TWM505655U - Smart card fingerprint pressing device - Google Patents
Smart card fingerprint pressing device Download PDFInfo
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- TWM505655U TWM505655U TW104201684U TW104201684U TWM505655U TW M505655 U TWM505655 U TW M505655U TW 104201684 U TW104201684 U TW 104201684U TW 104201684 U TW104201684 U TW 104201684U TW M505655 U TWM505655 U TW M505655U
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Description
本新型涉及一種設有積體電路晶片的可攜式塑膠卡片,尤指一種能夠讓指紋辨識模組獲得穩固定位的智慧卡片指紋按壓裝置。The invention relates to a portable plastic card with an integrated circuit chip, in particular to a smart card fingerprint pressing device capable of obtaining a stable fixed position of the fingerprint identification module.
智慧卡片(亦稱IC卡、積體電路卡或智能卡)為設有積體電路晶片的可攜式塑膠卡片,可以利用感應方式及接觸方式來進行資料的存取,目前廣泛應用於大眾交通運輸工具的悠遊卡、電子錢包、晶片金融卡、信用卡、電子票證及員工識別證......等。其中,為了提高智慧卡片的防偽功能及安全性,防止智慧卡片被盜刷或是被盜用的風險,申請人先前陸續提出如我國證書號數M372978號、M407449號及I423142號等設有指紋辨識功能的智慧卡片,利用指紋辨識模組接收輸入訊號及辨識是否為使用者本人的指紋的方式,有效解決智慧卡片被盜刷或是被盜用的風險問題。Smart cards (also known as IC cards, integrated circuit cards or smart cards) are portable plastic cards with integrated circuit chips. They can be accessed by sensing and contact methods. They are widely used in mass transportation. Tools for leisure cards, e-wallets, chip financial cards, credit cards, e-tickets and employee identification cards...etc. Among them, in order to improve the anti-counterfeiting function and security of smart cards, and to prevent the risk of smart card being stolen or stolen, the applicant has previously proposed fingerprint identification functions such as China's certificate numbers M372978, M407449 and I423142. The smart card uses the fingerprint identification module to receive the input signal and identify whether it is the user's own fingerprint, effectively solving the risk of the smart card being stolen or stolen.
現有具指紋辨識功能的智慧卡片的結構設計大致如圖7所示,該智慧卡片90主要包括一呈片形的載體91、一固設於該載體91頂面的軟性電路板92及一固設於該軟性電路板92頂面的面層93,其中於該軟性電路板92的頂面固設有一晶片94及一電連接該晶片94的指紋辨識模組95,並於該面層93對應設有供該晶片94及指紋辨識模組95外露出來的一晶片窗孔931及一指紋模組窗孔932,該指紋辨識模組95設有一指紋感應晶片951及一電連接該指紋感應晶片951的軟性電路接片952,並且該指紋模組窗孔932是透過一呈矩形框狀的框架96壓制抵靠於該指紋辨識模組95的指紋感應晶片951外周圍,藉以讓該指紋辨識模組95結合定位。The structure of the smart card having the fingerprint identification function is substantially as shown in FIG. 7. The smart card 90 mainly includes a carrier 91 in the form of a sheet, a flexible circuit board 92 fixed on the top surface of the carrier 91, and a fixing device. On the top surface 93 of the flexible circuit board 92, a chip 94 and a fingerprint identification module 95 electrically connected to the chip 94 are fixed on the top surface of the flexible circuit board 92, and corresponding to the surface layer 93. There is a chip window 931 and a fingerprint module window 932 for the chip 94 and the fingerprint recognition module 95. The fingerprint module 95 is provided with a fingerprint sensing chip 951 and a fingerprint sensing chip 951. The flexible circuit board 952, and the fingerprint module window 932 is pressed against the outer periphery of the fingerprint sensing chip 951 of the fingerprint recognition module 95 through a frame 96 having a rectangular frame shape, so that the fingerprint identification module 95 is provided. Combined positioning.
請參閱圖7所示,現有的智慧卡片90的指紋辨識模組95是直接貼附於該軟性電路板92而缺乏適當的支撐構造,在使用者用力按壓該指紋辨識模組95以便於指紋的讀取時,或者是智慧卡片90放置於皮夾或口袋而受壓彎折時,均相當容易對該指紋辨識模組95造成傷害,產生該指紋辨識模組95破壞、接線斷開或指紋感應晶片951剝離...等現象,導致現有具指紋辨識功能的智慧卡片90存在有耐用性差、不耐彎折及容易感應失效的問題。Referring to FIG. 7 , the fingerprint identification module 95 of the existing smart card 90 is directly attached to the flexible circuit board 92 and lacks an appropriate support structure. The user manually presses the fingerprint recognition module 95 to facilitate fingerprints. When reading, or when the smart card 90 is placed in a wallet or a pocket and is bent and pressed, it is quite easy to cause damage to the fingerprint recognition module 95, resulting in damage, disconnection or fingerprint sensing of the fingerprint recognition module 95. The phenomenon that the wafer 951 is stripped, etc., causes the existing smart card 90 having the fingerprint recognition function to have problems of poor durability, resistance to bending, and easy induction failure.
為解決現有智慧卡片指紋按壓結構存在有前述指紋辨識模組容易破損及不耐彎折的不足及限制,本新型的主要目的在於提出一種能夠讓指紋辨識模組獲得穩固定位的智慧卡片指紋按壓裝置,本新型於軟性電路板設置具剛性的定位框座來提供指紋辨識模組插置貼合,能夠對指紋辨識模組形成穩定可靠的支撐定位作用,有效解決現有智慧卡片指紋按壓裝置關於容易破損及不耐彎折的問題。In order to solve the existing smart card fingerprint pressing structure, there is a deficiency and limitation that the fingerprint identification module is easy to break and is not resistant to bending. The main purpose of the present invention is to provide a smart card fingerprint pressing device capable of obtaining a stable fixed position of the fingerprint identification module. The present invention provides a rigid positioning frame on the flexible circuit board to provide a fingerprint identification module insertion and fit, which can form a stable and reliable support positioning function for the fingerprint identification module, and effectively solve the problem that the existing smart card fingerprint pressing device is easily damaged. And the problem of not being able to bend.
本新型解決技術問題所提出的智慧卡片指紋按壓裝置,包括:一載體,其為具可撓性的薄型片體;一軟性電路板,其貼靠結合於該載體的頂面且設有至少一以積體電路構成的晶片;一定位框座,其為剛性的框槽構造且貼靠結合於該軟性電路板,該定位框座凹設有一嵌槽且於該嵌槽的其中一個側壁貫穿開設有一通孔;一指紋辨識模組,其嵌置貼設於該定位框座的嵌槽且包括一規格形狀與該嵌槽匹配的指紋感應晶片、一電連接該指紋感應晶片的軟性電路接片及一位於該指紋感應晶片下方的硬質基板,該軟性電路接片由該定位框座的通孔穿出且電連接該軟性電路板;以及一面層,其貼靠結合於該軟性電路板的頂面,該面層開設有一供該指紋感應晶 片露出的指紋模組窗孔且以該指紋模組窗孔的周緣貼靠壓掣該定位框座的周圍部分。The smart card fingerprint pressing device proposed by the present invention includes: a carrier which is a flexible thin sheet; a flexible circuit board which is attached to the top surface of the carrier and is provided with at least one a singularly-arranged circuit; a locating frame, which is a rigid frame structure and abuts against the flexible circuit board, the positioning frame is recessed with a slot and is formed through one of the side walls of the slot a fingerprint identification module, which is embedded in the recessed groove of the positioning frame and includes a fingerprint sensing chip having a shape matching the groove, and a flexible circuit connector electrically connecting the fingerprint sensing chip And a rigid substrate under the fingerprint sensing chip, the flexible circuit tab is pierced by the through hole of the positioning frame and electrically connected to the flexible circuit board; and a layer is attached to the top of the flexible circuit board Surface, the surface layer is provided with a fingerprint sensing crystal The exposed fingerprint module window hole is pressed against the peripheral portion of the positioning frame seat by the peripheral edge of the fingerprint module window.
所述的智慧卡片指紋按壓裝置,其中所述的定位框座於所述嵌槽的周圍向外依序形成一環框及一高度低於該環框的卡掣部;所述指紋模組窗孔係匹配對應於該環框的外周緣且能夠貼靠壓掣該卡掣部。The smart card fingerprint pressing device, wherein the positioning frame seat forms a ring frame and a card portion lower than the ring frame in the outer periphery of the slot; the fingerprint module window hole The matching corresponds to the outer circumference of the ring frame and can be pressed against the click portion.
所述的智慧卡片指紋按壓裝置,其中所述的定位框座係以金屬片材沖壓成型的單件式構造。The smart card fingerprint pressing device, wherein the positioning frame seat is a one-piece construction formed by stamping a metal sheet.
所述的智慧卡片指紋按壓裝置,其中所述定位框座的嵌槽的深度大於所述指紋辨識模組的厚度。In the smart card fingerprint pressing device, the depth of the slot of the positioning frame is greater than the thickness of the fingerprint recognition module.
所述的智慧卡片指紋按壓裝置,其中所述指紋辨識模組的硬質基板的長度大於所述指紋感應晶片的長度而對該指紋感應晶片與所述軟性電路接片的接線部位形成支撐,該硬質基板的端部係穿出所述定位框座的通孔。The smart card fingerprint pressing device, wherein the length of the rigid substrate of the fingerprint recognition module is greater than the length of the fingerprint sensing chip, and the connection between the fingerprint sensing chip and the flexible circuit tab is formed. The end of the substrate passes through the through hole of the positioning frame.
所述的智慧卡片指紋按壓裝置,其中所述指紋辨識模組的指紋感應晶片、軟性電路接片及硬質基板係由上而下依序疊靠貼合設置。The smart card fingerprint pressing device, wherein the fingerprint sensing chip, the flexible circuit tab and the rigid substrate of the fingerprint identification module are arranged in a stack from top to bottom.
本新型的技術手段可獲得的功效增進包括:The enhancements that can be obtained by the novel techniques include:
1. 本新型的指紋辨識模組是結合設置於框槽狀的定位框座內,讓指紋辨識模組獲得穩固可靠的支撐作用,能夠充分承受使用者按壓指紋辨識模組以便於讀取指紋的施力,有效解決現有智慧卡片的指紋辨識模組容易受到破壞或發生感應失效的問題。1. The fingerprint identification module of the present invention is combined with the positioning frame arranged in the frame groove shape, so that the fingerprint identification module obtains a stable and reliable supporting function, and can fully withstand the user pressing the fingerprint identification module to read the fingerprint. Shili effectively solves the problem that the fingerprint identification module of the existing smart card is easily damaged or inductively disabled.
2. 本新型以定位框座對指紋辨識模組形成可靠的支撐作用,即使智慧卡片因為放置於皮夾或口袋而受壓彎折時,依然可以有效保護指紋辨識模組避免受到傷害,提高智慧卡片的耐彎折性及耐用性。2. The new type of positioning frame provides a reliable support for the fingerprint identification module. Even if the smart card is pressed and bent due to being placed in a wallet or pocket, the fingerprint identification module can be effectively protected from damage and wisdom. The card's resistance to bending and durability.
3. 本新型讓指紋辨識模組直接嵌置結合於定位框座的嵌槽內,搭配定位框座以卡掣部與面層的指紋模組窗孔的匹配對位設計,有效簡化指紋辨識模組的 裝配作業,並提高指紋按壓裝置的結構穩固性。3. The new type allows the fingerprint identification module to be directly embedded in the recessed groove of the positioning frame seat, and is matched with the positioning frame seat to match the alignment of the fingerprint module window of the card portion and the surface layer, thereby effectively simplifying the fingerprint recognition mode. Group Assembling the work and improving the structural stability of the fingerprint pressing device.
10‧‧‧載體10‧‧‧ Carrier
20‧‧‧軟性電路板20‧‧‧Soft circuit board
21‧‧‧晶片21‧‧‧ wafer
22‧‧‧顯示模組22‧‧‧Display module
30‧‧‧面層30‧‧‧Face
31‧‧‧晶片窗孔31‧‧‧ wafer window aperture
32‧‧‧指紋模組窗孔32‧‧‧Fingerprint module window
33‧‧‧顯示窗孔33‧‧‧ display window
40、40A‧‧‧指紋辨識模組40, 40A‧‧‧ fingerprint identification module
41‧‧‧指紋感應晶片41‧‧‧Fingerprinting chip
42‧‧‧軟性電路接片42‧‧‧Soft circuit connectors
43‧‧‧硬質基板43‧‧‧hard substrate
50‧‧‧定位框座50‧‧‧ positioning frame
51‧‧‧嵌槽51‧‧‧Inlay
52‧‧‧環框52‧‧‧ ring frame
53‧‧‧卡掣部53‧‧‧Card Department
54‧‧‧通孔54‧‧‧through hole
90‧‧‧智慧卡片90‧‧‧Smart Card
91‧‧‧載體91‧‧‧ Carrier
92‧‧‧軟性電路板92‧‧‧Soft circuit board
93‧‧‧面層93‧‧‧Face
931‧‧‧晶片窗孔931‧‧‧Size window aperture
932‧‧‧指紋模組窗孔932‧‧‧Fingerprint module window
94‧‧‧晶片94‧‧‧ wafer
95‧‧‧指紋辨識模組95‧‧‧Fingerprint Identification Module
951‧‧‧指紋感應晶片951‧‧‧Fingerprinting chip
952‧‧‧軟性電路接片952‧‧‧Soft circuit connectors
96‧‧‧框架96‧‧‧Frame
圖1是本新型第一較佳實施例的立體圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a first preferred embodiment of the present invention.
圖2是本新型第一較佳實施例的組成元件分解圖。Figure 2 is an exploded view of the components of the first preferred embodiment of the present invention.
圖3是本新型第一較佳實施例的指紋辨識模組與定位框座的裝配關係圖。3 is a diagram showing the assembly relationship between the fingerprint recognition module and the positioning frame of the first preferred embodiment of the present invention.
圖4是本新型第一較佳實施例的組合剖面圖。Figure 4 is a cross-sectional view showing the combination of the first preferred embodiment of the present invention.
圖5是本新型第二較佳實施例的組合剖面圖。Figure 5 is a combined cross-sectional view of a second preferred embodiment of the present invention.
圖6是本新型第三較佳實施例的立體圖。Figure 6 is a perspective view of a third preferred embodiment of the present invention.
圖7是現有的智慧卡片的組成元件分解示意圖。Fig. 7 is an exploded perspective view showing the components of the conventional smart card.
本新型提出的智慧卡片指紋按壓裝置的第一較佳實施例係如圖1至圖4所示,該智慧卡片係包括:一載體10、一貼靠結合於該載體10的軟性電路板20、一貼靠結合於該軟性電路板20的面層30,以及利用一定位框座50裝配結合於該軟性電路板20與該面層30之間的指紋辨識模組40,並且利用熱壓合的方式將各組件結合固定成型;其中:如圖1及圖2所示,該載體10為概呈矩形的可撓性薄型片體,該軟性電路板20係貼固結合於該載體10的頂面,於該軟性電路板20設有相關的電路構造、記憶單元及至少一以積體電路構成的晶片21等構造,其中關於智慧卡片的相關電路構造、記憶單元及晶片21等構造均屬於現有技術且無關於本新型的技術特徵,所以不再詳細說明。The first preferred embodiment of the smart card fingerprint pressing device of the present invention is as shown in FIG. 1 to FIG. 4 . The smart card includes: a carrier 10 , a flexible circuit board 20 attached to the carrier 10 , A surface layer 30 bonded to the flexible circuit board 20 is attached to the surface layer 30 of the flexible circuit board 20, and a fingerprint identification module 40 coupled between the flexible circuit board 20 and the surface layer 30 is assembled by using a positioning frame 50, and is pressed by heat. In a manner, the components are combined and fixed; wherein, as shown in FIG. 1 and FIG. 2, the carrier 10 is a substantially rectangular flexible thin sheet, and the flexible circuit board 20 is fixedly bonded to the top surface of the carrier 10. The flexible circuit board 20 is provided with a related circuit structure, a memory unit, and at least one wafer 21 formed by an integrated circuit. The related circuit structure, the memory unit, and the wafer 21 and the like of the smart card belong to the prior art. Regardless of the technical features of the present invention, it will not be described in detail.
如圖3及圖4所示,該指紋辨識模組40係黏貼結合於該定位框座50,並包括由上而下依序疊靠貼合設置的一指紋感應晶片41、一軟性電路接片42及一硬質基板43,該指紋感應晶片41電連接該軟性電路接片42且該軟性電路接片 42電連接該軟性電路板20的電路構造,該硬質基板43係以金屬薄片、塑膠薄片或複合材料薄片...等具適當支撐剛性的硬質薄片,並且該硬質基板43的長度大於該指紋感應晶片41的長度,藉以在該指紋感應晶片41與該軟性電路接片42接線電連接時,提供接線位置足夠的支撐作用。As shown in FIG. 3 and FIG. 4, the fingerprint recognition module 40 is adhesively bonded to the positioning frame 50, and includes a fingerprint sensing chip 41 and a flexible circuit connector which are arranged in a stack from top to bottom. 42 and a rigid substrate 43, the fingerprint sensing chip 41 is electrically connected to the flexible circuit tab 42 and the flexible circuit tab 42 is electrically connected to the circuit structure of the flexible circuit board 20, which is a rigid sheet having a suitable supporting rigidity such as a metal foil, a plastic sheet or a composite sheet, and the length of the hard substrate 43 is larger than the fingerprint sensing. The length of the wafer 41 is such that when the fingerprint sensing wafer 41 is electrically connected to the flexible circuit tab 42, it provides sufficient support for the wiring location.
該定位框座50為具足夠剛性的矩形框槽構造且貼合固定於該軟性電路板20的其中一端側的適當位置,該定位框座50可以是利用金屬片材或塑膠材料等剛性材料製作成型的單件式構造(one-piece),本較佳實施例的定位框座50係以金屬片材沖壓成型,該定位框座50設有一規格形狀與該指紋感應晶片41相匹配且深度大於該指紋辨識模組40之厚度的矩形嵌槽51,提供該指紋辨識模組40黏貼固定於該定位框座50的嵌槽51中,該定位框座50於該嵌槽51的周圍向外依序形成一呈矩形狀的環框52及一呈矩形狀且高度低於該環框52的卡掣部53,並於該嵌槽51的其中一個側壁貫穿開設有一供該軟性電路接片42及該硬質基板43穿出的通孔54。The positioning frame 50 is a rectangular frame structure having sufficient rigidity and is fixedly fixed to an appropriate position on one end side of the flexible circuit board 20. The positioning frame 50 can be made of a rigid material such as a metal sheet or a plastic material. The one-piece molding is one-piece. The positioning frame 50 of the preferred embodiment is formed by stamping a metal sheet. The positioning frame 50 is provided with a shape matching the fingerprint sensing wafer 41 and the depth is greater than The rectangular slot 51 of the thickness of the fingerprint recognition module 40 is provided to be attached to the slot 51 of the positioning frame 50. The positioning frame 50 is outwardly disposed around the slot 51. Forming a rectangular ring frame 52 and a latching portion 53 having a rectangular shape and a lower height than the ring frame 52, and a flexible circuit tab 42 is formed through one of the side walls of the recess 51. The through hole 54 is formed in the rigid substrate 43.
如圖1、圖2及圖4所示,該面層30的規格形狀與該載體10相同且貼靠結合固定於該軟性電路板20的頂面,對應於該晶片21及該指紋辨識模組40,於該面層30開設有一供該晶片21露出的晶片窗孔31及一供該指紋辨識模組40露出的指紋模組窗孔32,並且該指紋模組窗孔32的規格形狀係匹配對應於該定位框座50的環框52的外周緣,讓該面層30能夠貼靠壓掣該定位框座50的卡掣部53且該定位框座50的環框52露出,將該定位框座50穩固地結合定位於該面層30與該軟性電路板20之間。As shown in FIG. 1 , FIG. 2 and FIG. 4 , the surface layer 30 has the same shape and shape as the carrier 10 and is fixedly attached to the top surface of the flexible circuit board 20 , corresponding to the chip 21 and the fingerprint identification module. 40, a wafer window 31 for exposing the chip 21 and a fingerprint module window 32 for exposing the fingerprint module 40 are formed on the surface layer 30, and the shape and shape of the fingerprint module window 32 are matched. Corresponding to the outer periphery of the ring frame 52 of the positioning frame 50, the surface layer 30 can be pressed against the latching portion 53 of the positioning frame 50 and the ring frame 52 of the positioning frame 50 is exposed. The frame 50 is firmly coupled between the surface layer 30 and the flexible circuit board 20.
請參閱圖2至圖4所示,本新型於組裝成型時,將該指紋辨識模組40由該定位框座50的通孔54插入該定位框座50的嵌槽51且黏貼固定,以及將該定位框座50貼靠結合於軟性電路板20的設定位置,將著將全部的組件置入模具內以熱壓合方式結合固定成型,組構成如圖1所示的智慧卡片。本新型將該指紋 辨識模組40直接嵌置結合於該定位框座50的嵌槽51內,搭配該面層30以該指紋模組窗孔32的匹配對位壓掣設計,能夠有效簡化該指紋辨識模組40的裝配作業且提高指結合構造的穩固性。Referring to FIG. 2 to FIG. 4 , the fingerprint identification module 40 is inserted into the slot 51 of the positioning frame 50 by the through hole 54 of the positioning frame 50 and is fixed and fixed during assembly and molding. The positioning frame 50 abuts against the set position of the flexible circuit board 20, and all the components are placed in the mold to be combined and fixed by thermocompression bonding, and the smart card shown in FIG. 1 is assembled. The new fingerprint The identification module 40 is directly embedded in the slot 51 of the positioning frame 50, and is matched with the surface layer 30 to match the matching alignment of the fingerprint module window 32, which can effectively simplify the fingerprint identification module 40. Assembly work and improve the stability of the finger joint construction.
請參閱圖1、圖2及圖4所示,本新型利用該定位框座50提供該指紋辨識模組40全面性的穩固可靠的支撐作用,能夠充分承受使用者按壓該指紋辨識模組40以便於讀取指紋的施力,有效避免該指紋辨識模組40因為按壓施力而受到破壞或發生感應失效的問題,同時利用該定位框座50的支撐保護作用,能夠在智慧卡片受壓彎折時,依然有效保護該指紋辨識模組40避免受到傷害,大幅提高具指紋辨識功能的智慧卡片的耐彎折性及耐用性。Referring to FIG. 1 , FIG. 2 and FIG. 4 , the positioning frame 50 provides the overall robust and reliable supporting function of the fingerprint recognition module 40 , and can fully withstand the user pressing the fingerprint identification module 40 . The urging of the fingerprint can effectively prevent the fingerprint recognition module 40 from being damaged or inductively disabled due to the pressing force. At the same time, the support card of the positioning frame 50 can be pressed and bent on the smart card. At the same time, the fingerprint recognition module 40 is effectively protected from damage, and the bending resistance and durability of the smart card with the fingerprint recognition function are greatly improved.
在如圖5所示的本新型的第二較佳實施例中,不同於第一較佳實施例的改變部分在於該指紋辨識模組40A,本實施例的指紋辨識模組40A係包括一指紋感應晶片41、一軟性電路接片42及一貼靠結合於該指紋感應晶片41底面而形成支撐保護作用的硬質基板43,該軟性電路接片42係電連接於該指紋感應晶片41對應於該通孔54的接線端且電連接該軟性電路板20的電路構造,並且該硬質基板43的長度大於該指紋感應晶片41的長度,能夠提供接線位置足夠的支撐作用。In the second preferred embodiment of the present invention as shown in FIG. 5, the change from the first preferred embodiment is in the fingerprint identification module 40A. The fingerprint identification module 40A of the embodiment includes a fingerprint. The inductive chip 41, a flexible circuit tab 42 and a rigid substrate 43 that is coupled to the bottom surface of the fingerprint sensing chip 41 to form a supporting protection, the flexible circuit tab 42 is electrically connected to the fingerprint sensing chip 41 corresponding to the The terminal of the through hole 54 is electrically connected to the circuit configuration of the flexible circuit board 20, and the length of the hard substrate 43 is larger than the length of the fingerprint sensing chip 41, so that a sufficient supporting role of the wiring position can be provided.
在如圖6所示的本新型的第三較佳實施例中,不同於第一較佳實施例的改變部分在於增設有一顯示模組22,並對應於該面層30開設有一供該顯示模組22露出的顯示窗孔33,讓本新型的指紋按壓裝置實施應用於具備顯示功能的智慧卡片。In the third preferred embodiment of the present invention as shown in FIG. 6, a modification different from the first preferred embodiment is that a display module 22 is additionally provided, and a display module is provided corresponding to the surface layer 30. The display window 33 exposed by the group 22 allows the fingerprint pressing device of the present invention to be applied to a smart card having a display function.
以上所述,僅是本新型的較佳實施例,並非對本新型作任何形式上的限制,任何所屬技術領域中具有通常知識者,若在不脫離本新型所提技術特徵的範圍內,利用本新型所揭示技術內容所作出局部更動或修飾的等效實施例,均仍屬於本新型技術特徵的範圍內。The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way. Any person having ordinary knowledge in the art can use the present invention without departing from the technical features of the present invention. Equivalent embodiments of the novel modifications or modifications made by the novel teachings are still within the scope of the novel features.
40‧‧‧指紋辨識模組40‧‧‧Fingerprint Identification Module
41‧‧‧指紋感應晶片41‧‧‧Fingerprinting chip
42‧‧‧軟性電路接片42‧‧‧Soft circuit connectors
43‧‧‧硬質基板43‧‧‧hard substrate
50‧‧‧定位框座50‧‧‧ positioning frame
51‧‧‧嵌槽51‧‧‧Inlay
52‧‧‧環框52‧‧‧ ring frame
53‧‧‧卡掣部53‧‧‧Card Department
54‧‧‧通孔54‧‧‧through hole
Claims (7)
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TW104201684U TWM505655U (en) | 2015-02-03 | 2015-02-03 | Smart card fingerprint pressing device |
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TW104201684U TWM505655U (en) | 2015-02-03 | 2015-02-03 | Smart card fingerprint pressing device |
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TWM505655U true TWM505655U (en) | 2015-07-21 |
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TWI552090B (en) * | 2015-02-03 | 2016-10-01 | Wu-Shu Lin | Smart card fingerprint press device |
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Publication number | Priority date | Publication date | Assignee | Title |
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TWI552090B (en) * | 2015-02-03 | 2016-10-01 | Wu-Shu Lin | Smart card fingerprint press device |
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