CN106154594B - Electric connection structure and array substrate - Google Patents
Electric connection structure and array substrate Download PDFInfo
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- CN106154594B CN106154594B CN201510147091.6A CN201510147091A CN106154594B CN 106154594 B CN106154594 B CN 106154594B CN 201510147091 A CN201510147091 A CN 201510147091A CN 106154594 B CN106154594 B CN 106154594B
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Abstract
The present invention relates to a kind of electric connection structures comprising the first connector and the second connector.First connector includes connection gasket.The connection gasket includes at least two conductive layers and a contact layer on various wirings layer.At least two conductive layers and the contact layer are electrically connected.The contact layer is electrically connected by anisotropy conducting medium and second connector.At least two conductive layers are staggered and partly overlap.Electric connection structure provided by the present invention and array substrate, which can be reduced, is judged to underproof probability for display panel according to impression.
Description
Technical field
The present invention relates to a kind of electric connection structure and a kind of array substrates.
Background technique
Touch panel, display panel processing procedure in, it usually needs by squeezing anisotropic conductive film for driving chip
Pin is electrically connected with the connection gasket for routes such as the scan line of electric connection, data line or touch routes.However, judgement should
Driving chip is easy to generate misjudgment when whether contacting good with connection gasket, misses so that contacting good display panel originally
It is judged to unqualified.
Summary of the invention
Therefore, it is necessary to provide a kind of electric connection structure comprising the first connector and the second connector, described first connects
Junctor includes connection gasket, and the connection gasket includes at least two conductive layers and a contact layer on various wirings layer, described
At least two conductive layers and the contact layer are electrically connected, and the contact layer passes through anisotropy conducting medium and second connector
It is electrically connected, at least two conductive layers are staggered and partly overlap.
It there is a need to provide a kind of array substrate, the array substrate includes display area and non-display area, described aobvious
Show region for showing that picture, the non-display area are arranged around the display area, the non-display area includes such as institute
State electric connection structure, the array substrate further includes scan line and data line, first connector and the scan line or number
It is electrically connected according to line, second connector is the driving chip of the driving scan line or data line.
Electric connection structure provided by the present invention and array substrate, since at least two conductive layers are staggered and part
Overlapping increases the overall width of each conductive layer in the plane, enables more conducting particles by contact layer in each conductive layer
Upper generation impression, and then reduce and display panel is judged to by underproof probability according to impression.
Detailed description of the invention
Fig. 1 is the floor map of array substrate provided by the specific embodiment of the invention.
Fig. 2 is array substrate in Fig. 1 along the cross-sectional view in the direction II-II.
Fig. 3 is array substrate in Fig. 1 along the cross-sectional view in the direction III-III.
Fig. 4 is array substrate in Fig. 1 along the cross-sectional view in the direction IV-IV.
Fig. 5 is array substrate in Fig. 1 along the cross-sectional view in the direction V-V.
Fig. 6 is the top view of two metal electrode overlappings in Fig. 2 ~ Fig. 5.
Fig. 7 is the floor map of array substrate provided by another embodiment of the present invention.
Main element symbol description
| Array substrate | 100 |
| Display area | 10 |
| Non-display area | 20 |
| Driving chip | 30 |
| First driving line | 11 |
| Second driving line | 12 |
| Pixel unit | 13 |
| Connection gasket | 21 |
| Connecting line | 211 |
| First connecting line | 211A |
| Second connecting line | 211B |
| Pin | 31 |
| Anisotropic conductive medium | 40 |
| Conducting particles | 41 |
| Insulate colloid | 42 |
| First conductive layer | 22 |
| First insulating layer | 23 |
| First contact hole | 231 |
| Second conductive layer | 24 |
| Second insulating layer | 25 |
| Second contact hole | 251 |
| Contact layer | 26 |
| First part | 20a |
| Second part | 20b |
| Part III | 20c |
| Part IV | 20d |
| First connection gasket group | 21a |
| Second connection gasket group | 21b |
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Referring to Fig. 1, its floor map for array substrate 100 provided by the specific embodiment of the invention.It is described
Array substrate 100 includes display area 10 and non-display area 20.The display area 10 is for showing picture.It is described non-aobvious
Show that area is arranged with 20 around the display area 10.The display area 10 include it is a plurality of be parallel to each other first driving line 11,
A plurality of the second driving line 12 being parallel to each other and intersect with those the first driving insulation of lines 11.It is described it is a plurality of first driving line 11 with
Second driving 12 common definition of line goes out multiple minimum pixel units 13.The non-display area 20 include multiple connection gaskets 21 and
A plurality of connecting line 211.Wherein, a part of connection gasket 21 is used to transmit signal, a part connection for a plurality of first driving line 11
Line 211 is for connecting the connection gasket 21 and the first driving line 11；Another part connection gasket 21 is for receiving an external circuit
Input signal, another part connecting line 211 is for connecting the connection gasket 21 and the external circuit.Multiple connection gasket 21 is electrically
A driving chip 30 is connected, so that the driving chip 30 is via the connecting line 211 and the connection gasket 211 to the display
Transmit electric signal in region 10.In the present embodiment, the first driving line 11 is data line, and the second driving line 12 is to sweep
Retouch line.The structure and the use of the connection gasket 21 and connecting line 211 for for a plurality of first driving line 11 transmitting signal
It is essentially identical in the connection gasket 21 for the input signal for receiving an external circuit and the structure of connecting line 211, below for being to be somebody's turn to do
A plurality of first driving line 11 is described for transmitting the connection gasket 21 of signal and the structure of connecting line 211.
In the present embodiment, multiple connection gasket 21 includes that the first connection gasket group 21a being parallel to each other is connect with second
Pad group 21b.Wherein, the first connection gasket group 21a is between the display area 10 and the second connection gasket group 21b.It is described
Connection gasket 21 in first connection gasket group 21a is staggered with the connection gasket 21 in the second connection gasket group 21b.Described in connection
The connecting line 211 of connection gasket 21 is located at each connection gasket 211 of the first connection gasket group 21a extremely in second connection gasket group 21b
Few side.In the present embodiment, the connecting line 211 for connecting connection gasket 21 in the second connection gasket group 21b is located at described the
The two sides of each connection gasket 211 of one connection gasket group 21a.
Referring to Figure 2 together, the array substrate 100 includes substrate 14, and the connection gasket 21 is set to the substrate 14
On.The driving chip 30 includes pin 31 corresponding with the connection gasket 21, and the pin 31 passes through anisotropic conductive
Medium (anisotropic conductive media) 40 and the connection gasket 21 are electrically connected.In the present embodiment, described
The material of substrate 14 is glass.
The anisotropic conductive medium 40 can be anisotropic conductive film either anisotropy conductiving glue comprising
Conducting particles 41 and insulation colloid 42, conducting particles 41 are distributed in insulation colloid 42.It is being attached pad 21 and pin 31
When being engaged, anisotropic conductive medium 40 is covered on the connection gasket 21 of substrate 14 first, then again by driving chip
30 are placed on anisotropic conductive medium 40, so that the connection gasket 21 in the pin 31 of driving chip 30 and substrate 14 aligns.
Later, using engagement device, such as: engagement pressure head (bounding head) applies pressure on driving chip 30, at this point, driving core
The meeting anisotropic conductive medium 40 of piece 30, and make the upper and lower ends of the conducting particles 41 in anisotropic conductive medium 40
It is electrically connected respectively with connection gasket 21 and pin 31, so that pin 31 passes through the conductive particle in anisotropic conductive medium 40
Son 41 is electrically connected with connection gasket 21.
The connection gasket 21 includes the first conductive layer 22 being set in substrate 14, the covering substrate 14 and the first conductive layer
22 the first insulating layer 23, the second conductive layer 24 being set on first insulating layer 23, covering first insulating layer 23
With the second insulating layer 25 of the second conductive layer 23 and the contact layer 26 being formed in the second insulating layer 25.Described first absolutely
The first contact hole 231 is offered in edge layer 23 so that first conductive layer 22 and the second conductive layer 24 by this first
Contact hole 231 is electrically connected.The second contact hole 251 is offered in the second insulating layer 25, so that the second conductive layer 24
It is electrically connected by the second contact hole 251 with contact layer 26.
First conductive layer 22 and the second conductive layer 24 are non-transparent electrode layer, with the first driving in display area
Material used in line 11 and the second driving line 12 can be identical or different.First conductive layer 22 and the second conductive layer 24
Material can be selected from aluminium, molybdenum, copper, titanium, chromium, gold, silver and its compound.The contact layer 26 is transparency conducting layer, this is transparent to lead
Electric layer includes transparent oxide layer, for example, tin indium oxide (Indium Tin Oxide, ITO), indium zinc oxide (Indium Zinc
Qxide, IZO).
The a plurality of connecting line 211 is located in the substrate 14 and on first insulating layer 23.Also that is, part institute
It states connecting line 211 and first conductive layer 22 is located at same wiring layer, connecting line 211 described in another part is led with described second
Electric layer 24 is located at same wiring layer.
After pressing the pin 31 of driving chip 30 by anisotropy conducting medium 40 and connection gasket 21, anisotropy is conductive
Conducting particles in medium 40 can be generated on first conductive layer 22 or the second conductive layer 24 by contact layer 26 impression with
Judge whether the pin 31 of the driving chip 30 contacts well with connection gasket 21 for operator, first conductive layer 22 and second leads
The edge of electric layer 24 should as close as or beyond the contact layer 26 edge.However, setting in the first conductive layer 22 or
The connecting line 211 of 24 one side of the second conductive layer can hinder first conductive layer 22 or 24 edge of the second conductive layer to extend outwardly.Cause
This, in the specific embodiment of the invention, by the way that the first conductive layer 22 and the second conductive layer 24 are staggered, with increase this
The overall width of one conductive layer 22 and the second conductive layer 24 in the plane, so that conducting particles as much as possible be enable to pass through contact
Layer 26 generates impression on first conductive layer 22 or the second conductive layer 24.In other words, which leads with second
Electric layer 24 is staggered and partly overlaps.
Specifically, different layers are located at the connecting line 211 and close on first conductive layer 22 of the connecting line 211
Second conductive layer 24 close to the connecting line 211 one end alignment or the same direction beyond the contact layer 26 one end.
First conductive layer 22 or the second conductive layer 24 of the connecting line 211 are located on the same floor and closed on the connecting line 211
One end close to the connecting line 211 is exceeded by one end of the same direction of the contact layer 26.Though being appreciated that above description
In mention first conductive layer 22 or the second for being located at different layers with the connecting line 211 and closing on the connecting line 211 and lead
Electric layer 24 is aligned close to one end of the connecting line 211 or one end of the same direction beyond the contact layer 26, but due to system
The deviation of the precision of journey and equipment is located at different layers with the connecting line 211 in actual products and closes on the connecting line 211
First conductive layer 22 or the second conductive layer 24 close to one end of the connecting line 211 sometimes by the contact layer 26
One end of the same direction exceeds.
It is described for aspect, by the connection of 21 two sides of connection gasket 21 and the connection gasket in the first connection gasket group 21a
The definition of line 211 has first part 20a, second part 20b, Part III 20c and Part IV 20d.Please continue to refer to Fig. 2,
First part 20a is located at same wiring positioned at the first connecting line 211A in 21 left side of connection gasket and the first conductive layer 22
Layer is located at same wiring layer positioned at the second connecting line 211B on 21 right side of connection gasket and second conductive layer 24.This first
The right-hand end of conductive layer 22 is aligned or the right-hand end beyond the contact layer 26；The left end of second conductive layer 24 is aligned
Or the left end beyond the contact layer 26.
Referring to Fig. 3, it is the second part 20b in the array substrate 100 along the cross-sectional view in the direction III-III.?
In the second part 20b, positioned at the first connecting line 211A of 21 two sides of connection gasket and the 2nd 211B with the second conductive layer
24 are located at same wiring layer.The left end of first conductive layer 22 is aligned or the left end beyond the contact layer 26；This
The right-hand end of one conductive layer 22 is aligned or the right-hand end beyond the contact layer 26.
Referring to Fig. 4, it is the Part III 20c in the array substrate 100 along the cross-sectional view in the direction IV-IV.Institute
Part III 20c is stated, is located at same wiring positioned at the first connecting line 211A in 21 left side of connection gasket and second conductive layer 24
Layer is located at same wiring layer positioned at the second connecting line 211B on 21 right side of connection gasket and first conductive layer 22.This first is led
The left end of electric layer 22 is aligned or the left end beyond the contact layer 26；The right-hand end of second conductive layer 24 be aligned or
Right-hand end beyond the contact layer 26.
Referring to Fig. 5, it is the Part IV 20d in the array substrate 100 along the cross-sectional view in the direction IV-IV.Institute
State Part IV 20d, positioned at 21 two sides of connection gasket the first connecting line 211A and the second connecting line 211B with this first
Conductive layer 22 is located at same wiring layer.The left end of second conductive layer 24 is aligned or the left-hand end beyond the contact layer 26
Portion；The right-hand end of second conductive layer 24 is aligned or the right-hand end beyond the contact layer 26.
It is first part 20a, second part 20b, Part III 20c or Part IV please again together refering to Fig. 6
The structure top view that coincides of first conductive layer 22 and the second conductive layer 24 in 20d.Perpendicular to 100 surface of array substrate
On direction, first conductive layer 22 overlaps with 24 part of the second conductive layer, the first conductive layer 22 and the second conductive layer 24
Overlapping region is S1, Non-overlapping Domain S2.Preferably, the area summation of Non-overlapping Domain S2 is more than or equal to overlapping region
The a quarter of S1 area.
After the pin 31 of driving chip 30 is pressed by anisotropy conducting medium 40 and connection gasket 21, anisotropy conduction is situated between
Conducting particles in matter 40 can generate impression on first conductive layer 22 and the second conductive layer 24 by contact layer 26 to be made for
Industry person judges whether the pin 31 of the driving chip 30 contacts well with connection gasket 21.Above-mentioned array substrate 100, due to this first
Conductive layer 22 and the second conductive layer 24 are staggered, and the overall width of first conductive layer 22 and the second conductive layer 24 in the plane increases
Add, more conducting particles enable to generate impression on first conductive layer 22 or the second conductive layer 24 by contact layer 26,
And then reduces and array substrate 100 is judged to underproof probability.
The array substrate 100 can be applied in a display panel, for example, the display panel can be liquid crystal display panel
Or organic light emission electroluminescence display panel, in this example it is shown that panel is liquid crystal display panel, but it is not limited to
This.
Referring to Fig. 7, it is appreciated that the connection gasket can also be set in the case where display panel resolution ratio is increasing
It is equipped with three row's connection gasket groups being parallel to each other.As long as being staggered and partly overlapping however, meeting each conductive layer, make each conductive layer
Overall width in the plane increases, and more conducting particles is enable to generate impression on each conductive layer by contact layer
It reduces and array substrate 100 is judged as underproof probability.
Although the present invention is disclosed as above with preferred embodiment, however, it is not to limit the invention, any this field skill
Art personnel, without departing from the spirit and scope of the present invention, when can do various variations, spirit is done according to the present invention for these
Variation should be all included within protection scope of the presently claimed invention.
Claims (11)
1. a kind of electric connection structure comprising the first connector and the second connector, first connector includes connection gasket, institute
Stating connection gasket includes at least two conductive layers and a contact layer on the various wirings layer, at least two conductive layers with it is described
Contact layer is electrically connected, and the contact layer is electrically connected by anisotropy conducting medium and second connector, it is described at least
Two conductive layers are staggered and partly overlap, and at least one of left end of at least two conductive layers is aligned or exceeds should
The left end of contact layer, at least one of right-hand end of at least two conductive layers is aligned or the right side beyond the contact layer
Side end.
2. electric connection structure as described in claim 1, which is characterized in that the connection gasket is set in a substrate, the connection gasket
Including the first conductive layer, the first insulating layer, the second conductive layer, second insulating layer and the contact layer being sequentially arranged in the substrate,
The first contact hole is opened up on first insulating layer so that first conductive layer and the electric connection of the second conductive layer, second insulation
The second contact hole is opened up on layer so that second conductive layer and the contact layer are electrically connected, and second connector connects with described
Contact layer is electrically connected.
3. electric connection structure as claimed in claim 2, which is characterized in that first connector includes first to be parallel to each other
Connection gasket group and the second connection gasket group, the first connection gasket group and the second connection gasket group include multiple connection gaskets, and described the
One connector further includes a plurality of connecting line being electrically connected with the multiple connection gasket, connects and connects in the second connection gasket group
The connecting line of pad is located at at least side of each connection gasket in the first connection gasket group.
4. electric connection structure as claimed in claim 3, which is characterized in that a plurality of connecting line be located at the substrate and
On first insulating layer, it is located at different layers with the connecting line and closes on first conductive layer or second of the connecting line
Conductive layer is close to the alignment of one end of the connecting line or one end of the same direction beyond the contact layer.
5. electric connection structure as claimed in claim 3, which is characterized in that a plurality of connecting line be located at the substrate and
On first insulating layer, first conductive layer or second of the connecting line is located on the same floor and closed on the connecting line
Conductive layer is exceeded close to one end of the connecting line by one end of the same direction of the contact layer.
6. electric connection structure as claimed in claim 3, which is characterized in that connection gasket in the first connection gasket group and described
The connecting line definition of connection gasket two sides has first part, and the connecting line of the first part includes that the first connecting line is connect with second
Line, first connecting line and the first conductive layer are located at same wiring layer, and close to the left side of first conductive layer, second connection
Line and second conductive layer are located at same wiring layer, and close to the right side of second conductive layer, the right-hand end of first conductive layer
Portion's alignment or the right-hand end beyond the contact layer, the left end alignment of second conductive layer or the left side beyond the contact layer
End.
7. electric connection structure as claimed in claim 3, which is characterized in that connection gasket in the first connection gasket group and described
The connecting line definition of connection gasket two sides has second part, and the connecting line of the second part includes that the first connecting line is connect with second
Line, first connecting line and the second conductive layer are located at same wiring layer, and close to the left side of second conductive layer, second connection
Line and second conductive layer are located at same wiring layer, and close to the right side of second conductive layer, the left-hand end of first conductive layer
Portion's alignment or the left end beyond the contact layer, the right-hand end alignment of first conductive layer or the right side beyond the contact layer
End.
8. electric connection structure as claimed in claim 3, which is characterized in that connection gasket in the first connection gasket group and described
The connecting line definition of connection gasket two sides has Part III, and the connecting line of the Part III includes that the first connecting line is connect with second
Line, first connecting line and the second conductive layer are located at same wiring layer, and close to the left side of second conductive layer, second connection
Line and first conductive layer are located at same wiring layer, and close to the right side of first conductive layer, the left-hand end of first conductive layer
Portion's alignment or the left end beyond the contact layer, the right-hand end alignment of second conductive layer or the right side beyond the contact layer
End.
9. electric connection structure as claimed in claim 3, which is characterized in that connection gasket in the first connection gasket group and described
The connecting line definition of connection gasket two sides has Part IV, and the connecting line of the Part IV includes that the first connecting line is connect with second
Line, first connecting line and the first conductive layer are located at same wiring layer, and close to the left side of first conductive layer, second connection
Line and first conductive layer are located at same wiring layer, and close to the right side of first conductive layer, the left-hand end of second conductive layer
Portion's alignment or the left end beyond the contact layer, the right-hand end alignment of second conductive layer or the right side beyond the contact layer
End.
10. electric connection structure as described in claim 1, which is characterized in that at least two conductive layers include overlapping region with
Non-overlapping Domain, the area summation of the Non-overlapping Domain are more than or equal to a quarter of the overlapping region area.
11. a kind of array substrate, the array substrate includes display area and non-display area, and the display area is for showing
Picture, the non-display area are arranged around the display area, and the non-display area includes as appointed in claims 1 to 10
Electric connection structure described in one, the array substrate further include scan line and data line, and first connector is swept with described
Line or data line electrical connection are retouched, second connector is the driving chip of the driving scan line or data line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510147091.6A CN106154594B (en) | 2015-03-31 | 2015-03-31 | Electric connection structure and array substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510147091.6A CN106154594B (en) | 2015-03-31 | 2015-03-31 | Electric connection structure and array substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106154594A CN106154594A (en) | 2016-11-23 |
| CN106154594B true CN106154594B (en) | 2019-08-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510147091.6A Active CN106154594B (en) | 2015-03-31 | 2015-03-31 | Electric connection structure and array substrate |
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| CN (1) | CN106154594B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106773389A (en) * | 2016-12-30 | 2017-05-31 | 惠科股份有限公司 | Liquid crystal display device and panel thereof, and connection structure of display panel and system circuit |
| CN111710312B (en) * | 2020-07-06 | 2021-08-27 | 北京显芯科技有限公司 | Drive circuit, LCD display screen and electronic equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1885516A (en) * | 2005-06-23 | 2006-12-27 | 矽创电子股份有限公司 | Structure of electric connection pad |
| CN101840899A (en) * | 2009-03-19 | 2010-09-22 | 瀚宇彩晶股份有限公司 | Grounding structure |
| CN101969063A (en) * | 2010-08-27 | 2011-02-09 | 友达光电股份有限公司 | Pixel array substrate, conducting structure and display panel |
| TWI387763B (en) * | 2009-03-12 | 2013-03-01 | Au Optronics Corp | Bonding pad structure, chip bonding structure and method of examining chip bonding condition |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100672622B1 (en) * | 2000-07-26 | 2007-01-23 | 엘지.필립스 엘시디 주식회사 | Pad of liquid crystal display device and method for manufacturing the same |
| TWI419095B (en) * | 2010-10-25 | 2013-12-11 | Au Optronics Corp | Display device |
-
2015
- 2015-03-31 CN CN201510147091.6A patent/CN106154594B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1885516A (en) * | 2005-06-23 | 2006-12-27 | 矽创电子股份有限公司 | Structure of electric connection pad |
| TWI387763B (en) * | 2009-03-12 | 2013-03-01 | Au Optronics Corp | Bonding pad structure, chip bonding structure and method of examining chip bonding condition |
| CN101840899A (en) * | 2009-03-19 | 2010-09-22 | 瀚宇彩晶股份有限公司 | Grounding structure |
| CN101969063A (en) * | 2010-08-27 | 2011-02-09 | 友达光电股份有限公司 | Pixel array substrate, conducting structure and display panel |
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| CN106154594A (en) | 2016-11-23 |
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