TWM563658U - Clamping device capable of configuring wafer size and alignment of center and roundness - Google Patents

Abstract

The present invention proposes a gripping device capable of setting a wafer size and a whole center and a full circle, which has a sliding frame, a sliding seat, and a plurality of clamping members. The carriage has a longitudinal rail and a plurality of transverse rails, one end of which is connected to the lower end of the longitudinal rail. The carriage is disposed on the longitudinal rail and connected to the connecting component. Each of the clamping members has a slider, an interlocking lever, and at least one clamping portion. The slider is disposed on a lateral rail, and one end of the linkage rod is connected to the slider, and the other end is connected to the slider, and the clamping portion is fixed to the slider and is used to carry the wafer carrier ring. Thereby, it can be adapted to different sizes of carrier rings. If the bearing ring is not accurately placed in the center of the machine, the clamping portion can push the bearing ring to the center of the clamping device, so that the bearing ring is not damaged due to uneven force when taken.

Description

Can set wafer size and whole center, full circle clamping device

The present invention relates to a gripping device, and more particularly to a gripping device for use in a wafer manufacturing process for picking a wafer from a wafer placement platform and transferring the wafer to an accurately positioned position of the machine member.

In the manufacturing process of the integrated circuit, when various processing steps are performed on the wafer, since the equipment used in the processing is different, it is inevitable that the wafer is transferred between different devices. In order to match different processing equipment, the carrier for carrying wafers is not the same. For example, the wafer before processing can be placed in a metal carrier with a blue film for processing, and after repeated processing steps such as deposition, development, etching, and cleaning, the wafer is cut. . After the wafer is cut, in order to enable the clipping device to be easily taken, the blue film on the metal carrier ring is pressed by a plastic carrier ring having a size smaller than the metal carrier ring but still larger than the wafer. The blue film is stretched, thereby allowing the gaps between the crystal grains on the blue film to be increased and can be taken by an automated machine. After the plastic carrier ring is pressed against the blue film, the blue film is cut and fixed on the plastic carrier ring, and then the wafer is cut by the plastic carrier ring and the blue film cut and deformed. The piece moves.

Therefore, since the diameter of the plastic carrier ring is different from that of the metal carrier ring, in the prior art, in order to transport the metal carrier ring and the plastic carrier ring, the metal carrier ring and the plastic carrier ring are respectively grasped by the two types of jaws. After the two kinds of jaws are arranged, the moving mechanism of the moving jaws also needs to be set up two groups, so the construction cost of the plant is greatly increased.

In addition, the metal carrier ring and the plastic carrier ring may be displaced during the processing, and the plastic carrier ring may be deformed after the deformation of the blue film, and the metal carrier ring and the plastic carrier ring must be accurately positioned to be taken during the moving process. To keep it in the right place. Therefore, before taking the metal ring, the center of the metal carrier ring must be accurately positioned through a whole center mechanism (the whole center that the industry is accustomed to). Before taking the plastic carrier ring, the plastic must be passed through a round mechanism to plasticize the plastic carrier ring. The carrier ring returns to a perfect circle (that is, the industry's usual round shape), so as to avoid errors due to the center offset when taking.

In view of this, providing a better improvement solution is an urgent problem to be solved in the industry.

The main purpose of the present invention is to provide a gripping device which can be used for gripping different sizes of carrier rings to transport the carrier ring and the wafer on the carrier ring at different stages, and can simultaneously clamp and hold the carrier ring. Center or full circle.

In order to achieve the above object, the present invention provides a configurable wafer size and a full center, full circular gripping device having: a connecting component; a power device disposed on the connecting component; a sliding frame The utility model has: at least one longitudinal rail, an upper end of which is connected to the connecting component; and a plurality of transverse rails, one end of each of the transverse rails is connected to the lower end of the at least one longitudinal rail, and extends outward from the at least one longitudinal rail; a seat disposed on the at least one longitudinal rail and coupled to the power unit, the power unit moving the carriage along the length of the at least one longitudinal rail; a plurality of clamping members equal in number to the number of the transverse rails Each of the clamping members has: a slider disposed on one of the lateral rails and movable along a length of the transverse rail; a linkage rod having one end connected to the slider and the other end connected to the slider And at least one clamping portion fixed to the slider and configured to carry the wafer carrier ring.

Therefore, when the creation moves up and down along the longitudinal rail through the sliding seat, the linkage rod can be pivoted to drive the slider to move inward or outward together with the clamping portion, and the clamping portion can move more than the prior art fixture. The variation is greater, so it can be adapted to different sizes of wafer carrier rings, so that a single clamping device can be used to transport a variety of different wafer carrier rings, greatly reducing the cost of equipment construction. On the other hand, the wafer carrier ring is grasped by moving a plurality of clamping members synchronously toward the center, so if the wafer carrier ring is not accurately placed in the center of the machine, the clamping portion of the clamping member can push the wafer The wafer carrier ring is centered on the wafer clamping device of the present invention. Therefore, after the wafer is taken up by the wafer placement platform, the wafer is transferred to the machine component and positioned, and the wafer carrier ring is not Dimensions, eccentricity, deformation cause the carrier ring to shift to the machine member when offset or not centered.

In the above-mentioned gripping device capable of setting the wafer size and the whole center and the entire circle, the upper end of each of the at least one clamping portion of the clamping member is disposed on the slider of the clamping member. And extending downward from the slider, and a lower end of the at least one clamping portion is formed with a hook portion.

Each of the clamping members of the wafer size and the whole center and the entire circular shape as described above further has at least one abutting block respectively disposed on the at least one clamping portion and Moving along the length of the at least one clamping portion, whereby the lower side of the at least one abutting block can sandwich the wafer carrier ring with the upper side of the hook portion of the at least one clamping portion.

In the above-mentioned gripping device capable of setting the wafer size and the whole center and the entire circle, each of the holding members has two holding portions which are spaced apart from each other.

As described above, the wafer size and the whole center and the entire circular clamping device may be set, and the sliding sleeve is sleeved on the at least one longitudinal rail and has a plurality of tabs; The linkage rod is pivotally mounted on one of the tabs.

As described above, the wafer size and the whole center and the entire circular clamping device can be set: the power device includes: a body disposed on the connecting component; and a push rod disposed on the body a lower end, and one end of the push rod is fixed to the sliding seat; and the sliding frame has a plurality of longitudinal rails, the upper ends of the longitudinal rails are connected to the lower end of the connecting component, and the longitudinal rails are evenly disposed on the sliding rail Around the pole.

Please refer to Figure 1 first. The present invention proposes a gripping device capable of setting a wafer size and a whole center and a full circle, which can be used for holding a wafer carrier ring and can be adjusted to accommodate different sizes of wafer carrier rings. The wafer gripping device has a connecting component 11, a power unit 12, a carriage 20, a carriage 30, and a plurality of clamping members 40. The power unit 12 is disposed on the connecting component 11 and can include a body 121 and a push rod 122. In this embodiment, the body 121 is a pressure cylinder, and the push rod 122 is disposed at the lower end of the body 121 and can be elongated and shortened relative to the body 121. In other embodiments, the body 121 can include a servo or stepper motor, and the push rod 122 is a screw.

The carriage 20 is fixed to the connecting assembly 11 and has at least one longitudinal rail 21 and at least one transverse rail 22. The upper end of the longitudinal rail 21 is coupled to the lower end of the connection assembly 11. In the present embodiment, the carriage 20 has a plurality of longitudinal rails 21 that are evenly disposed around the push rods 122 to maintain a balance of structural forces. In this embodiment, the longitudinal rail 21 can be a long straight rod body. One end of each of the lateral rails 22 is coupled to the lower ends of the longitudinal rails 21 and extends outwardly from the longitudinal rails 21. In this embodiment, the transverse rails 22 have a total of four and are connected to each other to form a cross shape, and the center of the cross shape is fixed to the lower ends of the longitudinal rails 21. In other embodiments, the number of the lateral rails 22 is not limited thereto, and may be three or five or the like.

Please refer to Figure 2 and Figure 3 together. The carriage 30 is disposed on the longitudinal rail 21 and is movable along the length of the longitudinal rail 21. Specifically, the carriage 30 is sleeved on the longitudinal rail 21. One end of the push rod 122 is fixed to the slide 30, so that the slide can be moved by the push rod 122 of the power unit 12. The slider 30 has a plurality of tabs 31, and each of the tabs 31 extends outward. In this embodiment, the two pieces of the tabs 31 are spaced apart from each other and protrude outward in parallel.

Please refer to FIG. 1 , FIG. 4 , and FIG. 5 . The number of the clamping members 40 is equal to the number of the lateral rails 22, and each of the clamping members 40 has a slider 41, a linkage rod 42, and at least one clamping portion 43, and selectively has at least one abutting block 44. The slider 41 is disposed on one of the lateral rails 22 and is movable along the length of the lateral rail 22. One end of the interlocking lever 42 is connected to the slider 30, and the other end is connected to the slider 41. Specifically, the interlocking rod 42 can be pivotally disposed on one of the tabs 31 of the sliding seat 30, and is clamped by the two sets of the tabs 31 on the sliding seat 30 and pivoted on the linking rod 42 in this embodiment. On both sides.

The clamping portion 43 is fixed to the slider 41 and is used to carry the wafer carrier ring. In the embodiment, the upper end of each clamping portion 43 is disposed on the slider 41 of the same group of clamping members 40, and extends downward from the slider 41, and a lower portion of each clamping portion 43 is formed with a hook portion 430. The portion 430 is used to carry the wafer carrier ring. In the present embodiment, each of the clamping members 40 has two clamping portions 43 which are spaced apart from each other. Thereby, each of the clamping members 40 can be clamped at a wider position to more stably hold the wafer carrier ring.

In each of the holding members 40, the number of the abutting blocks 44 is equal to the number of the holding portions 43. Each of the abutting blocks 44 is disposed on one of the clamping portions 43 and movable along the length of the clamping portion 43, whereby the lower side of the abutting block 44 can be coupled to the upper side of the hook portion 430 of the clamping portion 43. The wafer carrier ring is clamped together.

Through the above structure, when the present invention is used, the holding member 40 can be opened and closed similarly to an umbrella. Since the wafer may be placed on the larger diameter metal wafer carrier ring A1 for transport, or may be placed on the smaller diameter plastic wafer carrier ring A2 for transport, the gripping device of the present invention is The spacing between the clamping members 40 is varied to accommodate different sizes of wafer carrier rings.

Please refer to Figure 1 and Figure 6. If the metal wafer carrier ring A1 having a larger diameter is to be gripped, the push rod 122 of the power unit 12 is downwardly extended to push the carriage 20 downward, so that the linkage rods 42 are downwardly and outwardly pivoted. Turning and driving the slider 41 to move outward along the lateral rail 22, thereby moving the clamping portion 43 fixed to the slider 41 outward. When the clamping distance to the center is greater than the radius of the wafer carrier ring, the wafer gripping device can be moved down until the hook portion 430 of the clamping portion 43 is lower than the wafer carrier ring, and then the push rod The 122 is slightly retracted upward so that the clamping portion 43 moves inwardly until the hook portion 430 extends below the wafer carrier ring, and then the wafer gripping device can extract the wafer carrier ring as long as it moves up.

If the plastic wafer carrier ring A2 of the smaller size is to be gripped, as long as the push rod 122 of the power unit 12 causes the slider 30 to be greatly retracted upward, the clamping portion 43 can be closely moved inwardly to correspond. Smaller wafer carrier ring.

On the other hand, even if the wafer carrier ring is displaced or deformed during processing, the wafer carrier ring can be pushed back to the correct position when the plurality of clamping portions 43 are moved from the outside to the inside. At the same time, when the clamping portion 43 is moved inwardly to the positioning, it can abut against the outer circumference of the wafer carrier ring, so that the wafer carrier ring can be pushed back to the original shape.

In summary, when the creation moves up and down along the longitudinal rail 21 through the slide 30, the linkage rod 42 can be pivoted to drive the slider 41 to move inward or outward together with the clamping portion 43, and the clamping portion 43 The range of movement can be larger than that of prior art fixtures, so it can be adapted to different sizes of wafer carrier rings, so that a different gripping device can be used to transport various wafer carrier rings. Significantly reduce the cost of equipment construction. On the other hand, the wafer carrier ring is grasped by moving the plurality of clamping members 40 synchronously toward the center. Therefore, if the wafer carrier ring is not accurately placed in the center of the machine table, the clamping portion 43 of the clamping member 40 can Pushing the wafer carrier ring is the center of the configurable wafer size and the entire center, full circle of the capture device. Therefore, after the wafer is taken from the wafer placement platform, the wafer is transferred to the wafer. When the machine components are placed and positioned, there is no offset or misalignment when the wafer carrier ring is transferred to the machine component due to the size, eccentricity, and deformation of the wafer carrier ring.

11‧‧‧Connecting components
12‧‧‧Powerplant
121‧‧‧Ontology
122‧‧‧Put
20‧‧‧Slide
21‧‧‧ longitudinal rail
22‧‧‧ transverse rail
30‧‧‧Slide
31‧‧‧ 片片
40‧‧‧Clamping parts
41‧‧‧ Slider
42‧‧‧ linkage rod
43‧‧‧Clamping Department
430‧‧‧Hook
44‧‧‧Abutment block
A1‧‧‧Metal wafer carrier ring
A2‧‧‧Plastic wafer carrier ring

FIG. 1 is a schematic view of a metal wafer carrier ring taken by the present invention. Figure 2 is a side view of the slider of the present invention. Figure 3 is a top plan view of the slider of the present invention. Figure 4 is a side view of the grip of the present invention. Figure 5 is a top plan view of the grip of the present invention. FIG. 6 is a schematic view of the plastic wafer carrier ring taken by the present invention.

Claims (8)

A gripping device capable of setting a wafer size and a whole center and a full circle, which can be used for holding a wafer carrier ring, and having: a connecting component; a power device disposed on the connecting component a carriage having: at least one longitudinal rail having an upper end coupled to the connecting assembly; and a plurality of transverse rails, one end of each of the transverse rails being coupled to the lower end of the at least one longitudinal rail and from the at least one longitudinal rail Extending outwardly; a sliding seat disposed on the at least one longitudinal rail and coupled to the power device, the power device moving the sliding seat along a length of the at least one longitudinal rail; a plurality of clamping members, the number thereof Is equal to the number of the transverse rails; each of the clamping members has: a slider disposed on one of the transverse rails and movable along the length of the transverse rail; a linkage rod having one end connected to the sliding seat, and the other One end is connected to the slider; and at least one clamping portion is fixed to the slider and is used for carrying the wafer carrier ring. The arranging device of claim 1 , wherein the upper end of each of the at least one clamping portion of the clamping member is disposed on the clamping member And a slider extending downward from the slider, and a lower end of each of the at least one clamping portion is formed with a hook portion. The arranging device of claim 2, wherein the clamping member has a full-center, full-circle clamping device, wherein each of the clamping members further has at least one abutting block disposed on the at least one clamping portion. And movable along the length of the at least one clamping portion, whereby the lower side of the at least one abutting block can sandwich the wafer carrying ring together with the upper side of the hook portion of the at least one clamping portion. The arranging device for setting a wafer size and a whole center and a full circle according to any one of claims 1 to 3, wherein each of the clamping members has two clamping portions, and the two clamping portions Set at intervals. The clip-size device and the whole-center, full-circle gripping device according to any one of claims 1 to 3, wherein the slider is sleeved on the at least one longitudinal rail and has a plurality of a tab; the linkage rod of each of the clamping members is pivotally mounted on one of the tabs. The method of claim 4, wherein the wafer size and the whole center and the entire circle are clamped, wherein the slider is sleeved on the at least one longitudinal rail and has a plurality of tabs; each of the clips The linkage rod of the holding member is pivotally mounted on one of the tabs. The device of claim 1, wherein the power device comprises: a body disposed on the connection component; and a push rod disposed at a lower end of the body, and one end of the push rod is fixed to the sliding seat; and the sliding frame has a plurality of longitudinal rails, an upper end of the longitudinal rails is connected to a lower end of the connecting component, and the The equal longitudinal rails are evenly disposed around the push rod. The device of claim 6 is configured to set a wafer size and a whole center and a full circle, wherein: the power device comprises: a body disposed on the connection component; and a push rod, the setting a lower end of the body, and one end of the push rod is fixed to the sliding seat; and the sliding frame has a plurality of longitudinal rails, the upper ends of the longitudinal rails are connected to the lower end of the connecting component, and the longitudinal rails are evenly disposed Around the putter.