TWM539763U - 介面卡流體散熱之固定裝置 - Google Patents

介面卡流體散熱之固定裝置 Download PDF

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Publication number
TWM539763U
TWM539763U TW105218085U TW105218085U TWM539763U TW M539763 U TWM539763 U TW M539763U TW 105218085 U TW105218085 U TW 105218085U TW 105218085 U TW105218085 U TW 105218085U TW M539763 U TWM539763 U TW M539763U
Authority
TW
Taiwan
Prior art keywords
interface card
heat
water
cooling device
water cooling
Prior art date
Application number
TW105218085U
Other languages
English (en)
Chinese (zh)
Inventor
Tai-Sheng Han
Original Assignee
Evga Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Evga Corp filed Critical Evga Corp
Priority to TW105218085U priority Critical patent/TWM539763U/zh
Publication of TWM539763U publication Critical patent/TWM539763U/zh
Priority to CN201721041994.7U priority patent/CN207305229U/zh
Priority to JP2017003945U priority patent/JP3213431U/ja
Priority to KR2020170004886U priority patent/KR200491304Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW105218085U 2016-11-25 2016-11-25 介面卡流體散熱之固定裝置 TWM539763U (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW105218085U TWM539763U (zh) 2016-11-25 2016-11-25 介面卡流體散熱之固定裝置
CN201721041994.7U CN207305229U (zh) 2016-11-25 2017-08-18 介面卡流体散热的固定装置
JP2017003945U JP3213431U (ja) 2016-11-25 2017-08-29 インターフェースカードの流体放熱の固定装置
KR2020170004886U KR200491304Y1 (ko) 2016-11-25 2017-09-15 인터페이스 카드의 유체 방열을 위한 고정장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105218085U TWM539763U (zh) 2016-11-25 2016-11-25 介面卡流體散熱之固定裝置

Publications (1)

Publication Number Publication Date
TWM539763U true TWM539763U (zh) 2017-04-11

Family

ID=59255378

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105218085U TWM539763U (zh) 2016-11-25 2016-11-25 介面卡流體散熱之固定裝置

Country Status (4)

Country Link
JP (1) JP3213431U (ja)
KR (1) KR200491304Y1 (ja)
CN (1) CN207305229U (ja)
TW (1) TWM539763U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD191875S (zh) 2017-11-10 2018-07-21 雙鴻科技股份有限公司 水冷散熱裝置
TWD193266S (zh) 2017-11-10 2018-10-01 雙鴻科技股份有限公司 具有兩薄型水箱之水冷散熱裝置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06266474A (ja) * 1993-03-17 1994-09-22 Hitachi Ltd 電子機器装置及びラップトップ型電子機器装置
US6796370B1 (en) * 2000-11-03 2004-09-28 Cray Inc. Semiconductor circular and radial flow cooler
KR100465088B1 (ko) * 2002-02-08 2005-01-06 쿨랜스코리아 주식회사 전자장치의 수냉식 냉각 시스템
JP2006210885A (ja) * 2004-12-27 2006-08-10 Matsushita Electric Ind Co Ltd 冷却装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD191875S (zh) 2017-11-10 2018-07-21 雙鴻科技股份有限公司 水冷散熱裝置
TWD193266S (zh) 2017-11-10 2018-10-01 雙鴻科技股份有限公司 具有兩薄型水箱之水冷散熱裝置

Also Published As

Publication number Publication date
JP3213431U (ja) 2017-11-09
KR200491304Y1 (ko) 2020-03-18
CN207305229U (zh) 2018-05-01

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