CN205452248U - Wafer cutting is with absorption formula tool with high gas tightness - Google Patents
Wafer cutting is with absorption formula tool with high gas tightness Download PDFInfo
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- CN205452248U CN205452248U CN201620110020.9U CN201620110020U CN205452248U CN 205452248 U CN205452248 U CN 205452248U CN 201620110020 U CN201620110020 U CN 201620110020U CN 205452248 U CN205452248 U CN 205452248U
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Abstract
The utility model provides a wafer cutting is with absorption formula tool with high gas tightness, is applicable to and is connected to an air exhaust device to contain a suction head seat, a springiness contaction layer and a sealing element. A base body, a plurality of first through -hole that runs through this base body and limit out an adsorption zone are jointly drawn together to this suction head stationary ladle, and a top surface and an intercommunication formed at this base body the holding recess of first through -hole. This springiness contaction layer sets up in this holding recess to include that is a horizontally contact surface, and a plurality of these contact surfaces that run through communicate respectively just the second through -hole of first through -hole. This sealing element sets up in the bottom surface of this base body to encircle this adsorption zone. The utility model discloses a set up this sealing element, promote the gas tightness when breathing in, and then promote the yield of product.
Description
Technical field
This utility model relates to a kind of semiconductor machining tool, particularly relates to a kind of wafer cutting adsorption-type tool with high-air-tightness.
Background technology
In the cutting processing procedure of wafer, one adsorption-type tool is locked on a cutting machine by dealer, and it is connected to an air extractor, again wafer is arranged on this adsorption-type tool and cuts, during, this air extractor air-breathing, to adsorb this wafer in this adsorption-type tool, but, error may be produced because of manual operation when this adsorption-type tool is locked in this cutting machine, in turn result in the phenomenon of " leakage ", when being intended to cut into large-sized wafer, this wafer is less likely to occur the situation of displacement, but, when being intended to cut into undersized wafer, even if the wafer after small leakage will also result in cutting cannot stably be adsorbed in this adsorption-type tool, therefore, this adsorption-type tool has the shortcoming that air-tightness is the best.
Summary of the invention
The purpose of this utility model is to provide a kind of wafer cutting adsorption-type tool with high-air-tightness that can improve product yield.
This utility model has the wafer cutting adsorption-type tool of high-air-tightness, it is adaptable to be connected to an air extractor, and this wafer cutting adsorption-type tool with high-air-tightness comprises an absorption headstock, an elastic connecting contact layer and a potted component.
This absorption headstock includes that one is connected to the base body of this air extractor, the first through hole of multiple two opposite sides extending through this base body, and an end face being formed at this base body and connect the containing groove of described first through hole, and described first through hole defines an adsorption zone jointly.
This elastic connecting contact layer is arranged at this containing groove, and includes a contact surface in level, and multiple the second through hole running through this contact surface and being respectively communicated with described first through hole.
This potted component is arranged at the bottom surface of this base body, and around this adsorption zone.
The wafer cutting adsorption-type tool with high-air-tightness described in the utility model, this wafer cutting adsorption-type tool with high-air-tightness also comprises a support unit, and this support unit includes multiple barricade being arranged at this base body and being closely against this elastic connecting contact layer edge.
The wafer cutting adsorption-type tool with high-air-tightness described in the utility model, this elastic connecting contact layer also includes multiple being formed at this contact surface and in crisscross respectively around the main cutting groove of described second through hole.
The wafer cutting adsorption-type tool with high-air-tightness described in the utility model, described barricade is L-shaped, each barricade has a horizontal plate part being arranged at this base body end face, and a vertical plate part being upwardly extended and being closely against this elastic connecting contact layer edge by this horizontal plate part.
The wafer cutting adsorption-type tool with high-air-tightness described in the utility model, each barricade also has and multiple are formed at this vertical plate part and are respectively communicated with in the secondary cutting groove of described main cutting groove.
The wafer cutting adsorption-type tool with high-air-tightness described in the utility model, this support unit also includes multiple locking part that described barricade is locked in this base body respectively.
The wafer cutting adsorption-type tool with high-air-tightness described in the utility model, this elastic connecting contact layer also includes multiple being formed at this contact surface and respectively around the air drain of described second through hole.
The wafer cutting adsorption-type tool with high-air-tightness described in the utility model, this potted component is an o-ring.
The wafer cutting adsorption-type tool with high-air-tightness described in the utility model, the material of this elastic connecting contact layer is rubber.
The beneficial effects of the utility model are: by arranging this potted component, promote air-tightness during air-breathing, and then the yield of improving product, and be no matter to cut into large scale or undersized wafer all can be suitable for, accordingly, it is capable to promote the speed of cutting, reach to increase the effect of production capacity.
Accompanying drawing explanation
Fig. 1 is a three-dimensional exploded view, illustrates that this utility model has an embodiment of the wafer cutting adsorption-type tool of high-air-tightness；
Fig. 2 is an axonometric chart of this embodiment；
Fig. 3 is an enlarged partial isometric view of this embodiment；
Fig. 4 is a face upwarding stereogram of this embodiment；
Fig. 5 is a face upwarding view of this embodiment；
Fig. 6 is a partial sectional view of the hatching line VI-VI along Fig. 5, illustrates that wafer is adsorbed in the situation that this embodiment is to be cut.
Detailed description of the invention
Below in conjunction with the accompanying drawings and this utility model is described in detail by embodiment.
Refering to Fig. 1 to Fig. 3, this utility model has an embodiment of the wafer cutting adsorption-type tool of high-air-tightness, comprises absorption headstock 3, support unit 4 of 2, elastic connecting contact layer and a potted component 5 (see Fig. 4).
This absorption headstock 2 includes a base body 21, the first through hole 22 of multiple two opposite sides extending through this base body 21, and an end face being formed at this base body 21 and connect the containing groove 23 of described first through hole 22, described first through hole 22 defines an adsorption zone 24 (see Fig. 4) jointly.
This elastic connecting contact layer 3 is arranged at this containing groove 23 in the way of laminating, and include a contact surface 31 in level, multiple run through this contact surface 31 and be respectively communicated with the second through hole 32 of described first through hole 22, multiple be formed at this contact surface 31 and respectively around the air drain 33 of described second through hole 32, and multiple it is formed at this contact surface 31 and in crisscross respectively around the main cutting groove 34 of described second through hole 32 with described air drain 33.In the present embodiment, the material of this elastic connecting contact layer 3 is rubber, but is not limited.
This support unit 4 includes multiple barricade 41 being arranged at this base body 21 and being closely against this elastic connecting contact layer 3 edge, and multiple locking part 42 that described barricade 41 is locked in this base body 21 respectively.In the present embodiment, each locking part 42 is a screw, but is not limited.
Described barricade 41 is in L-shaped, each barricade 41 has 411, the vertical plate part 412 being upwardly extended and being closely against this elastic connecting contact layer 3 edge by this horizontal plate part 411 of horizontal plate part being arranged at this base body 21 end face, and multiple are formed at this vertical plate part 412 and are respectively communicated with in the secondary cutting groove 413 of described main cutting groove 34.
Refering to Fig. 4 and Fig. 5, this potted component 5 is arranged at the bottom surface of this base body 21, and around this adsorption zone 24, in the present embodiment, this potted component 5 is an o-ring, but is not limited.
Refering to Fig. 3 and Fig. 6, time actually used, the present embodiment is set up in a cutting machine (not shown) producing line (not shown), and an air extractor 8 is connected to this base body 21, again wafer 9 is arranged on the contact surface 31 of this elastic connecting contact layer 3, then, start this air extractor 8, by described first through hole 22, this wafer 9 of suction adsorption that gas between described second through hole 32 and described air drain 33 is formed, in cutting process, one cutter (not shown) can be passed through the secondary cutting groove 413 of described barricade 41 and the main cutting groove 34 of this elastic connecting contact layer 3, this wafer 9 is cut into the wafer of fritter, to carry out follow-up processing.
By arranging this potted component 5, even if the present embodiment is locked in during this cutting machine produces error because of manual operation, nor affect on air-tightness during air-breathing, without producing the phenomenon of leakage, and then large scale and the small size wafer after the yield of improving product, and cutting is all difficult to displacement, therefore, the speed of cutting can be promoted, and then increase production capacity.
Additionally, by arranging described barricade 41 at the edge of this elastic connecting contact layer 3, when these cutter are by the edge of this elastic connecting contact layer 3, this elastic connecting contact layer 3 is not easy to rock, and makes the situation that this wafer 9 will not fly or rotate, the same yield improving product.
It is worth mentioning that, the present embodiment is applicable to the wafer cutting engineering method of " entirely cutting ", that is cut through this wafer 9 and become multiple complete wafer, described secondary cutting groove 413 makes these cutter will not be stopped by described barricade 41 through the edge of this elastic connecting contact layer 3, will not be stopped by this contact surface 31 when described main cutting groove 34 makes these cutter cut this wafer 9.But, this elastic connecting contact layer 3 can also be not provided with described main cutting groove 34, and is applied to the wafer cutting engineering method of " hemisection ", say, that does not completely cuts through this wafer 9, and now, described barricade 41 is also not necessary to arrange described secondary cutting groove 413.
In sum, this utility model is by arranging this potted component 5, promote air-tightness during air-breathing, and then the yield of improving product, and be no matter to cut into large scale or undersized wafer all can be suitable for, accordingly, it is capable to promote the speed of cutting, reach to increase the effect of production capacity, so the purpose of this utility model really can be reached.
Claims (9)
1. a wafer cutting adsorption-type tool with high-air-tightness, it is suitable for connection to an air extractor, this wafer cutting adsorption-type tool with high-air-tightness comprises an absorption headstock and an elastic connecting contact layer, this absorption headstock includes a base body being connected to this air extractor, first through hole of multiple two opposite sides extending through this base body, and an end face being formed at this base body and connect the containing groove of described first through hole, this elastic connecting contact layer is arranged at this containing groove, and include a contact surface in level, and multiple the second through hole running through this contact surface and being respectively communicated with described first through hole, it is characterized in that:
Described first through hole defines an adsorption zone jointly, and this wafer cutting adsorption-type tool with high-air-tightness also comprises a potted component, and this potted component is arranged at the bottom surface of this base body, and around this adsorption zone.
The wafer cutting adsorption-type tool with high-air-tightness the most according to claim 1, it is characterized in that: this wafer cutting adsorption-type tool with high-air-tightness also comprises a support unit, and this support unit includes multiple barricade being arranged at this base body and being closely against this elastic connecting contact layer edge.
The wafer cutting adsorption-type tool with high-air-tightness the most according to claim 2, it is characterised in that: this elastic connecting contact layer also includes multiple being formed at this contact surface and in crisscross respectively around the main cutting groove of described second through hole.
The wafer cutting adsorption-type tool with high-air-tightness the most according to claim 3, it is characterized in that: described barricade is L-shaped, each barricade has a horizontal plate part being arranged at this base body end face, and a vertical plate part being upwardly extended and being closely against this elastic connecting contact layer edge by this horizontal plate part.
The wafer cutting adsorption-type tool with high-air-tightness the most according to claim 4, it is characterised in that: each barricade also has and multiple are formed at this vertical plate part and are respectively communicated with in the secondary cutting groove of described main cutting groove.
The wafer cutting adsorption-type tool with high-air-tightness the most according to claim 2, it is characterised in that: this support unit also includes multiple locking part that described barricade is locked in this base body respectively.
The wafer cutting adsorption-type tool with high-air-tightness the most according to claim 1, it is characterised in that: this elastic connecting contact layer also includes multiple being formed at this contact surface and respectively around the air drain of described second through hole.
The wafer cutting adsorption-type tool with high-air-tightness the most according to claim 1, it is characterised in that: this potted component is an o-ring.
9. according to the wafer cutting adsorption-type tool with high-air-tightness described in any claim in claim 1 to 8, it is characterised in that: the material of this elastic connecting contact layer is rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620110020.9U CN205452248U (en) | 2016-02-03 | 2016-02-03 | Wafer cutting is with absorption formula tool with high gas tightness |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620110020.9U CN205452248U (en) | 2016-02-03 | 2016-02-03 | Wafer cutting is with absorption formula tool with high gas tightness |
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| CN205452248U true CN205452248U (en) | 2016-08-10 |
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| CN201620110020.9U Active CN205452248U (en) | 2016-02-03 | 2016-02-03 | Wafer cutting is with absorption formula tool with high gas tightness |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109801863A (en) * | 2019-01-17 | 2019-05-24 | 广州兴森快捷电路科技有限公司 | For processing the jig and processing method of package substrate inside groove |
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2016
- 2016-02-03 CN CN201620110020.9U patent/CN205452248U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109801863A (en) * | 2019-01-17 | 2019-05-24 | 广州兴森快捷电路科技有限公司 | For processing the jig and processing method of package substrate inside groove |
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