TWM571523U - Optical recognition module - Google Patents

Abstract

An optical identification module includes a sensor and a collimator. The sensor has a plurality of sensing regions. A collimator is disposed on the plurality of sensing regions, and the collimator includes a light transmissive substrate and a first light shielding layer. The first light shielding layer is disposed on the first surface of the light transmissive substrate. The first light shielding layer includes a plurality of first openings. The ratio of the thickness of the first light shielding layer to the width of each of the first openings is greater than one.

Description

Optical recognition module

The novel creation relates to an optical module, and in particular to an optical recognition module capable of recognizing biological features.

With the rapid development of Internet of Things technology, the application and demand of biometric technology has expanded rapidly. At present, the common biometric technology on the market mainly uses optical, capacitive or ultrasonic methods to identify biological features such as fingerprints, palm prints, vein distribution, iris, retina or facial features, thereby achieving identity identification or authentication. The optical recognition module that optically recognizes the biometric feature receives the light beam reflected by the object to be detected by the sensor to identify the biometric feature, and thus the biometric feature is recognized by the sensor or the ultrasonic wave. It has the advantages of high durability and low cost. However, the light beam reflected by the object to be tested is easily transmitted to the sensor in a disorderly manner, resulting in poor image quality and affecting the recognition result.

The novel creation provides an optical recognition module with good recognition capability.

An optical recognition module created by the present invention includes a sensor and a collimator. The sensor has a plurality of sensing regions. A collimator is disposed on the plurality of sensing regions, and the collimator includes a light transmissive substrate and a first light shielding layer. The first light shielding layer is disposed on the first surface of the light transmissive substrate. The first light shielding layer includes a plurality of first openings, and a ratio of a thickness of the first light shielding layer to a width of each of the first openings is greater than 1.

In an embodiment of the present invention, the first light shielding layer is located between the transparent substrate and the sensor, and the size of each of the first openings is less than or equal to the size of each sensing region.

In an embodiment of the novel creation, the collimator further includes a second light shielding layer and a plurality of microlenses. The second light shielding layer is disposed on the second surface of the light transmissive substrate. The second surface is opposite the first surface. The second light shielding layer includes a plurality of second openings. The size of each of the second openings is greater than or equal to the size of each of the first openings.

In an embodiment of the present invention, a plurality of microlenses are disposed on the second surface and are respectively located in the plurality of second openings.

In an embodiment of the present invention, the absolute value of the refractive index difference between the plurality of microlenses and the light transmissive substrate is less than 0.1.

In an embodiment of the present invention, the light transmissive substrate is located between the first light shielding layer and the sensor.

In an embodiment of the novel creation, the collimator further includes a second light shielding layer and a plurality of microlenses. The second light shielding layer is disposed on the second surface of the light transmissive substrate. The second surface is opposite the first surface. The second light shielding layer includes a plurality of second openings. The size of each of the second openings is less than or equal to the size of each of the sensing regions, and the size of each of the first openings is greater than or equal to the size of each of the second openings.

In an embodiment of the present invention, a plurality of microlenses are disposed on the first surface and are respectively located in the plurality of first openings.

An optical recognition module created by the present invention includes a sensor and a collimator. The sensor has a plurality of sensing regions. A collimator is disposed on the plurality of sensing regions, and the collimator includes a light transmissive substrate, a first light shielding layer, and a second light shielding layer. The light transmissive substrate has a first surface and a second surface, and the second surface is located between the first surface and the sensor. The first light shielding layer is disposed on the first surface, and the first light shielding layer includes a plurality of first openings. The second light shielding layer is disposed on the second surface, and the second light shielding layer includes a plurality of second openings. The size of each of the second openings is less than or equal to the size of each of the sensing regions, and the size of each of the first openings is greater than or equal to the size of each of the second openings.

In an embodiment of the novel creation, the collimator further includes a plurality of microlenses. The plurality of microlenses are disposed on the first surface and are respectively located in the plurality of first openings.

Based on the above, in the optical recognition module created by the present invention, the collimator is used to collimate the light beam transmitted to the sensor to effectively improve optical crosstalk, achieve optical noise reduction, and improve image resolution. Therefore, the optical recognition module created by the novel can have good recognition ability.

The above described features and advantages of the present invention will become more apparent and understood from the following description.

In the drawings, the figures depict typical features of the methods, structures, and/or materials used in the particular exemplary embodiments. However, the drawings are not limited to the structures or features of the following embodiments, and the drawings are not to be construed as limiting or limiting the scope or properties covered by the exemplary embodiments. For example, the relative thickness and location of layers, regions, and/or structures may be reduced or enlarged for clarity.

The use of similar or identical component symbols in the various drawings is intended to indicate the presence of the same or the same elements or features. Similar component symbols in the drawings indicate similar elements and their description will be omitted.

The optical recognition module enumerated in the following embodiments is adapted to capture the biological characteristics of the object to be tested. The object to be tested can be a finger or a palm. Correspondingly, the biometric feature can be a fingerprint, a vein or a palm print, but is not limited thereto.

1 to 7 are schematic cross-sectional views of optical recognition modules according to first to seventh embodiments of the present invention, respectively. Referring to FIG. 1 , the optical identification module 100 of the first embodiment includes a sensor 110 and a collimator 120 .

The sensor 110 is adapted to receive a light beam (ie, a light beam with biometric information, not shown) that is reflected by an object to be tested (not shown). For example, the sensor 110 can include a Charge Coupled Device (CCD), a Complementary Metal-Oxide Semiconductor (CMOS), or other suitable kind of optical sensing element.

The sensor 110 has a plurality of sensing regions R. The plurality of sensing regions R are a plurality of light receiving regions in the sensor 110. When the sensor 110 uses a plurality of charge coupled elements to receive light, the plurality of sensing regions R are respectively regions where the plurality of charge coupled devices are located. On the other hand, when the sensor 110 employs a complementary metal oxide semiconductor device to receive light, the plurality of sensing regions R are a plurality of pixel regions in the complementary metal oxide semiconductor device.

A collimator 120 is disposed on the plurality of sensing regions R. Specifically, the collimator 120 is disposed between the object to be tested and the sensor 110 to collimate the light beam reflected by the object to be tested and transmitted to the sensor 110, thereby improving optical interference and achieving optical noise reduction. And improve the image resolution.

Further, the collimator 120 includes a light transmissive substrate 122 and a first light shielding layer 124. The light transmissive substrate 122 can be any carrier that allows the beam to pass. For example, the transparent substrate 122 may include a glass substrate or a plastic substrate, but is not limited thereto.

The light transmissive substrate 122 has a first surface S1 and a second surface S2 opposite to the first surface S1. The first light shielding layer 124 is disposed on the first surface S1 of the light transmissive substrate 122. In this embodiment, the first surface S1 is located between the second surface S2 and the sensor 110, that is, the first surface S1 is a surface of the transparent substrate 122 facing the sensor 110, and the second surface S2 is transparent. The light substrate 122 faces away from the surface of the sensor 110. Therefore, the first light shielding layer 124 is located between the transparent substrate 122 and the sensor 110. In another embodiment, the collimator 120 can be inverted such that the first surface S1 provided with the first light shielding layer 124 faces away from the sensor 110, and the second surface S2 faces the sensor 110, so that The light substrate 122 is located between the first light shielding layer 124 and the sensor 110.

The first light shielding layer 124 is adapted to shield stray light, and the first light shielding layer 124 may be formed of any material capable of shielding light. For example, the material of the shielding light may include a light absorbing material, but is not limited thereto. For example, the material of the first light shielding layer 124 may include black ink or black photoresist. Further, the first light shielding layer 124 may be formed on the first surface S1 by printing. However, the material, color, and the manner in which the first light shielding layer 124 is formed on the first surface S1 may be changed as needed, and are not limited to the above.

Since the collimator 120 is disposed between the object to be tested and the sensor 110, in order for the sensor 110 to receive the light beam reflected by the object to be tested (ie, the light beam with biometric information), the collimator 120 The first light shielding layer 124 includes a plurality of first openings O1 disposed corresponding to the plurality of sensing regions R of the sensor 110. As such, the light beam reflected by the object to be tested can be transmitted to the sensor 110 via the plurality of first openings O1.

The size of each of the first openings O1 (such as the width WO1 of each of the first openings O1) is less than or equal to the size of each sensing region R (the width WR of each sensing region R) to transmit the light beam in each of the first openings O1. To the corresponding sensing area R. The above width (such as the width WO1 of the first opening O1 and the width WR of the sensing region R) may be the diameter of the opening/area (when the shape of the opening/area is circular) or the diagonal length of the opening/area ( When the shape of the opening/area is square).

In this embodiment, the arrangement relationship between the plurality of first openings O1 and the plurality of sensing regions R is one-to-one, that is, each of the sensing regions R is provided with a first opening O1. However, in another embodiment, the arrangement relationship between the plurality of first openings O1 and the plurality of sensing regions R may be many-to-one, that is, each of the sensing regions R is provided with a plurality of first openings O1.

The light-transmissive material may or may not be filled in the first openings O1 as needed. In this embodiment, no material is filled in each of the first openings O1. That is, the light transmission medium in each of the first openings O1 is air. However, in another embodiment, each of the first openings O1 may be filled with a light transmissive material. That is, the light transmission medium in each of the first openings O1 is a light transmissive material. The refractive index of the light transmissive material is preferably equal to or close to the refractive index of the transparent substrate 122 to reduce light loss due to interface reflection or beam transfer path changes.

According to different design requirements, the corner between the extending direction DE1 of each of the first openings O1 and the thickness direction DT of the transparent substrate 122 is in the range of 0 to 45 degrees. In the present embodiment, the angle (not shown) between the extending direction DE1 and the thickness direction DT is 0 degrees. In other words, each of the first openings O1 extends toward the thickness direction DT of the transparent substrate 122, but the present invention is not limited thereto.

The collimating effect of the light beam transmitted toward the sensing region R is related to the thickness T124 of the first light shielding layer 124 and the width WO1 of each of the first openings O1. The thicker the first light shielding layer 124 and/or the narrower the first openings O1, the more significant the beam collimation effect. Conversely, the thinner the first light shielding layer 124 and/or the wider the first openings O1, the less pronounced the collimating effect of the light beam. In order to effectively collimate the beam (for example, by shielding/absorbing a large angle beam in the light beam transmitted to the sensing region R by the first light shielding layer 124), the thickness T124 of the first light shielding layer 124 and each of the first openings O1 The ratio of width WO1 (T124/WO1) is greater than one. With the above design, the optical interference can be effectively improved, the optical noise reduction can be achieved, and the image resolution can be improved, so that the optical recognition module 100 has good recognition capability.

The optical recognition module 100 may further include other components according to different needs. For example, the optical recognition module 100 may further include a light source, but is not limited thereto.

Referring to FIG. 2, the main differences between the optical recognition module 200 of the second embodiment and the optical identification module 100 of FIG. 1 are as follows. In the optical recognition module 200, the angle θ between the extending direction DE1 of each of the first openings O1 and the thickness direction DT of the transparent substrate 122 is greater than 0 degrees and less than or equal to 45 degrees.

Referring to FIG. 3, the main differences between the optical recognition module 100A of the third embodiment and the optical recognition module 100 of FIG. 1 are as follows. In the optical recognition module 100A, the arrangement relationship between the plurality of first openings O1 and the plurality of sensing regions R is many-to-one, that is, each of the sensing regions R is provided with a plurality of first openings O1.

Referring to FIG. 4, the main differences between the optical recognition module 200A of the fourth embodiment and the optical identification module 200 of FIG. 2 are as follows. In the optical recognition module 200A, the arrangement relationship between the plurality of first openings O1 and the plurality of sensing regions R is many-to-one, that is, each of the sensing regions R is provided with a plurality of first openings O1.

Referring to FIG. 5, the main differences between the optical recognition module 300 of the fifth embodiment and the optical identification module 100 of FIG. 1 are as follows. In the optical recognition module 300, the collimator 120A includes a second light shielding layer 126 and a plurality of microlenses 128 in addition to the transparent substrate 122 and the first light shielding layer 124.

The second light shielding layer 126 is disposed on the second surface S2 of the light transmissive substrate 122. In other words, the second light shielding layer 126 and the first light shielding layer 124 are respectively located on opposite sides of the transparent substrate 122.

The second light shielding layer 126 is also adapted to shield stray light, and the second light shielding layer 126 can be formed of any material capable of shielding light. For example, the material of the shielding light may include a light absorbing material, but is not limited thereto. For example, the material of the second light shielding layer 126 may include black ink or black photoresist. Further, the second light shielding layer 126 may be formed on the second surface S2 by printing. However, the material, color, and the manner in which the second light shielding layer 126 is formed on the second surface S2 may be changed as needed, and are not limited to the above.

The second light shielding layer 126 includes a plurality of second openings O2 disposed corresponding to the plurality of first openings O1 of the first light shielding layer 124, and the size of each of the second openings O2 (such as the width WO2 of each second opening O2) may be It is greater than or equal to the size of each of the first openings O1 (such as the width WO1 of each of the first openings O1).

A plurality of microlenses 128 are disposed on the second surface S2 and located in the plurality of second openings O2, respectively. Further, the plurality of microlenses 128 are adapted to concentrate the light beam, and help the sensor 110 to receive more light beams that are reflected by the object to be tested. In this embodiment, the array of the plurality of microlenses 128 is arranged on the second surface S2, and the arrangement relationship of the plurality of microlenses 128 and the plurality of sensing regions R is one-to-one. However, in another embodiment, the arrangement relationship of the plurality of microlenses 128 with the plurality of sensing regions R may also be many-to-one.

The refractive indices of the plurality of microlenses 128 are preferably equal to or close to the refractive index of the transparent substrate 122 to reduce light loss due to interface reflection or beam transfer path changes. For example, the absolute value of the refractive index difference between the plurality of microlenses 128 and the transparent substrate 122 is preferably less than 0.1. In addition, the radius of curvature of each microlens 128 is smaller than the ratio of the thickness T122 of the transparent substrate 122 to the width WR of each sensing region R (T122/WR) to achieve a better convergence effect.

In this embodiment, the light-transmissive material may or may not be filled in the first openings O1 as needed. In addition, the collimator 120A can omit the arrangement of the plurality of microlenses 128. Under this structure, the second openings O2 can also be filled or not filled with light transmissive materials as needed. In addition, the optical identification module 300 may further include other components according to different needs. Please refer to the above for related instructions, and details are not described here.

Referring to FIG. 6, the main differences between the optical recognition module 400 of the sixth embodiment and the optical recognition module 300 of FIG. 5 are as follows. In the optical identification module 400, the first surface S1 of the first light shielding layer 124 is disposed opposite to the sensor 110, and the second surface S2 of the second light shielding layer 126 is disposed facing the sensor 110. The light substrate 122 is located between the first light shielding layer 124 and the sensor 110.

In addition, the size of each of the second openings O2 (such as the width WO2 of each of the second openings O2) is less than or equal to the size of each sensing region R (the width WR of each sensing region R), and the size of each first opening (eg, The width WO1) of each of the first openings O1 is greater than or equal to the size of each of the second openings O2 (e.g., the width WO2 of each of the second openings O2).

A plurality of microlenses 128 are disposed on the first surface S1 and are respectively located in the plurality of first openings O1. In this embodiment, the plurality of microlens arrays 128 are arranged on the first surface S1, and the arrangement relationship of the plurality of microlenses 128 and the plurality of sensing regions R is one-to-one. However, in another embodiment, the arrangement relationship of the plurality of microlenses 128 with the plurality of sensing regions R may be many-to-one. For the related design of the microlens 128, please refer to the foregoing, and it will not be repeated here.

In this embodiment, the second opening O2 may or may not be filled with a light transmissive material as needed. In addition, the collimator 120B can omit the arrangement of the plurality of microlenses 128. Under this structure, the first openings O1 can also be filled or not filled with light transmissive materials as needed. In addition, the optical recognition module 400 may further include other components according to different needs. Please refer to the above for related instructions, and details are not described here.

Referring to FIG. 7, the main differences between the optical recognition module 500 of the seventh embodiment and the optical identification module 400 of FIG. 6 are as follows. In the optical recognition module 500, the first light shielding layer 124C of the collimator 120C is thinner than the first light shielding layer 124 of the collimator 120B in FIG. 6, that is, the thickness T124C is smaller than the thickness T124, and the first light shielding layer The ratio of the thickness T124C of the layer 124C to the width WO1 of each of the first openings O1 (T124C/WO1) may not be greater than one. Therefore, the optical recognition module 500 can have a relatively thin thickness.

In this embodiment, the second opening O2 may or may not be filled with a light transmissive material as needed. In addition, the collimator 120C can omit the arrangement of the plurality of microlenses 128. Under this structure, the first openings O1 can also be filled or not filled with light-transmitting materials as needed. In addition, the optical recognition module 500 may further include other components according to different needs. Please refer to the above for related instructions, and details are not described here.

In summary, in the optical recognition module created by the present invention, the collimator is used to collimate the beam transmitted to the sensor to effectively improve optical interference, achieve optical noise reduction, and improve image resolution. Therefore, the optical recognition module created by the novel can have good recognition ability.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.

100, 100A, 200, 200A, 300, 400, 500‧‧‧ optical identification modules

110‧‧‧ Sensor

120, 120A, 120B, 120C‧‧ ‧ collimator

122‧‧‧Transparent substrate

124, 124C‧‧‧ first light shielding layer

126‧‧‧Second light shielding layer

128‧‧‧Microlens

DE1‧‧‧ extending direction

DT‧‧‧ thickness direction

O1‧‧‧ first opening

O2‧‧‧ second opening

R‧‧‧Sensing area

S1‧‧‧ first surface

S2‧‧‧ second surface

T122, T124, T124C‧‧‧ thickness

WO1, WO2, WR‧‧‧ width

Θ‧‧‧ angle

1 to 7 are schematic cross-sectional views of optical recognition modules according to first to seventh embodiments of the present invention, respectively.

Claims (10)

An optical identification module comprising: a sensor having a plurality of sensing regions; and a collimator disposed on the plurality of sensing regions, and the collimator comprises: a light transmissive substrate; And a first light shielding layer disposed on a first surface of the transparent substrate, wherein the first light shielding layer comprises a plurality of first openings, and the thickness of the first light shielding layer is different from each The ratio of the width of an opening is greater than one. The optical identification module of claim 1, wherein the first light shielding layer is located between the transparent substrate and the sensor, and the size of each first opening is less than or equal to each other. The size of the survey area. The optical identification module of claim 2, wherein the collimator further comprises: a second light shielding layer disposed on a second surface of the transparent substrate, and the second The surface is opposite to the first surface, and the second light shielding layer includes a plurality of second openings, wherein each of the second openings has a size greater than or equal to a size of each of the first openings. The optical identification module of claim 3, wherein the collimator further comprises: a plurality of microlenses disposed on the second surface and located in the plurality of second openings, respectively. The optical identification module of claim 4, wherein an absolute value of a refractive index difference between the plurality of microlenses and the transparent substrate is less than 0.1. The optical identification module of claim 1, wherein the transparent substrate is located between the first light shielding layer and the sensor. The optical identification module of claim 6, wherein the collimator further comprises: a second light shielding layer disposed on a second surface of the transparent substrate, and the second The surface is opposite to the first surface, the second light shielding layer includes a plurality of second openings, wherein the size of each of the second openings is less than or equal to the size of each sensing region, and the size of each of the first openings is greater than or equal to The size of each second opening. The optical identification module of claim 7, wherein the collimator further comprises: a plurality of microlenses disposed on the first surface and located in the plurality of first openings, respectively. An optical identification module includes: a sensor having a plurality of sensing regions; and a collimator disposed on the plurality of sensing regions, and the collimator includes: a transparent substrate Having a first surface and a second surface, and the second surface is located between the first surface and the sensor; a first light shielding layer disposed on the first surface, and The first light shielding layer includes a plurality of first openings; and a second light shielding layer disposed on the second surface, and the second light shielding layer includes a plurality of second openings, wherein each of the second openings The size of each of the sensing regions is less than or equal to the size of each of the sensing regions, and the size of each of the first openings is greater than or equal to the size of each of the second openings. The optical identification module of claim 9, wherein the collimator further comprises: a plurality of microlenses disposed on the first surface and located in the plurality of first openings, respectively.