TWM511061U - 扣持件及具有該扣持件之電子裝置組合 - Google Patents
扣持件及具有該扣持件之電子裝置組合 Download PDFInfo
- Publication number
- TWM511061U TWM511061U TW103213463U TW103213463U TWM511061U TW M511061 U TWM511061 U TW M511061U TW 103213463 U TW103213463 U TW 103213463U TW 103213463 U TW103213463 U TW 103213463U TW M511061 U TWM511061 U TW M511061U
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- Prior art keywords
- circuit board
- electronic device
- hole
- positioning post
- holding member
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10393—Clamping a component by an element or a set of elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2045—Protection against vibrations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2072—Anchoring, i.e. one structure gripping into another
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
本創作涉及一種扣持件及具有該扣持件之電子裝置組合,尤其涉及一種固持散熱器之扣持件及其電子裝置組合。
目前,業界在將一晶片模組電性連接至一電路板後,為了給使用時的晶片模組進行散熱,通常是於晶片模組上方設一散熱器,如中國大陸專利公告第2702467號揭示了一電子裝置組合,其包括:基體、散熱裝置、螺釘、電路板、螺母及晶片模組。當組裝電子裝置組合時,先將基體置於電路板上,然後將晶片模組置於基體;接著將散熱裝置的基板置於晶片模組上,使基板上的通孔和電路板上的孔洞相對應,將螺母從下至上插入電路板孔洞和基板的通孔中,並穿出通孔,最後將螺釘旋入螺母,從而將晶片模組與電路板固定在一起。然而,對於該電子裝置組合,由於散熱器是與電路板直接固定,故在鎖合時電路板兩端受到向上的作用力,使得電路板中間翹曲變形,從而影響晶片模組與電路板之間的電性連接。
鑒於此,確有必要提供一種改進之電子裝置組合,以克服先前技術存在之缺陷。
本創作之目係提供一種固持效果好以保障連接穩定性之扣持件及其電子裝置組合。
本創作之扣持件可藉以下技術方案實現:一種扣持件,可用於安裝於設有孔之電路板上,所述扣持件包括:固持件,所述固持件包括沿所述電路板表面水平延伸設置之安裝部以及自安裝部向上延伸設置之勾部;以及定位件,其具有上下延伸設置之定位柱,所述定位柱之上端與所述固持件相連接,所述定位柱之下端與所述電路板上之孔相配合;其中所述安裝部具有焊接面,所述焊接面藉由表面焊接技術焊接於電路板上。
本創作之電子裝置組合可藉以下技術方案實現:一種電子裝置組合,包括:電路板,其具有水平延伸之上表面,所述上表面上設有孔;晶片模組,安裝於所述上表面上,並位於所述孔之一側;散熱器,安裝於所述晶片模組上,使得所述晶片模組位於所述散熱器和所述電路板之間;扣持件,固定於電路板上,並位於所述晶片模組之一側;以及壓桿,其具有連接於所述扣持件上之鎖扣部以及壓接於所述散熱器上之壓接部;其中所述扣持件包括安裝於所述電路板上之孔中的定位柱以及沿電路板之上表面延伸並焊接於電路板之上表面之焊接部。
相較於先前技術,本創作藉由扣持件焊接於電路板上以供壓接散熱器之壓桿扣持,其製程簡單且具有較佳固持力,且不會造成電路板翹曲從而保障晶片模組與電路板間之良好電性連接。
100‧‧‧電子裝置組合
10‧‧‧散熱器
101‧‧‧導熱板
102‧‧‧散熱鰭片
11‧‧‧壓桿
111‧‧‧壓接部
112‧‧‧鎖扣部
12、12’‧‧‧扣持件
120、120’‧‧‧固持件
121、121’‧‧‧勾部
1210‧‧‧開口
122、122’‧‧‧安裝部
123‧‧‧焊接部
1230、1230’‧‧‧焊接面
124‧‧‧突出部
1240‧‧‧收容空間
125‧‧‧缺口
130、130’‧‧‧定位件
131‧‧‧定位柱
132‧‧‧主體部
200‧‧‧電路板
201‧‧‧孔
300‧‧‧晶片模組
第一圖係本創作電子裝置組合之立體組合圖;
第二圖係第一圖所示之電子裝置組合之側視圖;
第三圖係本創作電子裝置組合之立體分解圖;
第四圖係本創作扣持件之立體圖;
第五圖係本創作扣持件之另一實施例之立體圖。
請參閱第一圖和第二圖所示,該電子裝置組合100安裝於電路板200上並貼附於一晶片模組300上方。所述晶片模組300可直接安裝於電路板200上,亦可藉由一電連接器與電路板電性連接。所述電子裝置組合100包括散熱器10,壓接散熱器10之壓桿11以及扣持固定所述壓桿11之扣持件12。所述散熱器10包括貼附於所述晶片模組300上之導熱片101以及自導熱片101向上延伸設置之複數散熱鰭片102。
請參閱第三圖所示,所述壓桿11包括壓接部111以及鎖扣部112。所述壓接部111壓接於所述散熱器10之導熱片101上並位於所述複數散熱鰭片102之間。所述鎖扣部112自所述壓接部111向下彎折延伸設置,用以扣持於所述扣持件12上。所述鎖扣部112平行於所述壓接部111。於其他實施例中,所述壓桿11亦可為金屬條或其他結構。
請參閱第三圖和第四圖所示,所述扣持件12包括一固持件120以及一定位件130。所述固持件120包括於豎直方向延伸設置之勾部121以及於水平方向延伸設置之安裝部122。所述勾部121包括開口1210用以與所述壓桿11之鎖扣部112配合鎖固。所述安裝部122包括一對焊接部123,所述焊接部123具有焊接面1230用以藉由表面焊接技術(surface mount technique, SMT)焊接於電路板200上。所述安裝部122還包括連接所述一對焊接部123之突出部124,所述突出部124於豎直方向上高於所述一對焊接部123用以支撐所述壓桿11之鎖扣部112。所述突出部124由於係向上突伸設置,其下方形成一收容空間1240,所述定位件130收容於所述收容空間1240中。所述突出部124之相對兩側設有一對缺口125。
所述定位件130係為塑膠材料製成, 所述定位件130包括主體部132以及自主體部132之相對兩側於豎直方向上延伸設置之一對定位柱131。所述定位柱131向上延伸超出所述主體部132用以與所述固持件120之缺口125配合,所述定位柱131向下延伸超出所述主體部132用以與電路板200上之孔201相配合。所述定位件130可以與所述固持件120嵌入成型,亦可以為組裝於所述固持件120上。本創作藉由扣持件12焊接於電路板200上以供壓接散熱器10之壓桿11扣持,其製程簡單且具有較佳固持力,不會造成電路板翹曲而影響晶片模組與電路板間之電性連接。
第五圖係本創作扣持件12’之另一實施例。所述扣持件12’包括固持件120’以及定位件130’。所述固持件120’包括豎直設置之勾部121’以及水平設置之安裝部122’。所述安裝部122’為水平板狀設置,其上設有孔洞,用以容置所述定位件130’。所述定位件130’ 係為金屬材料製成之圓柱體。於本實施例中,所述安裝部122’之整個下表面1230’均焊接於電路板上以增大焊接面積,提供較大固持力。
綜上所述,本創作符合新型專利要件,爰依法提出專利申請。惟,以上所述者僅為本創作之較佳實施例,本創作之範圍並不以上述實施例為限,舉凡熟習本案技藝之人士援依本創作之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。
100‧‧‧電子裝置組合
10‧‧‧散熱器
11‧‧‧壓桿
12‧‧‧扣持件
200‧‧‧電路板
Claims (10)
- 一種扣持件,可用於安裝於設有孔之電路板上,所述扣持件包括:
固持件,所述固持件包括沿所述電路板表面水平延伸設置之安裝部以及自安裝部向上延伸設置之勾部;以及
定位件,其具有上下延伸設置之定位柱,所述定位柱之上端與所述固持件相連接,所述定位柱之下端與所述電路板上之孔相配合;其中
所述安裝部具有焊接面,所述焊接面藉由表面焊接技術焊接於電路板上。 - 如申請專利範圍第1項所述之扣持件,其中所述安裝部包括一對焊接部和連接所述一對焊接部並相對於焊接部呈向上突伸設置之突出部。
- 如申請專利範圍第1項所述之扣持件,其中所述安裝部設有與定位柱之上端配合之缺口。
- 如申請專利範圍第1項所述之扣持件,其中所述勾部設有一開口。
- 一種電子裝置組合,包括:
電路板,其具有水平延伸之上表面,所述上表面上設有孔;
晶片模組,安裝於所述上表面上,並位於所述孔之一側;
散熱器,安裝於所述晶片模組上,使得所述晶片模組位於所述散熱器和所述電路板之間;
扣持件,固定於電路板上,並位於所述晶片模組之一側;以及
壓桿,其具有連接於所述扣持件上之鎖扣部以及壓接於所述散熱器上之壓接部;其中
所述扣持件包括安裝於所述電路板上之孔中的定位柱以及沿電路板之上表面延伸並焊接於電路板之上表面之焊接部。 - 如申請專利範圍第5項所述之電子裝置組合,其中所述焊接部包括自所述定位柱向相對兩側延伸設置之兩部分,所述兩部分相對於所述定位柱呈對稱設置。
- 如申請專利範圍第6項所述之電子裝置組合,其中所述扣持件包括一豎直設置之開口,用以收容所述壓桿之鎖扣部。
- 如申請專利範圍第6項所述之電子裝置組合,其中所述扣持件包括位於上方之固持件以及位於固持件下方之定位件,所述定位柱設於所述定位件上,所述焊接部設於所述固持件上。
- 如申請專利範圍第6項所述之電子裝置組合,其中所述扣持件包括向上突伸設置並連接所述焊接部之兩部分之突出部。
- 如申請專利範圍第5項所述之電子裝置組合,其中所述壓桿之壓接部和所述鎖扣部相互平行。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/161,618 US9258881B2 (en) | 2014-01-22 | 2014-01-22 | SMT heat sink anchor |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM511061U true TWM511061U (zh) | 2015-10-21 |
Family
ID=52422622
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW103213463U TWM511061U (zh) | 2014-01-22 | 2014-07-30 | 扣持件及具有該扣持件之電子裝置組合 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9258881B2 (zh) |
CN (1) | CN204145963U (zh) |
TW (1) | TWM511061U (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11134591B2 (en) | 2019-12-20 | 2021-09-28 | Astec International Limited | Circuit board assemblies for electronic devices |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0582999A (ja) * | 1991-09-24 | 1993-04-02 | Nec Corp | 表面実装部品の実装方法および表面実装部品 |
US5734556A (en) * | 1996-06-26 | 1998-03-31 | Sun Microsystems, Inc. | Mechanical heat sink attachment having two pin headers and a spring clip |
US6222734B1 (en) * | 1999-11-29 | 2001-04-24 | Intel Corporation | Clamping heat sinks to circuit boards over processors |
US6822867B2 (en) | 2001-06-29 | 2004-11-23 | Intel Corporation | Electronic assembly with solderable heat sink and methods of manufacture |
US6734371B2 (en) * | 2001-09-28 | 2004-05-11 | Intel Corporation | Soldered heat sink anchor and method of use |
US7167369B1 (en) * | 2003-12-08 | 2007-01-23 | Cisco Technology, Inc. | Methods and apparatus for installing a heat sink using surface mount technology |
US7885077B2 (en) * | 2009-01-07 | 2011-02-08 | International Business Machines Corporation | Solderless heatsink anchor |
US8139361B2 (en) * | 2009-12-16 | 2012-03-20 | International Business Machines Corporation | Apparatus and method for attaching selected components to a printed circuit board |
CN102856274A (zh) * | 2011-06-30 | 2013-01-02 | 鸿富锦精密工业(深圳)有限公司 | 散热器扣具 |
-
2014
- 2014-01-22 US US14/161,618 patent/US9258881B2/en not_active Expired - Fee Related
- 2014-07-28 CN CN201420418138.9U patent/CN204145963U/zh not_active Expired - Fee Related
- 2014-07-30 TW TW103213463U patent/TWM511061U/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US9258881B2 (en) | 2016-02-09 |
US20150208495A1 (en) | 2015-07-23 |
CN204145963U (zh) | 2015-02-04 |
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