TWM501642U - High yield fixing device of chip - Google Patents

Description

High-yield wafer fixture

A high-yield wafer fixing device, in particular, a device capable of simultaneously ejecting a plurality of first workpieces and simultaneously pressing a plurality of first workpieces to a second workpiece.

The steps of ejector, suction and press are common in semiconductor processes. The ejector uses a thimble to push a wafer (grain) to separate the wafer from the film. The suction system uses a suction head to move the aforementioned pushed wafer to another position. The press-fit system presses the wafer to a substrate using a press-fit head.

However, the thimble, the suction head or the press head is designed to only eject a wafer or suck a wafer, but for the efficiency-oriented semiconductor industry, only the ejector of a single wafer can be ejected, and only a single wafer can be sucked. The head or the press head that can only press a single wafer has a limited production capacity. Especially when the thickness of the wafer is very thin or the material is fragile, the ejection requires a long process time, or when the wafer requires a certain pressing time, the conventional method is still low in productivity regardless of the speed of operation of the mechanism. Therefore, it is necessary to have a new way of working to break through the limitations of the old methods and effectively increase production capacity.

In view of the above disadvantages, the purpose of the present invention is to provide a high-yield wafer fixing device that simultaneously ejects at least two first workpieces and presses the at least two first workpieces together with a second one. At the workpiece, the effect of increasing production capacity can be achieved.

In order to achieve the above object, the technical means of the present invention is to provide a high-yield wafer fixing device, comprising: a loading platform; a multi-suction and discharge unit, which is located above the loading platform; An adjustment station adjacent to the stage; a stage adjacent to the adjustment stage; and a multi-nip unit mounted above the stage; wherein the stage is provided At least two first workpieces are disposed; the plurality of suction and discharge units suck the at least two first workpieces, and the at least two first workpieces are placed on the adjustment table; the platform is provided for a second workpiece; the multiple presses The unit draws at least two first workpieces located on the adjustment table and presses the at least two first workpieces to the second workpiece.

In one embodiment, the high-yield wafer fixture has a plurality of ejection units, and the plurality of ejection units are disposed below the stage.

In summary, the high-yield wafer fixing device of the present invention simultaneously ejects a plurality of first workpieces and simultaneously presses the plurality of first workpieces that are ejected to the second workpiece at the same time, thereby achieving an increase in productivity. effect. In order to make the multi-compression unit more efficient, the multi-nip unit can be rotated in multiple groups.

The first workpiece of the stage must be ejected by an ejection unit, which is because in the semiconductor process, the first workpiece is often a wafer, which is bonded to a blue film, and the blue film is adhered to an iron ring, iron. The ring is placed on the stage, so in order to separate the wafer from the blue film, it is necessary to have an ejection behavior.

10‧‧‧ stage

100‧‧‧ displacement module

11‧‧‧Multiple ejection units

110‧‧‧ thimble

111‧‧‧Displacement module

12‧‧‧Multiple suction unit

120‧‧‧displacement module

121‧‧‧Sucking head

13‧‧‧ adjustment station

130‧‧‧displacement module

131‧‧‧ adjustment seat

14‧‧ ‧ cap

140‧‧‧displacement module

141‧‧‧heating module

15‧‧‧Multiple press unit

150‧‧‧displacement module

151‧‧‧Pressing head

152‧‧‧heating module

16‧‧‧First Vision Positioning Module

17‧‧‧Second Visual Positioning Module

18‧‧‧ Third Vision Positioning Module

19‧‧‧Flip unit

20‧‧‧First workpiece

21‧‧‧second workpiece

S1~S13‧‧‧Steps

Figure 1 is a schematic illustration of a first embodiment of a high yield wafer fixture of the present invention.

Figure 2 is a schematic diagram showing the adjustment of the relative position of at least two first workpieces by an adjustment stage.

Figure 3 is another schematic view of an adjustment table adjusting the relative positions of at least two first workpieces.

Fig. 4 is a schematic view showing a rotary motion of a multi-nip unit.

Figure 5 is a schematic illustration of a second embodiment of a high yield wafer fixture of the present invention.

Fig. 6 is a flow chart showing the first embodiment of the present invention applied to a high-output wafer fixing method.

Figure 7 is a flow chart showing the second embodiment of the present invention applied to a high-output wafer fixing method.

Fig. 8 is a flow chart showing the third embodiment of the present invention applied to a high-output wafer fixing method.

The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present invention by the contents disclosed in the present specification.

Please refer to FIG. 1 , which is a first embodiment of a high-yield wafer fixing device having a loading platform 10 , a multi-ejection unit 11 , a multi-suction and discharge unit 12 , and an adjustment station. 13. A pedestal 14 , a multi-compression unit 15 , a first visual positioning module 16 , a second visual positioning module 17 and a third visual positioning module 18 .

The stage 10 has a displacement module 100 to enable the stage 10 to perform a linear reciprocating motion (X-axis reciprocating motion), a lateral reciprocating motion (Y-axis reciprocating motion), or a rotational motion. The stage 10 is capable of providing at least two first workpieces 20. The first workpiece 20 is a substrate, a wafer, a wafer or a die.

The multi-ejection unit 11 is disposed under the stage 10, and the multi-ejecting unit 11 has at least two ejector pins 110. The multi-ejecting unit 11 further has a displacement module 111 to enable the multi-ejecting unit 11 to be opposite to the stage. 10 is in a longitudinal reciprocating motion (Z-axis reciprocating motion), a linear reciprocating motion or a lateral reciprocating motion. The thimble 110 is capable of ejecting at least two first workpieces 20 located on the stage 10. However, the ejector pin 110 can be ejector of the number of the first workpieces 20 as needed to control the single needle or multiple needles to simultaneously eject.

The plurality of suction and discharge units 12 are disposed above the stage 10. The plurality of suction and discharge units 12 have a displacement module 120 to enable the plurality of suction and discharge units 12 to perform a longitudinal reciprocating movement, a linear reciprocating motion or a lateral reciprocating motion. The plurality of suction and discharge units 12 have at least two suction heads 121 coupled to a vacuum module to provide a vacuum suction force or a positive pressure thrust force to the suction head 121, so that the suction heads 121 can be sucked and discharged. At least two first workpieces 20.

The adjustment table 13 is adjacent to the stage 10, and the adjustment table 13 has a displacement module 130 for enabling the adjustment table 13 to perform a longitudinal reciprocating motion, a linear reciprocating motion or a lateral reciprocating motion, and the adjustment table 13 has at least two adjustment seats. 131. Each of the adjustment seats 131 is capable of performing a linear reciprocating motion or a lateral reciprocating motion. The function of the adjustment seat 13 is The position of the first workpiece 20 above it is adjusted such that the distance between the two or more first workpieces 20 conforms to the distance to be placed on the second work 21, and the position is made more precise.

The susceptor 14 is adjacent to the adjustment table 13. The pedestal 14 is provided for at least one second workpiece 21, which is a substrate, a film body, a wafer, a wafer or a die. The cap 14 has a displacement module 140 to enable the cap 14 to perform a linear reciprocating motion, a lateral reciprocating motion or a rotational motion. The susceptor 14 has a heating module 141 for heating the second workpiece 21 to facilitate the first workpiece 20 to be pressed against the second workpiece 21.

The multiple press unit 15 is disposed above the platform 14 , and the multiple press unit 15 has a displacement module 150 to enable the multiple press unit 15 to perform a longitudinal reciprocating motion, a lateral reciprocating motion, a rotational motion or a linear motion. Reciprocating motion. The multiple press unit 15 has at least two press-fit heads 151 coupled to a vacuum module to provide a vacuum suction force or a positive pressure thrust force to the press-fit heads 151 so that the press-fit heads 151 At least two first workpieces 20 can be sucked and at least two first workpieces 20 can be pressed against the first workpiece 21. The multiple press unit 15 can also be mounted on the displacement module 150. The multi-pressure unit 15 can also be rotated in a rotating manner to increase the efficiency. Each of the pressing heads 151 has a heating module 152 for heating the first workpiece 20. The multiple press unit 15 can also be of at least two sets of designs.

The first visual positioning module 16 is located above the multiple suction and discharge unit 12. The first visual positioning module 16 captures the image information of the loading platform 10 and the first workpiece 20 for positioning, and the image information is the first image information described below.

The second visual positioning module 17 is located above the adjustment table 13. The second image positioning module 17 captures the image information of the adjustment table 13 and the first workpiece 20, and the image information is the second image information described below.

The third visual positioning module 18 is located above the cap 14 and the multi-nip unit 15 . The third visual positioning module 18 captures image information of each of the pressing head 151, the first workpiece 20, the second workpiece 21, and the platform 14, and the image information is the third image information described below. The third visual positioning module 18 can further capture an image of the side of the first workpiece 20 that does not face the third visual positioning module 18, or the third visual positioning module 18 The image of the first work 20, the second workpiece 21 or the cap 14 can be captured through the press head having the first workpiece.

Referring to FIG. 5, a second embodiment of a high-output wafer fixing device of the present invention, in this embodiment, the stage 10, the multi-ejecting unit 11, the multi-suction unit 12, and the adjusting table 13. The cap 14, the multiple press unit 15, the first visual positioning module 16, the second visual positioning module 17, and the third visual positioning module 18 are as in the first embodiment described above, so that the component symbol is used. An embodiment is not described here, but is stated first.

In this embodiment, an inverting unit 19 is disposed between the adjusting table 13 and the multi-nip unit 15, and since the inverting unit 19 is added in the embodiment, the setting position of the adjusting table 13 is lower than the stage. 10. The inverting unit 19 is coupled to a vacuum module to provide a vacuum suction or a positive pressure to the inverting unit 19, so that the inverting unit 19 can suck at least two first workpieces 20 located on the adjustment table 13, and The at least two first workpieces 20 are rotated by an angle such that each of the pressure-bonding heads 151 can suck the first workpiece 20 that is rotated by an angle.

In this embodiment, the second image information further has image information of the inverting unit 19.

Referring to FIG. 6, the present application is applied to a first embodiment of a high-output wafer fixing method, the steps of which include:

S1, the top of the stage 10 is provided with a plurality of first workpieces 20. If the first workpiece 20 is a wafer or a die, it is bonded to a blue film, the blue film is adhered to an iron ring, and the iron ring is placed. It is placed on the stage 10, so that it is necessary to have an ejection behavior to achieve separation of the wafer from the blue film. The first visual positioning module 16 captures a first image information of the first workpiece 20 located on the stage 10, and transmits the operation result of the first image information to the stage 10 to adjust the precise position, and then presses the command. It is transmitted to the multi-out unit 11. The multi-ejection unit 11 moves toward the stage 10 in accordance with the command to eject at least two first workpieces 20. After the at least two first workpieces 20 are to be ejected, the multi-ejecting unit 11 is returned to the initial position, so that at least two first workpieces 20 are to be ejected again.

S2, the multi-pickup unit 12 receives the first image information, and moves toward the stage 10 according to the first image information, and the plurality of suction and discharge units 12 absorb the above-mentioned At least two first workpieces 20 are ejected, after at least two first workpieces 20 are to be sucked. And moving toward the adjustment table 13 and placing at least two first workpieces 20 on the adjustment seat 131 of the adjustment table 13. The second visual positioning module 17 captures the second image information on the adjustment seat and transmits the second image information to the adjustment station 13.

After the plurality of suction and discharge units 12 have placed at least two first workpieces 20 on the adjustment table 13, the plurality of suction and discharge units 12 are returned to the initial position to be sucked again to at least two first workpieces 20 located on the stage 10.

S3, please refer to FIG. 3 and FIG. 4, the adjustment table 13 also receives the second image information, and the at least two adjustment seats 131 are relatively moved to adjust the first workpiece 20 located in the at least two adjustment seats 131. position. The distance between the two or more first workpieces 20 on the second workpiece 21 can be adjusted to the pitch of the first workpiece 20 on the second workpiece 21.

S4, please refer to FIG. 1 again. If the first embodiment of the high-output wafer fixing device of the present invention is used, the adjustment table 13 is moved toward the multi-nip unit 15, and the multi-pressure unit 15 is also The second image information is received to move the multi-nip unit 15 toward the adjustment table 13 , and the pressing head 151 sucks at least two first workpieces 20 located on the adjustment base 131 . The press head 151 having at least two first workpieces 20 is moved above the cap 14.

The adjustment stage 13 is returned to the original position until the suction unit 12 again places the first workpiece 20 on the adjustment stage 13.

Referring to FIG. 5, in the second embodiment of the high-output wafer fixing device of the present invention, the adjustment table 13 is moved toward the reversing unit 19. The inverting unit 19 receives the second image information and rotates to the direction of the adjustment table 13. The inverting unit 19 sucks at least two first workpieces 20 located on the adjustment table 13 and rotates at least two first workpieces 20 by an angle. The multi-nip unit 15 is moved toward the reversing unit 19 to suck the first workpiece 20 located at the reversing unit 19. The press head 151 having at least two first workpieces 20 is moved above the cap 14.

S5, the third visual positioning module 18 captures image information of the first workpiece 20, the second workpiece 21 and the platform 14 of the pressing head 151, the image information is a third image information, and the pressing unit 15 is Accepting the third image information to enable the pressure head 151 to At least two first workpieces 20 are pressed against the second workpiece 21. Before the first workpiece 20 is pressed against the second workpiece 21, the platform 14 also receives the third image information to adjust the position of the cap 14 relative to the press head 151 having the first workpiece 20. After the pressing is completed, the pressing unit 15 and the cap 14 are returned to the original position or moved to the next working position to be pressed again.

Referring to FIG. 7, the present application is applied to a second embodiment of a high-output wafer fixing method, the steps of which include:

S6, the top of the stage 10 is provided with a plurality of first workpieces 20, and the first visual positioning module 16 captures a first image information of the first workpiece 20 of the stage 10, and the first image information is The result of the operation is transmitted to the stage 10 to adjust the precise position, and then the command is transmitted to the multi-absorption unit 12. If the first workpiece 20 is not bonded to a blue film, the ejector unit 11 need not be used.

The plurality of suction and discharge units 12 receive the first image information, and move toward the stage 10 according to the first image information, and the plurality of suction and discharge units 12 absorb at least two of the first workpieces 20 to be sucked at least two After a workpiece 20. And moving toward the adjustment table 13 and placing at least two first workpieces 20 on the adjustment seat 131 of the adjustment table 13. The second visual positioning module 17 captures the second image information on the adjustment seat and transmits the second image information to the adjustment station 13.

After the plurality of suction and discharge units 12 have placed at least two first workpieces 20 on the adjustment table 13, the plurality of suction and discharge units 12 are returned to the initial position to be sucked again to at least two first workpieces 20 located on the stage 10.

S7, please refer to FIG. 3 and FIG. 4, the adjustment table 13 also receives the second image information, and the at least two adjustment seats 131 are relatively moved to adjust the first workpiece 20 located in the at least two adjustment seats 131. position. The distance between the two or more first workpieces 20 on the second workpiece 21 can be adjusted to the pitch of the first workpiece 20 on the second workpiece 21.

S8, please refer to FIG. 1 again. If the first embodiment of the high-output wafer fixing device of the present invention is used, the adjustment table 13 is moved toward the multi-nip unit 15, and the multi-pressure unit 15 is also Receiving the second image information to move the multi-nip unit 15 toward the adjustment table 13 , and the pressing head 151 is sucked and positioned at the adjustment seat 131 The second workpiece 20 is less than two. The press head 151 having at least two first workpieces 20 is moved above the cap 14.

The adjustment stage 13 is returned to the original position until the suction unit 12 again places the first workpiece 20 on the adjustment stage 13.

Referring to FIG. 5, in the second embodiment of the high-output wafer fixing device of the present invention, the adjustment table 13 is moved toward the reversing unit 19. The inverting unit 19 receives the second image information and rotates to the direction of the adjustment table 13. The inverting unit 19 sucks at least two first workpieces 20 located on the adjustment table 13 and rotates at least two first workpieces 20 by an angle. The multi-nip unit 15 is moved toward the reversing unit 19 to suck the first workpiece 20 located at the reversing unit 19. The press head 151 having at least two first workpieces 20 is moved above the cap 14 or the press head 151 having at least two first workpieces 20 is rotated above the cap 14.

S9, the third visual positioning module 18 captures image information of the first workpiece 20, the second workpiece 21 and the platform 14 at the pressing head 151. The image information is a third image information, and the pressing unit 15 is The third image information is accepted such that the press head 151 can press at least two first workpieces 20 to the second workpiece 21. Before the first workpiece 20 is pressed against the second workpiece 21, the platform 14 also receives the third image information to adjust the position of the cap 14 relative to the press head 151 having the first workpiece 20. After the pressing is completed, the pressing unit 15 and the cap 14 are returned to the original position or moved to the next working position to be pressed again.

Referring to FIG. 8, the present application is applied to a third embodiment of a high-output wafer fixing method, the steps of which include:

S10, the plurality of suction and discharge units 12 are moved toward the stage 10, and the plurality of suction and discharge units 12 suck the at least two first workpieces 20, and at least two first workpieces 20 are to be sucked. And moving toward the adjustment table 13 and placing at least two first workpieces 20 on the adjustment seat 131 of the adjustment table 13. In the present embodiment, the steps of S1 and S2 or S6 described above may be employed.

S11, at least two adjustment seats 131 are relatively moved to adjust the position of the first workpiece 20 located at the at least two adjustment seats 131. The distance between the two or more first workpieces 20 on the second workpiece 21 can be adjusted to the pitch of the first workpiece 20 on the second workpiece 21.

S12, as shown in FIG. 4, the multi-nip unit 15 moves toward the adjustment table 13 in a rotational motion manner, and the pressure-bonding head 151 sucks at least two first workpieces 20 located on the adjustment base 131. The press head 151 having at least two first workpieces 20 is moved to a position above the cap 14 in a rotational motion. In this step, the steps of S8 or S4 described above may be employed.

The multiple press unit 15 is movable in a rotational motion mode that enables the plurality of press heads 151 to be sequentially operated. In turn, the efficiency of pressing is improved.

S13, the pressing head 151 can press at least two first workpieces 20 to the second workpiece 21. In this step, it is possible to adopt the steps of S9 or S5 described above.

The first image information, the second image information and the third image information are used to improve the accuracy of positioning.

The present invention as described above is applied to various embodiments of the high-yield wafer fixing method, the steps of which can be:

The multi-ejection unit 11 moves toward the stage 10 in accordance with the command to eject at least two first workpieces 20. After the at least two first workpieces 20 are to be ejected, the multi-ejecting unit 11 is returned to the initial position, so that at least two first workpieces 20 are to be ejected again. This step can also be omitted.

If the above-mentioned ejection step is omitted, the multiple suction and discharge unit 12 sucks at least two first workpieces 20 located on the stage 10 after the at least two first workpieces 20 are to be sucked. And moving toward the adjustment table 13 and placing at least two first workpieces 20 on the adjustment seat 131 of the adjustment table 13.

At least two adjustment seats 131 are relatively moved to adjust the position of the first workpiece 20 located at the at least two adjustment seats 131. The distance between the two or more first workpieces 20 on the second workpiece 21 can be adjusted to the pitch of the first workpiece 20 on the second workpiece 21.

The multiple press unit 15 moves in a rotational motion toward the adjustment table 13 , and the press head 151 sucks at least two first workpieces 20 located on the adjustment base 131 . The press head 151 having at least two first workpieces 20 is moved to a position above the cap 14 in a rotational motion. The multiple nip unit 15 is further capable of further performing a longitudinal reciprocating movement, a linear reciprocating motion or a lateral reciprocating motion. The longitudinal reciprocating movement, the linear reciprocating motion or the lateral reciprocating motion is a selective movement.

In addition, the inverting unit 19 sucks at least two first workpieces 20 located on the adjustment table 13 and rotates at least two first workpieces 20 by an angle. The multiple nip unit 15 moves in a rotational movement toward the reversing unit 19 to suck the first workpiece 20 at the reversing unit 19. The press head 151 having at least two first workpieces 20 is moved in a rotational motion to move above the cap 14.

The pressing head 151 presses at least two first workpieces 20 to the second workpiece 21. Before the pressing, the heating modules 141 and 152 respectively heat the second workpiece 21 and the first workpiece 20, and the first after heating. The workpiece 20 and the second workpiece 21 are more easily pressed.

In summary, the creation system utilizes a plurality of ejection units to eject at least two first workpieces on the stage, and then the plurality of suction units are used to pick up and release the at least first workpiece, and the plurality of compression units are used to at least two first The workpiece is pressed against a second workpiece located on the cap.

The effect of increasing the productivity is achieved by increasing the number of ejection of the first workpiece located on the stage and simultaneously pressing the plurality of first workpieces to the second workpiece.

The specific embodiments described above are only used to illustrate the features and functions of the present invention, and are not intended to limit the scope of implementation of the present invention, without departing from the spirit and technical scope of the present invention. Equivalent changes and modifications made by the disclosure of the disclosure are still covered by the scope of the following patent application.

10‧‧‧ stage

100‧‧‧ displacement module

11‧‧‧Multiple ejection units

110‧‧‧ thimble

111‧‧‧Displacement module

12‧‧‧Multiple suction unit

120‧‧‧displacement module

121‧‧‧Sucking head

13‧‧‧ adjustment station

130‧‧‧displacement module

131‧‧‧ adjustment seat

14‧‧ ‧ cap

140‧‧‧displacement module

141‧‧‧heating module

15‧‧‧Multiple press unit

150‧‧‧displacement module

151‧‧‧Pressing head

152‧‧‧heating module

16‧‧‧First Vision Positioning Module

17‧‧‧Second Visual Positioning Module

18‧‧‧ Third Vision Positioning Module

20‧‧‧First workpiece

21‧‧‧second workpiece

Claims (14)

A high-yield wafer fixing device comprising: a loading stage; a plurality of suction and discharge units located above the stage; an adjustment stage adjacent to the stage; a platform; Adjacent to the adjustment table; and a plurality of nip units disposed above the pedestal; wherein the gantry is provided for at least two first workpieces; and the plurality of absorbing units absorbs the at least two a workpiece, and the at least two first workpieces are placed on the adjustment table; the platform is provided for a second workpiece; the multi-pressure unit performs a rotary motion, and the multi-pressure unit is sucked at the adjustment table At least two first workpieces and press the at least two first workpieces to the second workpiece. The high-yield wafer fixing device according to claim 1, wherein the adjusting station adjusts a relative position of the at least two first workpieces, the adjusting table has a displacement module to enable the adjusting station to perform A longitudinal reciprocating motion, a linear reciprocating motion or a lateral reciprocating motion. The high-output wafer fixing device according to claim 2, wherein the adjusting table has at least two adjusting seats, and each adjusting seat performs a linear reciprocating motion or a lateral reciprocating motion to adjust the at least two first workpieces. Relative position. The high-yield wafer fixing device according to claim 1, further comprising a turning unit, the inverting unit being located between the adjusting table and the multi-nip unit. The high-output wafer fixing device according to claim 1, further comprising a first visual positioning module, wherein the first visual positioning module is located above the multiple suction and discharge unit. The high-output wafer fixing device according to claim 1, further comprising a second visual positioning module, the second visual positioning module being located above the adjustment platform. The high-output wafer fixing device according to claim 1, further comprising a third visual positioning module, the third visual positioning module being located above the plurality of pressing units. The high-output wafer fixing device of claim 7, wherein the third visual positioning module captures an image of a side of the first workpiece that does not face the third visual positioning module, or The third visual positioning module transmits the image of the second workpiece or the pedestal through the first workpiece. The high-yield wafer fixing device according to claim 1, wherein the stage has a displacement module for causing the stage to perform a reciprocating motion, a lateral reciprocating movement or a rotary motion; A displacement module is provided to cause the cap to perform a linear reciprocating motion, a lateral reciprocating movement or a rotational reciprocating motion. The high-yield wafer fixing device according to claim 1, further comprising a plurality of ejector units disposed under the stage, the multi-ejecting unit having at least two ejector pins The multi-ejecting unit further has a displacement module such that the multi-ejecting unit is longitudinally reciprocated, linearly reciprocated or laterally reciprocated relative to the stage. The high-yield wafer fixing device according to claim 1, wherein the multi-suction unit has a displacement module for causing the plurality of suction units to perform a longitudinal reciprocating movement, a linear reciprocating motion or a lateral reciprocating movement. For movement, the multiple suction unit has at least two suction heads. The high-yield wafer fixing device according to claim 1, wherein the multi-nip unit has a displacement module for causing the multiple pressing unit to perform a longitudinal reciprocating motion or the rotating motion, the multi-pressure The unit has at least two press-fit heads. The high-yield wafer fixing device according to claim 12, wherein the pressing head has a heating module; the platform has a heating module. The high-yield wafer fixing device according to claim 12, wherein the plurality of pressing units are two or more, and the displacement module causes the multiple pressing unit to perform a linear reciprocating motion.