TWM521773U - Touch panels - Google Patents

Abstract

The disclosure provides a touch panel. The touch panel includes a sensing electrode disposed on a substrate. The substrate has a first bonding area and a plurality of first bonding pads is disposed in the first bonding area on the substrate, wherein the first bonding pads are electrically connected to the sensing electrode. A plurality of second bonding pads is disposed in a second bonding area on a flexible print circuit board. The second bonding pads correspond to the first bonding pads in the first bonding area. An anisotropic conductive film is disposed between the first bonding area of the substrate and the second bonding area of the flexible print circuit board. The substrate further includes a third bonding area, such that in the third bonding area, the second bonding pads do not correspond to the first bonding pads.

Description

Touch panel

This creation is about touch technology, especially the bond pad configuration of the touch panel.

In recent years, touch panels have been widely used in various electronic products, such as mobile phones, portable computers, and palm-sized computers. Touch panels and display panels have become the input/output interfaces of electronic products. The touch panel usually includes sensing electrodes arranged in a touch array to provide a touch sensing function, and the sensing electrodes are electrically connected to the plurality of bonding pads located in the peripheral area of the touch panel via the wires, and the touch panel peripheral area The bonding pad is usually bonded to a bonding pad on a flexible printed circuit board (FPC) by means of an anisotropic conductive film (ACF), thereby obtaining the electricity of the sensing electrode. The signal is transmitted to an integrated circuit on the flexible printed circuit board to determine and process the touch signal.

After the anisotropic conductive adhesive is subjected to the pressing step, the conductive particles contained in the anisotropic conductive adhesive will gather through the substrate of the anisotropic conductive adhesive, so that the bonding pads in the peripheral region of the touch panel and the flexible printed circuit board The upper bonding pads create an electrical connection in the vertical direction. However, the bonding pad arrangement in the peripheral area of the touch panel is not easy to observe the state of the conductive particles in the anisotropic conductive paste after the pressing step, and the bonding pad of the peripheral area of the touch panel cannot be confirmed to be connected to the flexible printed circuit board. Whether the electrical connection between the pads is achieved.

In some embodiments of the present disclosure, a touch panel includes a sensing electrode disposed on a substrate, the substrate having a first bonding region, and the plurality of conductive electrodes in the prior art. The first bonding pads are disposed on the first bonding region of the substrate, the first bonding pads are electrically connected to the sensing electrodes; and the plurality of second bonding pads are disposed on the second bonding region of the flexible printed circuit board, so that the first bonding pads a bonding pad corresponding to the first bonding pad in the first bonding region; and an anisotropic conductive paste disposed between the second bonding region of the flexible printed circuit board and the first bonding region of the substrate, wherein the substrate further comprises a third bonding The regions are such that the first bonding pads and the second bonding pads are in a non-corresponding relationship in the third bonding region.

The present invention is configured by the bonding pad of the substrate of the touch panel and the flexible printed circuit board, so that the first bonding pad on the substrate and the second bonding pad on the flexible printed circuit board are in a non-corresponding relationship in a third bonding area. After the first bonding pad on the touch panel substrate and the second bonding pad on the flexible printed circuit board are bonded by the pressing step using the anisotropic conductive adhesive, according to the embodiment of the present invention, the first and second bonding pads are The anisotropic conductive paste in the third joint region of the non-corresponding relationship is not shielded by the first or second bonding pads, so that the state of the conductive particles of the anisotropic conductive paste can be observed through the third bonding region, thereby confirming the touch panel. Whether an electrical connection between the first bond pad on the substrate and the second bond pad on the flexible printed circuit board is achieved.

100‧‧‧ touch panel

100A‧‧‧ touch area

100P‧‧‧ surrounding area

101, 102, 113‧‧‧ substrates

103‧‧‧Sensing electrode

BA1‧‧‧ first junction area

BA2‧‧‧Second junction

BA3‧‧‧ third junction area

105‧‧‧First joint pad

107‧‧‧Soft printed circuit board

109‧‧‧Second joint pad

105F, 109F‧‧‧ functional joint pads

105D, 109D‧‧‧ dummy mat

Blank areas 105B-1, 105B-2, 105B-3, 109B-1, 109B-2, 109B-3‧‧

111‧‧‧ anisotropic conductive adhesive

111-1‧‧‧Insulation substrate

111-2‧‧‧ conductive particles

111-3‧‧‧Insulation film

115‧‧‧Lighting layer

W1‧‧‧Width

P1‧‧‧ spacing

D1‧‧‧first distance

D2‧‧‧Second distance

H1, h2‧‧‧ thickness

In order to make the above objects, features, and advantages of the present invention more comprehensible, the following is a detailed description of the following drawings: FIG. 1 is a schematic cross-sectional view of a touch panel according to some embodiments of the present invention.

2A is a stacked schematic diagram showing the positional correspondence of the second bonding pads on the flexible printed circuit board and the first bonding pads on the substrate in accordance with some embodiments of the present invention.

FIG. 2B is a stacked schematic diagram showing the positional correspondence between the second bonding pads on the flexible printed circuit board and the first bonding pads on the substrate according to other embodiments of the present invention.

2C is a stacked schematic diagram showing the positional correspondence between the second bonding pads on the flexible printed circuit board and the first bonding pads on the substrate in accordance with still other embodiments of the present invention.

FIG. 3A is a partially enlarged cross-sectional view showing a region E of the touch panel of FIG. 1 according to some embodiments of the present invention.

FIG. 3B is a partially enlarged cross-sectional view showing a region E of the touch panel of FIG. 1 according to still another embodiment of the present invention.

4 is a cross-sectional view of a touch panel in accordance with still other embodiments of the present invention.

FIG. 5 is a cross-sectional view of a touch panel according to still other embodiments of the present invention.

FIG. 1 is a cross-sectional view of a touch panel 100 according to some embodiments of the present invention. In some embodiments, the touch panel 100 can be capacitive, A resistive touch panel, or other type of touch panel that needs to transmit an electrical signal obtained by the touch area to a bonding pad of the peripheral area, the touch panel 100 includes a substrate 101. In some embodiments, the substrate 101 is transparent. An insulating film, such as a polyimide film, is formed on the substrate 101 and located in the touch area 100A. In some embodiments, the sensing electrode 103 includes a plurality of strips. An axial electrode and a plurality of second axial electrodes (not shown) are alternately insulated from the second axial electrode to form a touch sensing array. In some other embodiments, the sensing electrode 103 can include other forms of touch sensing arrays.

The touch panel 100 further includes a plurality of first bonding pads 105 or sensor bonding pads formed on the substrate 101 and located in the peripheral region 100P. The first bonding pads 105 are via wires. 1 is not shown) a plurality of first axial electrodes and a plurality of second axial electrodes each electrically connected to the sensing electrode 103, in order to transmit an electrical signal detected by the sensing electrode 103 to an external circuit. Processing, providing a flexible printed circuit board (FPC) 107 having a plurality of second bonding pads 109 or a FPC bonding pads formed thereon, these second The bonding pad 109 is electrically connected to an integrated circuit wafer (not shown in FIG. 1) on a flexible printed circuit board (FPC) 107.

In some embodiments, the first bonding pad 105 and the second bonding pad 109 are bonded together via an anisotropic conductive paste (ACF) 111 by pressing, in order to confirm the first bonding pad 105 and the second bonding pad 109. Whether the electrical connection between the two is achieved, whether the conductive particles in the anisotropic conductive paste (ACF) 111 pass through the insulating substrate of the anisotropic conductive paste (ACF) 111 can be observed, because the conductive particles Usually made of a metal material, when the conductive particles in the anisotropic conductive paste (ACF) 111 pass through the insulating substrate of the anisotropic conductive paste (ACF) 111, the reflection of the conductive particles can be observed by an optical microscope. .

In other embodiments, the conductive particles in the anisotropic conductive paste (ACF) 111 are also covered with an insulating film. When the insulating film is broken by the pressing step, the anisotropic conductive adhesive (ACF) 111 The conductive particles in the conductive pad can electrically connect the first bonding pad 105 and the second bonding pad 109, and when the insulating film is broken, the conductive particles may reflect light, and by observing whether the conductive particles have a reflective phenomenon, the first Whether a bonding pad 105 and the second bonding pad 109 are electrically connected.

Referring to FIG. 2A, there is shown a position corresponding to the position between the second bonding pad 109 on the flexible printed circuit board 107 and the first bonding pad 105 on the substrate 101 in the peripheral region of the touch panel according to some embodiments of the present invention. A cascading diagram of the relationship. As shown in FIG. 2A, a plurality of first bonding pads 105 are disposed on the first bonding region BA1 on the substrate 101. The first bonding pads 105 are electrically connected to the sensing electrodes 103 shown in FIG. A plurality of second bonding pads 109 are disposed on the second bonding area BA2 on the flexible printed circuit board 107. The second bonding pads 109 include a plurality of functional bonding pads 109F and at least one dummy pads 109D. The functional bonding pads 109F of the second bonding pad 109 correspond to the first bonding pads 105 in the first bonding area BA1 such that the functional bonding pads 109F have a function of transmitting an electrical signal, and the dummy bonding pads 109D of the second bonding pads 109 Then, the electrical bonding signal 109F and the dummy bonding pad 109D can be disposed in the second bonding area BA2 in a pitch manner. According to some embodiments of the present invention, the substrate 101 further includes a third bonding area BA3 such that the first bonding pad 105 and the second bonding pad 109 are non-corresponding in the third bonding area BA3, ie, The dummy bonding pads 109D of the two bonding pads 109 do not correspond to any of the first bonding pads 105 in the third bonding region BA3.

The anisotropic conductive paste 111 (shown in FIG. 1) is disposed between the second land area BA2 of the flexible printed circuit board 107 and the first land area BA1 of the substrate 101, and the second bond on the flexible printed circuit board 107. The anisotropic conductive paste 111 is also provided between the area BA2 and the third land area BA3 of the substrate 101. In some embodiments, the first bonding pad 105 may also include a plurality of functional bonding pads and selectively disposed dummy bonding pads (not shown in FIG. 2A), the functional bonding pads have a function of transmitting electrical signals, and the dummy bonding pads The electrical signal is not required to be transmitted, and the position of the functional bonding pad of the first bonding pad 105 is configured corresponding to the position of the functional bonding pad 109F of the second bonding pad 109.

According to some embodiments of the present invention, at least one blank region 105B-1 may be disposed between the first bonding pads 105 such that the position of the at least one dummy bonding pad 109D of the second bonding pad 109 corresponds to the blank region 105B-1. In accordance with some embodiments of the present author, a first bond pad 105 that would otherwise correspond to the second bond pad 109 can be removed, thereby creating a blank region 105B-1. As shown in FIG. 2A, in some embodiments, the third land area BA3 on the substrate 101 may include two blank areas 105B-1 and 105B-2 disposed at both side regions of the first bonding pads 105, respectively.

In accordance with some embodiments of the present disclosure, the width W1 of the blank region 105B-1 is greater than the pitch P1 between two immediately adjacent first bond pads 105 (which may be functional bond pads and dummy bond pads), in some embodiments, width W1 may be 2.5 times to 3.5 times the pitch P1. In a preferred embodiment, the center pitch of each of the first bond pads 105 is approximately equal to 2 times the pitch P1, and the width of each of the first bond pads 105 is a pitch. P1, therefore the preferred embodiment of the width W1 is 3 times the pitch P1. However, there may be a possibility that the actual pitch of the edge of each of the first bonding pads 105 may be slightly larger or smaller than the pitch P1 due to the process capability relationship.

Referring to FIG. 1 again, another substrate 102 as a cover plate is provided under the substrate 101, and a light shielding layer 115 for masking the lines of the peripheral portion of the touch panel is formed on the peripheral region 110P of the substrate 102. The substrate 101 is attached to the other substrate 102 (protective cover) and the light shielding layer 115, and the light shielding layer 115 is interposed between the substrate 101 (light transmitting insulating film) and the other substrate 102 (protective cover). After the second bonding pad 109 on the flexible printed circuit board 107 and the first bonding pad 105 on the substrate 101 are bonded by the anisotropic conductive adhesive 111 through a press-fit manner, in order to confirm the conductivity in the anisotropic conductive paste of the entire batch of products In the state of the particles, one of the products that has adhered the first bonding pad 105 and the second bonding pad 109 can be taken out, and the flexible printed circuit board 107 is disassembled and inspected, in this embodiment, formed on the substrate 101. A bond pad 105 and sense electrode 103 are disassembled along with the substrate 101 along with the flexible printed circuit board 107.

Since the material of the first bonding pad 105 is a metal such as molybdenum aluminum molybdenum, the material of the second bonding pad 109 is made of copper metal, and the adhesion of the copper foil to the flexible printed circuit board is higher than that of the molybdenum aluminum molybdenum or other oxide to the substrate 101. Since the adhesion is also good, when the flexible printed circuit board 107 is peeled off from the substrate 101, the first bonding pad 105 is peeled off from the substrate 101 and adhered to the second bonding pad 109. If no blank area 105B-1 or 105B-2 is disposed between the first bonding pads 105, all of the first bonding pads 105 are in contact with the second bonding pads 109, and the first bonding pads 105 and the second bonding pads 109 is opaque, and it is impossible to observe whether or not the insulating film on the periphery of the conductive particles in the anisotropic conductive paste 111 is crushed. When set in the third land area BA3 of the substrate 101 In the blank region 105B-1 or 105B-2, at least one dummy bonding pad 109D does not adhere to the first bonding pad 105, so that the conductive pad 109D which is not attached by the first bonding pad 105 can be observed. The state of the particle.

Moreover, since the pitch of the dummy bonding pad 109D and the substrate 101 is larger than the pitch of the functional bonding pad 109F and the first bonding pad 105, when the insulating film (or insulating paste) on the periphery of the conductive particles in the anisotropic conductive paste 111 is not When the dummy bonding pad 109D to which the first bonding pad 105 is attached is confirmed to be broken, it is confirmed that the conductive particles between the functional bonding pad 109F and the first bonding pad 105 are also broken, and the first bonding pad 105 and the first bonding pad are confirmed. The two bonding pads 109 are electrically connected.

In addition, by peeling off the substrate 101 (transparent insulating film) from the other substrate 102 (protective cover) and the light shielding layer 115, since the substrate 101 is a light transmissive film, and there is no first in the blank areas 105B-1, 105B-2 The bonding pad 105 can observe the state of the conductive particles after the pressing process from the blank regions 105B-1 and 105B-2 on the substrate 101 (light transmitting insulating film) side, thereby judging the second bonding pad 109 and the first bonding pad 105. Whether the electrical connection between the two is achieved. On the contrary, if there is no blank region 105B-1 or 105B-2 between the first bonding pads 105, the conductive particles in the anisotropic conductive paste will be sandwiched between each of the first bonding pads 105 and each second. Between the bonding pads 109, it is impossible to observe whether the state of the conductive particles in the anisotropic conductive paste reaches an electrical connection between the second bonding pad 109 and the first bonding pad 105.

As shown in FIG. 2A, in some embodiments, the blank regions 105B-1, 105B-2 between the first bonding pads 105 may be disposed on both side regions of the first bonding pads 105, thereby observing the pressing. The process has a pressing effect on the bond pads at the locations on both sides of the land. Although FIG. 2A depicts that the two side edges of the first bonding pad 105 each have one blank area 105B-1, 105B-2, in other embodiments It is also possible to use other numbers and locations of blank areas.

FIG. 2B is a stacked schematic diagram showing the positional correspondence between the second bonding pad 109 on the flexible printed circuit board 107 and the first bonding pad 105 on the substrate 101 according to other embodiments of the present invention, as shown in FIG. 2B. In some embodiments, in addition to arranging one blank area 105B-1, 105B-2 in each of the two side regions of the first bonding pad 105, a blank may be disposed in the middle of the first bonding pad 105. In the region 105B-3, the positions of the blank regions 105B-1, 105B-2, and 105B-3 correspond to the dummy bonding pads 109D of the second bonding pads 109, and blanks are provided via the both ends and the intermediate regions of the first bonding pads 105. The regions 105B-1, 105B-2, and 105B-3 can further confirm the pressing effect of the pressing head of the pressing device on the bonding pads on the left and right sides and the intermediate position of the joint region, and can thereby adjust the process parameter conditions of the pressing device. To achieve a uniform press-fit effect at both ends and in the middle.

In addition, as shown in FIG. 2B, the first bonding pad 105 may include a plurality of functional bonding pads 105F and selectively disposed dummy bonding pads 105D, and the dummy bonding pads 105D may be disposed in the blank regions 105B-1, 105B-2. On both sides. Although FIG. 2B is a diagram showing that both ends of the first bonding pad 105 have a blank area 105B-1, 105B-2 between the two dummy bonding pads 105D, and a blank area 105B-3 is located between the two functions. Between the bond pads 105F, but in other embodiments other functional numbers and locations may be used to configure the functional bond pads 105F, the dummy bond pads 105D, and the blank regions 105B-1, 105B-2, 105B-3.

2C is a stacked schematic diagram showing the positional correspondence between the second bonding pad 109 on the flexible printed circuit board 107 and the first bonding pad 105 on the substrate 101, according to still other embodiments of the present invention, as shown in FIG. 2C. As shown, in some embodiments, a blank area 109B-1 may be disposed between the second bonding pads 109, 109B-2, 109B-3, and the dummy bonding pads 105D of the first bonding pads 105 correspond to the blank regions 109B-1, 109B-2, 109B-3, and the dummy bonding pads 105D are disposed on the third bonding on the substrate 101. The area BA3 is such that the first bonding pad 105 and the second bonding pad 109 are in a non-corresponding relationship in the third bonding area BA3.

FIG. 3A is a partially enlarged cross-sectional view showing a region E of the touch panel 100 of FIG. 1 according to some embodiments of the present invention. As shown in FIG. 3A, the second bonding pad 109 and the substrate of the flexible printed circuit board 107 are shown. An anisotropic conductive paste 111 is interposed between the first bonding pads 105 of 101, and the anisotropic conductive paste 111 comprises an insulating substrate 111-1 and a plurality of conductive particles 111-2 dispersed in the insulating substrate 111-1, when soft After the second bonding pad 109 on the printed circuit board 107 is pressed against the first bonding pad 105 on the substrate 101, the anisotropic conductive adhesive 111 between the second bonding pad 109 and the first bonding pad 105 is squeezed. Pressing, according to the characteristics of the anisotropic conductive paste 111, the conductive particles 111-2 are gathered by the insulating substrate 111-1 after being pressed, and the second bonding pad 109 is generated between the second bonding pad 109 and the first bonding pad 105. The electrical connection is perpendicular to the surface direction of the flexible printed circuit board 107 and the substrate 101 (for example, the electrical connection in the Z direction), but the electrical connection is not generated in the direction parallel to the surface of the flexible printed circuit board 107 and the substrate 101 (for example, There will be no electrical connection in the X and Y directions).

As shown in FIG. 3A, the first bonding pad 105 has a thickness h1. For example, the thickness h1 may be 0.2 to 0.4 μm. In the preferred embodiment, the thickness h1 may be 0.3 μm, and the second bonding pad 109 has a thickness h2. The thickness h2 may be 3 to 30 μm, and the thickness h2 may be 8 to 25 μm in the preferred embodiment. The thickness h1 depends on the metal trace between the sensing electrode 103 and the first bonding pad 105. Since the metal trace is thin, it is easy to break, so when the metal trace and the first When a bonding pad 105 is overlapped, the thickness h1 cannot be too thick, so the thickness h1 is smaller than the thickness h2. In some embodiments, the thickness h2 of the second bonding pad 109 is 10 to 100 times the thickness h1 of the first bonding pad 105, for example, the thickness h2 may be about 10 μm, and the thickness h1 is about 1 μm.

According to some embodiments of the present invention, the second bonding pad 109 is separated from the blank area 105B-1 on the substrate 101 by a first distance d1 (about less than 12.4 μm ), and the second bonding pad 109 and the first bonding pad 105 are Between the second distance d2 (about less than 12 μm), the first distance d1 is greater than the second distance d2, and the difference between the first distance d1 and the second distance d2 is about the thickness h1 (ie, between about 0.2 μm and 0.4 μm) Therefore, when it is observed from the blank region 105B-1 that the conductive particles 111-2 have passed through the insulating substrate 111-1, the conductive particles 111 between the second bonding pad 109 and the first bonding pad 105 can be more confirmed. -2 has been surely passed through the insulating substrate 111-1 to achieve electrical connection in the vertical direction, because when the first distance d1 with a large distance can already achieve the desired pressing effect, it is more sure that the distance is smaller. The second distance d2 also achieves the desired press-fit effect.

FIG. 3B is a partially enlarged cross-sectional view showing a region E of the touch panel 100 of FIG. 1 according to another embodiment of the present invention. As shown in FIG. 3B, the conductive particles 111-2 in the anisotropic conductive paste 111 are shown. The periphery is also covered with an insulating film 111-3. After the second bonding pad 109 on the flexible printed circuit board 107 is pressed together with the first bonding pad 105 on the substrate 101, the anisotropic conductive adhesive 111 is pressed. When the insulating film 111-3 around the conductive particles 111-2 is broken, an electrical connection between the second bonding pad 109 and the first bonding pad 105 can be achieved.

According to the embodiment of the present invention, in the third land area BA3 on the substrate 101, the first bonding pad 105 and the second bonding pad 109 have a non-correspondence relationship. The correspondence relationship is, for example, from the provision of the blank areas 105B-1, 105B-2, 105B-3 between the first bonding pads 105 or the blank areas 109B-1, 109B-2 between the second bonding pads 109. 109B-3, when the flexible printed circuit board 107 is to be removed to observe the state of the conductive particles 111-2 in the anisotropic conductive paste 111, between the first bonding pads 105 or between the second bonding pads 109. The blank region allows the conductive particles 111-2 not to be shielded by the first bonding pad 105 or the second bonding pad 109, whereby the conductive particles 111-2 can be observed to be reflective. Therefore, the setting of the blank region not only makes the condition of the conductive particles easy to be observed, but also confirms the electrical property between the second bonding pad 109 and the first bonding pad 105 more effectively by observing the state of the conductive particles in the blank region as described above. Whether the connection is indeed achieved.

FIG. 4 is a cross-sectional view of the touch panel 100 according to another embodiment of the present invention. The sensing electrode 103 and the first bonding pad 105 of the touch panel 100 are formed on the substrate 101. In some embodiments, the substrate 101 is formed. It may be a glass substrate or a flexible plastic substrate. The flexible printed circuit board 107 has a second bonding pad 109. The second bonding pad 109 is bonded to the first bonding pad 105 via the anisotropic conductive adhesive 111. In some embodiments, The configuration of the second bonding pad 109 and the first bonding pad 105 may be as shown in FIG. 2A, 2B or 2C.

In addition, the touch panel 100 further includes another substrate 113 disposed above the flexible printed circuit board 107. The substrate 113 serves as a protective cover, and a light shielding layer 115 is formed on the inner surface of the substrate 113 in the peripheral region 100P. In this embodiment, after the second bonding pad 109 and the first bonding pad 105 are bonded by the pressing step through the anisotropic conductive paste 111, the blank region 105B between the first bonding pads 105 may be directly from the substrate 101 side. -1 (as shown in Fig. 3) The state of the conductive particles 111-2 after the press-bonding step was observed.

FIG. 5 is a cross-sectional view of the touch panel 100 according to another embodiment of the present invention. In some embodiments, the substrate 101 is used as a protective cover, and the sensing electrode 103 is formed on the inner surface of the substrate 101. Located in the touch area 100A. In addition, a light shielding layer 115 is further formed on the inner surface of the substrate 101 in the peripheral region 100P. The first bonding pad 105 is formed on the light shielding layer 115, and the first bonding pad 105 can be electrically connected and sensed by wires or other electrical connections. The electrodes 103 are connected, and the second bonding pads 109 on the flexible printed circuit board 107 and the first bonding pads 105 are bonded by the pressing step through the anisotropic conductive paste 111. In this embodiment, the first bonding pads 105 are located in the anisotropy. The conductive paste 111 is between the light shielding layer 115. In some embodiments, the configuration of the second bond pad 109 and the first bond pad 105 can be as shown in FIG. 2A, 2B or 2C. In this embodiment, since the light shielding layer 115 is formed on the peripheral region 100P of the substrate 101, the flexible printed circuit board 107 needs to be removed to confirm the state after the conductive particles 111-2 have undergone the pressing step.

In some embodiments, the blank area is disposed at one end of the bond pad that is less adherent to the carrier board (eg, substrate 101 or flexible printed circuit board 107), for example, when the first bond pad 105 and the second bond pad When the material of 109 is replaced such that the adhesion of the first bonding pad 105 to the substrate 101 is greater than the adhesion of the second bonding pad 109 to the flexible printed circuit board 107, at least one blank area is disposed between the second bonding pads 109, for example. The blank area 109B-1, 109B-2 or 109B-3 shown in FIG. 2C is such that the position of at least one dummy bonding pad 105D of the first bonding pad 105 corresponds to the blank area 109B-1, 109B-2 or 109B-3.

When the flexible printed circuit board 107 is detached from the substrate 101, since the adhesion of the second bonding pad 109 to the flexible printed circuit board 107 is poor, the second bonding pad 109 is separated from the flexible printed circuit board 107 to be bonded to the first bonding. Pad 105 For the affixing, since there is no second bonding pad 109 in the blank areas 109B-1, 109B-2, and 109B-3, the anisotropic conductive adhesive can be observed in the blank area 109B-1, 109B-2 or 109B-3. Whether the conductive particles of (ACF) 111 pass through the insulating paste or the insulating film. If the blank areas 109B-1, 109B-2 or 109B-3 are not provided between the second bonding pads 109, all of the first bonding pads 105 and the second bonding pads 109 are in contact with each other, and the anisotropy cannot be observed. Whether the conductive particles of the conductive paste (ACF) 111 pass through the insulating paste or the insulating film.

When the adhesion of the first bonding pad 105 to the substrate 101 is less than the adhesion of the second bonding pad 109 to the flexible printed circuit board 107, at least one blank area is disposed between the first bonding pads 105, for example, as shown in FIG. 2B. The blank area 105B-1, 105B-2 or 105B-3, that is, the embodiment corresponding to the 3A and 3B drawings.

Although the present invention has been disclosed as a preferred embodiment, it is not intended to limit the present invention, and those of ordinary skill in the art can understand that a certain change can be made without departing from the spirit and scope of the present invention. Retouching. Therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application.

101‧‧‧Substrate

BA1‧‧‧ first junction area

BA2‧‧‧Second junction

BA3‧‧‧ third junction area

105‧‧‧First joint pad

107‧‧‧Soft printed circuit board

109‧‧‧Second joint pad

109F‧‧‧ functional mat

109D‧‧‧Dummy joint pad

105B-1, 105B-2‧‧‧ blank area

W1‧‧‧Width

P1‧‧‧ spacing

Claims (8)

A touch panel includes: a sensing electrode disposed on a substrate, wherein the substrate has a first bonding region; and a plurality of first bonding pads are disposed on a first bonding region of the substrate, the first The bonding pad is electrically connected to the sensing electrode; the plurality of second bonding pads are disposed on a second bonding region of a flexible printed circuit board, such that the second bonding pads correspond to the first bonding region a first bonding pad; and an anisotropic conductive paste disposed between the second bonding region of the flexible printed circuit board and the first bonding region of the substrate, wherein the substrate further comprises a third bonding region, The first bonding pads and the second bonding pads are in a non-corresponding relationship in the third bonding region. The touch panel of claim 1, wherein the third bonding area is located in a first blank area between the first bonding pads on the substrate, and the first blank area has a width greater than two a spacing between the first bonding pads adjacent to each other, and the second bonding pads include a dummy bonding pad corresponding to the first blank area. The touch panel of claim 2, wherein the second bonding pad is separated from the first blank area on the substrate by a first distance, and the second bonding pad and the first bonding pad are The second distance is greater than the second distance, and the difference between the first distance and the second distance is 0.2 μm to 0.4 μm. The touch panel of claim 1, wherein the third interface a second blank area between the second bonding pads, the second blank area having a width greater than a spacing between the two adjacent second bonding pads, wherein the first bonding pads comprise A dummy bond pad corresponds to the second blank area. The touch panel of claim 1, wherein the anisotropic conductive paste comprises an insulating substrate, and a plurality of conductive particles are dispersed in the insulating substrate, and the plurality of conductive regions are located in the third bonding region. The conductive particles are not obscured by the first bond pad or the second bond pad. The touch panel of claim 1, wherein the substrate is a protective cover, and the touch panel further comprises a light shielding layer disposed on the protective cover, wherein the first bonding pads are interposed Between the light shielding layer and the anisotropic conductive paste. The touch panel of claim 1, wherein the substrate is a light-transmissive insulating film, the sensing electrode and the first bonding pads are directly disposed on the light-transmissive insulating film, and the touch panel The method further includes: a protective cover disposed under the transparent insulating film; and a light shielding layer disposed on the protective cover, and the light shielding layer is interposed between the transparent insulating film and the protective cover. The touch panel of claim 1, wherein the thickness of the second bonding pads is 10 to 100 times the thickness of the first bonding pads.