TWM514606U - Touch module - Google Patents

Abstract

A touch module used in a touch display apparatus having a back cover. The touch module includes a thick substrate, a first thin substrate, a first electrode layer, a first adhesive layer, a second thin substrate, a second electrode layer, and a second adhesive layer. The thick substrate is configured to provide a rigid support to the touch module. The first electrode layer is disposed on the first thin substrate. The first adhesive layer is adhered between the thick substrate and the first thin substrate on which the first electrode layer is disposed. The second thin substrate includes a surface for touching operations. The second electrode layer is disposed on another surface of the second thin substrate opposite to the surface for touching operations. The second adhesive layer is adhered between the first thin substrate on which the first electrode layer is disposed and the second electrode layer. Each of the first thin substrate and the second thin substrate has a first thickness. The thick substrate has a second thickness greater than the first thickness.

Description

Touch module

The present invention relates to a touch module, and more particularly to a fingerprint recognition touch module.

With the rapid development of electronic technology, touch modules have been widely used in various electronic devices, such as mobile phones, tablets, and the like. A typical touch module can be disposed on the display screen and includes a plurality of touch electrodes. When an object (finger or touch pen, etc.) approaches or touches the display screen, the corresponding touch electrode generates an electrical signal, thereby achieving touch sensing.

The structure of the conventional touch module is, from top to bottom, a cover glass, an adhesive layer, a receiving sensing layer (Rx seonsor), a glass substrate, and a driving sensing layer (Tx sensor). The glass cover and the glass substrate have a large thickness in order to provide a certain strength, and are usually 500 to 700 μm. This conventional architecture has no problem for general touch applications (for example, identification of touch behaviors such as performing clicks and sliding pages), but it is not suitable for special touch applications requiring high-precision sensing (for example, fingerprint recognition). ). Specifically, this conventional architecture faces the problem of insufficient sensitivity and identification of fingerprint sensing due to thickness factors when it is required to maintain the strength of the glass cover.

In view of this, the present invention proposes a touch module that can be applied to fingerprint recognition by improving the structural design of the touch module.

According to one embodiment of the present invention, a touch module includes a thick substrate for providing hard support for the touch module, a first thin substrate for carrying the electrode layer, and a first electrode layer disposed at the first thin layer. a first adhesive layer, a thick substrate and a first thin substrate provided with a first electrode layer; a second thin substrate comprising a surface for a touch operation; and a second electrode layer disposed on the second thin substrate relative to the substrate And a second adhesive layer bonded to the first thin substrate and the second electrode layer provided with the first electrode layer, wherein the second thin substrate has a first thickness and the thick substrate has a second surface The thickness is greater than the first thickness.

In one or more embodiments of the present invention, the thickness of the first thin substrate is the same as the thickness of the second thin substrate.

In one or more embodiments of the present invention, the first thickness is 75 to 125 microns.

In one or more embodiments of the present invention, the first thickness described above is 100 microns.

In one or more embodiments of the present invention, the first electrode layer is separated from the second electrode layer by a distance, and the distance is 100 to 200 microns.

In one or more embodiments of the present creation, the distance described above is 125 microns.

In one or more embodiments of the present invention, the first electrode layer and the second electrode layer each include a plurality of electrode lines. The electrode wires are arranged in parallel according to a pitch, and the pitch is 50 to 70 μm.

In one or more embodiments of the present invention, the spacing described above is 60 microns.

In one or more embodiments of the present invention, the first electrode layer and the second electrode layer each include a plurality of electrode lines. Each electrode line has a line width and the line width is 3 to 10 microns.

In one or more embodiments of the present invention, the line width described above is 5 microns.

In one or more embodiments of the present invention, the second thickness is 500 to 600 micrometers.

In one or more embodiments of the present invention, the first electrode layer is a driving sensing layer, and the second electrode layer is a receiving sensing layer.

In one or more embodiments of the present invention, the thick substrate has a first through hole, the first thin substrate has a second through hole, and the first through hole exposes the second through hole.

In one or more embodiments of the present invention, the touch module further includes a first touch wafer and a second touch wafer. The first touch wafer is disposed on the first thin substrate and located in the first through hole and bonded to the first electrode layer. The second touch wafer is disposed on the second thin substrate and located in the second through hole and bonded to the second electrode layer.

In one or more implementations of the present invention, the touch module further includes a touch wafer. The touch wafer is bonded to the first electrode layer and the second electrode layer via the first through hole and the second through hole, respectively.

In one or more embodiments of the present invention, the touch module further includes a light shielding layer. The light shielding layer is disposed between the second thin substrate and the portion of the second electrode layer, and the front projection of the first through hole to the light shielding layer overlaps with the light shielding layer.

In one or more embodiments of the present invention, the second thickness is 4 to 6 times the first thickness.

In summary, the touch module of the present invention places the receiving sensing layer (ie, the second electrode layer) on a thin substrate (ie, the second thin substrate), and uses the thin substrate as a finger when the user touches Direct contact with the component, thus improving the sensitivity and recognition of the sensing fingerprint when receiving the sensing layer. Moreover, the driving sensing layer (ie, the first electrode layer) of the touch module is also disposed on another thin substrate (ie, the first thin substrate), and the thin substrate is further adhered to the receiving sensing layer, thereby increasing the driving sensing layer. The mutual capacitance value between the receiving and sensing layers can be driven by an existing IC. Furthermore, the touch module is further bonded to the driving sensing layer by a thick substrate having a thickness larger than that of the first thin substrate and the second thin substrate, thereby making up for the shortage of the mechanical strength of the two thin substrates. With the above configuration, the touch module of the present invention can be used for fingerprint recognition applications requiring high precision sensing.

The above description is only used to explain the problems to be solved by the present invention, the technical means for solving the problems, the effects thereof, and the like, and the specific details of the present invention will be described in detail in the following embodiments and related drawings.

1, 3‧‧‧ touch display device

10‧‧‧Back cover

100‧‧‧ assembly port

12, 32‧‧‧ touch module

120‧‧‧ Thick substrate

120a‧‧‧First perforation

121‧‧‧First thin substrate

121a‧‧‧Second perforation

122‧‧‧First electrode layer

122a, 125a‧‧‧electrode lines

122b, 125b‧‧‧ joint pads

123a‧‧‧First adhesive layer

123b‧‧‧Second adhesive layer

124‧‧‧Second thin substrate

125‧‧‧Second electrode layer

126a‧‧‧First touch chip

126b‧‧‧second touch chip

127‧‧‧ shading layer

326‧‧‧ touch wafer

326a, 326b‧‧‧ conductive bumps

14‧‧‧Display module

140‧‧‧Sequence Control Board

142‧‧‧Soft circuit board

D‧‧‧Distance

P‧‧‧ spacing

T1‧‧‧first thickness

T2‧‧‧second thickness

W‧‧‧Line width

The above and other objects, features, advantages and embodiments of the present invention can be more clearly understood. The description of the drawings is as follows: FIG. 1 is a diagram showing the touch module of the present embodiment applied to touch A schematic cross-sectional view of the display device.

FIG. 2A is a perspective assembled view of the touch module according to an embodiment of the present invention.

FIG. 2B is a perspective exploded view of the touch module in FIG. 2A.

FIG. 3 is a partial top view showing the first electrode layer and the second electrode layer in an embodiment of the present invention.

Fig. 4A is a top view showing the thick substrate in Fig. 2A.

4B is a top view showing a thick substrate of another embodiment of the present creation.

FIG. 5 is a cross-sectional view showing the touch module of another embodiment of the present invention applied to the touch display device.

Figure 6 is a cross-sectional view showing the touch module of Figure 5 along line 6-6'.

In the following, a plurality of embodiments of the present invention will be disclosed in the drawings. For the sake of clarity, a number of practical details will be described in the following description. However, it should be understood that these practical details are not applied to limit the creation. That is to say, in the implementation part of this creation, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

Please refer to Figures 1 to 2B. FIG. 1 is a cross-sectional view showing the touch panel 12 applied to the touch display device 1 according to an embodiment of the present invention. FIG. 2A is a perspective assembled view of the touch module 12 according to an embodiment of the present invention. FIG. 2B is a perspective exploded view of the touch module 12 in FIG. 2A.

As shown in FIG. 1 to FIG. 2B , in the present embodiment, the touch display device 1 includes at least a back cover 10 , a touch module 12 , and a display module 14 . The back cover 10 has an assembly opening 100. The touch module 12 is fixed to the assembly port 100. The display module 14 is disposed between the back cover 10 and the touch module 12 and is located in the accommodating space formed by the back cover 10 and the touch module 12 . The touch module 12 is permeable to light, so that the user can view the screen displayed by the display module 14 through the touch module 12. In one embodiment, the display module 14 is the liquid crystal display module 14, but the present invention is not limited thereto.

The touch module 12 includes a thick substrate 120, a first thin substrate 121, a first electrode layer 122, a first adhesive layer 123a, a second thin substrate 124, a second electrode layer 125, and a second adhesive layer 123b. The thick substrate 120 is used to provide hard support for the touch module 12; the thick substrate 120 is engaged with the back cover 10. The first electrode layer 122 is disposed on the first thin substrate 121. The first electrode layer 122 of the present embodiment is disposed, for example, on the lower surface of the first thin substrate 121. In other embodiments, the first electrode layer 122 is also disposed. It may be disposed on the upper surface of the first thin substrate 121. The second thin substrate 124 includes a touch-operated surface. Specifically, the upper surface of the second thin substrate 124 is a surface for a user to touch. The second electrode layer 125 is disposed on the second thin substrate 124. The second electrode layer 125 of the present embodiment is disposed on the lower surface of the second thin substrate 124.

The first adhesive layer 123a is used to bond the thick substrate 120 and the first thin substrate 121 having the first electrode layer 122. The first adhesive layer 123a of the present embodiment is specifically bonded between the thick substrate 120 and the first electrode layer 122. . The second adhesive layer 123b is used to bond the first thin substrate 121 provided with the first electrode layer 122 and the second thin substrate 124 provided with the second electrode layer 125. The second adhesive layer 123b of the embodiment is bonded to the first The thin substrate 121 is between the second electrode layer 125. . The thick substrate 120 is the substrate closest to the display module 14 of the touch module 12, and the second thin substrate 124 is the substrate of the touch module 12 farthest from the display module 14 for the user. Touching the finger to make touch behavior.

Further, the second thin substrate 124 has a first thickness t1, the thick substrate 120 has a second thickness t2, and the second thickness t2 is 4 to 6 times the first thickness t1. In various embodiments, the second thin substrate 124 has a first thickness t1 of 75 to 125 microns, and preferably 100 microns. Compared with the conventional glass cover (about 500 to 700 micrometers), the thickness of the second thin substrate 124 of the present invention can be designed to bring the distance between the user's finger and the second electrode layer 125 closer. The sensitivity and recognition of the sensing of the finger by the second electrode layer 125 are greatly improved, which is beneficial to the related application of fingerprint recognition. In one embodiment, the first thin substrate 121 and the second thin substrate 124 have the same thickness, but the present invention is not limited thereto.

In the actual manufacturing process, the first electrode layer 122 and the second electrode layer 125 are respectively disposed on the first thin substrate 121 and the second thin substrate 124 and are adhered to each other to form a semi-finished product of the touch module 12 . As described above, the thicknesses of the first thin substrate 121 and the second thin substrate 124 are greatly reduced for the application of fingerprint recognition, and the present invention further designs the thick substrate 120 to be attached to the semi-finished product of the touch module 12 described above. To enhance the overall mechanical strength of the touch module 12. Yu Yi In the embodiment, the second thickness t2 of the thick substrate 120 is 500 to 600 micrometers, but the present invention is not limited thereto. In general, the thicknesses of the first thin substrate 121 and the second thin substrate 124 of the present embodiment are smaller than the thickness of the thick substrate 120.

Please refer to FIG. 3 , which is a partial top view of the first electrode layer 122 and the second electrode layer 125 according to an embodiment of the present invention. As shown, the first electrode layer 122 (such as the drive sensing layer) and the second electrode layer 125 (such as the receiving sensing layer) each include a plurality of electrode lines 122a, 125a. The extending direction of any one of the electrode lines 122a of the first electrode layer 122 and the second electrode layer 125 is perpendicular to each other, so that the first electrode layer 122 and the second electrode layer 125 form a mesh, but Creation is not limited to this.

The fingerprint of a typical adult's fingerprint is about 75 microns. In various embodiments, the electrode line 122a of the first electrode layer 122 and the electrode line 125a of the second electrode layer 125 are each arranged in parallel according to a pitch P, and the pitch is 50 to 70 micrometers, preferably 60 micrometers. By designing the pitch P of the electrode line 122a of the first electrode layer 122 and the electrode line 125a of the second electrode layer 125 to be less than 75 μm, the line width W of each of the electrode lines 122a and 125a is designed to be 3 to 10 micrometers, preferably 5 micrometers, can achieve the purpose of detecting the wave front and trough of the user's fingerprint, and even if the sensing precision of the first electrode layer 122 and the second electrode layer 125 is raised to the fingerprint recognition level.

In various embodiments, the electrode line 122a of the first electrode layer 122 and the electrode line 125a of the second electrode layer 125 are metal wires, and may be, for example, fine line printing or yellow light. Made by the process, but this creation is not limited to this.

In the metal mesh structure formed by the first electrode layer 122 and the second electrode layer 125, in order to increase the mutual capacitance between the first electrode layer 122 and the second electrode layer 125 to the driving capability of the existing IC The scope of the present invention further designs the distance D between the first electrode layer 122 and the second electrode layer 125 to be 100 to 200 micrometers. For example, in one embodiment, the first thickness t1 of the first thin substrate 121 is 100 micrometers, and the thickness of the second adhesive layer 123b may be 25 micrometers, so the first electrode layer 122 is separated from the second electrode layer 125. The distance D is 125 microns.

In the embodiment, the first adhesive layer 123a for bonding the thick substrate 120 and the first electrode layer 122 and the second adhesive layer 123b for bonding the first thin substrate 121 and the second electrode layer 125 may be Optically Clear Adhesive (OCA) or water gel, but this creation is not limited to this.

As shown in FIGS. 1 and 2B, in the present embodiment, the thick substrate 120 has a first through hole 120a, the first thin substrate 121 has a second through hole 121a, and the first through hole 120a exposes the second through hole 121a. The touch module 12 further includes a first touch wafer 126a and a second touch wafer 126b. The first touch wafer 126a is disposed on the first thin substrate 121 and located in the first through hole 120a of the thick substrate 120 and bonded to the first electrode layer 122. For example, conductive bumps (not shown) on the first touch wafer 126a are bonded to bond pads (not shown) on the first electrode layer 122. The second touch wafer 126b is disposed on the second thin substrate 124 and located in the second through hole 121a of the first thin substrate 121 and bonded to the second electrode layer 125. For example, conductive bumps (not shown) on the second touch wafer 126b are bonded to bond pads (not shown) on the second electrode layer 125. In addition, the display module 14 further includes a Timing-Control board 140 and Flexible circuit board 142. The flexible circuit board 142 is connected to the timing control board 140 and is bonded to the first electrode layer 122 and the second electrode layer 125 through the first through hole 120a of the thick substrate 120 and the second through hole 121a of the first thin substrate 121, respectively.

It is to be noted that, in general, the pitch of the bonding pads (not shown) of the first electrode layer 122 and the second electrode layer 125 is about 12 micrometers. In this embodiment, the first touch wafer 126a and the second touch wafer 126b are respectively bonded to the first electrode layer 122 and the second electrode layer 125. Therefore, the first thin substrate 121 and the second thin substrate 124 are both The tolerance of the fit tolerance can be relaxed, which is beneficial to the improvement of the process yield. Furthermore, since the number of the electrode lines 122a of the first electrode layer 122 and the electrode lines 125a of the second electrode layer 125 are several thousand, the first touch wafer 126a and the second touch wafer 126b are independently driven first. The structure of the electrode layer 122 and the second electrode layer 125, the size of the first touch wafer 126a and the second touch wafer 126b are not too large, so there is more space for the two to design circuits such as amplifiers to increase the driving. ability. In addition, the first touch wafer 126a and the second touch wafer 126b are respectively disposed in the first through hole 120a and the second through hole 121a, and can also be prevented in a subsequent Drop Test or Push Test. A touch wafer 126a and a second touch wafer 126b are damaged.

As shown in FIG. 1 , in the embodiment, the touch module 12 further includes a light shielding layer 127 . The light shielding layer 127 is disposed between the second thin substrate 124 and a portion of the second electrode layer 125. Generally, the area of the touch display device 1 corresponding to the light shielding layer 127 is defined as a non-visible area, and the area of the touch display device 1 corresponding to the light shielding layer 127 is defined as a visible area. The metal grid formed by the first electrode layer 122 and the second electrode layer 125 covers the entire visible area and extends at least partially to the non- Visible area. According to the above-mentioned structural configuration of the touch module 12, the touch application of the user can perform fingerprint recognition in the visible area. Further, in the present embodiment, the orthographic projection of the first through hole 120a to the light shielding layer 127 of the thick substrate 120 is overlapped with the light shielding layer 127. In other words, the first through hole 120a of the thick substrate 120 and the second through hole 121a of the first thin substrate 121 are located in the non-visible area, so that the first electrode layer 122 and the second electrode layer 125 are not affected by the user. Touch behavior in the visible area.

In one embodiment, the light shielding layer 127 is an ink layer, but the present invention is not limited thereto.

Please refer to FIG. 4A, which is a top view of the thick substrate 120 in FIG. 2A. In the present embodiment, the first through hole 120a of the thick substrate 120 is a closed perforation. The closed first perforation 120a allows the thick substrate 120 to have better structural strength. However, this creation is not limited to this. Please refer to FIG. 4B , which is a top view of the thick substrate 120 of another embodiment of the present invention. In the present embodiment, the first through hole 120a of the thick substrate 120 is an open perforation. That is, the first perforations 120a extend to the edges of the thick substrate 120, in other words, from the top view point of view, the edges of the thick substrate 120 are formed into a concave shape by the arrangement of the first perforations 120a. The open first perforation 120a facilitates the fabrication of the thick substrate 120.

Please refer to FIG. 5 , which is a schematic cross-sectional view of the touch control module 3 applied to the touch display device 3 according to another embodiment of the present invention. As shown in the figure, the touch display device 3 includes a back cover 10, a touch module 32, and a display module 14. The touch module 32 includes a thick substrate 120, a first thin substrate 121, a first electrode layer 122, a first adhesive layer 123a, a second thin substrate 124, a second electrode layer 125, and a second adhesive layer. Layer 123b. For the structure, function, and connection relationship of the same elements in FIG. 5 and those in the first embodiment, reference may be made to the above related description, and details are not described herein again. It should be noted that the difference between the embodiment and the embodiment shown in FIG. 1 is that the touch module 32 of the present embodiment includes only a single touch wafer 326. The touch wafer 326 is bonded to the first electrode layer 122 and the second electrode layer 125 via the opening of the first through hole 120a of the thick substrate 120 and the second through hole 121a of the first thin substrate 121, respectively.

In detail, please refer to FIG. 6 , which is a cross-sectional view of the touch module 32 along the line segment 6-6 ′ in FIG. 5 . As shown, the first electrode layer 122 has a bonding pad 122b on the first thin substrate 121, and the second electrode layer 125 has a bonding pad 125b on the first thin substrate 121 and in the second through hole 121a. In contrast, touch wafer 326 has conductive bumps 326a, 326b. For example, the conductive bumps 326a, 326b are gold bumps, but the creation is not limited thereto. The touch wafer 326 is bonded to the bond pads 122b, 125b by conductive bumps 326a, 326b, respectively. In practical applications, the bonding tolerance between the first thin substrate 121 and the second thin substrate 124 can be controlled to be smaller than the pitch of the bonding pads 122b of the first electrode layer 122 and the bonding pads 125b of the second electrode layer 125. The pitch of the conductive bumps 326a, 326b can be accurately bonded to the bond pads 122b, 125b, respectively, when the touch wafer 326 is bonded.

From the above detailed description of the specific implementation of the present invention, it can be clearly seen that the touch module of the present invention sets the receiving sensing layer (ie, the second electrode layer) on a thin substrate (ie, the second thin substrate). The thin substrate is used as a component for direct contact of the finger when the user touches, thereby improving sensitivity and recognition when receiving the fingerprint of the sensing layer. And the driving sensing layer of the touch module (ie The first electrode layer is also disposed on another thin substrate (ie, the first thin substrate), and the thin substrate is further adhered to the receiving sensing layer, thereby increasing the mutual capacitance between the driving sensing layer and the receiving sensing layer, and Can be driven by existing ICs. Furthermore, the touch module is further bonded to the driving sensing layer by a thick substrate having a thickness larger than that of the first thin substrate and the second thin substrate, thereby making up for the shortage of the mechanical strength of the two thin substrates. With the above configuration, the touch module of the present invention can be used for fingerprint recognition applications requiring high precision sensing.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the present creation. The scope is subject to the definition of the scope of the patent application.

1‧‧‧Touch display device

10‧‧‧Back cover

100‧‧‧ assembly port

12‧‧‧Touch Module

120‧‧‧ Thick substrate

120a‧‧‧First perforation

121‧‧‧First thin substrate

121a‧‧‧Second perforation

122‧‧‧First electrode layer

123a‧‧‧First adhesive layer

123b‧‧‧Second adhesive layer

124‧‧‧Second thin substrate

125‧‧‧Second electrode layer

126a‧‧‧First touch chip

126b‧‧‧second touch chip

127‧‧‧ shading layer

14‧‧‧Display module

140‧‧‧Sequence Control Board

142‧‧‧Soft circuit board

D‧‧‧Distance

T1‧‧‧first thickness

T2‧‧‧second thickness

Claims (17)

A touch module includes: a thick substrate for providing hard support for the touch module; a first thin substrate; a first electrode layer disposed on the first thin substrate; a first adhesive layer, Bonding the thick substrate to the first thin substrate provided with the first electrode layer; a second thin substrate comprising a touch-operated surface; and a second electrode layer disposed on the second thin substrate relative to the supply a second surface of the touch-operated surface; and a second adhesive layer bonded between the first thin substrate and the second electrode layer provided with the first electrode layer; wherein the second thin substrate has a first The thickness of the thick substrate has a second thickness greater than the first thickness. The touch module of claim 1, wherein the thickness of the first thin substrate is the same as the thickness of the second thin substrate. The touch module of claim 1, wherein the first thickness is 75 to 125 microns. The touch module of claim 3, wherein the first thickness is 100 micrometers. The touch module of claim 1, wherein the first electrode layer is separated from the second electrode layer by a distance, and the distance is 100 to 200 micrometers. The touch module of claim 5, wherein the distance is 125 microns. The touch module of claim 1, wherein the first electrode layer and the second electrode layer each comprise a plurality of electrode lines, the electrode lines are arranged in parallel according to a pitch, and the spacing is 50 to 70 microns. The touch module of claim 7, wherein the pitch is 60 micrometers. The touch module of claim 1, wherein the first electrode layer and the second electrode layer each comprise a plurality of electrode lines, each of the electrode lines having a line width, and the line width is 3 to 10 microns. The touch module of claim 9, wherein the line width is 5 micrometers. The touch module of claim 1, wherein the second thickness is 500 to 600 micrometers. The touch module of claim 1, wherein the first electrode layer is a driving sensing layer, and the second electrode layer is a receiving sensing layer. The touch module of claim 1, wherein the thick substrate has a first through hole, the first thin substrate has a second through hole, and the first through hole exposes the second through hole. The touch module of claim 13, further comprising: a first touch wafer disposed on the first thin substrate and located in the first through hole and bonded to the first electrode layer; A second touch wafer is disposed on the second thin substrate and located in the second through hole and bonded to the second electrode layer. The touch module of claim 13 further comprising a touch wafer, wherein the touch wafer is bonded to the first electrode layer and the second electrode layer via the first through hole and the second through hole, respectively. The touch module of claim 13, further comprising a light shielding layer disposed between the second thin substrate and a portion of the second electrode layer, and the first through hole to the light shielding layer An orthographic projection overlaps the light shielding layer. The touch module of claim 1, wherein the second thickness is 4 to 6 times the first thickness.