TWM502753U - Fan module - Google Patents
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Abstract
Description
本新型創作是有關於一種風扇模組，且特別是有關於一種可降低其所產生的噪音的風扇模組。The present invention relates to a fan module, and more particularly to a fan module that reduces the noise generated by the fan module.
近年來隨著電腦科技的突飛猛進，使得電腦之運作速度不斷地提高。由於個人電腦在工作場所及住家中激增的因素，將會在計算環境中產生相關問題。憂慮之一是當電腦在操作時，會有噪音的產生。舉例來說，電腦內的中央處理器及電源供應器的風扇會在運作的過程中產生噪音。In recent years, with the rapid advancement of computer technology, the speed of computer operation has been continuously improved. Due to the proliferation of personal computers in the workplace and in the home, problems will arise in the computing environment. One of the worries is that when the computer is operating, there will be noise. For example, the central processor in the computer and the fan of the power supply will generate noise during operation.
一般而言，為了預防電腦主機內部之電子元件過熱，而導致電子元件發生暫時性或永久性的失效，通常會在電腦主機之電源供應器(power supply)、中央處理單元(CPU)及繪圖處理單元(GPU)等溫度容易升高之電子元件上配置風扇來對電子元件進行散熱，用以迅速移除電子元件於高速運作時所產生的熱能，因而降低電子元件之本身的溫度，如此將使得電腦主機之運作能夠更為順暢。然而，風扇的轉動會產生振動噪音，而當上述振動噪音落入人耳接收範圍內時，會影響使用者的聽覺感受，亦 即會影響使用者的操作舒適性。In general, in order to prevent the electronic components inside the computer host from overheating, the electronic components are temporarily or permanently disabled, usually in the power supply, central processing unit (CPU) and graphics processing of the host computer. A fan, such as a GPU, which is easily heated, is provided with a fan to dissipate heat from the electronic component to quickly remove thermal energy generated by the electronic component during high-speed operation, thereby reducing the temperature of the electronic component itself, thus The operation of the computer mainframe can be smoother. However, the rotation of the fan generates vibration noise, and when the above vibration noise falls within the receiving range of the human ear, it will affect the user's hearing experience. This will affect the user's operational comfort.
本新型創作提供一種風扇模組，其運轉時所產生的噪音較小。The novel creation provides a fan module that generates less noise during operation.
本新型創作的風扇模組，其包括一風扇本體以及一共振罩體。風扇本體包括至少一消音孔、一出風口、一上表面、相對上表面的一下表面以及連接上表面與下表面的一側表面。消音孔的口徑關聯於風扇本體於運作中所發出的音頻。共振罩體設置於風扇本體上，以與風扇本體共同定義出一共振腔，且共振罩體罩覆消音孔。The fan module of the present invention comprises a fan body and a resonance cover. The fan body includes at least one silencing hole, an air outlet, an upper surface, a lower surface opposite to the upper surface, and a side surface connecting the upper surface and the lower surface. The aperture of the silencing hole is related to the audio emitted by the fan body during operation. The resonant cover body is disposed on the fan body to define a resonant cavity together with the fan body, and the resonant cover body covers the sound-absorbing hole.
基於上述，本新型創作的風扇模組設置一共振罩體於風扇本體上，使共振罩體與風扇本體共同定義出一共振腔，且風扇本體具有至少一個消音孔，共振罩罩覆上述消音孔，而上述消音孔的口徑與風扇本體於運作時所發出的音頻相關聯，因而可依據欲降低的風扇本體於運作時所發出的噪音的音頻來對應設計消音孔的口徑以及共振罩體的尺寸。如此配置，本發明的風扇模組即可利用共振腔的自然頻率與風扇本體於運作時所發出的音波的頻率一樣時會產生共振的亥姆霍茲原理來消耗聲音的能量，因而能針對風扇本體於運作時所發出的音頻進行吸音而達到降低噪音量的效果。Based on the above, the fan module of the present invention is provided with a resonant cover body on the fan body, so that the resonant cover body and the fan body jointly define a resonant cavity, and the fan body has at least one sound-absorbing hole, and the resonant cover covers the sound-absorbing hole. The aperture of the above-mentioned silencing hole is associated with the audio emitted by the fan body during operation, so that the aperture of the silencing hole and the size of the resonant cover can be correspondingly designed according to the audio of the noise emitted by the fan body during operation. . With such a configuration, the fan module of the present invention can utilize the Helmholtz principle of resonating when the natural frequency of the resonant cavity is the same as the frequency of the sound wave emitted by the fan body during operation, thereby consuming the energy of the sound, and thus can be directed to the fan. The sound emitted by the main body during operation is sound-absorbing to achieve a noise reduction effect.
為讓本新型創作的上述特徵和優點能更明顯易懂，下文 特舉實施例，並配合所附圖式作詳細說明如下。In order to make the above features and advantages of the novel creation more obvious, the following The embodiments are described in detail with reference to the accompanying drawings.
10‧‧‧電子裝置10‧‧‧Electronic devices
12‧‧‧機殼12‧‧‧Shell
14‧‧‧電子元件14‧‧‧Electronic components
100、100a、100b‧‧‧風扇模組100, 100a, 100b‧‧‧ fan modules
110‧‧‧風扇本體110‧‧‧Fan body
112‧‧‧消音孔112‧‧‧Sound hole
114‧‧‧出風口114‧‧‧air outlet
116‧‧‧上表面116‧‧‧Upper surface
118‧‧‧下表面118‧‧‧ lower surface
119‧‧‧側表面119‧‧‧ side surface
120‧‧‧共振罩體120‧‧‧Resonant cover
B‧‧‧消音孔距離B‧‧‧ Silence hole distance
D‧‧‧厚度D‧‧‧thickness
d‧‧‧口徑D‧‧‧ caliber
G‧‧‧間距G‧‧‧ spacing
L‧‧‧內壁厚度L‧‧‧ inner wall thickness
圖1是依照本新型創作的一實施例的一種風扇模組的示意圖。1 is a schematic diagram of a fan module in accordance with an embodiment of the present invention.
圖2是依照本新型創作的一實施例的風扇模組設置於電子裝置內的剖面示意圖。2 is a cross-sectional view of a fan module disposed in an electronic device in accordance with an embodiment of the present invention.
圖3是依照本新型創作的另一實施例的風扇模組設置於電子裝置內的剖面示意圖。3 is a cross-sectional view showing a fan module disposed in an electronic device according to another embodiment of the present invention.
圖4以及圖5是依照本新型創作的不同實施例的風扇模組的示意圖。4 and 5 are schematic views of a fan module in accordance with various embodiments of the present invention.
圖6是依照本新型創作的一實施例的風扇模組設置於電子裝置內的剖面示意圖。FIG. 6 is a cross-sectional view showing a fan module disposed in an electronic device according to an embodiment of the present invention.
有關本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之各實施例的詳細說明中，將可清楚的呈現。以下實施例中所提到的方向用語，例如：「上」、「下」、「前」、「後」、「左」、「右」等，僅是參考附加圖式的方向。因此，使用的方向用語是用來說明，而並非用來限制本發明。並且，在下列各實施例中，相同或相似的元件將採用相同或相似的標號。The above and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the embodiments of the invention. The directional terms mentioned in the following embodiments, such as "upper", "lower", "front", "back", "left", "right", etc., are only directions referring to the additional schema. Therefore, the directional terminology used is for the purpose of illustration and not limitation. Also, in the following embodiments, the same or similar elements will be given the same or similar reference numerals.
圖1是依照本新型創作的一實施例的一種風扇模組的示意圖。請同時參照圖1以及圖2，風扇模組100包括一風扇本體110以及一共振罩體120。風扇本體110如圖1所示包括至少一消音孔112、一出風口114、一上表面116、相對上表面116的一下表面118以及連接上表面116與下表面118的一側表面119。共振罩體120設置於風扇本體110上，以與風扇本體110共同定義出一共振腔，並且，共振罩體120罩覆風扇本體110上的消音孔112。1 is a schematic diagram of a fan module in accordance with an embodiment of the present invention. Referring to FIG. 1 and FIG. 2 , the fan module 100 includes a fan body 110 and a resonant cover 120 . The fan body 110 includes at least one silencing hole 112, an air outlet 114, an upper surface 116, a lower surface 118 opposite the upper surface 116, and a side surface 119 connecting the upper surface 116 and the lower surface 118, as shown in FIG. The resonant cover 120 is disposed on the fan body 110 to define a resonant cavity together with the fan body 110, and the resonant cover 120 covers the silencing hole 112 on the fan body 110.
圖2是依照本新型創作的一實施例的風扇模組設置於電子裝置內的剖面示意圖。請同時參照圖1以及圖2，本實施例的風扇模組100可例如設置於一電子裝置10的一機殼12內，用以對電子裝置10內的電子元件(例如為圖2所示的電子元件14或其他設置於電子裝置10內的電子元件)進行散熱。在本實施例中，電子裝置10可例如為一筆記型電腦，而風扇模組100則可為用以對電子裝置10內的中央處理單元(CPU)或電源供應單元(PSU)等電子元件進行散熱的風扇模組。當然，本實施例僅用以舉例說明，本發明並不侷限風扇模組100的應用以及電子裝置10的種類。2 is a cross-sectional view of a fan module disposed in an electronic device in accordance with an embodiment of the present invention. Referring to FIG. 1 and FIG. 2 , the fan module 100 of the present embodiment can be disposed, for example, in a casing 12 of an electronic device 10 for electronic components in the electronic device 10 (for example, as shown in FIG. 2 ). The electronic component 14 or other electronic component disposed in the electronic device 10 dissipates heat. In this embodiment, the electronic device 10 can be, for example, a notebook computer, and the fan module 100 can be used for electronic components such as a central processing unit (CPU) or a power supply unit (PSU) in the electronic device 10. Cooling fan module. Of course, this embodiment is for illustrative purposes only, and the present invention is not limited to the application of the fan module 100 and the type of the electronic device 10.
具體而言，消音孔112設置於風扇本體110的下表面118，而共振罩體120亦設置於風扇本體110的下表面118以罩覆消音孔112，並且，共振罩體120如圖1所示地緊鄰風扇本體100的出風口114。在本實施例中，共振罩體120設置於下表面118與電子裝置10的機殼12之間。舉例來說，風扇本體110的下表面118與機殼12之間如圖2所示具有一間距G，而共振罩體120即 位於此間距G內，且此間距約介於2毫米至3毫米之間。在此情況下，共振罩體120的厚度D可預設為1.8毫米。當然，本實施例的數值僅用以舉例說明，而非用以限制本創作新型。Specifically, the sound absorbing hole 112 is disposed on the lower surface 118 of the fan body 110, and the resonant cover 120 is also disposed on the lower surface 118 of the fan body 110 to cover the sound absorbing hole 112, and the resonant cover 120 is as shown in FIG. The ground is adjacent to the air outlet 114 of the fan body 100. In the present embodiment, the resonant cover 120 is disposed between the lower surface 118 and the casing 12 of the electronic device 10. For example, the lower surface 118 of the fan body 110 and the casing 12 have a spacing G as shown in FIG. 2, and the resonant cover 120 is Located within this spacing G, and this spacing is between about 2 mm and 3 mm. In this case, the thickness D of the resonant cover 120 may be preset to 1.8 mm. Of course, the numerical values of the present embodiment are for illustrative purposes only, and are not intended to limit the novel.
在本實施例中，風扇模組100的消音孔112的口徑d係關聯於風扇本體110於運作中所發出的音頻。一般而言，風扇本體110於運作中所發出的音頻約在介於1500赫茲(Hz)至3000赫茲的時候所產生的聲音能量最大，因此，本實施例預設風扇本體110於運作中所發出的音頻為2000赫茲。當然，本實施例僅用以舉例說明，本創作新型並不侷限於此。風扇模組100即是利用亥姆霍茲的共振原理，因為共振腔內的自然頻率與風扇本體110於運作中所發出的音波的頻率一樣時會產生共振的現象，故為了克服摩擦力而消耗聲音的能量，因而能達到吸音與降低音量的效果。In this embodiment, the aperture d of the silencing hole 112 of the fan module 100 is associated with the audio emitted by the fan body 110 during operation. In general, the sound generated by the fan body 110 during operation is about 1500 Hz to 3000 Hz. Therefore, the fan body 110 is preset to operate in the operation. The audio is 2000 Hz. Of course, this embodiment is for illustrative purposes only, and the novel is not limited thereto. The fan module 100 utilizes the resonance principle of Helmholtz, because the natural frequency in the resonant cavity resonates when the frequency of the sound wave generated by the fan body 110 during operation is the same, so it is consumed in order to overcome the friction. The energy of the sound can thus achieve the effect of sound absorption and volume reduction.
具體來說，消音孔112的口徑d與風扇本體110於運作中所發出的音頻之間的關係應滿足亥姆霍茲(Helmholtz)公式的關係：
其中，d代表消音孔112的口徑，f0
代表風扇本體110於運作中所發出的音頻，c代表音速，S代表消音孔112的截面積，L代表消音孔112的內壁厚度，而V則代表共振腔140的體積。進一步而言，若消音孔112的形狀呈圓形，則消音孔112的截面
積S與消音孔112的口徑d的關係應滿足下列公式的關係：
換句話說，消音孔112的口徑d除了關聯於風扇本體110於運作中所發出的音頻之外，亦關聯於消音孔112的截面積S、消音孔112的內壁厚度L以及共振腔的體積V。In other words, the aperture d of the silencing hole 112 is related to the cross-sectional area S of the silencing hole 112, the thickness L of the inner wall of the silencing hole 112, and the volume of the resonant cavity, in addition to the audio emitted by the fan body 110 during operation. V.
在本實施例中，風扇本體110於運作中所發出的音頻可例如預設為2000赫茲，而消音孔112的內壁厚度L可預設為0.8毫米(mm)，並可依據電子裝置10的尺寸及空間定出共振腔的體積V，以得到消音孔112的口徑d與音頻的關係，如此，即可依據欲降低的噪音的音頻來設計消音孔112的口徑d。當然，本實施例的數值僅用以舉例說明，本創作新型並不侷限於上述的預設數值。In this embodiment, the audio emitted by the fan body 110 during operation may be preset to, for example, 2000 Hz, and the inner wall thickness L of the sound absorbing hole 112 may be preset to 0.8 millimeters (mm), and may be according to the electronic device 10 The size and space define the volume V of the resonant cavity to obtain the relationship between the aperture d of the silencing hole 112 and the audio. Thus, the aperture d of the silencing hole 112 can be designed according to the audio of the noise to be reduced. Of course, the numerical values of the present embodiment are for illustrative purposes only, and the present invention is not limited to the above preset values.
圖3是依照本新型創作的另一實施例的風扇模組設置於電子裝置內的剖面示意圖。在此必須說明的是，本實施例的風扇模組與圖2的風扇模組100相似，因此，本實施例沿用前述實施例的元件標號與部分內容，其中採用相同的標號來表示相同或近似的元件，並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例，本實施例不再重複贅述。以下將針對本實施例的風扇模組100與圖2的風扇模組100的差異做說明。3 is a cross-sectional view showing a fan module disposed in an electronic device according to another embodiment of the present invention. It should be noted that the fan module of this embodiment is similar to the fan module 100 of FIG. 2. Therefore, the present embodiment uses the component numbers and parts of the foregoing embodiments, wherein the same reference numerals are used to indicate the same or similar. The components are omitted, and the description of the same technical content is omitted. For the description of the omitted part, reference may be made to the foregoing embodiment, and the description is not repeated herein. The difference between the fan module 100 of the present embodiment and the fan module 100 of FIG. 2 will be described below.
在本實施例中，風扇模組100的消音孔的數量可為多個(繪示為3個)，如此，則各消音孔112的口徑d與風扇本體110於運作中所發出的音頻之間的關係應滿足亥姆霍茲(Helmholtz)
公式：
其中，n代表消音孔的數量，d代表消音孔的口徑，f0 代表風扇本體於運作中所發出的音頻，c代表音速，S代表消音孔112的截面積，L代表消音孔112的內壁厚度，B代表相鄰兩消音孔之間的距離，且V代表共振腔的體積。換句話說，消音孔112的口徑除了關聯於風扇本體110於運作中所發出的音頻之外，亦關聯於消音孔的數量n、消音孔112的截面積S、消音孔112的內壁厚度L以及共振腔的體積V。Where n represents the number of silencing holes, d represents the aperture of the silencing hole, f 0 represents the audio emitted by the fan body during operation, c represents the speed of sound, S represents the cross-sectional area of the silencing hole 112, and L represents the inner wall of the silencing hole 112. Thickness, B represents the distance between two adjacent silencing holes, and V represents the volume of the resonant cavity. In other words, the aperture of the silencing hole 112 is related to the number of silencing holes n, the cross-sectional area S of the silencing hole 112, and the inner wall thickness of the silencing hole 112, in addition to the audio emitted by the fan body 110 during operation. And the volume V of the resonant cavity.
圖4以及圖5是依照本新型創作的不同實施例的風扇模組的示意圖。圖6是依照本新型創作的一實施例的風扇模組設置於電子裝置內的剖面示意圖。在此必須說明的是，圖4以及圖5所示的風扇模組100a、100b與前述的風扇模組100相似，因此，本實施例沿用前述實施例的元件標號與部分內容，其中採用相同的標號來表示相同或近似的元件，並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例，本實施例不再重複贅述。以下將針對圖4以及圖5所示的風扇模組100a、100b與前述的風扇模組100的差異做說明。4 and 5 are schematic views of a fan module in accordance with various embodiments of the present invention. FIG. 6 is a cross-sectional view showing a fan module disposed in an electronic device according to an embodiment of the present invention. It should be noted that the fan modules 100a and 100b shown in FIG. 4 and FIG. 5 are similar to the fan module 100 described above. Therefore, the present embodiment uses the component numbers and parts of the foregoing embodiments, wherein the same is used. The reference numerals are given to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted part, reference may be made to the foregoing embodiment, and the description is not repeated herein. The difference between the fan modules 100a and 100b shown in FIGS. 4 and 5 and the fan module 100 described above will be described below.
在電子裝置10內的空間有限的情況下，若風扇本體110的下表面118與電子裝置10的機殼12之間的間距G較小(例如間距G介於1毫米至1.5毫米之間)而無法容納共振罩體120，則 共振罩體120可如圖4以及圖5所示地設置於風扇本體110的側表面119，消音孔112亦設置於風扇本體110的側表面119，以使共振罩體120能罩覆風扇本體110的消音孔112。如此，風扇模組100a、100b便可在不受電子裝置10的厚度限制的情況下，利用前述的亥姆霍茲的共振原理，依據欲降低的噪音的音頻來設計消音孔112的口徑，進而達到吸音與降低音量的效果。In the case where the space in the electronic device 10 is limited, if the distance G between the lower surface 118 of the fan body 110 and the casing 12 of the electronic device 10 is small (for example, the pitch G is between 1 mm and 1.5 mm) Cannot accommodate the resonant cover 120, then The resonant cover 120 can be disposed on the side surface 119 of the fan body 110 as shown in FIG. 4 and FIG. 5, and the sound-absorbing hole 112 is also disposed on the side surface 119 of the fan body 110, so that the resonant cover 120 can cover the fan body 110. Silence hole 112. In this manner, the fan modules 100a and 100b can design the aperture of the silencing hole 112 according to the noise of the noise to be reduced, without using the Helmholtz resonance principle described above, without being limited by the thickness of the electronic device 10. Achieve sound absorption and volume reduction.
在此須說明的是，圖4以及圖5所示的風扇模組100a、100b其結構上大致相似，惟圖4所示的風扇模組100a的風扇本體110具有多個消音孔112(繪示為4個)，而圖5所示的風扇模組100a的風扇本體110僅具有1個消音孔112。因此，圖4所示的風扇模組100a的各消音孔112的口徑與風扇本體110於運作中所發出的音頻之間的關係應如前所述滿足亥姆霍茲(Helmholtz)公式：
其中，n代表消音孔的數量，d代表消音孔的口徑，f0 代表風扇本體於運作中所發出的音頻，c代表音速，S代表消音孔112的截面積，L代表消音孔112的內壁厚度，B代表相鄰兩消音孔之間的間距，且V代表共振腔的體積。Where n represents the number of silencing holes, d represents the aperture of the silencing hole, f 0 represents the audio emitted by the fan body during operation, c represents the speed of sound, S represents the cross-sectional area of the silencing hole 112, and L represents the inner wall of the silencing hole 112. Thickness, B represents the spacing between adjacent two silencing holes, and V represents the volume of the resonant cavity.
並且，圖5所示的風扇模組100b的消音孔112的口徑與風扇本體110於運作中所發出的音頻之間的關係應如前所述滿足亥姆霍茲(Helmholtz)公式的關係：
其中，d代表消音孔112的口徑，f0 代表風扇本體110於運作中所發出的音頻，c代表音速，S代表消音孔112的截面積，L代表消音孔112的內壁厚度，而V則代表共振腔140的體積。Where d represents the aperture of the silencing hole 112, f 0 represents the audio emitted by the fan body 110 during operation, c represents the speed of sound, S represents the sectional area of the silencing hole 112, L represents the inner wall thickness of the silencing hole 112, and V Represents the volume of the resonant cavity 140.
綜上所述，本新型創作的風扇模組設置一共振罩體於風扇本體上，使共振罩體與風扇本體共同定義出一共振腔，且風扇本體具有至少一個消音孔，共振罩罩覆上述消音孔，而上述消音孔的口徑與風扇本體於運作時所發出的音頻相關聯，因而可依據欲降低的風扇本體於運作時所發出的噪音的音頻來對應設計消音孔的口徑以及共振罩體的尺寸。如此配置，本發明的風扇模組即可利用共振腔的自然頻率與風扇本體於運作時所發出的音波的頻率一樣時會產生共振的亥姆霍茲原理來消耗聲音的能量，因而能針對風扇本體於運作時所發出的音頻進行吸音而達到降低噪音量的效果。In summary, the fan module of the present invention is provided with a resonant cover body on the fan body, so that the resonant cover body and the fan body jointly define a resonant cavity, and the fan body has at least one silencing hole, and the resonant cover covers the above a sound-absorbing hole, and the diameter of the sound-absorbing hole is associated with the sound emitted by the fan body during operation, so that the aperture of the sound-absorbing hole and the resonance cover can be correspondingly designed according to the noise of the noise generated by the fan body during operation. size of. With such a configuration, the fan module of the present invention can utilize the Helmholtz principle of resonating when the natural frequency of the resonant cavity is the same as the frequency of the sound wave emitted by the fan body during operation, thereby consuming the energy of the sound, and thus can be directed to the fan. The sound emitted by the main body during operation is sound-absorbing to achieve a noise reduction effect.
雖然本新型創作已以實施例揭露如上，然其並非用以限定本新型創作，任何所屬技術領域中具有通常知識者，在不脫離本新型創作的精神和範圍內，當可作些許的更動與潤飾，故本新型創作的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.
100‧‧‧風扇模組100‧‧‧Fan module
110‧‧‧風扇本體110‧‧‧Fan body
112‧‧‧消音孔112‧‧‧Sound hole
114‧‧‧出風口114‧‧‧air outlet
116‧‧‧上表面116‧‧‧Upper surface
118‧‧‧下表面118‧‧‧ lower surface
119‧‧‧側表面119‧‧‧ side surface
120‧‧‧共振罩體120‧‧‧Resonant cover
d‧‧‧口徑D‧‧‧ caliber
Claims (10)
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| Application Number | Priority Date | Filing Date | Title |
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| TW103220305U TWM502753U (en) | 2014-11-14 | 2014-11-14 | Fan module |
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| Application Number | Priority Date | Filing Date | Title |
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| TW103220305U TWM502753U (en) | 2014-11-14 | 2014-11-14 | Fan module |
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| Publication Number | Publication Date |
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| TWM502753U true TWM502753U (en) | 2015-06-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI776662B (en) * | 2021-09-01 | 2022-09-01 | 奇鋐科技股份有限公司 | Centrifugal fan noise-lowering structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI776662B (en) * | 2021-09-01 | 2022-09-01 | 奇鋐科技股份有限公司 | Centrifugal fan noise-lowering structure |
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