TWM522463U - Adsorption type fixture with high stability for chip cutting - Google Patents

Description

Adhesive jig for wafer cutting with high stability

The present invention relates to a semiconductor processing jig, and more particularly to an adsorption jig for wafer cutting with high stability.

Referring to FIG. 1, a conventional adsorption jig 1 includes a suction head holder 11 connected to an air extracting device (not shown) and having a plurality of first through holes (not shown), and a The rubber layer 12 of the head block 11 is adsorbed, and the rubber layer 12 has a plurality of second through holes 121 respectively communicating with the first through holes.

In the wafer cutting process, the adsorption jig 1 is mounted on a cutting machine (not shown), and is connected to the air extracting device, and then a wafer (not shown) is disposed on the rubber layer 12. During the cutting process, the air suction device inhales and adsorbs the wafer through the second through holes 121. However, since the edge of the rubber layer 12 is supported without support, when the cutting blade of the cutting machine (Fig. When the edge of the rubber layer 12 is passed, the rubber layer 12 is shaken, so that the wafer cannot be stably adsorbed to the adsorption jig 1 and is liable to fly or rotate, and enters the next stage. When the cutting machine is used, it cannot be placed on another adsorption type fixture 1 due to displacement, or the small wafer after cutting cannot be adsorbed, resulting in a situation of dropping or defective products, thereby reducing the yield of the product.

Therefore, the object of the present invention is to provide an adsorption jig for wafer cutting with high stability which can improve the yield of a product.

Therefore, the novel high-stability adsorption tool for wafer cutting is suitable for being connected to an air suction device, and comprises an adsorption head holder, an elastic contact layer and a supporting unit.

The adsorption head base includes a base body connected to the air suction device, a plurality of first through holes respectively penetrating through opposite sides of the base body, and a top surface formed on the base body and communicating with the first A through hole accommodating groove.

The elastic contact layer is disposed in the receiving recess, and includes a horizontal contact surface, and a plurality of second through holes extending through the contact surface and respectively communicating the first through holes.

The support unit includes a plurality of retaining walls disposed on the base body and abutting against an edge of the elastic contact layer.

The effect of the novel is that the structural stability of the elastic contact layer is strengthened by providing the supporting unit, so that the elastic contact layer is not easily shaken during the cutting process, and the wafer can be stably adsorbed on the elastic contact layer. Improve product yield.

Referring to FIG. 2 to FIG. 4, an embodiment of the present invention has a highly stable adsorption jig for wafer cutting, comprising an adsorption head holder 2, an elastic contact layer 3 and a support unit 4.

The squeezing head base 2 includes a base body 21, a plurality of first through holes 22 respectively extending through opposite sides of the base body 21, and a top surface formed on the base body 21 and communicating the first through holes. The hole 22 accommodates the groove 23.

The elastic contact layer 3 is disposed on the accommodating recess 23 in a conforming manner, and includes a horizontal contact surface 31, a plurality of second through holes extending through the contact surface 31 and respectively communicating the first through holes 22. 32. A plurality of air grooves 33 formed on the contact surface 31 and surrounding the second through holes 32, and a plurality of air grooves 33 formed on the contact surface 31 and surrounding the second through holes 32 and the air in a crisscross manner The main cutting groove 34 of the groove 33. In this embodiment, the material of the elastic contact layer 3 is rubber, but not limited thereto.

The supporting unit 4 includes a plurality of retaining walls 41 disposed on the base body 21 and abutting against the edge of the elastic contact layer 3, and a plurality of locking members 42 respectively locking the retaining walls 41 to the base body 21. In this embodiment, the locks 42 are respectively a screw, but are not limited thereto.

The retaining walls 41 are L-shaped and have a horizontal plate portion 411 disposed on the top surface of the base body 21, and a vertical plate extending upward from the horizontal plate portion 411 and abutting against the edge of the elastic contact layer 3. The portion 412 and the plurality of sub-cut grooves 413 formed in the vertical plate portion 412 and communicating with the main cutting grooves 34, respectively.

Referring to FIG. 4 and FIG. 5, in actual use, the embodiment is mounted on a cutting machine (not shown) of a production line (not shown), and an air extracting device 8 is connected to the base body 21, A wafer 9 is disposed on the contact surface 31 of the elastic contact layer 3, and then the air suction device 8 is activated to pass through the first through holes 22, the second through holes 32, and the air grooves 33. The suction force formed by the gas adsorbs the wafer 9. During the cutting process, a cutting blade (not shown) passes through the secondary cutting groove 413 of the retaining wall 41 and the main cutting groove 34 of the elastic contact layer 3, The wafer 9 is diced into small pieces of wafers for subsequent processing.

By providing the retaining walls 41 at the edges of the elastic contact layer 3, when the cutting blade passes the edge of the elastic contact layer 3, the elastic contact layer 3 is not easily shaken, and therefore, the wafer 9 is cut during the cutting process. The flying or rotating condition does not occur, and the cut wafer can also be adsorbed to the elastic contact layer 3 without displacement, thereby improving the yield of the product.

It should be noted that the present embodiment is applicable to a "full-cut" wafer cutting method, that is, cutting through the wafer 9 into a plurality of complete wafers, and the auxiliary cutting grooves 413 pass the cutting blade through the elastic contact layer. The edges of 3 are not blocked by the retaining walls 41, and the main cutting grooves 34 prevent the cutting blades from being blocked by the contact faces 31 when they are cut. However, the elastic contact layer 3 may not be provided with the main cutting grooves 34, but may be applied to a "half-cut" wafer cutting method, that is, the wafer 9 is not completely cut through, and at this time, the retaining walls 41 It is not necessary to provide these sub-cut grooves 413.

In summary, the present invention enhances the structural stability of the elastic contact layer 3 by providing the supporting unit 4, so that the elastic contact layer 3 is not easily shaken during the cutting process, and the wafer 9 can be stably adsorbed on the The elastic contact layer 3 achieves the effect of improving the yield of the product, so that the object of the present invention can be achieved.

However, the above is only the embodiment of the present invention, and when it is not possible to limit the scope of the present invention, all the simple equivalent changes and modifications according to the scope of the patent application and the contents of the patent specification are still This new patent covers the scope.

2‧‧‧Adsorption head
21‧‧‧Base body
22‧‧‧ first through hole
23‧‧‧ accommodating grooves
3‧‧‧Elastic contact layer
31‧‧‧Contact surface
32‧‧‧Second through hole
33‧‧‧ gas trough
34‧‧‧Main cutting slot
4‧‧‧Support unit
41‧‧‧Retaining wall
411‧‧‧ horizontal board
412‧‧‧Vertical board
413‧‧‧Subcutting slot
42‧‧‧Locker
8‧‧‧Exhaust device
9‧‧‧ wafer

Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: FIG. 1 is a perspective view illustrating a conventional adsorption tool; FIG. 2 is an exploded perspective view of the present invention; FIG. 3 is a perspective view of the embodiment; FIG. 4 is a partially enlarged perspective view of the embodiment; FIG. 4 is a partially enlarged perspective view of the embodiment; The circle is adsorbed to the case of this embodiment to be cut.

2‧‧‧Adsorption head

21‧‧‧Base body

3‧‧‧Elastic contact layer

31‧‧‧Contact surface

32‧‧‧Second through hole

33‧‧‧ gas trough

4‧‧‧Support unit

41‧‧‧Retaining wall

411‧‧‧ horizontal board

412‧‧‧Vertical board

42‧‧‧Locker

Claims (7)

The invention relates to a high-stability adsorption tool for wafer cutting, which is suitable for being connected to an air suction device, comprising: a suction head base comprising a base body connected to the air suction device, and a plurality of bases respectively running through the base body a first through hole on the opposite side, and a receiving groove formed on the top surface of the base body and communicating with the first through holes; an elastic contact layer disposed in the receiving groove and included a horizontal contact surface, and a plurality of second through holes penetrating the contact surface and respectively communicating with the first through holes; and a supporting unit including a plurality of the base body and abutting against the edge of the elastic contact layer Retaining wall. The high-stability adsorption tool for wafer cutting according to claim 1, wherein the elastic contact layer further comprises a plurality of main cuts formed on the contact surface and surrounding the second through holes in a crisscross manner. groove. The adsorption jig for wafer cutting according to claim 2, wherein the retaining walls are L-shaped and have a horizontal plate portion disposed on a top surface of the base body, and a The horizontal plate portion extends upwardly and abuts against a vertical plate portion of the edge of the elastic contact layer. The adsorption jig for wafer cutting according to claim 3, wherein each of the retaining walls further has a plurality of sub-cut grooves formed in the vertical plate portion and communicating with the main cutting grooves, respectively. The high-stability adsorption tool for wafer cutting according to claim 1, wherein the support unit further comprises a plurality of fasteners respectively locking the retaining walls to the base body. The adsorption jig for wafer cutting according to claim 1, wherein the elastic contact layer further comprises a plurality of gas grooves formed on the contact faces and surrounding the second through holes, respectively. The adsorption jig for wafer cutting according to any one of claims 1 to 6, wherein the elastic contact layer is made of rubber.