TWM532142U - Loop heat pipe and electronic device having the same - Google Patents

Abstract

The present invention discloses a loop heat pipe. In the loop heat pipe, an extension portion is formed in one piece with the liquid-gas conversion chamber and making a heat contact with the heating electronic element. Hence, the thermal resistance between the electronic element and the liquid-gas conversion chamber could be reduced and improve the heat-transmission efficiency by the present invention.

Description

Loop heat pipe and electronic device using the same

This creation relates to a heat sink, and in particular to a loop heat pipe that can be used in an electronic device.

The Loop Heat Pipe is a heat sink that utilizes the principle of absorbing large amounts of heat during a two-phase change to achieve rapid heat transfer. Referring to FIG. 1A and FIG. 1B , the conventional loop heat pipe 2 includes a liquid-gas conversion chamber 21 , a condensation portion 25 , and a pipeline 23 that communicates with the liquid-to-liquid conversion chamber 21 and the condensation portion 25 to form a complete circuit. When the loop type heat pipe 2 is mounted in the electronic device 1, since the path of the loop type heat pipe 2 does not have to pass through the electronic component 3 (for example, a wafer) which is heated in the electronic device 1, it is generated in order to be able to operate the electronic component. The heat is smoothly transmitted to the loop type heat pipe. A common solution is to lap a heat pipe 5 (or a heat conducting plate) between the electronic component 3 and the loop heat pipe 2 to indirectly generate the electronic component 3. Heat is transferred to the loop heat pipe 2 via the heat pipe 5. However, when heat is transferred between different objects, thermal resistance is generated due to different materials and gaps in the contact faces, so when heat is transferred from the electronic components to the heat pipes and from the heat pipes to the loop heat pipes, it is inevitable Two stages of thermal resistance are generated. As the thermal resistance builds up, the thermal conductivity of the heat decreases. Therefore, the conventional design still has a lot of room for improvement.

In view of the shortcomings of the above-mentioned loop heat pipe applied to electronic devices, the present invention proposes an improved loop heat pipe design, especially in the liquid gas conversion of the loop heat pipe. The cavity extends outwardly from an extension and allows the extension to be in direct thermal contact with the hot electronic component. With this one-piece design, not only can the assembly process be reduced, but also the thermal resistance between the electronic component and the liquid-to-gas conversion chamber can be reduced to improve the efficiency of heat transfer. In addition, for the product that originally needs to be covered with a heat-conducting cover on the periphery of the wafer, the extension piece provided by the present invention may additionally form a structure of a cover body as the case may be, so that the electronic device of the present invention can also be used to eliminate the extension piece and the extension device. The thermal resistance between the thermal cover increases the efficiency of heat transfer.

In order to achieve the above object, in a preferred embodiment, the present invention provides a loop type heat pipe that is in thermal contact with an electronic component, the loop heat pipe includes a first liquid gas conversion chamber having an outlet end and an inlet end; An extension member has a one-piece structure with the first liquid-gas conversion chamber, and extends outward from the first liquid-gas conversion chamber to be in thermal contact with the electronic component; a conduit connecting the outlet end and the inlet end, and the first The liquid-gas conversion chambers together form a circuit; a working medium is filled in the pipeline and the first liquid-gas conversion chamber; and a condensation portion is disposed on the circuit.

In a preferred embodiment of the present invention, a water storage chamber is further disposed between the pipeline and the inlet end of the first liquid gas conversion chamber, and the extension member extends only from the first liquid gas conversion chamber without The water storage chamber extends outward.

In a preferred embodiment of the present invention, the extension member further includes a cover for covering the electronic component.

In a preferred embodiment of the present invention, the condensing portion is provided with at least one of the following components: a fin, a heat pipe, a temperature equalizing plate, a heat conducting member, and a fan.

In a preferred embodiment of the present invention, a second liquid-gas conversion chamber is further included, wherein the extension member and the second liquid-gas conversion chamber are of a one-piece structure, and the extension member is located in the first liquid-to-gas conversion chamber and Two liquid gas conversion chambers.

In a preferred embodiment of the present invention, a heat pipe is further disposed on the exterior of the extension.

In another preferred embodiment, the present invention provides an electronic device comprising: an electronic component; and a loop type heat pipe, the loop heat pipe comprising: a first liquid gas conversion chamber having an outlet end and an inlet end; An extension member extending outward from the first liquid-gas conversion chamber and in thermal contact with the electronic component; a conduit connecting the outlet end and the inlet end, and forming a loop together with the first liquid-gas conversion chamber; a working medium, filling In the pipeline and the first liquid-gas conversion chamber; and a condensation portion disposed on the circuit; wherein the heat generated by the operation of the electronic component can be transmitted to the first liquid-gas conversion chamber by the extension member, The working medium in the liquid-to-liquid conversion chamber is converted from a liquid state to a gaseous state, and enters the pipeline from the outlet end, and when the gaseous working medium flows through the condensation portion, it is converted from a gaseous state to a liquid state, and enters through the pipeline. The inlet end of the first liquid gas conversion chamber.

In another preferred embodiment of the present invention, the extension member is of a one-piece construction with the first liquid-to-liquid conversion chamber.

In another preferred embodiment of the present invention, a water storage chamber is further disposed between the pipeline and the inlet end of the first liquid gas conversion chamber, and the extension member extends only from the first liquid gas conversion chamber without Extending outward from the reservoir.

In another preferred embodiment of the present invention, the extension member is further formed with a cover for covering the electronic component.

In another preferred embodiment of the present invention, a heat shield is further included to cover the electronic component, the extension being in thermal contact with the heat shield.

In another preferred embodiment of the present invention, the condensing portion is provided with at least one of the following: a fin, a heat pipe, a temperature equalizing plate, a heat conducting member, and a fan.

In another preferred embodiment of the present invention, a second liquid-gas conversion chamber is further included, wherein the extension member and the first liquid-to-liquid conversion chamber and the second liquid-gas conversion chamber are of a one-piece structure, and the extension member is located at A first liquid gas conversion chamber and a second liquid gas conversion chamber.

In another preferred embodiment of the present invention, a heat pipe is further disposed on the extension The exterior of the piece.

1‧‧‧Electronic device

2‧‧‧Circular heat pipe

21‧‧‧Liquid gas conversion chamber

21A‧‧‧export end

21B‧‧‧ entrance end

211‧‧‧ top surface

212‧‧‧ side wall

213‧‧‧ bottom

22‧‧‧Extensions

221‧‧‧ Cover

23‧‧‧ Pipes

24‧‧‧Working media

25‧‧‧ Condensation Department

26‧‧‧Water storage chamber

3‧‧‧Electronic components

4‧‧‧ boards

5‧‧‧heat pipe

6‧‧‧heat cover

1A and 1B are a schematic structural view and a side view of a conventional loop heat pipe.

2A and 2B are schematic diagrams showing the structure of the loop heat pipe and the electronic device and a side view of some of the components according to the first preferred embodiment of the present invention.

3A and 3B are schematic views of the structure of the loop type heat pipe provided by the present invention when the extension member extends outward from the bottom surface and the side wall of the liquid gas conversion chamber.

The 3C figure is a schematic diagram of the structure of the loop type heat pipe provided by the present invention when the liquid-gas conversion chamber is tubular.

Fig. 4A is a schematic view showing the structure of the loop type heat pipe provided by the present invention, the extension member further including a cover body.

Figure 4B is a schematic diagram of the structure of the loop type heat pipe provided by the present invention, in which the extension member is in thermal contact with a heat conducting cover.

Figure 5 is a schematic view showing the structure of a loop type heat pipe and an electronic device according to a second preferred embodiment of the present invention.

6A and 6B are schematic diagrams showing the schematic diagram of a loop type heat pipe and an electronic device provided by the present invention, having a plurality of water storage chambers, a plurality of liquid gas conversion chambers, and a plurality of condensation portions, and side views of some components.

7A and 7B are schematic diagrams of the structure of the loop type heat pipe and the electronic device provided by the present invention, and a side view of some components when the heat pipe is disposed outside the extension member.

Please refer to FIG. 2A and FIG. 2B at the same time, according to the first preferred device of the present creation. The embodiment provides a loop type heat pipe and an electronic device using the loop type heat pipe. The loop type heat pipe 2 is applied and installed in an electronic device 1 and is responsible for maintaining the tropics generated when the electronic components 3 in the electronic device 1 operate to maintain normal operation. The electronic device 1 can be a desktop computer, a notebook computer, a tablet computer, a mobile phone, a host computer, an interface card or other devices that require better temperature control during operation. The creation is not limited as long as the loop heat pipe can be used. Place it in it. The electronic component 3 can be a component that generates heat during operation, such as a chip, a processor, or a memory, and is generally mounted on a circuit board 4 or a substrate in the electronic device 1.

According to a first preferred embodiment of the present invention, the loop heat pipe 2 is mainly composed of a liquid gas conversion chamber 21, an extension member 22, a line 23, a working medium 24, a condensing portion 25, and the like. The liquid-gas conversion chamber 21 has a cavity structure and has an outlet end 21A and an inlet end 21B, and the extension member 22 has a one-piece structure with the liquid-gas conversion chamber 21, and is external to the liquid-to-gas conversion chamber 21. After extending, it is in thermal contact with the electronic component 3. The line 23 is connected to the outlet end 21A of the liquid-gas conversion chamber 21 and the inlet end 21B, and together with the liquid-gas conversion chamber 21 forms a complete circuit. The working medium 24 is filled in the line 23 and the liquid-gas conversion chamber 21, which absorbs heat during the liquid-gas conversion process and discharges the heat during the gas-liquid conversion process. The condensing portion 25 is disposed on the circuit formed by the pipeline 23, and when the gaseous working medium 24 passes through the condensing portion 25, the condensing portion 25 moves the tropical portion of the working medium 24 from the gaseous state to the liquid state, and the liquid state The working medium 24 is finally returned to the liquid-to-gas conversion chamber 21 by the line 23 for the next liquid-gas shift. In the present creation, the condensing portion 25 may be selected from the group consisting of a fin, a heat pipe, a temperature equalizing plate, a heat conducting member, and a fan member, and is adjacent to the periphery of the pipe 23, but the condensing portion 25 itself may also be formed with an internal pipe (in the figure) Not shown) and interconnected or connected to the conduit 23, the creation is not limited as long as the tropical medium of the working medium 24 can be moved.

The extension member 22 proposed in this embodiment is structurally extended outward from the liquid-gas conversion chamber 21, and the two are in a one-piece structure in appearance. However, there are various options in the process, and the same can be selected. a material that is integrally molded, welded or welded from the same material, or Different materials are welded or welded, but in the end they can be a one-piece structure. In the present creation, the extension member 22 serves as a bridge and medium for heat conduction between the liquid-gas conversion chamber 21 and the electronic component 3. The extension member 22 itself is not a liquid-to-gas conversion chamber, does not contain a working medium, and does not perform liquid-gas conversion. work. In the material selection of the liquid-gas conversion chamber and the extension member, the material may be selected from materials having good heat conduction properties, such as metals such as copper, aluminum, silver, stainless steel, titanium, alloys, and even non-metal materials.

In order to be able to cope with various possibilities in the spatial arrangement of the interior of the electronic device 1, the extension member 22 can extend outward from different positions of the liquid-gas conversion chamber 21, for example, when a thin-plate type liquid-gas conversion chamber 21 is used. The cross section may be rectangular or approximately rectangular. In this case, the extension member 22 may extend outward from the top surface 211 of the liquid-to-gas conversion chamber 21 as shown in FIG. 2B, or may be converted from liquid-gas as shown in FIG. 3A. The bottom surface 213 of the cavity 21 extends outwardly, or may extend outward from the side wall 212 of the liquid-vapor conversion chamber 21 as shown in FIG. 3B, which is not limited in this creation. In addition, the liquid-to-gas conversion chamber 21 can also adopt other types of shapes in other preferred embodiments, and even adopt different shapes in different sections, so that the cross-section can have various changes, such as a circular shape, a rectangular shape, and the like. The elliptical shape, the polygonal shape and even the irregular shape may be embodied in accordance with the present invention as long as it has a cavity structure. For example, the liquid-gas conversion chamber 21 shown in FIG. 3C has a tubular shape and thus has a circular cross section. The extension portion 22 extends outward from a position intermediate the liquid-to-gas conversion chamber 21, and can also be in thermal contact with the electronic component 3 when mounted in the electronic device 1.

In the present embodiment, the extension member 22 is in thermal contact with the electronic component 3. The term "thermal contact" as used herein refers to contact in thermal conduction, and the extension member 22 and the electronic component 3 are in actual structure. There are at least two embodiments, direct contact and indirect contact, and it is of course not excluded that the two are in close proximity but are not physically accessible. In terms of direct contact, the surface of the extension member 22 directly conforms to the surface of the electronic component 3; indirect contact may be provided between the extension member 22 and the electronic component 3 with a heat conductive medium such as a thermal paste (not shown), or As shown in FIG. 4A, the extension member 22 is further formed with a cover body 221 to cover the electronic component 3, and in the cover body 221 A heat conducting medium such as a thermal conductive paste (not shown) is disposed between the electronic component 3 and the electronic component 3, or as shown in FIG. 4B, after the electronic component 3 is covered with a heat conducting cover 6, the extending member 22 is further connected to the heat conducting cover. 6 is fitted and disposed between the extension member and the heat conducting cover or between the heat conducting cover and the electronic component, and a heat conducting medium such as a thermal conductive paste (not shown) is disposed as needed.

The liquid-gas conversion chamber 21 provided in this embodiment may be provided with a capillary structure (not shown) inside to allow the working medium 24 to be adsorbed therein. In the present invention, the capillary structure may be disposed in the entire liquid-to-gas conversion chamber 21 or may be disposed only in a portion of the liquid-to-gas conversion chamber 21, and the creation is not limited as long as the heat generated by the electronic component 3 can be utilized. The extension member 22 is conducted to the working medium 24 in the capillary structure to perform the conversion of the liquid gas.

Referring to FIG. 5, a second preferred embodiment of the present invention provides a loop type heat pipe and an electronic device using the loop type heat pipe. The second preferred embodiment is further provided with a water storage chamber 26 in addition to the first preferred embodiment, and the other components and operation are substantially the same as those provided by the first preferred embodiment. The loop heat pipes are the same and will not be described again. The water storage chamber 26 is disposed between the pipeline 23 and the inlet end 21B of the liquid-gas conversion chamber 21, and is mainly responsible for storing the liquid working medium 24. In the present embodiment, the water storage chamber 26 and the liquid-gas conversion chamber 21 are Two different cavities may be separately formed and separated (for example, a capillary structure is disposed between them), or may be the same cavity but belong to different sections, such as in a cavity. A capillary structure is disposed in a certain section, and a capillary structure is not disposed in another section. At this time, the section provided with the capillary structure can be used as the liquid-gas conversion chamber 21, and the area in which the capillary structure is not provided The segment is used as the water storage chamber 26. However, regardless of whether the liquid-to-gas conversion chamber 21 and the water storage chamber 26 belong to the same cavity or belong to two different cavities, the design emphasis of the present embodiment is to prevent the extension member 22 from the water storage chamber 26 . The position or section extends outwardly and only extends the extension 22 outwardly from the position or section of the liquid-to-liquid conversion chamber 21 in order to ensure that the liquid working medium of the reservoir is not thermally converted to After the gaseous state, the reverse direction reverses in the direction of the condensation portion, thus affecting the loop heat pipe 2 The original one-way cycle works. Further, the capillary structure may be selected from a powder sintered capillary structure, a metal mesh capillary structure or a fibrous material which are commonly used in the art, and is not limited.

The circuit type heat pipe provided by the present invention and the electronic device using the circuit type heat pipe, the liquid gas conversion chamber and the condensation portion disposed in the circuit, except that the liquid gas can be removed as disclosed in the first preferred embodiment In addition to such a combination of the conversion chamber 21 and a condensation portion 25, in other preferred embodiments, a plurality of liquid-gas conversion chambers and a plurality of condensation portions are disposed, and the liquid-gas conversion chamber, the condensation portion, and the liquid are followed. The staggered sequence of the gas conversion chamber and the condensing portion is provided in the circuit of the loop heat pipe. At this time, the extension of the loop type heat pipe provided by the present invention is located between a plurality of liquid-gas conversion chambers and at the same time is a one-piece structure with a plurality of liquid-gas conversion chambers, thereby reducing heat during heat transfer. The resistance, and the extension also transfers the heat generated by the operation of the electronic component to a plurality of liquid-to-liquid conversion chambers to perform the conversion of the liquid gas. In addition, when the liquid-gas conversion chamber has a water storage chamber, in addition to the combination of a liquid-storage chamber 26 and a liquid-to-liquid conversion chamber 21 and a condensation portion 25, as disclosed in the second preferred embodiment. In other preferred embodiments, as shown in FIG. 6A and FIG. 6B, a plurality of water storage chambers 26, a plurality of liquid-gas conversion chambers 21, and a plurality of condensation portions 25 are disposed, and the water storage is followed. The interleave order of the chamber 26, the liquid-to-liquid conversion chamber 21, the condensation portion 25, the water storage chamber 26, and the liquid-to-liquid conversion chambers 21 and 25 condensing portions is provided in the circuit of the loop type heat pipe. At this time, the extension member 22 of the loop type heat pipe 2 provided by the present invention is located between the plurality of liquid-gas conversion chambers and has a one-piece structure together with the plurality of liquid-gas conversion chambers 21, thereby still reducing heat transfer. The thermal resistance of the time does not allow the extension member 22 to extend outwardly from the position or section of the reservoir chamber 26. With the above design, the extension member 22 can transfer the heat generated by the operation of the electronic component 3 to a plurality of liquid-to-liquid conversion chambers 21 to perform the conversion of the liquid gas, and ensure that the liquid in the water storage chamber 26 is not allowed. The working medium is converted to a gaseous state to avoid backflow.

According to the preferred embodiment of the present invention, the design concept is a one-piece design by using the extension member and the liquid-to-gas conversion chamber, and more efficiently producing the electronic component during operation. The raw heat is accurately transferred to the liquid-to-gas conversion chamber for liquid-gas conversion of the working medium. However, if the heat generated by the operation of the electronic component exceeds the thermal energy required to operate the loop heat pipe, and other heat dissipation space is available in the electronic device, the present creation may also be in other specific embodiments. Further, a condensation portion is additionally disposed on the outside of the extension member to disperse excess heat energy. For example, as shown in FIGS. 7A and 7B, an additional heat pipe 5 is disposed outside the extension member 22, and the loop heat pipe 2 and the heat pipe are provided. The dual function of 5 is to make the tropical walk generated when the electronic components operate faster.

1‧‧‧Electronic device

2‧‧‧Circular heat pipe

21‧‧‧Liquid gas conversion chamber

21A‧‧‧export end

21B‧‧‧ entrance end

22‧‧‧Extensions

23‧‧‧ Pipes

25‧‧‧ Condensation Department

3‧‧‧Electronic components

4‧‧‧ boards

Claims (14)

A loop type heat pipe is in thermal contact with an electronic component, the loop type heat pipe includes: a first liquid gas conversion chamber having an outlet end and an inlet end; and an extension member and the first liquid gas conversion chamber a piece-type structure extending outward from the first liquid-gas conversion chamber to be in thermal contact with the electronic component; a conduit connecting the outlet end and the inlet end, and forming a circuit together with the first liquid-gas conversion chamber a working medium filled in the pipeline and the first liquid-to-gas conversion chamber; and a condensation portion disposed on the circuit. The circuit type heat pipe according to claim 1, further comprising a water storage chamber disposed between the pipeline and the inlet end of the first liquid gas conversion chamber, the extension member only converting from the first liquid gas The cavity extends outwardly without extending outwardly from the reservoir. The circuit-type heat pipe of claim 1, wherein the extension further comprises a cover for covering the electronic component. The circuit-type heat pipe according to claim 1, wherein the condensing portion is provided with at least one of the following: a fin, a heat pipe, a temperature equalizing plate, a heat conducting member, and a fan. The circuit-type heat pipe according to claim 1, further comprising a second liquid-gas conversion chamber, wherein the extension member and the second liquid-gas conversion chamber are of a one-piece structure, and the extension member is located at the A first liquid gas conversion chamber and the second liquid gas conversion chamber. The circuit-type heat pipe according to claim 1, further comprising a heat pipe disposed outside the extension. An electronic device comprising: an electronic component; a loop type heat pipe comprising: a first liquid gas conversion chamber having an outlet end and an inlet end; an extension member extending outward from the first liquid gas conversion chamber and in thermal contact with the electronic component a conduit connecting the outlet end and the inlet end, and forming a circuit together with the first liquid-gas conversion chamber; a working medium filled in the pipeline and the first liquid-gas conversion chamber; and a condensation a portion disposed on the circuit; wherein the heat generated by the operation of the electronic component can be transferred to the first liquid-to-liquid conversion chamber by the extension member, and the working medium in the first liquid-gas conversion chamber is The liquid state is converted into a gaseous state and enters the pipeline from the outlet end, and when the gaseous working medium flows through the condensation portion, it is converted from a gaseous state to a liquid state, and enters the first liquid gas via the pipeline The inlet end of the conversion chamber. The electronic device of claim 7, wherein the extension member is in a one-piece structure with the first liquid-to-gas conversion chamber. The electronic device of claim 7, further comprising a water storage chamber disposed between the pipeline and the inlet end of the first liquid gas conversion chamber, and the extension member is only converted from the first liquid gas The cavity extends outwardly without extending outwardly from the reservoir. The electronic device of claim 7, wherein the extension member is further formed with a cover for covering the electronic component. The electronic device of claim 7, further comprising a heat shield covering the electronic component, the extension being in thermal contact with the heat shield. The electronic device of claim 7, wherein the condensation portion is provided with at least one of the following: a fin, a heat pipe, a temperature equalizing plate, a heat conducting member, and a fan. The electronic device of claim 7, further comprising a second liquid-to-liquid conversion chamber, wherein the extension member and the first liquid-to-liquid conversion chamber and the second liquid-to-liquid conversion chamber are one-piece And the extension is located between the first liquid gas conversion chamber and the second liquid gas conversion chamber. The electronic device of claim 7, further comprising a heat pipe disposed outside the extension.