TWM503593U - Monitoring camera device - Google Patents

Abstract

A monitoring camera device is provided. The monitoring camera device includes a light compensating assembly, a heat dissipating element and a camera assembly, wherein the light compensating assembly includes a circuit board and a plurality of light compensating elements disposed on the circuit board. The circuit board includes a first surface and a second surface opposite to the first surface, wherein the light compensating elements are disposed on the first surface. The heat dissipating element includes a bent portion, and a bearing portion and a bottom portion which are located at two sides of the bent portion. The second surface of the circuit board is fixed on the bearing portion, and the circuit board includes a first hole, the bearing portion includes a second hole, wherein the first hole is corresponding to the second hole. The camera assembly is disposed at a side, far away from the light compensating assembly, of the bearing portion and a lens of the camera assembly is exposed by the first hole and the second hole. The monitoring camera device has better heat dissipation effect.

Description

Surveillance camera

This creation relates to a photographic apparatus, and more particularly to a surveillance photographic apparatus.

In recent years, with the development of the security surveillance system industry, in order to protect people's lives and property safety, whether in buildings, streets, lanes or shops, surveillance cameras are everywhere, which can provide supervisors to monitor monitored areas. And can simultaneously record the video of the screen for a period of time.

Since the surveillance camera is often installed in the corner of a building or a lane, it is easy to affect the shooting effect due to poor ambient light during shooting. Current surveillance cameras often have infrared illumination modules to compensate for poor ambient light conditions. The infrared illumination module and the camera module in the surveillance camera are placed inside the same casing, but because the infrared illumination module generates waste heat during the illumination process, when the waste heat cannot be effectively dissipated, the infrared illumination module is caused. The luminous efficiency is reduced, and the service life of the infrared lighting module is even reduced.

The present invention provides a monitoring and photographing device which can have a good heat dissipation effect.

The surveillance imaging device provided by the present invention comprises a fill light assembly, a heat dissipating component and a photographing component, wherein the fill light component comprises a circuit board and a plurality of fill light components disposed on the circuit board. The circuit board has opposite first and second faces, and the fill light elements are disposed on the first face. The heat dissipating component has a bent portion and a bearing portion and a bottom portion on both sides of the bent portion. The second side of the circuit board is fixed to the carrying portion, and the circuit board includes a first hole, and the carrying portion includes a second hole, and the second hole is opposite to the first hole. The photographic component configures a side of the carrier away from the fill component, and the first hole and the second hole expose the lens of the photographic component.

In an embodiment of the present invention, the monitoring and photographing apparatus further includes a base, wherein a bottom of the heat dissipating component is coupled to the base.

In an embodiment of the present invention, the bottom of the heat dissipating component further includes a plurality of locking slots for locking to the base.

In an embodiment of the present invention, the monitoring and photographing apparatus further includes a casing, a light-filling component, a heat dissipating component, and a photographing component, and a bottom of the heat dissipating component is coupled to the casing. The outer casing further has a light transmission window corresponding to the lens.

In an embodiment of the present invention, the bottom of the heat dissipating component further includes a plurality of locking slots for locking to the outer casing.

In an embodiment of the present invention, the above-described photographic assembly is fixed to the outer casing.

In an embodiment of the present invention, the photographic assembly described above is fixed to the carrying portion.

In an embodiment of the present invention, the circuit board is locked to the carrying portion of the heat dissipating component.

In an embodiment of the present invention, the light-filling element comprises an infrared light-emitting diode or an infrared laser element.

In an embodiment of the present creation, the above-mentioned surveillance camera device is further The heat conductive material is coated on the edge of the circuit board and connected to the carrying portion of the heat dissipating component.

In the photographic imaging device of the present invention, since the heat dissipating members are bent to form the bearing portion and the bottom portion on both sides of the bending portion, heat generated by the light-filling member can be conducted to the bottom portion via the bearing portion of the heat dissipating member. When the bottom is connected to other heat conductors, heat can be further dissipated by other heat conductors, thereby improving heat dissipation efficiency. Therefore, the proposed monitoring and photographing device can have a good heat dissipation effect.

100,300‧‧‧ surveillance camera

110‧‧‧ Filling components

111‧‧‧Circuit board

111a‧‧‧ first side

111b‧‧‧ second side

112‧‧‧Complementary components

113‧‧‧First hole

114‧‧‧First keyhole

120‧‧‧Heat components

121‧‧‧ bends

122‧‧‧Loading Department

123‧‧‧ bottom

124‧‧‧Second hole

125‧‧‧Second keyhole

126‧‧‧Lock slot

127‧‧‧ third keyhole

130, 230‧‧‧Photographic components

131‧‧‧ lens

132‧‧‧Image capture module

140, 140a‧‧‧Locker

150‧‧‧Base

160‧‧‧ Thermal materials

350‧‧‧ Shell

352‧‧‧Light window

354‧‧‧ bottom

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a surveillance imaging apparatus according to an embodiment of the present invention.

2 is a perspective exploded view of a circuit board and a heat dissipating component of the monitoring and photographing apparatus according to an embodiment of the present invention.

FIG. 3 is a front elevational view of a fill light assembly according to an embodiment of the present invention.

4 is a partial cross-sectional view showing the monitoring and photographing apparatus of still another embodiment of the present invention.

FIG. 5 is a cross-sectional view of a heat dissipating component and a photographing assembly according to another embodiment of the present invention.

Fig. 6 is a cross-sectional view showing the monitoring and photographing apparatus of another embodiment of the present invention.

1 is a schematic cross-sectional view of a monitoring and photographing apparatus according to an embodiment of the present invention, and FIG. 2 is a perspective exploded view of a circuit board and a heat dissipating component of the monitoring photographing apparatus according to an embodiment of the present invention. Referring to FIG. 1 and FIG. 2 simultaneously, the monitoring and photographing apparatus 100 of the present embodiment includes a fill light assembly 110, a heat dissipating component 120, and a photographing component 130, wherein the fill light component 110 includes a circuit board 111 and is disposed on A plurality of fill elements 112 on the circuit board 111 (shown in Figure 1). The circuit board 111 has opposite first and second faces 111a, 111b, and these light-filling elements 112 are disposed on the first surface 111a. The heat dissipating component 120 has a bent portion 121 and a bearing portion 122 and a bottom portion 123 at both sides of the bent portion 121. The second surface 111b of the circuit board 111 is fixed to the carrying portion 122, and the circuit board 111 includes a first hole 113. The carrying portion 122 includes a second hole 124, and the second hole 124 is opposite to the first hole 113. The photographing component 130 is disposed on a side of the carrying portion 122 away from the fill light assembly 110 , and the first hole 113 and the second hole 124 expose the lens 131 of the photographing assembly 130 .

In the embodiment, the image capturing component 130 further includes an image capturing module 132, and the lens 131 is disposed between the image capturing module 132 and the heat dissipating component 120. The arrangement of the first hole 113 and the second hole 124 can prevent the field of view of the lens 131 from being blocked, so that the lens 131 can image an object outside the monitoring device 100 to the image capturing module 132, and the image is captured. The module 132 can be used to record an image of an object. The image capturing module 132 can include an image sensing component for sensing an image, a storage component for storing an image, and the like. The image sensing component can be a charge coupled device (CCD) or a complementary gold oxide. CMOS image sensor, but not limited to this.

In this embodiment, the fill light element 112 can emit light when the ambient light is insufficient, so that the photographing component 130 can sense a clear image. The commonly used light-filling element 112 is an infrared light-emitting element such as an infrared light-emitting diode or an infrared laser element, but the light-filling element 112 of the present invention is not limited thereto. FIG. 3 is a front elevational view of a fill light assembly according to an embodiment of the present invention. Referring to FIG. 3 , in the present embodiment, the fill light element 112 is disposed, for example, around the first hole 113 of the circuit board 111 , and the light fill elements 112 are arranged in a circular shape along the first hole 113 . The fill light element 112 can be, for example, other arrangements depending on the needs of use. This creation does not limit the number and arrangement of the fill light elements 112.

Referring to FIG. 1 and FIG. 2 again, in the embodiment, the material of the heat dissipating component 120 includes, for example, metal. For example, the material of the heat dissipating component 120 is, for example, aluminum or an alloy thereof. In other embodiments, the material of the heat dissipating component 120 may be other materials, such as metals, alloys, or ceramic materials, but not limited thereto. Since the heat dissipating member 120 is bent to form the bearing portion 122 and the bottom portion 123 on both sides of the bending portion 121, the heat generated by the light filling assembly 110 can be conducted to the bottom portion 123 via the carrying portion 122 of the heat dissipating member 120. When the bottom portion 123 is connected to other heat conductors, heat can be further dissipated by other heat conductors, thereby improving heat dissipation efficiency. For example, the surveillance camera 100 can further include a base 150 in which the bottom 123 of the heat dissipating component 120 is coupled to the base 150 such that the heat dissipating component 120 can conduct heat to the base 150 for further heat dissipation by the base 150. In addition, a heat conducting layer (not shown) such as a thermal paste or a thermal paste may be additionally coated on the bottom 123 of the heat dissipating component 120. The thermal paste is further in contact with the base 150 to improve heat dissipation efficiency.

It is worth mentioning that in another embodiment shown in FIG. 4, in order to further improve the heat dissipation efficiency, the monitoring and photographing device may further include a heat conductive material 160 coated on the edge of the circuit board 111 and connected to the heat dissipating component. The carrying portion 122 of 120. The heat conductive material 160 is, for example, a thermal conductive paste or a thermal conductive adhesive, so that thermal energy can be transmitted to the heat dissipating component 120 via the edge of the circuit board 111 and the heat conductive material 160, thereby improving heat dissipation efficiency.

Referring to FIG. 2 again, in the embodiment, the circuit board 111 is, for example, fixed to the carrying portion 122 of the heat dissipating component 120. Specifically, the circuit board 111 includes a plurality of first locking holes 114, and the receiving portion 122 of the heat dissipating component 120 includes a plurality of second locking holes 125 corresponding to the first locking holes 114, and the first locking hole 114. The number of the second lock holes 125 corresponds to the number of the second lock holes 125, and the monitoring photographing device 100 further includes a plurality of lock members 140, for example. The locking member 140 of the embodiment is, for example, a screw for passing through the corresponding first locking hole 114 and the second locking hole 125 to fix the circuit board 111 to the carrying portion 122 of the heat dissipating component 120. In this embodiment, the four first locking holes 114 correspond to the four second locking holes 125. However, the present invention does not limit the number of the first locking holes 114 and the second locking holes 125, and does not limit the circuit board 111 and The manner in which the carrier portion 122 is fixed.

The bottom portion 123 of the heat dissipating component 120 further includes a plurality of locking slots 126. The base 150 includes a plurality of locking holes (not shown) corresponding to the locking slots 126 of the heat dissipating component 120. The locking member 140 passes through the corresponding locking slot. 126 and a keyhole to connect the bottom 123 of the heat dissipating component 120 to the base 150. In this embodiment, the four lock grooves 126 and the four corresponding lock holes are taken as an example, and the present invention does not limit the number of the lock grooves 126 and the lock holes. As shown in FIG. 2, in the present embodiment, the shape of the lock groove 126 is, for example, elongated, for slightly adjusting the position of the heat dissipating member 120.

As shown in FIG. 1 , in the embodiment, the photographing unit 130 is bulky and heavy, and is disposed on the base 150 . In other embodiments of the present creation, smaller photographic components may also be employed. FIG. 5 is a cross-sectional view of a heat dissipating component and a photographing assembly according to another embodiment of the present invention. As shown in FIG. 5, in the present embodiment, since the photographing unit 230 has a small volume, it can be directly fixed to the carrying portion 122 of the heat dissipating member 120. Specifically, the heat dissipating component 120 further includes a plurality of third locking holes 127 (shown in FIG. 2), and the photographic component 230 further includes a plurality of fourth locking holes (not shown) corresponding to the third locking holes 127. The photographic assembly 230 is locked to the carrying portion 122 of the heat dissipating member 120 by the locking member 140a passing through the corresponding third locking hole 127 and the fourth locking hole.

Fig. 6 is a cross-sectional view showing the monitoring and photographing apparatus of another embodiment of the present invention. Please refer to FIG. 6 , the monitoring and photographing apparatus 300 and the present creation of the embodiment. The structure and advantages of the monitoring and photographing apparatus 100 of an embodiment are similar. The difference is that in the present embodiment, the monitoring photographing apparatus 300 omits the base 150 of FIG. 1, and the monitoring photographing apparatus 300 further includes a casing 350 for covering the fill light. The component 110, the heat dissipating component 120 and the photographic component 130, and the bottom 123 of the heat dissipating component 120 are coupled to the outer casing 350. In this embodiment, the bottom portion 123 of the heat dissipating component 120 can be fixed to the bottom 354 of the outer casing 350 by locking or other means. As such, the heat dissipating component 120 can conduct heat generated by the fill light assembly 110 to the outer casing 350 to further dissipate heat through the outer casing 350.

In this embodiment, the outer casing 350 further includes a light transmission window 352 corresponding to the lens 131 of the photographic component 130. The light transmission window 352 corresponds to the first hole 113 of the light-filling component 110 and the second hole 124 of the heat dissipation component 120, To expose the lens 131.

In summary, in the present invention, the monitoring and photographing device is formed by bending the heat dissipating members to form the bearing portion and the bottom portion on both sides of the bending portion, so that the heat generated by the light-filling member can be conducted to the bottom portion via the bearing portion of the heat dissipating member. When the bottom is connected to other heat conductors, the heat dissipation can be further enhanced by the other heat conductors, thereby improving the heat dissipation effect. Therefore, the monitoring and photographing device of the present invention can have a good heat dissipation effect. In addition, the present invention can further apply a thermal conductive material to the edge of the circuit board and connect the heat dissipating components to improve the efficiency of transferring thermal energy.

Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and anyone skilled in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of protection is subject to the definition of the scope of the patent application.

100‧‧‧ surveillance camera

110‧‧‧ Filling components

111‧‧‧Circuit board

111a‧‧‧ first side

111b‧‧‧ second side

112‧‧‧Complementary components

113‧‧‧First hole

120‧‧‧Heat components

121‧‧‧ bends

122‧‧‧Loading Department

123‧‧‧ bottom

124‧‧‧Second hole

130‧‧‧Photographic components

131‧‧‧ lens

132‧‧‧Image capture module

150‧‧‧Base

Claims (10)

A surveillance imaging device includes: a fill light assembly comprising a circuit board and a plurality of fill light components disposed on the circuit board, wherein the circuit board has a first surface and a second surface opposite to each other The light element is disposed on the first surface; a heat dissipating component has a bent portion and a bearing portion and a bottom portion on both sides of the bending portion, and the second surface of the circuit board is fixed to the carrying portion, and the The circuit board includes a first hole, the bearing portion includes a second hole, the second hole is opposite to the first hole, and a photographic component is disposed on a side of the bearing portion away from the light-filling component, and the first A hole and the second hole expose a lens of the photographic assembly. The surveillance camera device of claim 1, further comprising a base, the bottom of the heat dissipating component being coupled to the base. The surveillance camera of claim 2, wherein the bottom of the heat dissipating component further comprises a plurality of locking slots for locking to the base. The surveillance camera device of claim 1, further comprising a casing covering the light-filling component, the heat-dissipating component and the camera component, and the bottom of the heat-dissipating component is connected to the casing, the casing further having Corresponding to a light transmission window of the lens. The surveillance camera of claim 4, wherein the bottom of the heat dissipating component further comprises a plurality of locking slots for locking to the housing. The surveillance camera of claim 4, wherein the camera assembly is fixed to the housing. The surveillance camera of claim 1, wherein the camera assembly is fixed to the carrier. The surveillance camera of claim 1, wherein the circuit board is locked to the carrier of the heat dissipating component. The surveillance imaging device of claim 1, wherein the light-filling elements comprise an infrared light-emitting diode or an infrared laser element. The surveillance camera device of claim 1, further comprising a heat conductive material applied to an edge of the circuit board and connected to the carrier portion of the heat dissipating component.