TWM553877U - Bed jig for cutting circuit board - Google Patents

Description

Bed fixture for cutting circuit substrate

The present invention relates to a fixed fixture for adsorbing and fixing a cutting object in a cutting device, and more particularly to a bed fixture for cutting a circuit substrate.

In the manufacturing process of a circuit board, a circuit board having a plurality of substrates is first manufactured, and then each substrate is cut and used individually. When the circuit substrate is moved to the cutting machine and the substrates are fixed for cutting, it is common to realize the movement and positioning of each substrate via a jig having a vacuum suction function. Therefore, the Republic of China Patent Publication No. I566291 discloses a "cutting device, an adsorption mechanism, and a device having an adsorption mechanism", which is shown in Fig. 2(a) of the case No. I566291, and the adsorption jig includes a metal plate. a (bottom plate) and an adsorbing member having a plurality of protrusions each having a rubber layer (preventing sliding and abrasion of the circuit substrate), and the protrusions are each provided with an adsorption hole (a vacuum penetrating through the metal plate) The adsorption hole is provided, and the first cutting groove and the second cutting groove of the longitudinal direction and the lateral direction are simultaneously provided on the adsorption member.

In the technical solution, each of the adsorption holes is disposed at the middle of the protrusions, and after the adsorption and fixation of the circuit board and the cutting, it is difficult to remove the circuit substrate from the vacuum (the adsorption force is too concentrated in the middle), that is, There is a possibility that it is difficult to break the vacuum, and when the fixed circuit board is adsorbed, the adsorption force is excessively generated and the circuit board is bent (when the circuit board is thin). Although it is possible to adjust the vacuum adsorption force by the operation of the vacuum adsorption device, it will cause a process. The increase in process complexity is not conducive to cutting and yield improvement of the circuit board. Therefore, how to improve the above-mentioned deficiencies, that is, the technical difficulties that the applicant of this case wants to solve.

In view of the lack of conventional use, the purpose of this creation is to develop a bed fixture for a circuit board that disperses vacuum adsorption force under the condition that the vacuum adsorption pressure is constant.

In order to achieve the above object, the present invention provides a bed fixture for cutting a circuit substrate, comprising: a metal plate having a plurality of communication holes; a glue layer disposed on the front surface of the metal plate, the glue layer Forming a plurality of laterally and longitudinally aligned adsorption portions, each of the adsorption portions is provided with a plurality of transverse first cutting grooves and a plurality of longitudinal second cutting grooves, the first cutting grooves and the second cutting grooves Each of the adsorption portions is provided with a frame portion protruding from the front surface of the adhesive layer, and a plurality of adsorption holes are disposed on the frame portion, and the adsorption holes are connected to the communication holes.

Each of the adsorption portions is provided with a cross-arranged discharge groove extending from the periphery of the adsorption portion and communicating with the first cutting grooves and the second cutting grooves. Further, the discharge grooves are orthogonally arranged in a cross.

Therefore, by dispersing the vacuum adsorption force under the condition that the vacuum adsorption pressure is constant, the creation can effectively improve the uniformity of the adsorption force during vacuum adsorption of the circuit substrate, and the ease of vacuum adsorption after cutting can be improved, and Allow thinner circuit substrates to avoid bending during vacuum adsorption, and improve cutting accuracy when cutting circuit boards (avoiding skewing). In addition, the creation can achieve the effect of drainage and chip removal during cutting, and can reduce or avoid the residual splash on the circuit board to achieve the effect.

[this creation]

1‧‧‧Metal sheet

11‧‧‧Connected holes

2‧‧‧ glue layer

21‧‧‧Adsorption Department

22‧‧‧First cutting slot

23‧‧‧Second cutting slot

24‧‧‧ Frame Department

3‧‧‧Adsorption holes

4‧‧‧Drainage trough

100‧‧‧ circuit board

101‧‧‧ circuit board

The first drawing is a plan view of a bed fixture for cutting a circuit substrate of the preferred embodiment of the present invention.

The second drawing is a schematic view of each adsorption section of the first figure of the preferred embodiment of the present invention.

The third drawing is a partial cross-sectional view of the first embodiment of the preferred embodiment of the present invention.

The fourth figure is a schematic cross-sectional view showing the use of the stacked circuit substrate of the preferred embodiment of the present invention for cutting.

The fifth drawing is a schematic view of the cross-sectional state of the circuit substrate after the cutting and adsorption of the preferred embodiment of the present invention.

In order for your review board to have a clear understanding of the content of this work, please refer to the following examples with diagrams and symbols, please refer to it.

Referring to the first to third figures, the present invention provides a bed fixture for cutting a circuit substrate, comprising: a metal plate 1 and a glue layer 2. The glue layer 2 can be composed of a rubber material.

The metal plate 1 is provided with a plurality of communication holes 11 that communicate with a vacuuming device or device.

The adhesive layer 2 is covered (fitted) on the front surface of the metal plate 1, and the adhesive layer 2 is formed with a plurality of adsorption portions 21 arranged in a lateral direction and a longitudinal direction, and each of the adsorption portions 21 is provided with a plurality of lateral directions. a cutting groove 22 and a plurality of second cutting grooves 23 in the longitudinal direction, the first cutting grooves 22 and the second cutting grooves 23 are in communication with each other, and each of the adsorption portions 21 is provided with a frame portion 24, and the frame portion 24 is protruded A plurality of adsorption holes 3 are disposed on the front surface of the rubber layer 2, and the adsorption holes 3 are communicated with the communication holes 11.

Therefore, please refer to the second and fourth figures, in which a circuit substrate 100 is stacked and the circuit substrate 100 is cut in the case of vacuum adsorption. Entering the state of vacuum adsorption At this time, air is evacuated from the adsorption holes 3 and the communication holes 11, so that the circuit substrate 100 is attracted. In this embodiment, each of the adsorption portions 21 is provided with a frame portion 24, so that the adsorption holes 3 are arranged in a surrounding manner, so that the vacuum adsorption can be performed under the condition that the vacuum adsorption pressure is constant. The force (produced by the vacuuming device end) is dispersed, which can effectively improve the uniformity of the adsorption force during vacuum adsorption of the circuit substrate 100, and the ease of removal from vacuum adsorption after cutting (avoiding excessive concentration of vacuum adsorption force), allowing the process Can go smoothly. Moreover, the thin circuit board 100 can be prevented from being bent during vacuum suction, so that the cutting precision when the circuit board 100 is cut can be improved, and the circuit board 100 can be prevented from being bent and cut into a skewed shape, thereby improving the manufacturing of the circuit board 100. rate.

Further, please refer to the first figure and the fifth figure, in particular, after the circuit substrate 100 is cut (divided into a plurality of pieces and includes the removal of waste materials), the circuit board 101 formed by the plurality of pieces can be formed by The adsorption holes 3 on each of the adsorption portions 21 are surely stably holding and fixing the plurality of circuit substrates 101, thereby improving the uniformity of the adsorption force. When the jig of the metal plate 1 and the rubber layer 2 is moved to another process of the next station, the adsorption and detachment of the plurality of circuit substrates 101 can be avoided, and the fluency of the next process can be improved ( When it is detected that one of the circuit substrates 101 is not properly adsorbed and detached when the next station process is detected, the process cannot be smoothly continued. Therefore, the fluency of the process can be improved to achieve the effect.

In addition, each of the adsorption portions 21 is provided with a cross-arranged discharge groove 4 extending from the periphery of the adsorption portion 21 and interfacing with the first cutting grooves 22 and the second cutting grooves 23 Connected. The effect of the drainage and the chip removal at the time of cutting can be improved, and the splashing of the residue can be reduced or prevented from remaining on the circuit substrate 100 (and the plurality of circuit boards 101 after cutting). Preferably, the discharge grooves 4 may be orthogonally arranged in a cross shape, thereby forming a shortest path with the first cutting grooves 22 and the second cutting grooves 23, so that the drainage and chip removal effects are better. Benchuang The characteristics of the work.

The above discussion is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; therefore, the equivalent shape, structure or combination of changes made in the spirit and scope of the present invention should be It is covered by the patent application scope of this creation.

21‧‧‧Adsorption Department

22‧‧‧First cutting slot

23‧‧‧Second cutting slot

24‧‧‧ Frame Department

3‧‧‧Adsorption holes

4‧‧‧Drainage trough

Claims (3)

A bed fixture for cutting a circuit substrate, comprising: a metal plate provided with a plurality of communication holes; a glue layer disposed on the front surface of the metal plate, wherein the glue layer is formed with a plurality of horizontal and vertical alignments In the adsorption portion, each of the adsorption portions is provided with a plurality of transverse first cutting grooves and a plurality of longitudinal second cutting grooves, wherein the first cutting grooves and the second cutting grooves are in communication with each of the adsorption portions. The frame portion is protruded from the front surface of the adhesive layer, and a plurality of adsorption holes are disposed on the frame portion, and the adsorption holes are connected to the communication holes. The bed fixture for cutting a circuit board according to claim 1, wherein each of the adsorption portions is provided with a cross-arranged discharge groove extending from a periphery of the adsorption portion and The first cutting groove and the second cutting grooves communicate with each other. The bed jig for cutting a circuit board according to claim 2, wherein the discharge grooves are orthogonally arranged in a cross.