
21 is an upper die; 22 is a lower die;
23. 23' is a release film; 24. 24' is a gummy base material;
30. 40' "is a light emitting diode; 31-35 ', 31 ' -36 ' as steps;
37 is a light emitting diode grain; 38. 42' ", 73" "are wires;
39 is a mounting lens; 41' ″ is a crystal grain;
43' "is a lens; 55 ', 55 ', 75 ' are through holes;
56' is a circuit protection component; 71 "" is an electronic component;
111 is the upper surface; 112 is the lower surface;
121. 521' ″, 721 "" are metal pads; 122. 122 ", 522"', 722 "", are metal contacts;
123. 523 ', 723' are metal wires; 141 is a dividing groove;
221 is a groove; 222 is a protrusion;
520' ", 720" "are metal conduction ports.
Detailed Description
The invention is further illustrated with reference to the following figures and specific examples. These examples are to be construed as merely illustrative and not limitative of the remainder of the disclosure in any way whatsoever. After reading the description of the invention, one skilled in the art can make various changes and modifications to the invention, and such equivalent changes and modifications also fall into the scope of the invention defined by the claims.
First preferred embodiment
Referring to fig. 2 to 4 together, in step 31, a ceramic substrate body 11 is sucked, for example, by negative pressure and bonded to a position below an upper mold 21, such that a surface of the surrounding wall to be formed faces a lower mold 22, and a release film 23 is disposed on the lower mold 22; next, as shown in step 32, the adhesive base material 24 is injected into the side of the release film 23 close to the upper mold 21. In the embodiment, the adhesive base material 24 is a liquid and thermosetting silica gel, but those skilled in the art of the present invention can arbitrarily select an adhesive base material having a cooling curing property or an ultraviolet light irradiation curing property, such as epoxy resin or other resins, or a composite adhesive base material formed by adding functional materials, such as phosphor, a light absorbing material, and a light reflecting material, without affecting the implementation of the present invention.
Next, as shown in step 33, the upper mold 21 and the lower mold 22 are close to each other, and the ceramic substrate body 11 and the adhesive base material 24 are heated and pressed at a temperature lower than 300 ℃, at this time, the adhesive base material 24 is mainly squeezed to fill the cavity of the lower mold 22 and is gradually bonded to the ceramic substrate body 11 during the pressing process, and particularly after the mold is closed, due to the influence of pressure and temperature, the adhesive base material 24 not only fills the cavity, but also is at least partially squeezed into the spaces 14 of tens to hundreds of micrometers (μm) between the metal pads 121, so that the metal pads 121 and the metal wires 123 sandwiched to form the above-mentioned spaces 14 are insulated from each other. In addition, the adhesive base material 24 filled in the groove 221 of the lower mold 22 after the mold is closed is gradually solidified on the ceramic substrate body 11, and the insulating surrounding wall 15 surrounding part of the metal circuit layer 12 is formed.
Then, when the mold is removed in step 34, the upper mold 21 and the lower mold 22 are gradually separated from each other, and due to the action of the release film 23, the formed insulating surrounding wall 15 is completely prevented from adhering to the lower mold 22 and is firmly combined with the ceramic substrate body 11, extending from the upper surface 111 toward the metal circuit layer 12 and having a height higher than the metal circuit layer 12, so that the insulating surrounding wall 15 and the ceramic substrate body 11 together form the accommodating space 16 for disposing the electronic component. The size of the receiving space 16 and the height and size of the surrounding insulating wall 15 are determined by the pitch and shape of the grooves 221 of the lower mold 22. The protrusion 222 may be formed in the groove 221 so that the insulation surrounding wall 15 is formed with a dividing groove 141 corresponding to the protrusion 222, so that the ceramic substrate 10 can be easily divided into smaller units; of course, whether the protrusion 222 is formed in the groove 221 or not, or whether the protrusion 222 has a different shape may be determined according to the conditions of the cutting instrument.
Through the above steps, the insulating surrounding wall can be smoothly formed on the ceramic substrate 10, the ceramic substrate 10 in this embodiment mainly includes a ceramic substrate body 11, a metal circuit layer 12 already disposed on the ceramic substrate body 11, the ceramic substrate body 11 includes an upper surface 111 and a lower surface 112 opposite to the upper surface 111, the metal circuit layer 12 includes metal pads 121 disposed on the upper surface 111, circuits (not shown), metal wires 123 penetrating through the ceramic substrate body 11, and metal contacts 122 disposed on the lower surface 112, and since the metal wires 123 are connected to the metal pads 121 and the metal contacts 122, the electronic components such as LED dies to be mounted on the metal pads 121 in the future can obtain enabling current or electrical signals through the metal contacts 122.
Fig. 5 shows the ceramic substrate 10 before cutting in fig. 4, the broken line in fig. 5 is the cutting path of the ceramic substrate 10, the ceramic substrate 10 can be cut into 25 smaller units, and the insulating surrounding wall 15 of each unit and the accommodating space 16 formed by surrounding it can be used as a space for arranging LED dies; of course, as those skilled in the art will readily understand, if the ceramic substrate is used to fabricate multi-cell VCSELs and other circuit components in array form, the ceramic substrate can also be used without division. In a second preferred embodiment of the ceramic substrate with surrounding walls and disposed with circuits according to the present invention, as shown in fig. 6, in the present embodiment, a ceramic substrate 10 divided into a single body includes a ceramic substrate body 11, a metal circuit layer 12, and an insulating surrounding wall 15, wherein the metal circuit layer 12 includes a metal pad 121 disposed on an upper surface 111, a metal contact (not shown) disposed on a lower surface 112, and a metal wire (not shown) electrically connecting the two.
Fig. 7 and 8 are cross-sectional views of the ceramic substrate 10 shown in fig. 6, in which a light emitting diode die 37 is soldered to the metal pad 121, a wire 38 is electrically bonded to another metal pad 121 by electrical shock from the upper surface of the light emitting diode die 37, then a transparent adhesive is filled in the accommodating space for packaging, and finally a lens 39 is mounted above the transparent adhesive to form a complete light emitting diode 30, wherein fig. 8 is a cross-sectional view of the light emitting diode 30 shown in fig. 7 cut along a dotted line a. The led die 37 is mounted or spot-welded on the metal pad 121 of the upper surface 111, and is electrically connected to another metal pad 121 of the upper surface 111 through a wire 38, so that the led die 37 can be electrically connected to an external power source through two metal contacts 122 of the lower surface 112 and emit light. The space 14 between the two metal pads 121 on the upper surface 111 has a cured adhesive substrate, so that the two metal pads 121 can be prevented from being deformed at a high temperature or being short-circuited during welding, which may cause damage to electronic components.
When the packaging glue is filled into the accommodating space 16 during the process, the insulating surrounding wall 15 can not only prevent the packaging glue from overflowing, but also make the formed insulating surrounding wall 15 have different effects by adding materials with different characteristics into the adhesive base material or using the adhesive base material with different materials. For example, when a glue base material with high light transmittance is used, the light emitting angle of the light emitting diode can be increased; when the high-reflection material is added, light rays can be intensively irradiated, and the light rays are prevented from interfering the adjacent light-emitting component; if the fluorescent powder is added, color matching, color temperature uniformity improvement or color rendering property adjustment can be realized. Certainly, even if three or more pairs of metal pads are formed in one accommodating space, at least one red, green and blue crystal grain is arranged in one surrounding wall, and a white light LED with good color rendering performance can be manufactured.
Of course, those skilled in the art of the present invention can also apply the ceramic substrate with surrounding wall and circuit layout in the embodiment to the VCSEL field such as 3D sensing, gesture recognition or face recognition, and the VCSEL device with excellent adhesion between the surrounding wall and the ceramic substrate is completed by disposing the infrared crystal grains for VCSEL on one of the metal pads, selectively disposing the sensing crystal grains on the other metal pad, and disposing the diffusion sheet on the surrounding wall.
Second preferred embodiment
Fig. 1 and 9 show a second preferred embodiment of the ceramic substrate with surrounding walls and circuits, wherein the same parts as those in the previous embodiment are not repeated herein, and only the differences are explained. In this embodiment, after the upper mold and the lower mold are separated from each other, step 35 ' is performed to separate the ceramic substrate 11 ' from the release film 23 ', and holes are drilled, for example, by laser beam, in the areas where the metal circuit layer 12 ' is not disposed within each of the surrounding insulating walls 15 ', so as to form at least one vent hole 13 ', thereby maintaining the outward ventilation of the accommodating space 16 ', even when the electronic component is operated to generate heat, the air in the accommodating space can be heated and exhausted to achieve an additional heat dissipation effect, and when the whole electronic component is heated by surface mounting or heated in the operation process, the air in the accommodating space is heated and expanded to provide a pressure relief path in time.
The invention further discloses that the exhaust holes penetrating through the ceramic substrate body are respectively arranged in the range of each preset insulating surrounding wall in the ceramic substrate body and the position of the preset metal circuit layer which is not distributed, so that the circuit component can expand and release pressure of gas caused by temperature difference in the surface mounting or using process, the packaged structure is ensured not to be cracked and damaged, and the product yield and the operation stability are improved. Although the above-described embodiment is to perform the drilling step after the insulating surrounding wall is formed and the substrate is removed from the mold, this order is not a limitation of the present invention, and those skilled in the art should understand that the drilling step can be advanced to step 31 without interfering with the implementation of the present invention.
The method for forming the surrounding wall on the ceramic substrate with circuit layout and the substrate of the present invention form the insulating surrounding wall on the ceramic substrate by means of pressing mold, which can greatly reduce the process temperature and prevent the ceramic substrate from generating thermal stress and expansion and contraction due to high temperature to cause the reduction of the product yield; in addition, the position accuracy of the insulating surrounding wall formed on the ceramic substrate can be improved, errors or dislocation generated in the electric welding process can be avoided, and the operation flow can be simplified at the same time. On the other hand, the liquid adhesive base material also fills the gaps in the metal pads or wires in the metal circuit layer, so that the metal pads or wires which are originally independent can be ensured to be insulated from each other after the adhesive base material is cured. The method of the invention is more suitable for forming the insulating surrounding walls with various shapes on the ceramic substrate, and meets various market requirements.
As shown in fig. 10 and fig. 11, in the present embodiment, between step 35 "and step 31", at least one circuit protection component 56 ' is additionally disposed on the metal circuit layer 12 ' of the ceramic substrate body 11 ' in step 36 ". The circuit protection component 56 'in this embodiment is a zener diode soldered and bonded on the ceramic substrate body 11', and particularly the metal circuit layer 12 'is formed with a pad of the circuit protection component 56' within a predetermined range of the insulating surrounding wall 15 'formed on the ceramic substrate body 11', so that the adhesive substrate can not only enter the ceramic substrate body from the through hole 55 ', but also at least partially shield the zener diode, and can be selected to be electrically insulated from the metal circuit layer 12' or conducted by forming a circuit in the metal circuit layer 12 'through the insulating surrounding wall 15', thereby at least partially embedding the circuit protection component 56 'in the insulating surrounding wall 15', protecting the circuit of the metal circuit layer 12 'and the electronic components to be mounted when encountering a large surge current, and further making the circuit protection component 56' at least partially not occupy the accommodating space in the insulating surrounding wall, making miniaturization of the entire assembly possible.
Third preferred embodiment
Please refer to a third preferred embodiment of the ceramic substrate with surrounding walls and circuits thereon according to the present invention, as shown in fig. 11 and 12, wherein the same parts as the previous embodiment are not repeated herein, and only the differences are explained. In this embodiment, step 35 "is performed before step 31", where at least one vent hole 13 "with a diameter of about 60 to 150 μm is formed in advance in each predetermined range of the insulating surrounding wall of the ceramic substrate body 11" without laying out the predetermined metal circuit layer 12 ", for example, by etching process, and at least one through hole 55" is formed in each predetermined position of the insulating surrounding wall on the predetermined cutting path; the adhesive base material 24 "is pressed into the through hole 55" during the heating and pressing process, so that the insulating surrounding wall 15 "is formed to be perpendicular to the ceramic substrate body 11" and is inserted into the through hole 55 "in an integrated manner to enhance the bonding between the insulating surrounding wall 15" and the ceramic substrate body 11 "to be firmer, and the adhesive base material 24" is pressed through the through hole 55 "and is injected between the metal contacts 122" to insulate the metal contacts 122 "from each other.
Fourth preferred embodiment
Referring to fig. 13, 14 and 15, the structure of the surrounding wall is not limited to the rectangular structure in the foregoing embodiments, and different structures may be used to form the insulating surrounding wall on the ceramic substrate. Fig. 14 is a light emitting diode 40 "' formed by disposing a light emitting diode die 41" ', a wire 42 "' and a lens 43" ' on the ceramic substrate 10 "' in fig. 13, wherein fig. 14 is a cross-sectional view of the ceramic substrate 10" ' in fig. 13 cut along a dashed line B after being manufactured into the light emitting diode 40 "'. The insulating surrounding wall 15 "'formed on the ceramic substrate 10"' in the present embodiment is a circular ring structure, so that the circular lens 43 "'can be disposed above the insulating surrounding wall 15"', which means that the technology disclosed in the present invention has great flexibility in manufacturing, and can completely meet different market requirements to manufacture products with different shapes.
Referring to fig. 15, the ceramic substrate 10 "'of the present embodiment further includes two wall-shaped metal connecting ports 520"'. The metal connecting port 520 "' is formed on the ceramic substrate body 51" ' by molding before the insulating surrounding wall 15 "' is formed. The ceramic substrate body 51 "'is formed with at least one through hole 55"' in a range where the insulating surrounding wall 15 "'is to be formed, the metal connection port 520"' is formed at the through hole 55 "'in a conductive penetrating manner, and a gap is formed between the metal connection port 520"' and the metal circuit layer 52 "'and can be selectively electrically insulated or conducted with the metal circuit layer 52"', thereby increasing the flexibility of the circuit layout. The metal conduction port 520' "may be formed to a desired height at a time, or may be formed to a partial height and then be thickened to a desired height by electroplating. For example, the electronic component may be mounted on the metal pad 521 '", or may be mounted on the metal conducting port 520'" to be electrically connected to the metal contact 522 '"through the metal wire 523'".
Referring to fig. 16 and 17, a fifth preferred embodiment of the ceramic substrate with surrounding walls and circuits thereon according to the present invention is shown, wherein the metal connecting port 720 "" is a pillar; of course, the metal conducting port 720 "" can be disposed at any position of the surrounding wall 74 "", such as at any position of four corners or four sides of the surrounding wall 74 "", and can expose a portion of the surrounding wall 74 "", which can be used as a contact for connecting wires or electronic components. The metal conducting port 720 "" is formed in such a manner that at least one through hole 75 "" is formed in a range where the insulating surrounding wall 74 "" is to be formed, and when the insulating surrounding wall 74 "" is formed, at least one plug hole corresponding to the through hole 75 "" is reserved in the insulating surrounding wall 74 "" and after the insulating surrounding wall 74 "" is formed, the plug hole is filled with a metal conductive material. The electronic component 71 "" can be mounted on the metal pad 721 "" and electrically connected to the metal contact 722 "" through the metal wire 723 "" and connected to the metal contact port 720 "" in the insulating surrounding wall 74 "" through the wire 73 "" so that the elasticity of the circuit layout can be greatly improved.
The method for forming the surrounding wall on the ceramic substrate with the circuit layout and the substrate of the invention form the solidified insulating surrounding wall on the ceramic substrate by the liquid-state adhesive base material in a pressing mold manner, thereby greatly reducing the high-temperature environment in the existing process on one hand and preventing the ceramic substrate from generating thermal stress and expansion shrinkage due to high temperature to cause the reduction of the product yield; in addition, the position accuracy of the insulating surrounding wall formed on the ceramic substrate can be improved, errors or dislocation generated in the electric welding process can be avoided, and the operation flow can be simplified at the same time. On the other hand, the liquid adhesive base material also fills the gaps among the metal pads or wires and the gaps among the metal contacts in the metal circuit layer, so that the metal pads or wires which are originally independent can be ensured to be mutually insulated after the adhesive base material is cured. In addition, the method provided by the invention forms at least one vent hole in the range of the insulating surrounding wall and at the position where the metal circuit layer is not distributed, thereby providing an additional heat dissipation effect for the electronic component and providing an additional pressure relief effect when the electronic component generates heat to generate hot gas expansion or decompose and emit gas. The present invention also forms a circuit protection component in the range of the insulating surrounding wall on the ceramic substrate body, thereby protecting the circuit of the metal circuit layer and the electronic component which is scheduled to be installed when the surge large current is encountered. The invention forms metal connecting port in the range of the insulating surrounding wall on the ceramic substrate body, thereby greatly improving the elasticity of the circuit layout.
Claims (10)
1. A method for forming a surrounding wall on a ceramic substrate with a circuit, at least one insulating surrounding wall is formed on the ceramic substrate, the ceramic substrate is provided with a ceramic substrate body and a metal circuit layer, the ceramic substrate body comprises an upper surface and a lower surface opposite to the upper surface, the metal circuit layer is arranged on at least the upper surface and is used for arranging at least one electronic component, wherein the metal circuit layer comprises at least a plurality of mutually independent metal connecting pads/wires, and intervals exist among the mutually independent connecting pads/wires, the method is characterized by comprising the following steps:
a) arranging the ceramic substrate body on an upper die, and arranging a release die on a lower die, wherein the metal circuit layer is arranged towards the lower die;
b) injecting a liquid adhesive base material into one side of the release mold close to the upper mold;
c) the upper die and the lower die are close to each other, the ceramic substrate body and the adhesive base material are heated and pressed, so that the adhesive base material is at least partially filled into the gap, the pad/wire gaps which are clamped to form the gap are insulated from each other, and the adhesive base material is solidified to form at least one insulating surrounding wall which surrounds at least part of the metal circuit layer;
d) the upper die and the lower die are mutually far away from each other, so that the ceramic substrate body is separated from the release die, wherein the insulating surrounding wall extends from the upper surface to the direction of the metal circuit layer and is higher than the metal circuit layer, and the insulating surrounding wall and the ceramic substrate body jointly form an accommodating space which partially surrounds the electronic component.
2. The method according to claim 1, further comprising a step e) of forming at least one vent hole in the ceramic substrate body in a region where the insulating surrounding wall is formed and where the metal circuit layer is not disposed, before the step a) or after the step d).
3. The method of claim 1, further comprising the step f) of disposing at least one protective member on said metal circuit layer before step a), wherein said protective member is disposed at least partially at a position where said insulating surrounding wall is to be formed, thereby at least partially embedding said protective member in said insulating surrounding wall.
4. A method for forming a surrounding wall on a ceramic substrate having a circuit laid out thereon as claimed in claim 1, 2 or 3, wherein in said step c), the insulating surrounding wall is formed at a temperature of less than 300 ℃.
5. A ceramic substrate having a surrounding wall and an electrical circuit disposed thereon, the substrate comprising:
a ceramic substrate body including an upper surface and a lower surface opposite to the upper surface;
a metal circuit layer arranged on at least the upper surface for arranging at least one electronic component, wherein the metal circuit layer comprises at least a plurality of mutually independent metal connecting pads/wires, and intervals are reserved among the mutually independent connecting pads/wires;
at least one insulation surrounding wall surrounding at least part of the metal circuit layer, wherein the insulation surrounding wall is made of a rubber base material, and the insulation surrounding wall extends from the upper surface to the direction of the metal circuit layer and is higher than the metal circuit layer in height, so that the insulation surrounding wall and the ceramic substrate body jointly form an accommodating space partially surrounding the electronic component; and the adhesive base material is at least partially filled into the interval, so that the pads/wires clamped to form the interval are insulated from each other.
6. The ceramic substrate with surrounding walls and disposed with circuits as claimed in claim 5, wherein said adhesive base material is silicone.
7. The ceramic substrate with surrounding walls and arranged with circuits as claimed in claim 5, wherein the adhesive base material is epoxy resin.
8. The ceramic substrate with surrounding walls and disposed with circuit as claimed in claim 5, wherein the ceramic substrate body is formed with at least one vent hole in the surrounding area of the insulating surrounding wall, at the position where the metal circuit layer is not disposed.
9. The ceramic substrate with surrounding walls and arranged with circuits as claimed in claim 6, wherein said electronic components are VCSEL dies.
10. The ceramic substrate with surrounding walls and laid out with circuits as claimed in claim 5, 6, 7, 8 or 9, wherein at least one protection member is provided on said metal circuit layer, and said protection member is at least partially provided at a position where said insulating surrounding wall is formed, thereby at least partially embedding said protection member in said insulating surrounding wall.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107138794 | 2018-11-01 | ||
| TW107138794 | 2018-11-01 | ||
| TW108116246A TWI704651B (en) | 2018-11-01 | 2019-05-10 | Method for forming surrounding wall on ceramic substrate with circuit layout and the substrate |
| TW108116246 | 2019-05-10 |
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|---|---|
| CN111148338A true CN111148338A (en) | 2020-05-12 |
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| CN201911060820.9A Pending CN111148338A (en) | 2018-11-01 | 2019-11-01 | Method for forming surrounding wall on ceramic substrate with circuit and substrate |
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Application publication date: 20200512 |