TWM502938U - Electronic assembly - Google Patents
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- TWM502938U TWM502938U TW104200903U TW104200903U TWM502938U TW M502938 U TWM502938 U TW M502938U TW 104200903 U TW104200903 U TW 104200903U TW 104200903 U TW104200903 U TW 104200903U TW M502938 U TWM502938 U TW M502938U
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Abstract
Description
本新型創作是有關於一種電子總成，且特別是有關於一種具有共振器的電子總成。The present invention relates to an electronic assembly, and more particularly to an electronic assembly having a resonator.
就現有的桌上型個人電腦來說，其大致是由主機以及顯示器所組成。通常而言，主機係作為處理訊號或儲存資料所用，其中為求獲致更大的儲存容量，大多是在主機內增設硬碟。然而，在硬碟運轉的過程中，其會產生特定的振動頻率，進而發出特定頻率範圍的聲音。又，主機內的元件在運轉時會產生熱能，為避免前述元件因熱能積累的緣故而故障或損毀，通是在主機的機殼上開設以出風口並對應次出風口設置風扇模組，藉以透過風扇模組在機殼內引起氣流，進而將熱能自出風口排出機殼外。相似地，在風扇模組的過程中，其會產生特定的振動頻率，進而發出特定頻率範圍的聲音。In the case of an existing desktop personal computer, it is roughly composed of a host computer and a display. Generally speaking, the host system is used for processing signals or storing data. In order to obtain a larger storage capacity, most of the hard disks are added to the host. However, during the operation of the hard disk, it generates a specific vibration frequency, which in turn emits a sound in a specific frequency range. Moreover, the components in the main body generate heat during operation, and in order to prevent the above components from being damaged or damaged due to the accumulation of thermal energy, the fan module is opened on the casing of the main body and the fan module is arranged corresponding to the secondary air outlet. The airflow is caused in the casing through the fan module, and the heat is discharged from the air outlet to the outside of the casing. Similarly, during the fan module, it produces a specific vibration frequency, which in turn emits a sound in a specific frequency range.
換言之，在主機運轉的過程中會因其內部的元件所產生的振動而發出不同頻率的聲音。對使用者來說，前述不同頻率的 聲音混雜後便是惱人的噪音，因此如何消除前述惱人的噪音便成為亟待解決的問題之一。In other words, during the operation of the main engine, sounds of different frequencies are emitted due to the vibration generated by the internal components. For the user, the aforementioned different frequencies When the sound is mixed, it is annoying noise, so how to eliminate the aforementioned annoying noise becomes one of the problems to be solved.
本新型創作提供一種電子總成，其可有效消除其內部的元件振動時所發出的噪音。The novel creation provides an electronic assembly that effectively eliminates the noise emitted by components within its internal vibrations.
本新型創作提出一種電子總成，包括外殼、至少一振動元件以及至少一共振器。外殼具有空間。前述至少一振動元件組裝於外殼上且位於空間內，並適於在運轉時產生振動而發出聲波。前述至少一共振器對應於前述至少一振動元件而設置，其中前述至少一共振器具有腔體以及至少一連通孔，且前述至少一連通孔連通空間與腔體。在聲波通過前述至少一連通孔時，聲波由腔體所吸收。The present invention proposes an electronic assembly comprising a housing, at least one vibrating element, and at least one resonator. The outer casing has space. The at least one vibrating element is assembled on the outer casing and located in the space, and is adapted to generate vibration during operation to emit sound waves. The at least one resonator is disposed corresponding to the at least one vibrating element, wherein the at least one resonator has a cavity and at least one communication hole, and the at least one communication hole communicates with the cavity and the cavity. When the sound wave passes through the aforementioned at least one communication hole, the sound wave is absorbed by the cavity.
基於上述，本新型創作的電子總成的機殼內或殼罩上設置有一或多個共振器，且例如是黑姆赫茲(Helmholtz)共振器。因此，機殼或殼罩內的元件運轉時的振動所發出的特定頻率的聲音，可透過共振器來吸收。也就是說，本新型創作的電子總成可透過共振器來消除其內部的元件運轉時所發出的噪音，從而提高使用者使用時的舒適度。Based on the above, one or more resonators are disposed in or on the casing of the electronic assembly of the present invention, and are, for example, a Helmholtz resonator. Therefore, the sound of a specific frequency emitted by the vibration of the components in the casing or the casing can be absorbed by the resonator. That is to say, the electronic assembly created by the present invention can eliminate the noise generated by the operation of the components inside the resonator through the resonator, thereby improving the comfort of the user.
為讓本新型創作的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will become more apparent and understood from the following description.
100、100A‧‧‧電子總成100, 100A‧‧‧Electronic assembly
110、110a‧‧‧外殼110, 110a‧‧‧ Shell
111、111a‧‧‧空間111, 111a‧‧‧ space
112~115‧‧‧組裝孔112~115‧‧‧Assembled holes
121‧‧‧第一振動元件121‧‧‧First vibrating element
121a‧‧‧振動元件121a‧‧‧Vibration element
122‧‧‧第二振動元件122‧‧‧Second vibrating element
123‧‧‧第三振動元件123‧‧‧ Third vibrating element
131‧‧‧第一共振器131‧‧‧First Resonator
131a‧‧‧第一腔體131a‧‧‧First cavity
131b‧‧‧第一連通孔131b‧‧‧first connecting hole
132‧‧‧第二共振器132‧‧‧Second resonator
132a‧‧‧第二腔體132a‧‧‧Second cavity
132b‧‧‧第二連通孔132b‧‧‧second connecting hole
133‧‧‧第三共振器133‧‧‧ Third Resonator
133a‧‧‧第三腔體133a‧‧‧ third cavity
133b‧‧‧第三連通孔133b‧‧‧ third connecting hole
134‧‧‧共振器134‧‧‧Resonator
134a‧‧‧腔體134a‧‧‧ cavity
134b、134c‧‧‧連通孔134b, 134c‧‧‧Connected holes
D1~D5‧‧‧孔徑D1~D5‧‧‧ aperture
H1~H4‧‧‧頭部H1~H4‧‧‧ head
L1~L3‧‧‧孔深L1~L3‧‧‧ hole depth
V1~V3‧‧‧體積V1~V3‧‧‧ volume
W1‧‧‧第一聲波W1‧‧‧First Sound Wave
W2‧‧‧第二聲波W2‧‧‧Second sound wave
W3‧‧‧第三聲波W3‧‧‧ third sound wave
圖1是本新型創作一實施例的電子總成的示意圖。1 is a schematic view of an electronic assembly of an embodiment of the present invention.
圖2是圖1的各個共振器的剖面示意圖。2 is a schematic cross-sectional view of each of the resonators of FIG. 1.
圖3是本新型創作其他實施例的共振器的剖面示意圖。3 is a schematic cross-sectional view of a resonator of another embodiment of the present invention.
圖4是本新型創作另一實施例的電子總成的剖面示意圖。4 is a schematic cross-sectional view of an electronic assembly of another embodiment of the present invention.
圖1是本新型創作一實施例的電子總成的示意圖。圖2是圖1的各個共振器的剖面示意圖。請參考圖1與圖2，在本實施例中，電子總成100例如是桌上型個人電腦的主機，但不以此為限。電子總成100包括外殼110、第一振動元件121、第二振動元件122、第三振動元件123、對應於第一振動元件至121設置的第一共振器131、對應於第二振動元件至122設置的第二共振器132以及對應於第三振動元件至123設置的第三共振器133。雖然本實施例是以設置有三個振動元件以及對應於前述三個振動元件而設置的三個共振器的電子總成100作說明，但本新型創作並不以此為限。也就是說，舉凡設置有至少一組振動元件與共振器的電子總成皆屬本新型創作所欲保護的範疇。1 is a schematic view of an electronic assembly of an embodiment of the present invention. 2 is a schematic cross-sectional view of each of the resonators of FIG. 1. Referring to FIG. 1 and FIG. 2, in the embodiment, the electronic assembly 100 is, for example, a host of a desktop personal computer, but is not limited thereto. The electronic assembly 100 includes a housing 110, a first vibrating element 121, a second vibrating element 122, a third vibrating element 123, a first resonator 131 corresponding to the first vibrating element to 121, and a second vibrating element to 122. The second resonator 132 is disposed and the third resonator 133 corresponding to the third vibrating element to 123 is disposed. Although the present embodiment is described with an electronic assembly 100 provided with three vibrating elements and three resonators disposed corresponding to the three vibrating elements, the novel creation is not limited thereto. That is to say, the electronic assembly provided with at least one set of vibrating elements and resonators is within the scope of the novel creation.
外殼110具有空間111，第一振動元件至121、第二振動元件122與第三振動元件123分別組裝於外殼110上且位於空間111內，其中前述振動元件例如是硬碟、光碟機或其他運轉時會產 生振動的元件。詳細而言，第一振動元件121在運轉時會產生振動而發出第一聲波W1，第二振動元件122在運轉時會產生振動而發出第二聲波W2，而第三振動元件123在運轉時會產生振動而發出第三聲波W3。第一共振器131例如是設置於第一聲波W1會通過的路徑上，第二共振器132例如是設置於第二聲波W2會通過的路徑上，而第三共振器133例如是設置於第三聲波W3會通過的路徑上。The outer casing 110 has a space 111, and the first vibrating element 121, the second vibrating element 122 and the third vibrating element 123 are respectively assembled on the outer casing 110 and located in the space 111, wherein the vibrating element is, for example, a hard disk, a CD player or the like. Will produce Vibrating element. In detail, the first vibrating element 121 generates vibration during operation to emit the first acoustic wave W1, and the second vibrating element 122 generates vibration during operation to emit the second acoustic wave W2, and the third vibrating element 123 operates during operation. Vibration is generated to emit a third sound wave W3. The first resonator 131 is disposed, for example, on a path through which the first acoustic wave W1 passes, the second resonator 132 is disposed, for example, on a path through which the second acoustic wave W2 passes, and the third resonator 133 is disposed, for example, in the third. The sound wave W3 will pass on the path.
第一共振器131、第二共振器132以及第三共振器133例如是黑姆赫茲共振器，分別組裝於外殼110上且位於空間111內，其中第一共振器131具有第一腔體131a與第一連通孔131b，第二共振器132具有第二腔體132a與第二連通孔132b，而第三共振器133具有第三腔體133a與第三連通孔133b。第一連通孔131b連通第一腔體131a與空間111，第二連通孔132連通第二腔體132a與空間111，而第三連通孔133b連通第三腔體133a與空間111。由於第一振動元件121、第二振動元件122以及第三振動元件123運轉時所產生的振動頻率互不相同，因此便會發出頻率互不相同的第一聲波W1、第二聲波W2以及第三聲波W3，其中第一共振器131即是作為吸收第一聲波W1所用，第二共振器132即是作為吸收第二聲波W2所用，而第三共振器133即是作為吸收第三聲波W3所用。The first resonator 131, the second resonator 132, and the third resonator 133 are, for example, a Helmtz resonator, respectively assembled on the housing 110 and located in the space 111, wherein the first resonator 131 has the first cavity 131a and The first communication hole 131b has a second cavity 132a and a second communication hole 132b, and the third resonator 133 has a third cavity 133a and a third communication hole 133b. The first communication hole 131b communicates with the first cavity 131a and the space 111, the second communication hole 132 communicates with the second cavity 132a and the space 111, and the third communication hole 133b communicates with the third cavity 133a and the space 111. Since the vibration frequencies generated when the first vibrating element 121, the second vibrating element 122, and the third vibrating element 123 operate are different from each other, the first acoustic wave W1, the second acoustic wave W2, and the third having different frequencies are emitted. The acoustic wave W3 in which the first resonator 131 is used for absorbing the first acoustic wave W1, the second resonator 132 is used for absorbing the second acoustic wave W2, and the third resonator 133 is used for absorbing the third acoustic wave W3.
此處，第一腔體131a、第二腔體132a與第三腔體133a的體積V1~V3互為相等，且第一連通孔131b、第二連通孔132b 與第三連通孔133b的孔深L1~L3互為相等，但第一連通孔131b、第二連通孔132b與第三連通孔133b的孔徑D1~D3互不相同。基於黑姆赫茲共振器的共振頻率的計算原理可得知，第一共振器131的共振頻率是由體積V1、深度L1與孔徑D1所定義，第二共振器132的共振頻率是由體積V2、深度L2與孔徑D2所定義，而第三共振器133的共振頻率是由體積V3、深度L3與孔徑D3所定義，其中在孔徑D1<D2<D3的條件下，第一共振器131的共振頻率<第二共振器132的共振頻率<第三共振器133的共振頻率。又，由於第一共振器131的共振頻率與第一聲波W1的頻率相同(或者是，第一聲波W1的頻率為第一共振器131的共振頻率的倍頻)，第二共振器132的共振頻率與第二聲波W2的頻率相同(或者是，第二聲波W2的頻率為第二共振器132的共振頻率的倍頻)，且第三共振器133的共振頻率與第三聲波W3的頻率相同(或者是，第三聲波W3的頻率為第三共振器133的共振頻率的倍頻)，因此在第一聲波W1通過第一連通孔131b時其會由第一腔體131a所吸收，在第二聲波W2通過第二連通孔132b時其會由第二腔體132a所吸收，且在第三聲波W3通過第三連通孔133b時其會由第三腔體133a所吸收。如此為之，便能有效消除因電子總成100內的第一振動元件121至第三振動元件123運轉時所發出的噪音，從而提高使用者使用時的舒適度。Here, the volumes V1 V V3 of the first cavity 131 a , the second cavity 132 a and the third cavity 133 a are equal to each other, and the first communication hole 131 b and the second communication hole 132 b The hole depths L1 to L3 of the third communication hole 133b are equal to each other, but the apertures D1 to D3 of the first communication hole 131b, the second communication hole 132b, and the third communication hole 133b are different from each other. Based on the calculation principle of the resonance frequency of the Herm Hertz resonator, it can be known that the resonance frequency of the first resonator 131 is defined by the volume V1, the depth L1 and the aperture D1, and the resonance frequency of the second resonator 132 is determined by the volume V2. The depth L2 is defined by the aperture D2, and the resonance frequency of the third resonator 133 is defined by the volume V3, the depth L3, and the aperture D3, wherein the resonance frequency of the first resonator 131 under the condition of the aperture D1 < D2 < D3 <Resonance Frequency of Second Resonator 132 < Resonance Frequency of Third Resonator 133. Further, since the resonance frequency of the first resonator 131 is the same as the frequency of the first acoustic wave W1 (or the frequency of the first acoustic wave W1 is a multiple of the resonance frequency of the first resonator 131), the resonance of the second resonator 132 The frequency is the same as the frequency of the second acoustic wave W2 (or the frequency of the second acoustic wave W2 is a multiple of the resonant frequency of the second resonator 132), and the resonant frequency of the third resonator 133 is the same as the frequency of the third acoustic wave W3. (Alternatively, the frequency of the third acoustic wave W3 is a frequency multiplication of the resonance frequency of the third resonator 133), so that when the first acoustic wave W1 passes through the first communication hole 131b, it is absorbed by the first cavity 131a, The second acoustic wave W2 is absorbed by the second cavity 132a when passing through the second communication hole 132b, and is absorbed by the third cavity 133a when the third acoustic wave W3 passes through the third communication hole 133b. In this way, the noise generated when the first to third vibrating elements 121 to 123 in the electronic assembly 100 are operated can be effectively eliminated, thereby improving the comfort of the user during use.
圖3是本新型創作其他實施例的共振器的剖面示意圖。請參考圖3，不同於上述實施例的第一共振器131、第二共振器132 以及第三共振器133的是：本實施例的共振器134可具有腔體134a以及連通腔體134a的兩個連通孔134b、134c，其中連通孔134b的孔徑D4小於連通孔134c的孔徑D5。基於黑姆赫茲共振器的共振頻率的計算原理可得知，共振器134可藉由兩個孔徑不等但孔深相等的連通孔134b、134c以具有兩個不同的共振頻率。詳細而言，分別就連通孔134b與腔體134a所構成的黑姆赫茲共振器以及連通孔134c與腔體134a所構成的黑姆赫茲共振器來看，由於連通孔134c的孔徑D5大於連通孔134b的孔徑D4，因此連通孔134c與腔體134a所構成的黑姆赫茲共振器的共振頻率會大於連通孔134b與腔體134a所構成的黑姆赫茲共振器的共振頻率。換言之，當兩個頻率分別與連通孔134b與腔體134a所構成的黑姆赫茲共振器的共振頻率以及連通孔134c與腔體134a所構成的黑姆赫茲共振器的共振頻率相等的聲波，或者是兩個頻率分別為連通孔134b與腔體134a所構成的黑姆赫茲共振器的共振頻率以及連通孔134c與腔體134a所構成的黑姆赫茲共振器的共振頻率的倍頻的聲波通過共振器134時，前述頻率不等的聲波皆能被共振器134的腔體134a所吸收。3 is a schematic cross-sectional view of a resonator of another embodiment of the present invention. Referring to FIG. 3, the first resonator 131 and the second resonator 132 are different from the above embodiment. And the third resonator 133 is: the resonator 134 of the present embodiment may have a cavity 134a and two communication holes 134b, 134c that communicate with the cavity 134a, wherein the aperture D4 of the communication hole 134b is smaller than the aperture D5 of the communication hole 134c. Based on the calculation principle of the resonance frequency of the Herm Hertz resonator, it is known that the resonator 134 can have two different resonance frequencies by two communication holes 134b, 134c having unequal apertures but equal hole depths. In detail, in view of the Helm hertz resonator constituted by the communication hole 134b and the cavity 134a and the Helm Hertz resonator constituted by the communication hole 134c and the cavity 134a, respectively, since the aperture D5 of the communication hole 134c is larger than the communication hole The aperture D4 of 134b, therefore, the resonant frequency of the Herm Hertz resonator formed by the communication hole 134c and the cavity 134a is greater than the resonant frequency of the Herm Hers resonator formed by the communication hole 134b and the cavity 134a. In other words, when the two frequencies are respectively equal to the resonance frequency of the Helm hertz resonator constituted by the communication hole 134b and the cavity 134a and the resonance frequency of the resonance frequency of the Helm Hertz resonator formed by the communication hole 134c and the cavity 134a, or The resonance frequencies of the two frequencies are the resonance frequency of the Helm hertz resonator formed by the communication hole 134b and the cavity 134a, and the resonance of the frequency of the resonance frequency of the Helm Hertz resonator formed by the communication hole 134c and the cavity 134a. At the time of the 134, the sound waves of the aforementioned unequal frequencies can be absorbed by the cavity 134a of the resonator 134.
圖4是本新型創作另一實施例的電子總成的剖面示意圖。請參考圖4，本實施例的電子總成100A例如是風扇模組，其包括外殼110a、振動元件121a以及如上所述的第一共振器131、第二共振器132、第三共振器133與共振器134。外殼110a例如是導風罩，振動元件121a例如是組裝於外殼110a上的風扇，其 中風扇可因轉速不同而發出不同頻率的聲波，故需配置具有不同共振頻率的第一共振器131、第二共振器132、第三共振器133與共振器134來吸收前述聲波。4 is a schematic cross-sectional view of an electronic assembly of another embodiment of the present invention. Referring to FIG. 4, the electronic assembly 100A of the present embodiment is, for example, a fan module including a housing 110a, a vibrating element 121a, and a first resonator 131, a second resonator 132, and a third resonator 133 as described above. Resonator 134. The outer casing 110a is, for example, an air hood, and the vibration element 121a is, for example, a fan assembled to the outer casing 110a. The middle fan can emit sound waves of different frequencies due to different rotational speeds, so it is necessary to configure the first resonator 131, the second resonator 132, the third resonator 133 and the resonator 134 having different resonance frequencies to absorb the aforementioned sound waves.
詳細而言，外殼110a具有多個組裝孔112~115，其中組裝孔112~115的孔徑大小分別對應於第一共振器131的頭部H1、第二共振器132的頭部H2、第三共振器133的頭部H3與共振器134的頭部H4而設置，因此第一共振器131、第二共振器132、第三共振器133與共振器134分別藉由組裝孔112~115插接於外殼110a上，且位於空間111a之外。此時，第一共振器131的第一腔體131a便藉由穿過頭部H1的第一連通孔131b與空間111a相連通，第二共振器132的第二腔體132a便藉由穿過頭部H2的第二連通孔132b與空間111a相連通，第三共振器133的第三腔體133a便藉由穿過頭部H3的第三連通孔133b與空間111a相連通，且共振器134的腔體134a便藉由穿過頭部H4的連通孔134b、134c與空間111a相連通。In detail, the outer casing 110a has a plurality of assembly holes 112-115, wherein the aperture sizes of the assembly holes 112-115 correspond to the head H1 of the first resonator 131, the head H2 of the second resonator 132, and the third resonance, respectively. The head H3 of the 133 and the head H4 of the resonator 134 are disposed, so that the first resonator 131, the second resonator 132, the third resonator 133, and the resonator 134 are respectively inserted through the assembly holes 112-115. The housing 110a is located outside the space 111a. At this time, the first cavity 131a of the first resonator 131 communicates with the space 111a through the first communication hole 131b passing through the head H1, and the second cavity 132a of the second resonator 132 passes through the head. The second communication hole 132b of the portion H2 communicates with the space 111a, and the third cavity 133a of the third resonator 133 communicates with the space 111a through the third communication hole 133b passing through the head portion H3, and the cavity of the resonator 134 The body 134a communicates with the space 111a by the communication holes 134b, 134c passing through the head portion H4.
因此，在不同頻率的聲波分別通過第一連通孔131b、第二連通孔132b、第三連通孔133b或連通孔134b、134c時，其會由對應的的第一共振器131的第一腔體131a所吸收、第二共振器132的第二腔體132a所吸收、第三共振器133的第三腔體133a所吸收或共振器134的腔體134a所吸收。如此為之，便能有效消除因電子總成100A的振動元件121a運轉時所發出的噪音，從而提高使用者使用時的舒適度。Therefore, when the sound waves of different frequencies pass through the first communication hole 131b, the second communication hole 132b, the third communication hole 133b or the communication holes 134b, 134c, respectively, they are caused by the first cavity of the corresponding first resonator 131. The body 131a absorbs, is absorbed by the second cavity 132a of the second resonator 132, is absorbed by the third cavity 133a of the third resonator 133, or is absorbed by the cavity 134a of the resonator 134. In this way, the noise generated when the vibration element 121a of the electronic assembly 100A is operated can be effectively eliminated, thereby improving the comfort of the user during use.
綜上所述，本新型創作的電子總成的機殼內或殼罩上設置有一或多個共振器，且例如是黑姆赫茲(Helmholtz)共振器。因此，機殼或殼罩內的元件運轉時的振動所發出的特定頻率的聲音，可透過共振器來吸收。也就是說，本新型創作的電子總成可透過共振器來消除其內部的元件運轉時所發出的噪音，從而提高使用者使用時的舒適度。In summary, one or more resonators are disposed in the casing or the cover of the electronic assembly of the present invention, and are, for example, a Helmholtz resonator. Therefore, the sound of a specific frequency emitted by the vibration of the components in the casing or the casing can be absorbed by the resonator. That is to say, the electronic assembly created by the present invention can eliminate the noise generated by the operation of the components inside the resonator through the resonator, thereby improving the comfort of the user.
雖然本新型創作已以實施例揭露如上，然其並非用以限定本新型創作，任何所屬技術領域中具有通常知識者，在不脫離本新型創作的精神和範圍內，當可作些許的更動與潤飾，故本新型創作的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.
100‧‧‧電子總成100‧‧‧Electronic assembly
110‧‧‧外殼110‧‧‧Shell
111‧‧‧空間111‧‧‧ Space
121‧‧‧第一振動元件121‧‧‧First vibrating element
122‧‧‧第二振動元件122‧‧‧Second vibrating element
123‧‧‧第三振動元件123‧‧‧ Third vibrating element
131‧‧‧第一共振器131‧‧‧First Resonator
131b‧‧‧第一連通孔131b‧‧‧first connecting hole
132‧‧‧第二共振器132‧‧‧Second resonator
132b‧‧‧第二連通孔132b‧‧‧second connecting hole
133‧‧‧第三共振器133‧‧‧ Third Resonator
133b‧‧‧第三連通孔133b‧‧‧ third connecting hole
W1‧‧‧第一聲波W1‧‧‧First Sound Wave
W2‧‧‧第二聲波W2‧‧‧Second sound wave
W3‧‧‧第三聲波W3‧‧‧ third sound wave
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104200903U TWM502938U (en) | 2015-01-20 | 2015-01-20 | Electronic assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104200903U TWM502938U (en) | 2015-01-20 | 2015-01-20 | Electronic assembly |
Publications (1)
| Publication Number | Publication Date |
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| TWM502938U true TWM502938U (en) | 2015-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI577892B (en) * | 2015-12-08 | 2017-04-11 | 英業達股份有限公司 | Apparatus for heat-dissipating fan |
| CN108089674A (en) * | 2016-11-22 | 2018-05-29 | 英业达科技有限公司 | Radiator fan device and method for regulation of sound volume |
-
2015
- 2015-01-20 TW TW104200903U patent/TWM502938U/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI577892B (en) * | 2015-12-08 | 2017-04-11 | 英業達股份有限公司 | Apparatus for heat-dissipating fan |
| CN108089674A (en) * | 2016-11-22 | 2018-05-29 | 英业达科技有限公司 | Radiator fan device and method for regulation of sound volume |
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