CN205488084U - Wafer cutting is with absorption formula tool with high stability - Google Patents
Wafer cutting is with absorption formula tool with high stability Download PDFInfo
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- CN205488084U CN205488084U CN201620109965.9U CN201620109965U CN205488084U CN 205488084 U CN205488084 U CN 205488084U CN 201620109965 U CN201620109965 U CN 201620109965U CN 205488084 U CN205488084 U CN 205488084U
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Abstract
The utility model provides a wafer cutting is with absorption formula tool with high stability, is applicable to and is connected to an air exhaust device, and this wafer cutting contains a suction head seat, a springiness contaction layer and a support element with absorption formula tool. A base body, a plurality of first through -hole that runs through this base body are drawn together to this suction head stationary ladle, and a top surface and an intercommunication formed at this base body the holding recess of first through -hole. This springiness contaction layer sets up in this holding recess to include that is a horizontally contact surface, and a plurality of these contact surfaces that run through communicate respectively just the second through -hole of first through -hole. This support element includes a plurality of the setting in this base body and tight supporting in the barricade at this springiness contaction layer edge. The utility model discloses a set up this support element, strengthen the structural stability on this springiness contaction layer, make this springiness contaction layer be difficult to rock in cutting process, reach the effect that improves the product yield.
Description
Technical field
This utility model relates to a kind of semiconductor machining tool, particularly relates to one and has high steady
Adsorption-type tool is used in wafer cutting qualitatively.
Background technology
Refering to Fig. 1, existing a kind of adsorption-type tool 1, comprise one and be connected to one and bleed
Device (not shown) also has the absorption headstock 11 of multiple first through hole (not shown), and one
The individual rubber layer 12 being arranged at this absorption headstock 11, this rubber layer 12 has multiple being respectively communicated with
Second through hole 121 of described first through hole.
In the cutting processing procedure of wafer, this adsorption-type tool 1 is set up in a cutting machine, and (figure is not
Show) on, and connect this air extractor, then wafer (not shown) is arranged at this rubber
On layer 12, in cutting process, this air extractor air-breathing, and by described second through hole 121
Adsorb this wafer, but, owing to the edge of this rubber layer 12 is without supporter supports, when this is cut
When one cutter (not shown) of cutting mill is by the edge of this rubber layer 12, this rubber layer
12 can rock so that this wafer cannot stably be adsorbed in this adsorption-type tool 1, is susceptible to
The situation flown or rotate, and when entering next cutting machine, cannot be able to place because of displacement
Fritter wafer after another adsorption-type tool 1, or cutting cannot be adsorbed, and causes
Material or the situation of defective products, and then reduce the yield of product.
Summary of the invention
The purpose of this utility model be to provide a kind of can improve product yield there is high stable
Property wafer cutting use adsorption-type tool.
This utility model has the wafer cutting adsorption-type tool of high stability, it is adaptable to even
Being connected to an air extractor, this wafer cutting adsorption-type tool with high stability comprises
One absorption headstock, an elastic connecting contact layer and a support unit.
This absorption headstock includes that one is connected to the base body of this air extractor, multiple difference
Run through the first through hole of two opposite sides of this base body, and one is formed at this pedestal originally
The end face of body and connect the containing groove of described first through hole.
This elastic connecting contact layer is arranged at this containing groove, and includes a contact surface in level,
And multiple the second through hole running through this contact surface and being respectively communicated with described first through hole.
This support unit includes multiple being arranged at this base body and being closely against this elastic connecting contact layer
The barricade at edge.
The wafer cutting adsorption-type tool with high stability described in the utility model, should
Elastic connecting contact layer also includes multiple being formed at this contact surface and in crisscross respectively around institute
State the main cutting groove of the second through hole.
The wafer cutting adsorption-type tool with high stability described in the utility model, institute
Stating barricade is L-shaped, and each barricade has the water being arranged at this base body end face
Flat part, and one upwardly extended and be closely against this elastic connecting contact layer edge by this horizontal plate part
Vertical plate part.
The wafer cutting adsorption-type tool with high stability described in the utility model, often
One barricade also has and multiple are formed at this vertical plate part and are respectively communicated with in described main cutting groove
Secondary cutting groove.
The wafer cutting adsorption-type tool with high stability described in the utility model, should
Support unit also includes multiple locking part that described barricade is locked in this base body respectively.
The wafer cutting adsorption-type tool with high stability described in the utility model, should
Elastic connecting contact layer also includes multiple being formed at this contact surface and respectively around described second through hole
Air drain.
The wafer cutting adsorption-type tool with high stability described in the utility model, should
The material of elastic connecting contact layer is rubber.
The beneficial effects of the utility model are: by arranging this support unit, strengthen this bullet
The structural stability of property contact layer, makes this elastic connecting contact layer be not easy to rock in cutting process,
This wafer can stably be adsorbed in this elastic connecting contact layer, reaches to improve the effect of product yield.
Accompanying drawing explanation
Fig. 1 is an axonometric chart, and existing a kind of adsorption-type tool is described；
Fig. 2 is a three-dimensional exploded view, illustrates that this utility model has the wafer cutting of high stability
By an embodiment of adsorption-type tool；
Fig. 3 is an axonometric chart of this embodiment；
Fig. 4 is an enlarged partial isometric view of this embodiment；
Fig. 5 is a schematic diagram, illustrates that wafer is adsorbed in the situation that this embodiment is to be cut.
Detailed description of the invention
Below in conjunction with the accompanying drawings and this utility model is described in detail by embodiment.
Refering to Fig. 2 to Fig. 4, this utility model has the wafer cutting adsorption-type of high stability
One embodiment of tool, comprises absorption 2, elastic connecting contact layer 3 of headstock and
Support unit 4.
This absorption headstock 2 includes a base body 21, multiple extends through this base body
First through hole 22 of two opposite sides of 21, and an end face being formed at this base body 21
And connect the containing groove 23 of described first through hole 22.
This elastic connecting contact layer 3 is arranged at this containing groove 23 in the way of laminating, and includes one
Contact surface 31 in level, multiple run through this contact surface 31 and be respectively communicated with described first through hole
Second through hole 32 of 22, multiple it is formed at this contact surface 31 and respectively around described second through hole
The air drain 33 of 32, and multiple it is formed at this contact surface 31 and in crisscross respectively around institute
State the main cutting groove 34 of the second through hole 32 and described air drain 33.In the present embodiment, this elasticity
The material of contact layer 3 is rubber, but is not limited.
This support unit 4 includes multiple being arranged at this base body 21 and being closely against this elastic connecting
The barricade 41 at contact layer 3 edge, and multiple respectively described barricade 41 is locked in this base body
The locking part 42 of 21.In the present embodiment, each locking part 42 is a screw, but not
As limit.
Described barricade 41 in L-shaped, each barricade 41 have one be arranged at this pedestal this
The horizontal plate part of body 21 end face 411, one is upwardly extended by this horizontal plate part 411 and is closely against
The vertical plate part 412 at this elastic connecting contact layer 3 edge, and multiple it is formed at this vertical plate part 412
And be respectively communicated with in the secondary cutting groove 413 of described main cutting groove 34.
Refering to Fig. 4 and Fig. 5, time actually used, the present embodiment be set up in one and produce line (figure
Do not show) cutting machine (not shown) on, and an air extractor 8 is connected to this pedestal this
Body 21, then wafer 9 is arranged on the contact surface 31 of this elastic connecting contact layer 3, then,
Start this air extractor 8, by described first through hole 22, described second through hole 32 and described
This wafer 9 of the suction adsorption that gas between air drain 33 is formed, in cutting process, a cutting
Cutter (not shown) can be passed through the secondary cutting groove 413 of described barricade 41 and this elastic connecting contact layer 3
Main cutting groove 34, this wafer 9 is cut into the wafer of fritter, to carry out follow-up processing.
By arranging described barricade 41 at the edge of this elastic connecting contact layer 3, when these cutter pass through
During the edge of this elastic connecting contact layer 3, this elastic connecting contact layer 3 is not easy to rock, therefore, and cutting
During, the wafer after the situation that this wafer 9 will not fly or rotate, and cutting also can
It is adsorbed in this elastic connecting contact layer 3 with not shifting, and then improves the yield of product.
It is noted that the present embodiment is applicable to the wafer cutting engineering method of " entirely cutting ", the most just
It is to say that cutting through this wafer 9 becomes multiple complete wafer, described secondary cutting groove 413 to make this cutter
Will not be stopped by described barricade 41 through the edge of this elastic connecting contact layer 3, described main cutting
Will not be stopped by this contact surface 31 when groove 34 makes these cutter cut this wafer 9.But, should
Elastic connecting contact layer 3 can also be not provided with described main cutting groove 34, and is applied to the crystalline substance of " hemisection "
Circle cutting engineering method, say, that the completeest this wafer 9 that cuts through, now, described barricade 41 is the most not
Described secondary cutting groove 413 must be set.
In sum, this utility model, by arranging this support unit 4, strengthens this Elastic Contact
The structural stability of layer 3, makes this elastic connecting contact layer 3 be not easy to rock in cutting process, should
Wafer 9 can stably be adsorbed in this elastic connecting contact layer 3, reaches to improve the effect of product yield,
So the purpose of this utility model really can be reached.
Claims (7)
1. a wafer cutting adsorption-type tool with high stability, it is adaptable to connect
To an air extractor, this wafer cutting adsorption-type tool with high stability comprises one
Individual absorption headstock and an elastic connecting contact layer, this absorption headstock includes that one is connected to this and bleeds
The base body of device, multiple two opposite sides extending through this base body first lead to
Hole, and an end face being formed at this base body and connect the accommodating recessed of described first through hole
Groove, this elastic connecting contact layer is arranged at this containing groove, and includes a contact surface in level,
And multiple the second through hole running through this contact surface and being respectively communicated with described first through hole, its feature
It is:
This wafer cutting adsorption-type tool with high stability also comprises one and supports single
Unit, this support unit includes multiple being arranged at this base body and being closely against this elastic connecting contact layer
The barricade at edge.
The wafer cutting adsorption-type with high stability the most according to claim 1
Tool, it is characterised in that: this elastic connecting contact layer also include multiple be formed at this contact surface and in
Crisscrossly respectively around the main cutting groove of described second through hole.
The wafer cutting adsorption-type with high stability the most according to claim 2
Tool, it is characterised in that: described barricade is L-shaped, and each barricade has one and is arranged at
The horizontal plate part of this base body end face, and one upwardly extended by this horizontal plate part and tight against
Vertical plate part in this elastic connecting contact layer edge.
The wafer cutting adsorption-type with high stability the most according to claim 3
Tool, it is characterised in that: each barricade also have multiple be formed at this vertical plate part and point
It is not communicated in the secondary cutting groove of described main cutting groove.
The wafer cutting adsorption-type with high stability the most according to claim 1
Tool, it is characterised in that: this support unit also includes multiple being locked in by described barricade respectively
The locking part of this base body.
The wafer cutting adsorption-type with high stability the most according to claim 1
Tool, it is characterised in that: this elastic connecting contact layer also include multiple be formed at this contact surface and point
Not around the air drain of described second through hole.
7. according to the high stability that has described in any claim in claim 1 to 6
Adsorption-type tool is used in wafer cutting, it is characterised in that: the material of this elastic connecting contact layer is rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620109965.9U CN205488084U (en) | 2016-02-03 | 2016-02-03 | Wafer cutting is with absorption formula tool with high stability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620109965.9U CN205488084U (en) | 2016-02-03 | 2016-02-03 | Wafer cutting is with absorption formula tool with high stability |
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| Publication Number | Publication Date |
|---|---|
| CN205488084U true CN205488084U (en) | 2016-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620109965.9U Active CN205488084U (en) | 2016-02-03 | 2016-02-03 | Wafer cutting is with absorption formula tool with high stability |
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| Country | Link |
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| CN (1) | CN205488084U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108279367A (en) * | 2016-12-30 | 2018-07-13 | 致茂电子(苏州)有限公司 | absorption type test device |
-
2016
- 2016-02-03 CN CN201620109965.9U patent/CN205488084U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108279367A (en) * | 2016-12-30 | 2018-07-13 | 致茂电子(苏州)有限公司 | absorption type test device |
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| GR01 | Patent grant |