CN106445211B - Touch-control module - Google Patents

Touch-control module Download PDF

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Publication number
CN106445211B
CN106445211B CN201510475911.4A CN201510475911A CN106445211B CN 106445211 B CN106445211 B CN 106445211B CN 201510475911 A CN201510475911 A CN 201510475911A CN 106445211 B CN106445211 B CN 106445211B
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touch
control module
thin substrate
electrode
substrate
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CN106445211A (en
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林俊民
王旨伟
游雅筠
谢曜任
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CHEN SHENG PHOTOELECTRIC Co Ltd
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CHEN SHENG PHOTOELECTRIC Co Ltd
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Priority to CN201510475911.4A priority Critical patent/CN106445211B/en
Priority to TW104129531A priority patent/TWI575417B/en
Priority to TW104214468U priority patent/TWM514606U/en
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Abstract

The present invention discloses a kind of touch-control module, includes thick substrate, the first thin substrate, first electrode layer, the first bonding coat, the second thin substrate, the second electrode lay and the second bonding coat.Thick substrate is to provide rigid support for the touch-control module.First electrode layer is set in the first thin substrate.First bonding coat binds thick substrate and the first thin substrate for being equipped with first electrode layer.Second thin substrate includes the surface of operation for touch.The second electrode lay is set on another surface of second thin substrate relative to the surface of operation for touch.Second bonding coat is bonding on the first thin substrate and the second electrode lay equipped with first electrode layer.Second thin substrate has first thickness, and the second thickness that thick substrate has is greater than first thickness.Touch-control module of the invention can be used in the identification of fingerprint application for needing high precision to incude.

Description

Touch-control module
Technical field
The present invention relates to a kind of touch-control modules, in particular to a kind of identification of fingerprint touch-control module.
Background technique
With the rapid progress of electronics technology, touch-control module has been widely used in various electronic device, such as mobile Phone, tablet computer etc..Typical touch-control module may be disposed on display screen, including multiple touch control electrodes.In object (hand Refer to or touching pen etc.) close or touching display screen when, corresponding touch control electrode generates electric signal, reaches touch-control sensing whereby.
The framework of existing touch-control module is from top to bottom sequentially glass cover-plate (cover glass), adhesion layer, receives sense Answer layer (Rx sensor), glass substrate and driving inductive layer (Tx sensor).Glass cover-plate and glass substrate are in order to provide Certain intensity and there is biggish thickness, usually 500-700 microns.This existing framework applies (example for general touch-control Such as, execute the identification for the touch-controls behavior such as clicking, slide the page) on simultaneously no problem, but can not simultaneously be competent at and high precision is needed to incude Special touch-control apply (for example, identification of fingerprint).Particularly, this existing framework in the existing intensity of glass cover-plate to be maintained and When applied to identification of fingerprint, it will face the sensitivity (sensitivity) and identification of fingerprint induction because of thickness factor (identification) insufficient problem.
Summary of the invention
In view of this, the present invention designs improvement by the structure of touch-control module, a kind of fingerprint recognition that can be applied to is proposed Touch-control module.
An embodiment according to the present invention, provides a kind of touch-control module, includes thick substrate, to provide for touch-control module Rigid support;First thin substrate, to carry electrode layer;First electrode layer is set in the first thin substrate;First bonding coat, Bind thick substrate and the first thin substrate for being equipped with first electrode layer;Second thin substrate, the surface comprising operation for touch;Second electricity Pole layer, is set on another surface of second thin substrate relative to the surface of operation for touch;And second bonding coat, it is bonding on The first thin substrate and the second electrode lay equipped with first electrode layer, wherein the second thin substrate has first thickness, thick substrate has Second thickness is greater than first thickness.
In one or more embodiments of the invention, the thickness of the first above-mentioned thin substrate and the thickness of the second thin substrate It is identical.
In one or more embodiments of the invention, above-mentioned first thickness is 75 to 125 microns.
In one or more embodiments of the invention, above-mentioned first thickness is 100 microns.
In one or more embodiments of the invention, above-mentioned first electrode layer and the second electrode lay separate a distance, And this distance is 100 to 200 microns.
In one or more embodiments of the invention, above-mentioned distance is 125 microns.
In one or more embodiments of the invention, above-mentioned first electrode layer and the second electrode lay respectively include multiple electricity Polar curve.Electrode wires are arranged in parallel according to a spacing, and this spacing is 50 to 70 microns.
In one or more embodiments of the invention, above-mentioned spacing is 60 microns.
In one or more embodiments of the invention, above-mentioned first electrode layer and the second electrode lay respectively include multiple electricity Polar curve.Each electrode wires have a line width, and this line width is 3 to 10 microns.
In one or more embodiments of the invention, above-mentioned line width is 5 microns.
In one or more embodiments of the invention, above-mentioned second thickness is 500 to 600 micromillimetres.
In one or more embodiments of the invention, above-mentioned first electrode layer is driving inductive layer, and second electrode Layer is reception inductive layer.
In one or more embodiments of the invention, above-mentioned thick substrate has the first perforation, and the first thin substrate has Second perforation, and the first perforation exposes the second perforation.
In one or more embodiments of the invention, above-mentioned touch-control module also includes the first touch chip and second Touch chip.First touch chip is set in the first thin substrate and is located in the first perforation, and is bonded to first electrode layer. Second touch chip is set in the second thin substrate and is located in the second perforation, and is bonded to the second electrode lay.
In one or more embodiments of the invention, above-mentioned touch-control module also includes touch chip.Touch chip point First electrode layer and the second electrode lay are not bonded to via the first perforation and the second perforation.
In one or more embodiments of the invention, above-mentioned touch-control module also includes light shield layer.Light shield layer is set to Between second thin substrate and partial second electrode layer, and the orthographic projection of the first perforation to light shield layer is Chong Die with light shield layer.
In one or more embodiments of the invention, above-mentioned second thickness is 4 to 6 times of first thickness.
In conclusion touch-control module of the invention, which will receive inductive layer (i.e. the second electrode lay), is set to a thin substrate (i.e. Second thin substrate) on, and the component that finger directly contacts when using this thin substrate as user's touch-control, therefore reception sense can be promoted Sensitivity and identification when layer being answered to incude fingerprint.Also, the driving inductive layer (i.e. first electrode layer) of touch-control module is also provided with In in another thin substrate (i.e. the first thin substrate), and this thin substrate again with receive inductive layer and be bonded, use increase and driving inductive layer With receive the mutual capacitance between inductive layer, and can be driven by existing IC.Furthermore touch-control module is greater than the first thin base again with thickness Plate and the thick substrate of the second thin substrate are bonded with driving inductive layer, are used and are made up above-mentioned two thin substrate on laser intensity not Foot.It is configured by above structure, touch-control module of the invention can be used in the identification of fingerprint application for needing high precision to incude.
Below in conjunction with the drawings and specific embodiments, the present invention will be described in detail, but not as a limitation of the invention.
Detailed description of the invention
Fig. 1 is diagrammatic cross-section of the touch-control module applied to touch control display device for being painted an embodiment of the present invention.
Fig. 2A is the three-dimensional combination figure for being painted the touch-control module of an embodiment of the present invention.
Fig. 2 B is the exploded perspective figure for the touch-control module being painted in Fig. 2A.
Fig. 3 is the first electrode layer for being painted an embodiment of the present invention and the partial top view of the second electrode lay.
Fig. 4 A is the top view for the thick substrate being painted in Fig. 2A.
Fig. 4 B is the top view for being painted the thick substrate of another embodiment of the present invention.
Fig. 5 is to be painted the touch-control module of another embodiment of the present invention to be applied to the diagrammatic cross-section of touch control display device.
Fig. 6 is the diagrammatic cross-section of the touch-control module that is painted in Fig. 5 along line segment 6-6 '.
Specific embodiment
Technical solution of the present invention is described in detail in the following with reference to the drawings and specific embodiments, to be further understood that The purpose of the present invention, scheme and effect, but it is not intended as the limitation of scope of the appended claims of the present invention.
Please refer to Fig. 1 to Fig. 2 B.Fig. 1 is to be painted the touch-control module 12 of an embodiment of the present invention to be applied to touch-control and show and set Standby 1 diagrammatic cross-section.Fig. 2A is the three-dimensional combination figure for being painted the touch-control module 12 of an embodiment of the present invention.Fig. 2 B is to be painted The exploded perspective figure of touch-control module 12 in Fig. 2A.
As shown in Fig. 1 to Fig. 2 B, in present embodiment, touch control display device 1 includes at least back-cover 10, touch-control module 12 And display module 14.Back-cover 10 has assembly mouth 100.Touch-control module 12 is fixed on assembly mouth 100.Display module 14 is set to Between back-cover 10 and touch-control module 12, and it is located at back-cover 10 and is formed by accommodating space with touch-control module 12.Touch-control module 12 It is light-permeable, therefore user can pass through touch-control module 12 and watch picture shown by display module 14.In an embodiment, Display module 14 is LCD MODULE 14, but the present invention is not limited thereto.
Touch-control module 12 includes thick substrate 120, the first thin substrate 121, first electrode layer 122, the first bonding coat 123a, the Two thin substrates 124, the second electrode lay 125 and the second bonding coat 123b.Thick substrate 120 is to provide rigid branch for touch-control module 12 Support;Thick substrate 120 is sticked in back-cover 10.First electrode layer 122 is set in the first thin substrate 121, first electricity of the present embodiment Pole layer 122 is for example set on the lower surface of the first thin substrate 121, and in other embodiments, first electrode layer 122 can also The upper surface of the first thin substrate 121 is arranged in.Second thin substrate 124 includes the surface of an operation for touch, specifically, the The upper surface of two thin substrates 124 is the surface for user's touch operation.The second electrode lay 125 is set to the second thin substrate 124 On, the second electrode lay 125 of the present embodiment is the lower surface for being set to the second thin substrate 124.
First bonding coat 123a is to bind thick substrate 120 and be equipped with the first thin substrate 121 of first electrode layer 122, originally First bonding coat 123a of embodiment is specifically to be bonding between thick substrate 120 and first electrode layer 122.Second bonding coat 123b To bind the first thin substrate 121 for being equipped with first electrode layer 122 and the second thin substrate 124 equipped with the second electrode lay 125, this Second bonding coat 123b of embodiment is bonding between the first thin substrate 121 and the second electrode lay 125.From the point of view of overall architecture, Thick substrate 120 is the substrate of the closest display module 14 of touch-control module 12, and the second thin substrate 124 be touch-control module 12 farthest away from The substrate of display module 14 is contacted with the finger for user and carries out touch-control behavior.
Further explain, the second thin substrate 124 have first thickness t1, thick substrate 120 have second thickness t2, second Thickness t2 is 4 to 6 times of first thickness t1.In multiple embodiments, first thickness t1 possessed by the second thin substrate 124 is 75 to 125 microns, and preferably 100 microns.For existing glass cover-plate (about 500 to 700 microns), this hair The thickness design of the second bright thin substrate 124 can further the finger and the distance between the second electrode lay 125 of user, therefore can The sensitivity and identification for greatly improving 125 finger sensing of the second electrode lay, are conducive to the related application of identification of fingerprint.Yu Yishi It applies in mode, the first thin substrate 121 and the second thin substrate 124 have same thickness, but the present invention is not limited thereto.
In actual manufacturing process, first electrode layer 122 and the second electrode lay 125 are respectively arranged at the first thin substrate 121 and second in thin substrate 124 and are bonded to each other and are formed the semi-finished product of touch-control module 12.As described above, the first thin substrate 121 Significantly be thinned with the thickness of the second thin substrate 124 for the application of identification of fingerprint, and the present invention further design by Thick substrate 120 is bonded with the semi-finished product of above-mentioned touch-control module 12, to enhance the overall mechanism intensity of touch-control module 12.Implement in one In mode, the second thickness t2 of thick substrate 120 is 500 to 600 microns, but the present invention is not limited thereto.Generally speaking, this reality The thickness of the first thin substrate 121 and the second thin substrate 124 of applying example is less than the thickness of thick substrate 120.
It referring to figure 3., is the office for the first electrode layer 122 and the second electrode lay 125 for being painted an embodiment of the present invention Portion's top view.As shown, first electrode layer 122 (such as driving inductive layer) and the second electrode lay 125 (as received inductive layer) are each Include multiple electrodes line 122a, 125a.Any electrode wires 122a of first electrode layer 122 and any electricity of the second electrode lay 125 The extending direction of polar curve 125a is perpendicular to one another, so that first electrode layer 122 and the second electrode lay 125 form grid (mesh), but The present invention is not limited thereto.
The trough spacing (pitch) of the fingerprint of general adult is about 75 microns.In multiple embodiments, first electrode The electrode wires 122a and the electrode wires 125a of the second electrode lay 125 of layer 122 are respectively arranged in parallel according to a spacing P, and this spacing It is 50 to 70 microns, preferably 60 microns.By the electrode wires 122a's and the second electrode lay 125 for making first electrode layer 122 The spacing P of electrode wires 125a is designed less than 75 microns, then is cooperated and designed line width W possessed by each electrode wires 122a, 125a It is 3 to 10 microns, preferably 5 microns, that is, can reach the wave crest of detecting user's fingerprint and the purpose of trough, even if also first The induction precision of electrode layer 122 and the second electrode lay 125 is promoted to identification of fingerprint grade.
In multiple embodiments, the electrode wires 122a of above-mentioned first electrode layer 122 and the electrode wires of the second electrode lay 125 125a is plain conductor, and can be by such as ultrafine wire printing technology (fine line printing) or yellow light technique institute Manufacture, but the present invention is not limited thereto.
In the case where above-mentioned first electrode layer 122 is formed by metal grill framework with the second electrode lay 125, in order to electric by first Mutual capacitance between pole layer 122 and the second electrode lay 125 increases to the range of the driving capability of existing IC in one's power, and the present invention is into one First electrode layer 122 is separated distance D with the second electrode lay 125 and is designed as 100 to 200 microns by step.For example, Yu Yishi It applying in mode, the first thickness t1 of the first thin substrate 121 is 100 microns, and the thickness of the second bonding coat 123b can be 25 microns, Therefore it is 125 microns that first electrode layer 122, which separates distance D with the second electrode lay 125,.
In multiple embodiments, to bind thick substrate 120 and first electrode layer 122 the first bonding coat 123a and It all can be optical cement (Optically to bind the second bonding coat 123b of the first thin substrate 121 and the second electrode lay 125 Clear Adhesive, OCA) or glue, but the present invention is not limited thereto.
As shown in Fig. 1 and Fig. 2 B, in present embodiment, thick substrate 120 has the first perforation 120a, the first thin substrate 121 have the second perforation 121a, and the first perforation 120a exposes the second perforation 121a.Also, touch-control module 12 also includes First touch chip 126a and the second touch chip 126b.First touch chip 126a is set in the first thin substrate 121, and And it is located in the first perforation 120a of thick substrate 120, and be bonded to first electrode layer 122.For example, the first touch chip The joint sheet (not shown) in conductive bump (not shown) engagement first electrode layer 122 on 126a.Second touch chip 126b It is set in the second thin substrate 124, and is located in the second perforation 121a of the first thin substrate 121, and be bonded to second electrode Layer 125.For example, the engagement on the conductive bump (not shown) engagement the second electrode lay 125 on the second touch chip 126b Pad (not shown).In addition, the also packet timing control plate of display module 14 (Timing-Control board) 140 and flexible circuit Plate 142.Flexible circuit board 142 connects timing control plate 140, and is each passed through the first perforation 120a and the of thick substrate 120 One thin substrate 121 second perforation 121a and be bonded to first electrode layer 122 and the second electrode lay 125.
It is noted that in general, first electrode layer 122 and the respective joint sheet (not shown) of the second electrode lay 125 It is spaced about 12 microns.Present embodiment is respectively engaged to first using the first touch chip 126a and the second touch chip 126b The framework of electrode layer 122 and the second electrode lay 125, thus the first thin substrate 121 with the second thin substrate 124 being bonded between the two Tolerance tolerance can relax, and be conducive to the promotion of attaching process qualification rate.Furthermore due to the electrode wires of first electrode layer 122 The quantity of the electrode wires 125a of 122a and the second electrode lay 125 is each thousands of nearly, is touched using the first touch chip 126a and second Control chip 126b independently drives the framework of first electrode layer 122 Yu the second electrode lay 125, the first touch chip 126a and the The size of two touch chip 126b would not be excessive, thus the two just have more spaces can design the circuits such as some amplifiers come Increase driving capability.In addition, the first touch chip 126a and the second touch chip 126b are respectively arranged at the first perforation 120a In the second perforation 121a, also first can be prevented in subsequent drop test (Drop Test) or thrust test (Push Test) Touch chip 126a and the second touch chip 126b is impaired.
As shown in Figure 1, touch-control module 12 also includes light shield layer 127 in present embodiment.Light shield layer 127 is set to Between two thin substrates 124 and partial second electrode layer 125.In general, the region of the corresponding light shield layer 127 of touch control display device 1 It is defined as non-visible area domain, and the region other than the corresponding light shield layer 127 of touch control display device 1 is defined as visible area.First electricity Pole layer 122 is formed by metal grill with the second electrode lay 125 and covers entire visible area, and extends at least partially into non-visual Region.According to the above-mentioned structure configuration in relation to touch-control module 12, user can be allowed to carry out the touch-control of identification of fingerprint in visible area Using.Also, present embodiment design makes orthographic projection and light shield layer of the first perforation 120a of thick substrate 120 to light shield layer 127 127 overlappings.That is, the first perforation 120a of thick substrate 120 and the second perforation 121a of the first thin substrate 121 all can positions In non-visible area domain, therefore it will not influence first electrode layer 122 and the induction of the second electrode lay 125 user institute in visible area The touch-control behavior of progress.
In an embodiment, light shield layer 127 is ink layer, but the present invention is not limited thereto.
A referring to figure 4. is the top view for the thick substrate 120 being painted in Fig. 2A.In present embodiment, thick substrate 120 First perforation 120a be closed perforation.Enclosed first perforation 120a may make thick substrate 120 to obtain structure with preferable Intensity.However, the present invention is not limited thereto.B referring to figure 4. is the thick substrate 120 for being painted another embodiment of the present invention Top view.In present embodiment, the first perforation 120a of thick substrate 120 is open perforation.That is, the first perforation 120a extends to the edge of thick substrate 120, and in other words, from the point of view of top view angle, the edge of thick substrate 120 is worn by first The setting of hole 120a and the aspect for forming edge indent.The first open perforation 120a is conducive to the processing system of thick substrate 120 It makes.
It referring to figure 5., is to be painted the touch-control module 32 of another embodiment of the present invention applied to touch control display device 3 Diagrammatic cross-section.As shown, touch control display device 3 includes back-cover 10, touch-control module 32 and display module 14.Touch-control module 32 include thick substrate 120, the first thin substrate 121, first electrode layer 122, the first bonding coat 123a, the second thin substrate 124, second Electrode layer 125 and the second bonding coat 123b.With the structure of same components, function in Fig. 1 and between other assemblies in Fig. 5 Connection relationship can refer to the above related description, and details are not described herein.Herein it is noted that present embodiment with it is shown in FIG. 1 At the difference of embodiment, it is the touch-control module 32 of present embodiment only comprising single touch chip 326.Touch chip 326 It is engaged respectively via the second opening up for 121a of perforation of the first perforation 120a and the first thin substrate 121 of thick substrate 120 To first electrode layer 122 and the second electrode lay 125.
Specifically, Fig. 6 is please referred to, is the diagrammatic cross-section of the touch-control module 32 that is painted in Fig. 5 along line segment 6-6 '. As shown, there is first electrode layer 122 joint sheet 122b to be located in the first thin substrate 121, and the second electrode lay 125 is with connecing Close pad 125b be located in the first thin substrate 121 and second perforate 121a in.Relatively, touch chip 326 has conductive bump 326a,326b.For example, conductive bump 326a, 326b is golden convex block (golden bump), but the present invention not as Limit.Touch chip 326 is bonded to joint sheet 122b, 125b respectively with conductive bump 326a, 326b.In practical application, as long as First thin substrate 121 can control to be less than the engagement of first electrode layer 122 with the tolerance that is bonded of the second thin substrate 124 between the two The spacing for padding the spacing of 122b and the joint sheet 125b of the second electrode lay 125, can be by conductive stud when engaging touch chip 326 Block 326a, 326b are accurately bonded to joint sheet 122b, 125b respectively.
By above for the detailed description of a specific embodiment of the invention, it is apparent that touch-control module of the invention Inductive layer (i.e. the second electrode lay) will be received to be set in a thin substrate (i.e. the second thin substrate), and using this thin substrate as use The component that finger directly contacts when person's touch-control, therefore sensitivity and identification when receiving inductive layer induction fingerprint can be promoted.And And the driving inductive layer (i.e. first electrode layer) of touch-control module is also disposed in another thin substrate (i.e. the first thin substrate), and this Thin substrate is bonded with reception inductive layer again, is used and is increased driving inductive layer and receive the mutual capacitance between inductive layer, and can be by existing There is IC to be driven.Furthermore touch-control module is greater than the thick substrate of the first thin substrate and the second thin substrate again with thickness and driving incudes Layer fitting, uses the deficiency for making up above-mentioned two thin substrate on laser intensity.It is configured by above structure, touch-control mould of the invention Block can be used in the identification of fingerprint application for needing high precision to incude.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe It knows those skilled in the art and makes various corresponding changes and modifications, but these corresponding changes and change in accordance with the present invention Shape all should fall within the scope of protection of the appended claims of the present invention.

Claims (16)

1. a kind of touch-control module, characterized by comprising:
One thick substrate, to provide rigid support for the touch-control module;
One first thin substrate;
One first electrode layer is set in first thin substrate;
One first bonding coat binds the thick substrate and first thin substrate for being equipped with the first electrode layer;
One second thin substrate, the surface comprising an operation for touch;
One the second electrode lay is set on another surface of second thin substrate relative to the surface of the operation for touch;And
One second bonding coat is bonding on first thin substrate equipped with the first electrode layer and between the second electrode lay;
Wherein second thin substrate has a first thickness, and the second thickness which has is greater than the first thickness, and The second thickness is 4 to 6 times of the first thickness.
2. touch-control module as described in claim 1, which is characterized in that the thickness of first thin substrate and second thin substrate Thickness is identical.
3. touch-control module as described in claim 1, which is characterized in that the first thickness is 75 to 125 microns.
4. touch-control module as claimed in claim 3, which is characterized in that the first thickness is 100 microns.
5. touch-control module as described in claim 1, which is characterized in that the first electrode layer and the second electrode lay separate one away from From, and the distance is 100 to 200 microns.
6. touch-control module as claimed in claim 5, which is characterized in that the distance is 125 microns.
7. touch-control module as described in claim 1, which is characterized in that the first electrode layer and the second electrode lay respectively include more A electrode wires, those electrode wires are arranged in parallel according to a spacing, and the spacing is 50 to 70 microns.
8. touch-control module as claimed in claim 7, which is characterized in that the spacing is 60 microns.
9. touch-control module as described in claim 1, which is characterized in that the first electrode layer and the second electrode lay respectively include more A electrode wires, each of electrode wires have a line width, and the line width is 3 to 10 microns.
10. touch-control module as claimed in claim 9, which is characterized in that the line width is 5 microns.
11. touch-control module as described in claim 1, which is characterized in that the second thickness is 500 to 600 micromillimetres.
12. touch-control module as described in claim 1, which is characterized in that the first electrode layer be driving inductive layer, and this second Electrode layer is to receive inductive layer.
13. touch-control module as described in claim 1, which is characterized in that the thick substrate has one first perforation, the first thin base Plate has one second perforation, and first perforation exposes second perforation.
14. touch-control module as claimed in claim 13, which is characterized in that also include:
One first touch chip is set in first thin substrate and is located in first perforation, and is bonded to first electricity Pole layer;And
One second touch chip is set in second thin substrate and is located in second perforation, and is bonded to second electricity Pole layer.
15. touch-control module as claimed in claim 13, which is characterized in that also include a touch chip, touch chip difference The first electrode layer and the second electrode lay are bonded to via first perforation and second perforation.
16. touch-control module as claimed in claim 13, which is characterized in that also include a light shield layer, which is set to this Between second thin substrate and the part the second electrode lay, and an orthographic projection and the light shield layer of first perforation to the light shield layer Overlapping.
CN201510475911.4A 2015-08-05 2015-08-05 Touch-control module Active CN106445211B (en)

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CN201510475911.4A CN106445211B (en) 2015-08-05 2015-08-05 Touch-control module
TW104129531A TWI575417B (en) 2015-08-05 2015-09-07 Touch module
TW104214468U TWM514606U (en) 2015-08-05 2015-09-07 Touch module

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CN106445211B (en) * 2015-08-05 2019-10-15 宸盛光电有限公司 Touch-control module
CN107422931B (en) * 2017-06-23 2020-11-03 上海天马微电子有限公司 Flexible display panel and display device

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