TWM555056U - Inductor component - Google Patents

Inductor component Download PDF

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Publication number
TWM555056U
TWM555056U TW106213014U TW106213014U TWM555056U TW M555056 U TWM555056 U TW M555056U TW 106213014 U TW106213014 U TW 106213014U TW 106213014 U TW106213014 U TW 106213014U TW M555056 U TWM555056 U TW M555056U
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Taiwan
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flat
insulated wire
inductive component
covering body
flat portion
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TW106213014U
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Chinese (zh)
Inventor
Peng-Chen Lo
Lung-Ching Tan
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Magic Tech Co Ltd
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Priority to TW106213014U priority Critical patent/TWM555056U/en
Publication of TWM555056U publication Critical patent/TWM555056U/en

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Description

電感元件 Inductive component

本案係關於一種電子元件,詳而言之,係關於一種電感元件。 This case relates to an electronic component, in particular, to an inductive component.

參閱第1A和1B圖,現有技術之電感元件100包括包覆體11和外露於包覆體11之線圈的傳導部122。基本上,由鐵粉構成之包覆體11會緊密包覆由漆包銅線環繞而成之線圈,故電感元件100為幾乎沒有間隙的結構。 Referring to FIGS. 1A and 1B, the prior art inductive component 100 includes a cladding 11 and a conductive portion 122 exposed to the coil of the cladding 11. Basically, the covering body 11 made of iron powder closely covers the coil surrounded by the lacquer-coated copper wire, so that the inductance element 100 has a structure with almost no gap.

電感元件100於使用時,電流通過線圈所產生的熱會藉由鐵粉而向外傳導以散熱,然而,電感元件100並未有得以進行散熱之設計,導致熱能積蓄在電感元件100內部造成產品特性下降。 When the inductor component 100 is in use, the heat generated by the current passing through the coil is conducted outward by the iron powder to dissipate heat. However, the inductor component 100 does not have a heat dissipation design, and the thermal energy is accumulated in the inductor component 100 to cause the product. The characteristics are declining

此外,隨著技術進步,電感元件往往朝向大電流和大功率的方向發展,但工作電流之增加亦會提高電感元件本身之溫度,除了產品特性下降之外,更會連帶影響週邊電子元件或基板。 In addition, as technology advances, inductive components tend to develop toward large currents and high power, but the increase in operating current also increases the temperature of the inductive component itself. In addition to the degradation of product characteristics, it also affects peripheral electronic components or substrates. .

因此,如何提供一種符合前述要求之電感元件為目前業界亟待解決之議題。 Therefore, how to provide an inductance component that meets the above requirements is an urgent issue to be solved in the industry.

為解決至少上述問題,本案提出一種電感元件,係包 括:線圈,包括由絕緣導線環繞形成之繞圈部及由該絕緣導線的兩端延伸形成之傳導部;以及包覆體,由磁性材料一體成型以緊密包覆該繞圈部並外露該傳導部,且該包覆體包括非平坦部。 In order to solve at least the above problems, the present invention proposes an inductive component, a package The coil includes a coil portion formed by an insulated wire and a conductive portion formed by extending both ends of the insulated wire, and a covering body integrally formed of a magnetic material to tightly cover the coil portion and expose the conductive portion And the covering body includes a non-flat portion.

於一實施例中,該包覆體的至少一面形成有該非平坦部,且該非平坦部具有平行於該絕緣導線兩端的延伸方向之至少一非平坦結構,其中,該非平坦結構為凸肋或凹槽,且該非平坦結構係延伸至該至少一面的邊緣。 In one embodiment, at least one side of the covering body is formed with the non-flat portion, and the non-flat portion has at least one non-flat structure parallel to an extending direction of both ends of the insulated wire, wherein the uneven structure is a rib or a concave a slot, and the non-planar structure extends to an edge of the at least one side.

於一實施例中,該包覆體的至少一面形成有該非平坦部,且該非平坦部具有垂直於該絕緣導線兩端的延伸方向之至少一非平坦結構,其中,該非平坦結構為凸肋或凹槽,且該非平坦結構係延伸至該至少一面的邊緣。 In one embodiment, at least one side of the covering body is formed with the non-flat portion, and the non-flat portion has at least one non-flat structure perpendicular to an extending direction of both ends of the insulated wire, wherein the uneven structure is a rib or a concave a slot, and the non-planar structure extends to an edge of the at least one side.

於一實施例中,該包覆體的至少一面形成有該非平坦部,且該非平坦部具有傾斜於該絕緣導線兩端的延伸方向之至少一非平坦結構,其中,該非平坦結構為凸肋或凹槽,且該非平坦結構係延伸至該至少一面的邊緣。 In one embodiment, at least one side of the covering body is formed with the non-flat portion, and the non-flat portion has at least one non-flat structure inclined to an extending direction of both ends of the insulated wire, wherein the uneven structure is a rib or a concave a slot, and the non-planar structure extends to an edge of the at least one side.

於一實施例中,該包覆體的至少一面形成有該非平坦部,且該非平坦部具有傾斜於該絕緣導線兩端的延伸方向之至少二非平坦結構,該二非平坦結構並彼此交會,其中,該非平坦結構為凸肋或凹槽,且該非平坦結構係延伸至該至少一面的邊緣。 In one embodiment, at least one side of the covering body is formed with the non-flat portion, and the non-flat portion has at least two non-flat structures inclined in an extending direction of both ends of the insulated wire, and the two non-flat structures intersect each other, wherein The uneven structure is a rib or a groove, and the uneven structure extends to an edge of the at least one side.

於一實施例中,該包覆體的至少一面形成有該非平坦部,且該非平坦部具有平行於該絕緣導線兩端的延伸方向之至少一非平坦結構以及垂直於該絕緣導線兩端的延伸方 向之至少另一非平坦結構,該非平坦結構和該另一非平坦結構並彼此交會,其中,該非平坦結構為凸肋或凹槽,且該非平坦結構係延伸至該至少一面的邊緣。 In one embodiment, at least one side of the covering body is formed with the non-flat portion, and the non-flat portion has at least one non-flat structure parallel to an extending direction of both ends of the insulated wire and an extension perpendicular to both ends of the insulated wire To at least another non-planar structure, the non-planar structure and the other non-flat structure intersect each other, wherein the non-planar structure is a rib or a groove, and the non-flat structure extends to an edge of the at least one side.

此外,該線圈之傳導部係經彎折以貼附於該包覆體之底面上,該非平坦部形成於該包覆體之相對於該底面之頂面上。該線圈之傳導部係由該絕緣導線的兩端經壓扁所構成者或由該絕緣導線的兩端各自連接傳導件所構成者。 In addition, the conductive portion of the coil is bent to be attached to the bottom surface of the covering body, and the uneven portion is formed on a top surface of the covering body opposite to the bottom surface. The conducting portion of the coil is formed by crimping both ends of the insulated wire or by connecting the conductive members to both ends of the insulated wire.

因此,本創作之電感元件表面之非平坦結構能形成空氣流通通道,讓空氣得以藉由這些非平坦結構而流通於電感元件表面上,進而帶走熱量,此外,這些非平坦結構亦可增加電感元件與空氣的接觸面積,達到散熱之效果。 Therefore, the non-flat structure of the surface of the inductive component of the present invention can form an air flow passage, allowing air to flow on the surface of the inductor element by these non-flat structures, thereby taking away heat, and in addition, these non-flat structures can also increase the inductance. The contact area between the component and the air achieves the effect of heat dissipation.

100、200、300、400、500、600、700‧‧‧電感元件 100, 200, 300, 400, 500, 600, 700‧‧‧ inductance components

11、21、31、41、51、61、71‧‧‧包覆體 11, 21, 31, 41, 51, 61, 71‧‧ ‧ wraps

122、222、322、422、522、622、722、222’、23‧‧‧傳導部 122, 222, 322, 422, 522, 622, 722, 222', 23‧‧ ‧ transmission

21A、31A、41A、51A、61A、71A‧‧‧非平坦部 21A, 31A, 41A, 51A, 61A, 71A‧‧‧ non-flat parts

21a、31a、41a、51a、61a、71a‧‧‧頂面 21a, 31a, 41a, 51a, 61a, 71a‧‧‧ top

21b、31b、41b、51b、61b、71b‧‧‧底面 21b, 31b, 41b, 51b, 61b, 71b‧‧‧ bottom

211、311、411、511、611、611’、711、711’‧‧‧非平坦結構 211, 311, 411, 511, 611, 611', 711, 711'‧‧‧ non-flat structures

221‧‧‧繞圈部 221‧‧‧Circle

第1A和1B圖為先前技術之電感元件之示意圖;第2A和2B圖為本案之電感元件之一實施例之示意圖;第3A和3B圖為本案之電感元件之一實施例之示意圖;第4A和4B圖為本案之電感元件之一實施例之示意圖;第5A和5B圖為本案之電感元件之一實施例之示意圖;第6A和6B圖為本案之電感元件之一實施例之示意圖;第7A和7B圖為本案之電感元件之一實施例之示意 圖;以及第8A和8B圖為本案之電感元件之線圈之一實施例之示意圖。 1A and 1B are schematic views of a prior art inductive component; 2A and 2B are schematic views of one embodiment of an inductive component of the present invention; and FIGS. 3A and 3B are schematic views of an embodiment of an inductive component of the present invention; And FIG. 4B is a schematic diagram of an embodiment of an inductive component of the present invention; FIGS. 5A and 5B are schematic diagrams showing an embodiment of an inductive component of the present invention; and FIGS. 6A and 6B are diagrams showing an embodiment of an inductive component of the present invention; 7A and 7B are schematic illustrations of one embodiment of the inductive component of the present invention Figure 8 and Figures 8A and 8B are schematic views of one embodiment of a coil of an inductive component of the present invention.

以下藉由特定的具體實施例說明本創作之實施方式,熟習此項技藝之人士可由本文所揭示之內容輕易地瞭解本創作之其他優點及功效。須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本創作可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本創作所能產生之功效及所能達成之目的下,均應仍落在本創作所揭示之技術內容得能涵蓋之範圍內。 The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily appreciate other advantages and functions of the present invention from the disclosure herein. It is to be understood that the structure, the proportions, the size and the like of the drawings are only used in conjunction with the disclosure of the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effectiveness and the purpose of the creation. The technical content revealed by the creation can be covered.

請參閱第2至7圖,本創作之電感元件200、300、400、500、600和700包括包覆體21、31、41、51、61和71和線圈(第2至7圖僅繪示線圈的傳導部222、322、422、522、622和722)。 Referring to Figures 2 to 7, the inductive components 200, 300, 400, 500, 600, and 700 of the present invention include the covering bodies 21, 31, 41, 51, 61, and 71 and the coils (the figures 2 to 7 are only shown Conducting portions 222, 322, 422, 522, 622, and 722) of the coil.

線圈,如第8A和8B圖所示,包括由絕緣導線環繞形成之繞圈部221及由該絕緣導線的兩端延伸形成之傳導部222’或23,如第8A圖所示,傳導部222’可由該絕緣導線之壓扁的兩端所構成,以直接形成SMD焊接面;如第8B圖所示傳導部23可由該絕緣導線的兩端各自連接傳導件所構成,藉由傳導件(如端子片)上的焊接面而形成SMD焊接面。 The coil, as shown in Figs. 8A and 8B, includes a coil portion 221 formed by an insulated wire and a conductive portion 222' or 23 formed by extending both ends of the insulated wire, as shown in Fig. 8A, the conducting portion 222 ' can be formed by the flattened ends of the insulated wire to directly form the SMD soldering surface; as shown in Fig. 8B, the conducting portion 23 can be formed by connecting the two ends of the insulated wire to each other by a conducting member, such as a conductive member (such as The welding surface on the terminal piece) forms an SMD welding surface.

回到第2至7圖,包覆體21、31、41、51、61和71由磁性材料一體成型以緊密包覆該繞圈部並外露傳導部222、322、422、522、622和722。 Returning to Figures 2 to 7, the covering bodies 21, 31, 41, 51, 61 and 71 are integrally formed of a magnetic material to closely cover the winding portion and expose the conductive portions 222, 322, 422, 522, 622 and 722. .

包覆體21、31、41、51、61和71的磁性材料例如鐵粉。包覆體21、31、41、51、61和71的至少一面,例如頂面21a、31a、41a、51a、61a和71a形成有非平坦部21A、31A、41A、51A、61A和71A。包覆體21、31、41、51、61和71之相對於該至少一面的一面,例如底面21b、31b、41b、51b、61b和71b供線圈的傳導部222、322、422、522、622和722彎折而貼附於其上。 The magnetic materials of the covering bodies 21, 31, 41, 51, 61 and 71 are, for example, iron powder. At least one surface of the covering bodies 21, 31, 41, 51, 61, and 71, for example, the top surfaces 21a, 31a, 41a, 51a, 61a, and 71a are formed with uneven portions 21A, 31A, 41A, 51A, 61A, and 71A. The surfaces of the covering bodies 21, 31, 41, 51, 61 and 71 with respect to the at least one side, for example the bottom surfaces 21b, 31b, 41b, 51b, 61b and 71b, provide the conductive portions 222, 322, 422, 522, 622 of the coil. And 722 is bent and attached to it.

包覆體21、31、41、51、61和71是使用模具高壓壓鑄成型以包覆線圈,而非平坦部21A、31A、41A、51A、61A和71A則是於高壓壓鑄成型時一起形成的。換言之,本創作之包覆體與其上的非平坦部乃於高壓壓鑄成型時期同步形成,故可節約成本。 The covering bodies 21, 31, 41, 51, 61, and 71 are formed by high pressure die casting using a mold to cover the coil, and the non-flat portions 21A, 31A, 41A, 51A, 61A, and 71A are formed together at the time of high pressure die casting. . In other words, the cover body of the present invention and the non-flat portion thereon are formed simultaneously in the high-pressure die-casting molding period, so that cost can be saved.

接著說明本創作非平坦部之各種實施例。 Next, various embodiments of the present non-flat portion will be described.

如第2A和2B圖所示,非平坦部21A包括非平坦結構211,其延伸平行於傳導部222兩端的延伸方向(於第2B圖中,可視為兩個傳導部222的連線方向),並延伸至頂面21a的邊緣。第2A和2B圖中所示之非平坦結構211為凸出於頂面21a之凸肋,相對於該凸肋之凹槽可作為空氣流通道,藉此提高表面散熱效率。本創作並未限制該凸肋的高度、寬度或數量,而非平坦結構211亦可為凹入於頂面21a之凹槽。 As shown in FIGS. 2A and 2B, the uneven portion 21A includes a non-flat structure 211 extending parallel to the extending direction of both ends of the conductive portion 222 (in FIG. 2B, it can be regarded as a connecting direction of the two conductive portions 222), And extending to the edge of the top surface 21a. The uneven structure 211 shown in Figs. 2A and 2B is a rib protruding from the top surface 21a, and the groove with respect to the rib can serve as an air flow passage, thereby improving surface heat dissipation efficiency. The creation does not limit the height, width or number of the ribs, and the non-flat structure 211 may also be a recess recessed into the top surface 21a.

如第3A和3B圖所示,非平坦部31A包括非平坦結構311,其延伸垂直於傳導部322兩端的延伸方向(於第3B圖中,可視為兩個傳導部322的連線方向),並延伸至頂面31a的邊緣。第3A和3B圖中所示之非平坦結構311為凸出於頂面31a之凸肋,本創作並未限制該凸肋的高度、寬度或數量,而非平坦結構311亦可為凹入於頂面31a之凹槽。 As shown in FIGS. 3A and 3B, the uneven portion 31A includes a non-flat structure 311 extending perpendicularly to the extending direction of both ends of the conductive portion 322 (in FIG. 3B, it can be regarded as the connecting direction of the two conductive portions 322), And extending to the edge of the top surface 31a. The non-flat structure 311 shown in FIGS. 3A and 3B is a convex rib protruding from the top surface 31a. The present invention does not limit the height, width or number of the ribs, and the non-flat structure 311 may also be concave. The groove of the top surface 31a.

如第4A和4B圖所示,非平坦部41A包括非平坦結構411,其延伸傾斜於傳導部422兩端的延伸方向(於第4B圖中,可視為兩個傳導部422的連線方向),並延伸至頂面41a的邊緣。第4A圖所示之非平坦結構411之傾斜方向為頂面41a的左上右下方向。第4A和4B圖中所示之非平坦結構411為凸出於頂面41a之凸肋,相對於該凸肋之凹槽可作為空氣流通道,藉此提高表面散熱效率。本創作並未限制該凸肋的高度、寬度或數量,而非平坦結構411亦可為凹入於頂面41a之凹槽。 As shown in FIGS. 4A and 4B, the uneven portion 41A includes a non-flat structure 411 extending obliquely to the extending direction of both ends of the conductive portion 422 (in FIG. 4B, it can be regarded as a connecting direction of the two conductive portions 422), And extending to the edge of the top surface 41a. The oblique direction of the uneven structure 411 shown in Fig. 4A is the upper left and lower right directions of the top surface 41a. The uneven structure 411 shown in Figs. 4A and 4B is a rib protruding from the top surface 41a, and the groove with respect to the rib can serve as an air flow passage, thereby improving surface heat dissipation efficiency. The creation does not limit the height, width or number of the ribs, and the non-flat structure 411 may also be a recess recessed into the top surface 41a.

如第5A和5B圖所示,非平坦部51A包括非平坦結構511,其延伸傾斜於傳導部522兩端的延伸方向(於第5B圖中,可視為兩個傳導部522的連線方向),並延伸至頂面51a的邊緣。第5A圖所示之非平坦結構511之傾斜方向為頂面51a的左下右上方向。第5A和5B圖中所示之非平坦結構511為凸出於頂面51a之凸肋,相對於該凸肋之凹槽可作為空氣流通道,藉此提高表面散熱效率。本創作並未限制該凸肋的高度、寬度或數量,而非平坦結構511亦可 為凹入於頂面51a之凹槽。 As shown in FIGS. 5A and 5B, the uneven portion 51A includes a non-flat structure 511 extending obliquely to the extending direction of both ends of the conductive portion 522 (in FIG. 5B, it can be regarded as a connecting direction of the two conductive portions 522), And extending to the edge of the top surface 51a. The oblique direction of the uneven structure 511 shown in Fig. 5A is the lower left and upper right directions of the top surface 51a. The uneven structure 511 shown in Figs. 5A and 5B is a rib protruding from the top surface 51a, and the groove with respect to the rib can serve as an air flow passage, thereby improving surface heat dissipation efficiency. This creation does not limit the height, width or number of the ribs, and the flat structure 511 may also It is a groove recessed into the top surface 51a.

如第6A和6B圖所示,非平坦部61A包括平行和垂直於傳導部622兩端的延伸方向(於第6B圖中,可視為兩個傳導部622的連線方向)之非平坦結構611和611’,非平坦結構611平行於傳導部622兩端的延伸方向,非平坦結構611’垂直於傳導部622兩端的延伸方向,非平坦結構611和611’並延伸至頂面61a的邊緣,且非平坦結構611和611’彼此交會而將頂面61a區分成多個區塊。第6A和6B圖中所示之非平坦結構611和611’為凹入於頂面61a之凹槽,該凹槽可作為空氣流通道,藉此提高表面散熱效率。本創作並未限制該凹槽的高度、寬度或數量,而非平坦結構611和611’亦可為凸出於頂面61a之凸肋。 As shown in FIGS. 6A and 6B, the uneven portion 61A includes the uneven structure 611 which is parallel and perpendicular to the extending direction of both ends of the conductive portion 622 (in the FIG. 6B, which can be regarded as the connecting direction of the two conductive portions 622) and 611', the uneven structure 611 is parallel to the extending direction of both ends of the conducting portion 622, the uneven structure 611' is perpendicular to the extending direction of the both ends of the conducting portion 622, and the uneven structures 611 and 611' extend to the edge of the top surface 61a, and The flat structures 611 and 611' intersect each other to divide the top surface 61a into a plurality of blocks. The uneven structures 611 and 611' shown in Figs. 6A and 6B are grooves recessed in the top surface 61a, and the grooves can serve as air flow passages, thereby improving surface heat dissipation efficiency. The present creation does not limit the height, width or number of the grooves, and the non-flat structures 611 and 611' may also be ribs protruding from the top surface 61a.

如第7A和7B圖所示,非平坦部71A包括傾斜於傳導部722兩端的延伸方向(於第7B圖中,可視為兩個傳導部722的連線方向)之非平坦結構711和711’,非平坦結構711之傾斜方向為頂面71a的左上右下方向,非平坦結構711’之傾斜方向為頂面71a的左下右上方向,非平坦結構711和711’並延伸至頂面71a的邊緣,且非平坦結構711和711’彼此交會而將頂面71a區分成多個區塊。第7A和7B圖中所示之非平坦結構711和711’為凹入於頂面71a之凹槽,該凹槽可作為空氣流通道,藉此提高表面散熱效率。本創作並未限制該凹槽的高度、寬度或數量,而非平坦結構711和711’亦可為凸出於頂面71a之凸肋。 As shown in FIGS. 7A and 7B, the uneven portion 71A includes the uneven structures 711 and 711' which are inclined to the extending directions of both ends of the conductive portion 722 (in the FIG. 7B, which can be regarded as the connecting direction of the two conductive portions 722). The oblique direction of the uneven structure 711 is the upper left and lower right directions of the top surface 71a, and the oblique direction of the uneven structure 711' is the lower left and upper right directions of the top surface 71a, and the uneven structures 711 and 711' extend to the edge of the top surface 71a. And the uneven structures 711 and 711' intersect each other to divide the top surface 71a into a plurality of blocks. The uneven structures 711 and 711' shown in Figs. 7A and 7B are grooves recessed in the top surface 71a, and the grooves can serve as air flow passages, thereby improving surface heat dissipation efficiency. The present creation does not limit the height, width or number of the grooves, and the non-flat structures 711 and 711' may also be ribs protruding from the top surface 71a.

綜上所述,本創作係於電感元件之包覆體的至少一面 形成如凸肋或凹槽之至少一非平坦結構,以使該至少一面具有非平坦部,電感元件的非平坦部能增加其表面與空氣的接觸面積,藉此提昇散熱效果,而由多個非平坦結構所構成之波浪紋路更能提供空氣通道以供空氣流通,進而帶走因線圈通道所產生之熱量,俾提昇電感元件之散熱效果。此外,本創作之包覆體及形成於其上之非平坦部乃於模具高壓壓鑄程序中同步一體成型,故亦能節約成本。 In summary, the creation is on at least one side of the cladding of the inductive component. Forming at least one non-flat structure such as a rib or a groove such that the at least one surface has a non-flat portion, and the non-flat portion of the inductance element can increase the contact area of the surface with the air, thereby improving the heat dissipation effect, and The wave pattern formed by the non-flat structure can provide an air passage for the air to circulate, thereby taking away the heat generated by the coil passage and improving the heat dissipation effect of the inductor element. In addition, the cover body of the present invention and the non-flat portion formed thereon are simultaneously integrally formed in the high-pressure die-casting process of the mold, so that cost can also be saved.

上述實施樣態僅例示性說明本創作之功效,而非用於限制本創作,任何熟習此項技藝之人士均可在不違背本創作之精神及範疇下,對上述該些實施態樣進行修飾與改變。此外,在上述該些實施態樣中之結構的數目僅為例示性說明,亦非用於限制本創作。因此本創作之權利保護範圍,應如後述之申請專利範圍所列。 The above embodiments are merely illustrative of the effects of the present invention and are not intended to limit the present invention. Any person skilled in the art can modify the above-mentioned embodiments without departing from the spirit and scope of the present invention. And change. Moreover, the number of structures in the above-described embodiments is merely illustrative and is not intended to limit the present invention. Therefore, the scope of protection of this creation should be as listed in the scope of patent application described later.

200‧‧‧電感元件 200‧‧‧Inductance components

21‧‧‧包覆體 21‧‧ ‧ wrap

21A‧‧‧非平坦部 21A‧‧‧Apartment

21a‧‧‧頂面 21a‧‧‧Top

211‧‧‧非平坦結構 211‧‧‧Uneven structure

Claims (10)

一種電感元件,係包括:線圈,包括由絕緣導線環繞形成之繞圈部及由該絕緣導線的兩端延伸形成之傳導部;以及包覆體,由磁性材料一體成型以緊密包覆該繞圈部並外露該傳導部,且該包覆體包括非平坦部。 An inductive component comprising: a coil comprising a coil portion formed by an insulated wire and a conductive portion extending from both ends of the insulated wire; and a covering body integrally formed of a magnetic material to tightly cover the coil The conductive portion is exposed and exposed, and the covering body includes a non-flat portion. 如申請專利範圍第1項所述之電感元件,其中,該包覆體的至少一面形成有該非平坦部,且該非平坦部具有平行於該絕緣導線兩端的延伸方向之至少一非平坦結構。 The inductive component according to claim 1, wherein at least one surface of the covering body is formed with the non-flat portion, and the non-flat portion has at least one non-flat structure parallel to an extending direction of both ends of the insulated wire. 如申請專利範圍第1項所述之電感元件,其中,該包覆體的至少一面形成有該非平坦部,且該非平坦部具有垂直於該絕緣導線兩端的延伸方向之至少一非平坦結構。 The inductive component according to claim 1, wherein at least one surface of the covering body is formed with the non-flat portion, and the non-flat portion has at least one non-flat structure perpendicular to an extending direction of both ends of the insulated wire. 如申請專利範圍第1項所述之電感元件,其中,該包覆體的至少一面形成有該非平坦部,且該非平坦部具有傾斜於該絕緣導線兩端的延伸方向之至少一非平坦結構。 The inductive component according to claim 1, wherein the non-flat portion is formed on at least one surface of the covering body, and the non-flat portion has at least one non-flat structure inclined in an extending direction of both ends of the insulated wire. 如申請專利範圍第1項所述之電感元件,其中,該包覆體的至少一面形成有該非平坦部,且該非平坦部具有傾斜於該絕緣導線兩端的延伸方向之至少二非平坦結構,該二非平坦結構並彼此交會。 The inductive component according to claim 1, wherein at least one surface of the covering body is formed with the non-flat portion, and the non-flat portion has at least two non-flat structures inclined in an extending direction of both ends of the insulated wire, Two non-flat structures and meet each other. 如申請專利範圍第1項所述之電感元件,其中,該包覆體的至少一面形成有該非平坦部,且該非平坦部具有平行於該絕緣導線兩端的延伸方向之至少一非平坦結構以及垂直於該絕緣導線兩端的延伸方向之至少另一非平坦結構,該非平坦結構與該另一非平坦結構並彼此交 會。 The inductive component according to claim 1, wherein at least one surface of the covering body is formed with the non-flat portion, and the non-flat portion has at least one non-flat structure parallel to an extending direction of both ends of the insulated wire and vertical At least another non-flat structure extending in a direction of both ends of the insulated wire, the non-flat structure and the other non-flat structure intersecting each other meeting. 如申請專利範圍第2至6項中任一項所述之電感元件,其中,該非平坦結構為凸肋或凹槽,且該非平坦結構係延伸至該至少一面的邊緣。 The inductive component of any one of claims 2 to 6, wherein the non-planar structure is a rib or a groove, and the non-planar structure extends to an edge of the at least one side. 如申請專利範圍第1項所述之電感元件,其中,該線圈之傳導部係經彎折以貼附於該包覆體之底面上,且該非平坦部形成於該包覆體之相對於該底面之頂面上。 The inductive component of claim 1, wherein the conductive portion of the coil is bent to be attached to a bottom surface of the covering body, and the non-flat portion is formed on the covering body relative to the covering body On the top surface of the bottom surface. 如申請專利範圍第1項所述之電感元件,其中,該線圈之傳導部係由該絕緣導線的兩端經壓扁所構成者。 The inductive component according to claim 1, wherein the conductive portion of the coil is formed by flattening both ends of the insulated wire. 如申請專利範圍第1項所述之電感元件,其中,該線圈之傳導部係由該絕緣導線的兩端各自連接傳導件所構成者。 The inductive component according to claim 1, wherein the conductive portion of the coil is formed by connecting a conductive member to each end of the insulated wire.
TW106213014U 2017-09-01 2017-09-01 Inductor component TWM555056U (en)

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