TWM550801U - 燈具 - Google Patents
燈具 Download PDFInfo
- Publication number
- TWM550801U TWM550801U TW106206777U TW106206777U TWM550801U TW M550801 U TWM550801 U TW M550801U TW 106206777 U TW106206777 U TW 106206777U TW 106206777 U TW106206777 U TW 106206777U TW M550801 U TWM550801 U TW M550801U
- Authority
- TW
- Taiwan
- Prior art keywords
- luminaire
- fixing member
- strips
- fixing
- light
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
本新型創作是有關於一種燈具,且特別是有關於一種具有較佳散熱效果的燈具。
發光二極體(light-emitting diode,LED)屬於半導體元件,其發光原理是將電能轉換為光能。LED的壽命長達十萬小時以上,且LED更具有反應速度快、體積小、省電、低污染、高可靠度與適合量產等優點,因此LED正逐漸滲透一般照明燈具市場。
然而,在使用LED燈條作為燈具的光源時,LED燈條固定在整片無開口的固定板上,且固定板完全覆蓋LED燈條,而使得氣流無法流通,常會產生散熱不佳的問題。
本新型創作提供一種燈具,其可具有較佳的散熱效果。
本新型創作提出一種燈具,包括多個LED燈條與至少一個固定件。固定件固定在LED燈條的固定面上。固定面相對於發光二極體燈條的發光面。固定件僅覆蓋部分固定面。
依照本新型創作的一實施例所述,在上述燈具中,LED燈條可彼此間隔設置。
依照本新型創作的一實施例所述,在上述燈具中,各個LED燈條可包括電源。電源位於LED燈條的一端中。
依照本新型創作的一實施例所述,在上述燈具中,固定件可覆蓋電源的至少一部分。
依照本新型創作的一實施例所述,在上述燈具中,相鄰兩個LED燈條的電源可位於相鄰兩個LED燈條的同一端或不同端。
依照本新型創作的一實施例所述,在上述燈具中,固定件可夾固或鎖固LED燈條。
依照本新型創作的一實施例所述,在上述燈具中,固定件例如是在LED燈條的寬度方向上進行固定。
依照本新型創作的一實施例所述,在上述燈具中,固定件可具有至少一個散熱鰭片。
依照本新型創作的一實施例所述,在上述燈具中,固定件的數量例如是多個。
依照本新型創作的一實施例所述,在上述燈具中,更可包括至少一個連接件。連接件連接於固定件之間。
基於上述,在本新型創作所提出的燈具中,由於固定件僅覆蓋LED燈條的部分固定面,並非完全覆蓋LED燈條的固定面,因此氣流可充分地進行流通,進而使得燈具具有較佳的散熱效果。此外,由於本新型創作所提出的燈具的固定件具有較小的尺寸,因此可降低燈具的製造成本,且亦可降低燈具的重量且組裝前的體積,而有利於燈具的運送。
為讓本新型創作的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。
圖1為本新型創作的一實施例的燈具的示意圖。
請參照圖1,燈具100包括多個LED燈條102與至少一個固定件104。在此實施例中,固定件104的數量是以多個為例來進行說明。燈具100可用於各種照明應用中,例如可應用於植物照明吊燈或辦公室照明燈等。
LED燈條102可彼此間隔設置,而有利於進行散熱。各個LED燈條102可包括電源106。電源106位於LED燈條102的一端中。相鄰兩個LED燈條102的電源106可位於相鄰兩個LED燈條102的同一端或不同端。在此實施例中,相鄰兩個LED燈條102的電源106是以位於兩個LED燈條102的同一端為例來進行說明。
固定件104固定在LED燈條102的固定面S1上,用以固定LED燈條102。固定面S1相對於LED燈條102的發光面S2。固定件104例如是在LED燈條102的寬度方向DW上進行固定。固定件104的材料例如是鋁或鋁合金。固定件104可具有至少一個散熱鰭片108。散熱鰭片108有助於進行散熱。在此實施例中,散熱鰭片108的數量是以多個為例來進行說明。
舉例來說,固定件104可夾固或鎖固LED燈條102。具體來說,固定件104可藉由夾具(未繪示)夾固LED燈條102或可藉由螺絲(未繪示)鎖固LED燈條102。
固定件104僅覆蓋部分固定面S1,因此氣流可充分地進行流通,進而使得燈具100具有較佳的散熱效果。此外,固定件104可覆蓋電源106的至少一部分,有助於將電源106的熱導出,而進一步地提高散熱效果。固定件104的尺寸可彼此相同或互為不同。
此外,在固定件104的數量為多個的情況下,燈具100更可包括至少一個連接件110。連接件110連接於固定件104之間,可用以加強固定效果。舉例來說,連接件110與固定件104之間可藉由螺絲(未繪示)進行連接。連接件110的材料例如是鋁或鋁合金。在此實施例中,連接件110的數量是以多個為例來進行說明。
基於上述實施例可知,在燈具100中,由於固定件104僅覆蓋LED燈條102的部分固定面S1,並非完全覆蓋LED燈條102的固定面S1,因此氣流可充分地進行流通,進而使得燈具100具有較佳的散熱效果。此外,由於燈具100的固定件104具有較小的尺寸,因此可降低燈具100的製造成本,且亦可降低燈具100的重量與組裝前的體積,而有利於燈具100的運送。
圖2為本新型創作的另一實施例的燈具的示意圖。
請同時參照圖1與圖2,圖2的燈具200與圖1的燈具100的差異如下。在圖2的燈具200中,相鄰兩個LED燈條102的電源106位於相鄰兩個LED燈條102的不同端,亦即電源106交替排列於LED燈條102的一端與另一端。藉此,可避免相鄰兩個LED燈條102的電源106因距離太近而產生高溫,而有助於進一步降低燈具200的溫度。此外,燈具200與燈具100中相似的構件以相同的符號表示並省略其說明。
綜上所述,在上述實施例的燈具中,由於固定件僅覆蓋LED燈條的部分固定面,因此具有較佳的散熱效果。此外,由於燈具的固定件具有較小的尺寸,因此可降低燈具的製造成本,且有利於燈具的運送。
雖然本新型創作已以實施例揭露如上,然其並非用以限定本新型創作,任何所屬技術領域中具有通常知識者,在不脫離本新型創作的精神和範圍內,當可作些許的更動與潤飾,故本新型創作的保護範圍當視後附的申請專利範圍所界定者為準。
100、200‧‧‧燈具
102‧‧‧LED燈條
104‧‧‧固定件
106‧‧‧電源
108‧‧‧散熱鰭片
110‧‧‧連接件
DW‧‧‧寬度方向
S1‧‧‧固定面
S2‧‧‧發光面
圖1為本新型創作的一實施例的燈具的示意圖。 圖2為本新型創作的另一實施例的燈具的示意圖。
100‧‧‧燈具
102‧‧‧LED燈條
104‧‧‧固定件
106‧‧‧電源
108‧‧‧散熱鰭片
110‧‧‧連接件
DW‧‧‧寬度方向
S1‧‧‧固定面
S2‧‧‧發光面
Claims (10)
- 一種燈具,包括: 多個發光二極體燈條;以及 至少一固定件,固定在該些發光二極體燈條的一固定面上,其中該固定面相對於該些發光二極體燈條的一發光面,且該至少一固定件僅覆蓋部分該固定面。
- 如申請專利範圍第1項所述的燈具,其中該些發光二極體燈條彼此間隔設置。
- 如申請專利範圍第1項所述的燈具,其中各該發光二極體燈條包括一電源,位於各該發光二極體燈條的一端中。
- 如申請專利範圍第3項所述的燈具,其中該至少一固定件覆蓋該些電源的至少一部分。
- 如申請專利範圍第3項所述的燈具,其中相鄰兩個發光二極體燈條的該些電源位於相鄰兩個發光二極體燈條的同一端或不同端。
- 如申請專利範圍第1項所述的燈具,其中該至少一固定件夾固或鎖固該些發光二極體燈條。
- 如申請專利範圍第1項所述的燈具,其中該至少一固定件在該些發光二極體燈條的寬度方向上進行固定。
- 如申請專利範圍第1項所述的燈具,其中該至少一固定件具有至少一散熱鰭片。
- 如申請專利範圍第1項所述的燈具,其中該至少一固定件的數量為多個。
- 如申請專利範圍第9項所述的燈具,更包括至少一連接件,連接於該些固定件之間。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW106206777U TWM550801U (zh) | 2017-05-12 | 2017-05-12 | 燈具 |
US15/700,184 US20180331265A1 (en) | 2017-05-12 | 2017-09-11 | Lamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW106206777U TWM550801U (zh) | 2017-05-12 | 2017-05-12 | 燈具 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM550801U true TWM550801U (zh) | 2017-10-21 |
Family
ID=61013817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106206777U TWM550801U (zh) | 2017-05-12 | 2017-05-12 | 燈具 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20180331265A1 (zh) |
TW (1) | TWM550801U (zh) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8083373B2 (en) * | 2009-07-23 | 2011-12-27 | James William Zimmerman | LED retrofit for fluorescent backlit signs |
US20130128603A1 (en) * | 2011-11-20 | 2013-05-23 | Foxsemicon Integrated Technology, Inc. | Vehicle headlamp system |
US8888313B2 (en) * | 2012-03-07 | 2014-11-18 | Harris Manufacturing, Inc. | Light emitting diode troffer door assembly |
KR101447437B1 (ko) * | 2013-07-29 | 2014-10-08 | 엘지디스플레이 주식회사 | 커버 보텀 및 이를 이용한 표시장치 |
KR101701143B1 (ko) * | 2014-08-27 | 2017-02-13 | 김종희 | 엘이디 가로등 |
-
2017
- 2017-05-12 TW TW106206777U patent/TWM550801U/zh not_active IP Right Cessation
- 2017-09-11 US US15/700,184 patent/US20180331265A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20180331265A1 (en) | 2018-11-15 |
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MM4K | Annulment or lapse of a utility model due to non-payment of fees |